CN204191076U - A kind of Novel active power filter module heat dissipation structure - Google Patents

A kind of Novel active power filter module heat dissipation structure Download PDF

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Publication number
CN204191076U
CN204191076U CN201420618065.8U CN201420618065U CN204191076U CN 204191076 U CN204191076 U CN 204191076U CN 201420618065 U CN201420618065 U CN 201420618065U CN 204191076 U CN204191076 U CN 204191076U
Authority
CN
China
Prior art keywords
module
heat
pipe radiator
active power
power filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420618065.8U
Other languages
Chinese (zh)
Inventor
商亮亮
丁湘洪
昌锋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Anhui Sewoll Electrical Technology Co., Ltd.
Original Assignee
ANHUI SAIWO ELECTRICAL TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ANHUI SAIWO ELECTRICAL TECHNOLOGY Co Ltd filed Critical ANHUI SAIWO ELECTRICAL TECHNOLOGY Co Ltd
Priority to CN201420618065.8U priority Critical patent/CN204191076U/en
Application granted granted Critical
Publication of CN204191076U publication Critical patent/CN204191076U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of Novel active power filter module heat dissipation structure, comprise the housing be made up of plate, module header board, module top board and module base plate after module, in housing, be provided with IGBT assembly, capacitance component and relay assembly; IGBT assembled is on heat-pipe radiator, heat-pipe radiator is arranged on the angle of plate after module base plate and module, the outside of module base plate is provided with heat-pipe radiator relative position and the air channel communicated, blower fan is provided with below air channel, capacitance component is assemblied in the angle of module header board and module top board, and relay assembly is arranged in the space left between heat-pipe radiator and capacitance component.The utility model safeguards easy accessibility, and topology layout is reasonable, is also beneficial to the heat radiation of each assembly in Active Power Filter-APF module simultaneously, has maintenance cost low, the advantage that assembly work efficiency is high.

Description

A kind of Novel active power filter module heat dissipation structure
Technical field
The utility model relates to technical field of electric equipment, is specifically related to a kind of Novel active power filter module heat dissipation structure.
Background technology
Active Power Filter-APF module housing is used to a kind of cupboard protecting Active Power Filter-APF module normally to work, and mostly adopts steel to process., there is dismounting inconvenience in each assembly of the Active Power Filter-APF module in housing, easily influence each other interference, the defect of the heat radiation such as IGBT module difficulty etc.
Utility model content
The purpose of this utility model is to overcome above-mentioned the deficiencies in the prior art, provides a kind of rationally distributed, compact conformation, does not affect each assembly radiating in Active Power Filter-APF module, have the Active Power Filter-APF module heat dissipation structure of novel layouts structure.
A kind of Novel active power filter module heat dissipation structure, comprises the housing be made up of plate, module header board, module top board and module base plate after module, is provided with IGBT assembly, capacitance component and relay assembly in housing; IGBT assembled is on heat-pipe radiator, heat-pipe radiator is arranged on the angle of plate after module base plate and module, the outside of module base plate is provided with heat-pipe radiator relative position and the air channel communicated, blower fan is provided with below air channel, capacitance component is assemblied in the angle of module header board and module top board, and relay assembly is arranged in the space left between heat-pipe radiator and capacitance component.
Further describing as technique scheme:
Described relay assembly gap is arranged on the side of heat-pipe radiator, capacitance component.
Further describing as technique scheme:
Described module top board offers several louvres.
Further describing as technique scheme:
Thermal conductive silicon is coated with between described IGBT assembly and heat-pipe radiator.
The utility model safeguards easy accessibility, and topology layout is reasonable, is also beneficial to the heat radiation of each assembly in Active Power Filter-APF module simultaneously, has maintenance cost low, the advantage that assembly work efficiency is high.
Accompanying drawing explanation
Fig. 1 is detonation configuration schematic diagram of the present utility model;
Fig. 2 is perspective view of the present utility model;
Fig. 3 is cross-sectional view of the present utility model.
Embodiment
See Fig. 1 and Fig. 2, a kind of Novel active power filter module heat dissipation structure that the utility model provides, comprise by plate after module 1, module header board 2, the housing 5 that module top board 3 and module base plate 4 are formed, IGBT assembly 6 is provided with in housing 5, capacitance component 7 and relay assembly 8, in order to solve the technical problem described in background technology, the technical solution of the utility model is, IGBT assembly 6 is assemblied on heat-pipe radiator 9, composition graphs 3, heat-pipe radiator 9 is arranged on the angle of plate 1 after module base plate 4 and module, the outside of module base plate 4 is provided with heat-pipe radiator 9 relative position and the air channel 10 communicated, blower fan 11 is provided with below air channel 10, capacitance component 7 is assemblied in the angle of module header board 2 and module top board 3, relay assembly 8 is arranged in the space left between heat-pipe radiator 9 and capacitance component 7, and with heat-pipe radiator 9, capacitance component 7 has gap, module top board 3 offers several louvres 12.
Like this, first IGBT assembly 6 can be dispelled the heat by heat-pipe radiator 9, and the heat shed can be taken away along with blower fan 11, and the heat of relay assembly 8, capacitance component 7 is discharged among a small circle from louvre 12, and all the other also discharge housing 5 by blower fan 11.
Further improvement as technique scheme:
Be coated with thermal conductive silicon between IGBT assembly 6 and heat-pipe radiator 9, object is, improves the radiating effect of IGBT assembly 6 further.
The above is only preferred implementation of the present utility model, protection range of the present utility model be not only confined to above-described embodiment, and all technical schemes belonged under the utility model thinking all belong to protection range of the present utility model.It should be pointed out that for those skilled in the art, do not departing from the some improvements and modifications under the utility model principle prerequisite, these improvements and modifications also should be considered as protection range of the present utility model.

