CN204179067U - A kind of semiconductor article discharger with layer-stepping transfer bar mechanism - Google Patents
A kind of semiconductor article discharger with layer-stepping transfer bar mechanism Download PDFInfo
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- CN204179067U CN204179067U CN201420711946.4U CN201420711946U CN204179067U CN 204179067 U CN204179067 U CN 204179067U CN 201420711946 U CN201420711946 U CN 201420711946U CN 204179067 U CN204179067 U CN 204179067U
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Abstract
The utility model discloses a kind of semiconductor article discharger with layer-stepping transfer bar mechanism, comprise push rod, peel of mould and blanking track, described push rod lines up two rows, and adjacent two push rods have difference in height in vertical direction; Described peel of mould comprises the protruding post that driven by drive unit and presses down cover plate, and described protruding post is suitable with semiconductor article in the horizontal direction, and adjacent two protruding posts have difference in height in vertical direction; Described blanking track and semiconductor article suitable, adjacent blanking track has difference in height in vertical direction.Difference in height in the shape chamber vertical direction of the difference in height in the difference in height in adjacent two push rod vertical direction, peel of mould in adjacent two protruding post vertical direction, adjacent two blanking tracks and track cover plate composition, three's difference in height matches.Two semiconductor articles adjacent in plastic package lead frame can be carried out the differential goods of transport disengaging height and be separated by the utility model in vertical direction, transport disengaging height difference is enough to adjacent two semiconductor articles are discharged from peel of mould, and the semiconductor leads pin after Trim Molding is not in contact with each other.The utility model structure is simple, effectively improves automaticity and the efficiency of equipment, ensure that quality and the serviceability rate of goods.
Description
Technical field
The utility model relates to operation automatic cutting former after plastic package lead frame, particularly relates to a kind of for carrying out the shaping semiconductor article discharger with layer-stepping transfer bar mechanism of automatic cutting after lead frame plastic packaging.
Background technology
Along with the prices of raw and semifnished materials go up, market competition is day by day fierce, in order to increase production capacity, reduce costs, improves product quality.On the one hand, extensive or very lagre scale integrated circuit (VLSIC) is used widely; On the other hand, domestic integrated circuit (IC) manufacture industry gradually by the packing forms of integrated circuit (IC) and discrete device to many rows, chip type, microminiaturized future development.Goods support (lead frame) is more and more thinner, and bearing product gets more and more, and lead spacing is more and more less.Figure
5shown in be exactly many rows plastic package lead frame of a kind of arrangement terminal pin cross coupling more closely.For both the spacing W adjacent of the semiconductor leads pin after this type of plastic package lead frame Trim Molding close to 0, if still use traditional being separated in same level to discharge semiconductor article device, adjacent two mutual collision deformations of semiconductor leads pin certainly will be caused like this, reduce the serviceability rate of goods.
Utility model content
The purpose of this utility model solves the deficiencies in the prior art, peel of mould is transferred into after providing one can adapt to arrange the cross-linked many row's plastic package lead frame Trim Moldings of terminal pin more closely, realize the differential goods of transport disengaging height to be in vertical direction separated, finally by layer-stepping push rod, semiconductor article is discharged peel of mould, realize the semiconductor article discharger be finally separated with the technological waste in plastic package lead frame.
The technical solution adopted in the utility model is: a kind of semiconductor article discharger with layer-stepping transfer bar mechanism, and comprise push rod, peel of mould and blanking track, described push rod lines up two rows, and adjacent two push rods have difference in height in vertical direction; Described peel of mould comprises the protruding post that driven by drive unit and presses down cover plate, and described protruding post is suitable with semiconductor article in the horizontal direction, and adjacent two protruding posts have difference in height in vertical direction; Described blanking track and semiconductor article suitable, adjacent blanking track has difference in height in vertical direction.
As further improvement of the utility model, described blanking track is also furnished with track cover plate, and shape chamber and the semiconductor article of described blanking track and track cover plate composition are suitable.
Further improve as of the present utility model, difference in height in the shape chamber vertical direction of the difference in height in the difference in height in adjacent two push rod vertical direction, peel of mould in adjacent two protruding post vertical direction and adjacent two blanking tracks and track cover plate composition, three's difference in height matches.
