CN204189124U - A kind of CPU heat abstractor - Google Patents
A kind of CPU heat abstractor Download PDFInfo
- Publication number
- CN204189124U CN204189124U CN201420710766.4U CN201420710766U CN204189124U CN 204189124 U CN204189124 U CN 204189124U CN 201420710766 U CN201420710766 U CN 201420710766U CN 204189124 U CN204189124 U CN 204189124U
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- wind
- guiding pipeline
- pedestal
- cpu
- fan
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Abstract
The utility model discloses a kind of CPU heat abstractor, it relates to field of computer technology, and it comprises CPU body, thermal conductive silicon glue-line, pedestal, the first wind-guiding pipeline, the second wind-guiding pipeline, radiation shell, fan, goes out fan and heat radiator; Its reasonable in design, modern design is unique, simple to operate, easy to use, thermal conductive silicon glue-line is set between pedestal and CPU body and effectively the heat of CPU can be passed to pedestal, improve radiating effect, adopt two wind-guiding circuit design, effectively heat can be passed, and adopt fan and go out fan loop design, improve radiating effect further.
Description
Technical field
The utility model relates to field of computer technology, is specifically related to a kind of CPU heat abstractor.
Background technology
CPU is the central processing unit of computing machine, is also the core parts of computing machine, and in the calculating process of computing machine, CPU can produce a large amount of heats, and in order to make, CPU can cool in time, normal operation, usually on CPU, installs heat abstractor dispel the heat.But along with the fast development of infotech, the arithmetic speed of CPU is improving constantly, and the heat produced during computing also increases, and current known technology can not meet radiating requirements thereupon, so need a kind of technology not enough to make up this on the market.
Summary of the invention
In order to solve the problem, the utility model provides a kind of technical scheme: a kind of CPU heat abstractor, main body is CPU body, and its innovative point is: also comprise thermal conductive silicon glue-line, pedestal, the first wind-guiding pipeline, the second wind-guiding pipeline, radiation shell, fan, go out fan and heat radiator; Described pedestal is coated on CPU body surrounding, is provided with one deck thermal conductive silicon glue-line between described pedestal and CPU body; Described first wind-guiding pipeline is fixedly connected on the upper end of pedestal, and described second wind-guiding pipeline is fixedly connected on the lower end of pedestal, and described first wind-guiding pipeline and the second wind-guiding pipeline and pedestal keep UNICOM; The other end of described first wind-guiding pipeline and the second wind-guiding pipeline is separately fixed at the top and bottom of radiation shell, and the first wind-guiding pipeline and the second wind-guiding pipeline and radiation shell keep UNICOM; Described heat radiator is several, is evenly distributed on the outside surface of radiation shell; Described fan and go out the upper and lower end that fan is arranged on radiation shell, and form loop.
As preferably, described radiation shell goes to upper and lower the middle font of end opening.
As preferably, described pedestal is the middle font of side end opening.
As preferably, described first wind-guiding pipeline and the second wind-guiding pipeline are arc surface.
The beneficial effects of the utility model: its reasonable in design, modern design is unique, simple to operate, easy to use, thermal conductive silicon glue-line is set between pedestal and CPU body and effectively the heat of CPU can be passed to pedestal, improve radiating effect, adopt two wind-guiding circuit design, effectively heat can be passed, and adopt fan and go out fan loop design, improve radiating effect further.
Accompanying drawing explanation
For ease of illustrating, the utility model is described in detail by following concrete enforcement and accompanying drawing.
Fig. 1 is structural representation of the present utility model.
1-CPU body; 2-thermal conductive silicon glue-line; 3-pedestal; 4-first wind-guiding pipeline; 5-second wind-guiding pipeline; 6-radiation shell; 7-fan; 8-goes out fan; 9-heat radiator.