Claims (4)

1. a Novel active power filter module heat dissipation structure, comprise by plate after module, module header board, the housing that module top board and module base plate are formed, IGBT assembly is provided with in housing, capacitance component and relay assembly, it is characterized in that: described IGBT assembled is on heat-pipe radiator, heat-pipe radiator is arranged on the angle of plate after module base plate and module, the outside of module base plate is provided with heat-pipe radiator relative position and the air channel communicated, blower fan is provided with below air channel, capacitance component is assemblied in the angle of module header board and module top board, relay assembly is arranged in the space left between heat-pipe radiator and capacitance component.
2. a kind of Novel active power filter module heat dissipation structure according to claim 1, is characterized in that: described relay assembly gap is arranged on the side of heat-pipe radiator, capacitance component.
3. a kind of Novel active power filter module heat dissipation structure according to claim 1, is characterized in that: described module top board offers several louvres.
4. a kind of Novel active power filter module heat dissipation structure according to claim 1,2 or 3, is characterized in that: be coated with thermal conductive silicon between described IGBT assembly and heat-pipe radiator.
CN201420618065.8U 2014-10-23 2014-10-23 A kind of Novel active power filter module heat dissipation structure Expired - Fee Related CN204191076U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420618065.8U CN204191076U (en) 2014-10-23 2014-10-23 A kind of Novel active power filter module heat dissipation structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420618065.8U CN204191076U (en) 2014-10-23 2014-10-23 A kind of Novel active power filter module heat dissipation structure

Publications (1)

Publication Number Publication Date
CN204191076U true CN204191076U (en) 2015-03-04

Family

ID=52623036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420618065.8U Expired - Fee Related CN204191076U (en) 2014-10-23 2014-10-23 A kind of Novel active power filter module heat dissipation structure

Country Status (1)

Country Link
CN (1) CN204191076U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP01 Change in the name or title of a patent holder

Address after: 234000 hi tech Industrial Development Zone, Anhui, Suzhou

Patentee after: Anhui Sewoll Electrical Technology Co., Ltd.

Address before: 234000 hi tech Industrial Development Zone, Anhui, Suzhou

Patentee before: ANHUI SAIWO ELECTRICAL TECHNOLOGY CO., LTD.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150304

Termination date: 20171023

CF01 Termination of patent right due to non-payment of annual fee