The beneficial effect that the utility model adopts is: two semiconductor articles adjacent in plastic package lead frame can be carried out the differential goods of transport disengaging height and be separated by the utility model in vertical direction, transport disengaging height difference is enough to adjacent two semiconductor articles are discharged from peel of mould, and the semiconductor leads pin after Trim Molding is not in contact with each other.The utility model structure is simple, effectively improves automaticity and the efficiency of equipment, ensure that quality and the serviceability rate of goods.
Accompanying drawing explanation
Fig. 1 is the utility model schematic diagram.
Fig. 2 is the utility model end view.
Fig. 3 is utility model works schematic diagram.
Fig. 4 is blanking track schematic diagram of the present utility model.
Fig. 5 is many rows plastic package lead frame of terminal pin cross coupling.
Shown in figure: 1 plastic package lead frame, 2 push rods, 3 peel of mould, 4 semiconductor articles, 5 blanking tracks, 6 track cover plates, 7 semiconductor leads pin, 8 protruding posts.
Embodiment
Below in conjunction with Fig. 1 to Fig. 5, the utility model is described further.
As shown in the figure, a kind of semiconductor article discharger with layer-stepping transfer bar mechanism, comprises push rod 2, peel of mould 3 and blanking track 5, and described push rod 2 lines up two rows, and adjacent two push rods 2 have difference in height in vertical direction; Described peel of mould 3 comprises the protruding post 8 that driven by drive unit and presses down cover plate, and described protruding post 8 is suitable with semiconductor article in the horizontal direction, and adjacent two protruding posts 8 have difference in height in vertical direction; Described blanking track 5 is suitable with semiconductor article, and adjacent blanking track 5 has difference in height in vertical direction.
Plastic package lead frame 1 is transferred into peel of mould 3 after Trim Molding, semiconductor article 4 realizes finally being separated with the technological waste in plastic package lead frame 1 by peel of mould 3, peel of mould 3 is made up of the protruding post 8 pressing down cover plate and bottom on top, by upper and lower pressure, semiconductor article 4 is separated.Semiconductor article 4 after separation is pushed blanking track 5 by definite value step pitch L and realizes semiconductor article discharge by push rod 2 from peel of mould 3, and push rod 2 resets and enters next circulation.The die cavity that blanking track 5 and track cover plate 6 form and semiconductor article 4 match.Semiconductor leads pin 7 before Trim Molding mutually cross coupling, in semiconductor leads pin 7 same level after Trim Molding, both spacing W adjacent is between 0 ~ 0.1mm.Two adjacent semiconductor articles 4 of mutual for semiconductor leads pin 7 cross coupling are carried out the differential goods of transport disengaging height be in vertical direction separated, transport disengaging height difference T is enough in the process that adjacent two semiconductor articles 4 are discharged from peel of mould 3, and the semiconductor leads pin 7 after Trim Molding is not in contact with each other.Adjacent two push rods 2 in vertical direction the die cavity that form of poor, adjacent two the blanking tracks of layer height 5 and track cover plate 6 in vertical direction layer height difference be all equal to the poor T of transport disengaging height of semiconductor article 4, and mutually to mate.Thus realize semiconductor article multi_layer extraction, semiconductor article 4 layering is discharged peel of mould, is entered layer-stepping blanking track die cavity and flow to subsequent processing by layer-stepping push rod.
Although, semiconductor article 4 is all in same level entering before peel of mould is separated with the technological waste in plastic package lead frame 1, in semiconductor leads pin 7 same level after Trim Molding, both spacing W adjacent is too small, is unfavorable for that semiconductor article 4 is separated discharge in same level; But, two adjacent semiconductor articles 4 of mutual for semiconductor leads pin 7 cross coupling are carried out the differential goods of transport disengaging height be in vertical direction separated, the nearest spacing distance M that semiconductor leads pin 7 after transport disengaging height difference T makes adjacent two Trim Moldings is formed meets semiconductor article 4 in separation discharge process, and the semiconductor leads pin 7 after adjacent two Trim Moldings is not in contact with each other.The semiconductor article 4 after being separated is released in the circulation of layer-stepping push rod; The difference in height of adjacent two layer-stepping push rods, layer-stepping blanking track die cavity difference in height and semiconductor article 4 be transport disengaging height difference T-phase coupling in vertical direction.