Embodiment
As shown in Figure 1, this embodiment by the following technical solutions: main body is CPU body 1, also comprises thermal conductive silicon glue-line 2, pedestal 3, first wind-guiding pipeline 4, second wind-guiding pipeline 5, radiation shell 6, fan 7, goes out fan 8 and heat radiator 9; Described pedestal 3 is coated on CPU body 1 surrounding, is provided with one deck thermal conductive silicon glue-line 2 between described pedestal 3 and CPU body 1; Described first wind-guiding pipeline 4 is fixedly connected on the upper end of pedestal 3, and described second wind-guiding pipeline 5 is fixedly connected on the lower end of pedestal 3, and described first wind-guiding pipeline 4 and the second wind-guiding pipeline 5 keep UNICOM with pedestal 3; The other end of described first wind-guiding pipeline 4 and the second wind-guiding pipeline 5 is separately fixed at the top and bottom of radiation shell 6, and the first wind-guiding pipeline 4 and the second wind-guiding pipeline 5 keep UNICOM with radiation shell 6; Described heat radiator 9 is several, is evenly distributed on the outside surface of radiation shell 6; Described fan 7 and go out the upper and lower end that fan 8 is arranged on radiation shell 6, and form loop.
Wherein, described radiation shell 6 goes to upper and lower the middle font of end opening; The middle font of described pedestal 3 in side end opening; Described first wind-guiding pipeline 4 and the second wind-guiding pipeline 5 are in arc surface.
Using method of the present utility model is: the heat of CPU passes to pedestal by thermal conductive silicon glue-line, transfer heat in radiation shell by two wind-guiding pipeline again, now because wind-guiding pipeline is arc surface, have partial heat to scatter and disappear, finally by double fan loop, disperse heat.
More than show and describe ultimate principle of the present utility model and principal character and advantage of the present utility model.The technician of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and instructions just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (4)
1. a CPU heat abstractor, main body is CPU body (1), it is characterized in that: also comprise thermal conductive silicon glue-line (2), pedestal (3), the first wind-guiding pipeline (4), the second wind-guiding pipeline (5), radiation shell (6), fan (7), go out fan (8) and heat radiator (9);
Described pedestal (3) is coated on CPU body (1) surrounding, is provided with one deck thermal conductive silicon glue-line (2) between described pedestal (3) and CPU body (1);
Described first wind-guiding pipeline (4) is fixedly connected on the upper end of pedestal (3), and described second wind-guiding pipeline (5) is fixedly connected on the lower end of pedestal (3), and described first wind-guiding pipeline (4) and the second wind-guiding pipeline (5) keep UNICOM with pedestal (3);
The other end of described first wind-guiding pipeline (4) and the second wind-guiding pipeline (5) is separately fixed at the top and bottom of radiation shell (6), and the first wind-guiding pipeline (4) and the second wind-guiding pipeline (5) keep UNICOM with radiation shell (6);
Described heat radiator (9), for several, is evenly distributed on the outside surface of radiation shell (6);
Described fan (7) and go out the upper and lower end that fan (8) is arranged on radiation shell (6), and form loop.
2. a kind of CPU heat abstractor according to claim 1, is characterized in that: described radiation shell (6) goes to upper and lower the middle font of end opening.
3. a kind of CPU heat abstractor according to claim 1, is characterized in that: described pedestal (3) is in font in the end opening of side.
4. a kind of CPU heat abstractor according to claim 1, is characterized in that: described first wind-guiding pipeline (4) and the second wind-guiding pipeline (5) are in arc surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420710766.4U CN204189124U (en) | 2014-11-25 | 2014-11-25 | A kind of CPU heat abstractor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201420710766.4U CN204189124U (en) | 2014-11-25 | 2014-11-25 | A kind of CPU heat abstractor |
Publications (1)
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CN204189124U true CN204189124U (en) | 2015-03-04 |
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Family Applications (1)
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CN201420710766.4U Expired - Fee Related CN204189124U (en) | 2014-11-25 | 2014-11-25 | A kind of CPU heat abstractor |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107608486A (en) * | 2017-09-20 | 2018-01-19 | 苏州聚力电机有限公司 | Computer CPU heat radiation module |
-
2014
- 2014-11-25 CN CN201420710766.4U patent/CN204189124U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107608486A (en) * | 2017-09-20 | 2018-01-19 | 苏州聚力电机有限公司 | Computer CPU heat radiation module |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150304 Termination date: 20151125 |