CN204209836U - A kind of multiple field diamond segment - Google Patents
A kind of multiple field diamond segment Download PDFInfo
- Publication number
- CN204209836U CN204209836U CN201420236285.4U CN201420236285U CN204209836U CN 204209836 U CN204209836 U CN 204209836U CN 201420236285 U CN201420236285 U CN 201420236285U CN 204209836 U CN204209836 U CN 204209836U
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- Prior art keywords
- layer
- noise reduction
- metal level
- diamond
- diamond segment
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Abstract
The utility model relates to diamond cutting tool field, is specifically related to a kind of multiple field diamond segment, it is characterized in that: comprise some layers of diamond layer and metal level, is provided with noise reduction layer between described adjacent two layers metal level.The utility model, by arranging metal level, can make cutter head form chip removal layer fast, increases the sharpness of cutter head, noise reduction layer is set between metal level simultaneously, carry out energy-absorbing function by the undulating pleats of noise reduction layer, effectively absorb the vibration of cutter head, thus reduce the generation of noise.
Description
Technical field
The utility model relates to diamond cutting tool field, is specifically related to a kind of multiple field diamond segment.
Background technology
Diamond saw blade is widely used in the hard brittle materials such as cutting stone material, concrete, glass, crystal, graphite electrode.Diamond saw blade is welded to form primarily of saw bit matrix and diamond segment, diamond segment is mixed by diamond and metal dust, compacting, die-filling and sintering is formed, cutter head is divided into individual layer and sandwich construction, the diamond segment of sandwich construction has better sharpness, such as: a kind of diamond segment with paster interlayer described in patent No. CN202428565U, its feature with: comprise some layers of diamond layer, an iron plate layer is provided with between adjacent two layers diamond layer, its shortcoming is that the saw blade that described diamond segment is housed produces great noise when cutting, usual cutting noise reaches more than 105dB, seriously endanger the healthy of people.
Utility model content
The utility model, for solving the problem and providing a kind of multiple field diamond segment, can reduce cutting noise effectively.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of multiple field diamond segment, is characterized in that: comprise some layers of diamond layer and metal level, is provided with noise reduction layer between described adjacent two layers metal level.
As preferably, described noise reduction layer is copper sheet layer.
As preferably, described noise reduction layer thickness is 0.5-1.2mm.
As preferably, uniform some roads undulating pleats on described noise reduction layer, the vibration produced when can absorb cutter head work.
As preferably, between described adjacent twice undulating pleats, be provided with sound-absorption hole or sound-absorbing seam.
As preferably, described diamond segment both sides are provided with some roads chip area, reduce chip to the wearing and tearing of cutter head, reduce fricative noise simultaneously.
The beneficial effects of the utility model: the utility model is by arranging metal level, cutter head can be made to form chip removal layer fast, increase the sharpness of cutter head, noise reduction layer is set between metal level simultaneously, energy-absorbing function is carried out by the undulating pleats of noise reduction layer, effectively absorb the vibration of cutter head, thus reduce the generation of noise.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model embodiment 1;
Fig. 2 is the cross-sectional view of noise reduction layer in the utility model embodiment 1.
Fig. 3 is the structural representation of the utility model embodiment 2
In figure, 1-diamond layer; 2-metal level; 3-noise reduction layer; 31-undulating pleats; 4-chip area.
Detailed description of the invention
The following stated is only better embodiment of the present utility model, therefore all equivalences done according to structure, feature and the principle described in the utility model patent claim change or modify, and are included in the utility model patent claim.
Embodiment 1: shown in Fig. 1 and Fig. 2, a kind of multiple field diamond segment, comprise two-layer diamond layer 1, be provided with two metal layers 2 between two-layer diamond layer 1, this metal level 2 is carbon alloy steel layer, is provided with one deck noise reduction layer 3 between metal level 2, this noise reduction layer 3 is copper sheet layer, noise reduction layer 3 thickness is 1.2mm, and on it, uniform some roads undulating pleats 31, is provided with sound-absorption hole between adjacent twice undulating pleats 31.Diamond segment both sides are also provided with some roads chip area 4, reduce chip to the wearing and tearing of cutter head, reduce fricative noise simultaneously.
Embodiment 2: as shown in Figure 3, a kind of multiple field diamond segment, comprise three layers of diamond layer 1, be provided with two metal layers 2 between adjacent two layers diamond layer 1, this metal level 2 is carbon alloy steel layer, is provided with one deck noise reduction layer 3 between metal level 2 layers, this noise reduction layer 3 is copper sheet layer, noise reduction layer 3 thickness is 0.5mm, uniform some roads undulating pleats 31 on it, is provided with sound-absorbing seam between adjacent twice undulating pleats 31.Diamond segment both sides are also provided with some roads chip area 4, reduce chip to the wearing and tearing of cutter head, reduce fricative noise simultaneously.
Claims (4)
1. a multiple field diamond segment, it is characterized in that: comprise some layers of diamond layer (1) and metal level (2), noise reduction layer (3) is provided with between described adjacent two layers metal level (2), described noise reduction layer (3) is copper sheet layer, upper uniform some roads undulating pleats (31) of described noise reduction layer (3).
2. multiple field diamond segment according to claim 1, is characterized in that: described noise reduction layer (3) thickness is 0.5-1.2mm.
3. multiple field diamond segment according to claim 1, is characterized in that: be provided with sound-absorption hole or sound-absorbing seam between described adjacent twice undulating pleats (31).
4. multiple field diamond segment according to claim 1, is characterized in that: described diamond segment both sides are provided with some roads chip area (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420236285.4U CN204209836U (en) | 2014-05-09 | 2014-05-09 | A kind of multiple field diamond segment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420236285.4U CN204209836U (en) | 2014-05-09 | 2014-05-09 | A kind of multiple field diamond segment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204209836U true CN204209836U (en) | 2015-03-18 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420236285.4U Expired - Fee Related CN204209836U (en) | 2014-05-09 | 2014-05-09 | A kind of multiple field diamond segment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204209836U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110480525A (en) * | 2019-09-11 | 2019-11-22 | 湖南九目新材料科技有限公司 | A kind of layered body deep trouth chip removal diamond segment |
-
2014
- 2014-05-09 CN CN201420236285.4U patent/CN204209836U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110480525A (en) * | 2019-09-11 | 2019-11-22 | 湖南九目新材料科技有限公司 | A kind of layered body deep trouth chip removal diamond segment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150318 Termination date: 20150509 |
|
| EXPY | Termination of patent right or utility model |