Two semiconductor articles adjacent in plastic package lead frame can be carried out the differential goods of transport disengaging height and be separated by the utility model in vertical direction, transport disengaging height difference is enough to adjacent two semiconductor articles are discharged from peel of mould, and the semiconductor leads pin after Trim Molding is not in contact with each other.The utility model structure is simple, effectively improves automaticity and the efficiency of equipment, ensure that quality and the serviceability rate of goods.
Those skilled in the art should know; protection scheme of the present utility model is not limited only to the above embodiments; various permutation and combination and conversion can also be carried out on the basis of above-described embodiment; under the prerequisite without prejudice to the utility model spirit, the various conversion that the utility model carries out all are dropped in protection range of the present utility model.
Claims (3)
1. with a semiconductor article discharger for layer-stepping transfer bar mechanism, it is characterized in that comprising push rod (2), peel of mould (3) and blanking track (5), described push rod (2) lines up two rows, and adjacent two push rods (2) have difference in height in vertical direction; Described peel of mould (3) comprises the protruding post (8) that driven by drive unit and presses down cover plate, and described protruding post (8) is suitable with semiconductor article in the horizontal direction, and adjacent two protruding posts (8) have difference in height in vertical direction; Described blanking track (5) is suitable with semiconductor article, and adjacent blanking track (5) has difference in height in vertical direction.
2. a kind of semiconductor article discharger with layer-stepping transfer bar mechanism according to claim 1, it is characterized in that described blanking track (5) is also furnished with track cover plate (6), the shape chamber that described blanking track (5) and track cover plate (6) form and semiconductor article suitable.
3. a kind of semiconductor article discharger with layer-stepping transfer bar mechanism according to claim 1 and 2, it is characterized in that the difference in height in the shape chamber vertical direction that difference in height in the difference in height in adjacent two push rod (2) vertical direction, peel of mould (3) in adjacent two protruding post (8) vertical direction and adjacent two blanking tracks (5) and track cover plate (6) form, three's difference in height matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420711946.4U CN204179067U (en) | 2014-11-25 | 2014-11-25 | A kind of semiconductor article discharger with layer-stepping transfer bar mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420711946.4U CN204179067U (en) | 2014-11-25 | 2014-11-25 | A kind of semiconductor article discharger with layer-stepping transfer bar mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204179067U true CN204179067U (en) | 2015-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420711946.4U Expired - Fee Related CN204179067U (en) | 2014-11-25 | 2014-11-25 | A kind of semiconductor article discharger with layer-stepping transfer bar mechanism |
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| Country | Link |
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| CN (1) | CN204179067U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524628A (en) * | 2019-08-14 | 2019-12-03 | 安徽国晶微电子有限公司 | Integrated antenna package Trim Molding mould |
-
2014
- 2014-11-25 CN CN201420711946.4U patent/CN204179067U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110524628A (en) * | 2019-08-14 | 2019-12-03 | 安徽国晶微电子有限公司 | Integrated antenna package Trim Molding mould |
| CN110524628B (en) * | 2019-08-14 | 2021-07-20 | 安徽国晶微电子有限公司 | Integrated circuit packaging rib cutting forming die |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C53 | Correction of patent for invention or patent application | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ding Haisheng Inventor after: Chen Yingzhi Inventor after: Yang Yaping Inventor after: Zheng Xiang Inventor after: Liu Zhenglong Inventor after: Wang Zonghua Inventor before: Ding Haisheng Inventor before: Chen Yingzhi Inventor before: Yang Yaping Inventor before: Zheng Xiang Inventor before: Liu Zhenglong Inventor before: Wang Zonghua |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Electronic industrial zone Tongguanshan District 244000 Anhui province Shicheng road in Tongling City Patentee after: Tongling Sanjiashantian Polytron Technologies Inc Address before: Electronic industrial zone Tongguanshan District 244000 Anhui province Shicheng road in Tongling City Patentee before: Tongling Sanjia Yamada Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150225 Termination date: 20191125 |