CN204165924U - A kind of oxygen sensor used in vehicle modularization assembly - Google Patents
A kind of oxygen sensor used in vehicle modularization assembly Download PDFInfo
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- CN204165924U CN204165924U CN201420187021.4U CN201420187021U CN204165924U CN 204165924 U CN204165924 U CN 204165924U CN 201420187021 U CN201420187021 U CN 201420187021U CN 204165924 U CN204165924 U CN 204165924U
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Abstract
The utility model relates to lambda sensor technical field, especially a kind of oxygen sensor used in vehicle modularization assembly, assembly is divided into induction zone, probe seal area, bonding pad and four, body seal district part, four parts are made up of peripheral parts and inner components, peripheral parts comprise probe sheath, hexagonal seat, master collet, sealing-plug and high temperature wire, inner components comprises inductive means, dead ring, sealing block, ceramic briquetting, electrode support, pigtail splice, wire bearing and fixing lock tube, and ceramic briquetting realizes the integration of inner components; Master collet only with hexagonal seat and sealing-plug by welding and rivet the sealing of realization body, do not interfere with inner components; The connector that hexagonal seat encapsulates as assembly, is linked into an integrated entity by welding and other peripheral parts such as probe sheath and master collet.The utility model passes through oxygen sensor used in vehicle assembly standardization zoning design and then realizes modularized encapsulation, improves packaging efficiency and yield rate, reduces production cost.
Description
Technical field
The utility model relates to lambda sensor technical field, especially a kind of oxygen sensor used in vehicle modularization assembly.
Background technology
Along with motor vehicle exhaust emission laws and regulations requirement is more and more stricter, the integrated chip type oxygen sensor of the quick cold start-up of energy is used widely, significantly to reduce engine cold-start discharge.But the square list structure of the severe applied environment of lambda sensor assembly and inner integrated chip, its assembly structure is designed complicated, encapsulation difficulty is large.And the dimensional accuracy error of integrated chip is comparatively large, have impact on encapsulation yield rate to a great extent.BOSCH company of Germany adopts the design of short body pottery briquetting in chip oxygen sensor assembly structure, and it is very long that oxygen sensor chip link gives prominence to ceramic briquetting; Flexible lead wire joint is compressed with the brace of oxygen sensor chip by C type shell fragment and contacts by bonding pad, is fixed together in bonding pad and master collet by cartridge clip, realizes bonding pad stablizing at circumferencial direction; Press fixing by rear end PTFE bearing and master collet again, to realize inner bonding pad fixing at axial direction.The design of this assembly structure is complicated, and being interfixed by inside and outside parts realizes general name encapsulation, to chip size precision and inside and outside parts concentricity requirement very high, encapsulation difficulty is large, as shown in Figure 1.In addition the unsymmetric structure of C type shell fragment easily causes 4, the upper and lower both sides of chip brace and pigtail splice to be stressed uneven, causes empty connection.
DELPHI company adopts the design of long body pottery briquetting in chip oxygen sensor assembly structure, and ceramic briquetting is fixing seal district not only, also will be fixedly connected with the pigtail splice in district; The pigtail splice of bonding pad adopts contact spring design, and rear end is with conductor compression jointing and be fixed in wire bearing, and front springs is touched folder and directly inserted in the locating slot of ceramic briquetting tail end, is contacted with the compression of chip brace by its own resilient realization; Press fixing by back-end sealing plug and master collet again, realize inner bonding pad fixing at axial direction.This general name structural design (Fig. 2) is although simplify to some extent, but to the dimensional accuracy of chip and the concentricity requirement of inner components higher, position slight shift between chip tail end and ceramic briquetting tail end locating slot will cause 4 pigtail splice elastic force uneven, even fracture chip, its encapsulation difficulty is large, and yield rate is low.
Patent CN 101216452A discloses a kind of chip oxygen sensor assembly, and it is mainly through being designed to a kind of contact spring structure of axial force distribution to realize " the blind dress " of encapsulation process by pigtail splice.Although this assembly structure can reduce bonding pad circumference encapsulation difficulty and make the elastic force of 4 pigtail splices even, realize circumferential portion " blind dress ", but require high to directional precision axial in structural assembly, because this highly determines the elastic force of contact spring, and be pressed by back-end sealing plug and master collet fixedly to realize inner bonding pad fixing at axial direction, which again increases Altitude control difficulty in encapsulation process, formed axially unstable, as shown in Figure 3.
Utility model content
In order to overcome existing above-mentioned deficiency, the utility model provides a kind of oxygen sensor used in vehicle modularization assembly.
The utility model solves the technical scheme that its technical matters adopts: a kind of oxygen sensor used in vehicle modularization assembly, be divided into induction zone, probe seal area, bonding pad and four, body seal district part, four parts are made up of peripheral parts and inner components, peripheral parts comprise probe sheath, hexagonal seat, master collet, sealing-plug and high temperature wire, inner components comprises inductive means, dead ring, sealing block, pottery briquetting, electrode support, pigtail splice, wire bearing and fixing lock tube, pottery briquetting is Intermediate Gray boss, tail end has down the long body design of groove, intermediate lands compacting sealing block, tail end falls groove and fixes with fixing lock tube, fixing lock tube wire bearing links together.Master collet in encapsulation process only with hexagonal seat and sealing-plug by welding and rivet the sealing of realization body, master collet exceeds certain distance than inner components.Hexagonal seat is the connector of assembly, and connect inner components by riveting pottery briquetting, be connected other peripheral parts by welding with probe sheath and master collet, with circular hole in the middle of sealing-plug, in circular hole, fill is for there being ventilated membrane.
According to another embodiment of the present utility model, comprising inductive means further can be induction chip, common induction zirconium pipe or the five live width territory induction zirconium pipes with three electrodes, according to the difference of inductive means, be called integrated chip type oxygen sensor modularization assembly, common tubular oxygen sensor modularization assembly and five live width territory tubular oxygen sensor modularization assemblies respectively.
According to another embodiment of the present utility model, comprise induction chip in integrated chip type oxygen sensor assembly further and only brace is exposed ceramic briquetting end face, the height exposed is lower than electrode support.Pigtail splice is the design of contact spring formula, comprises front end in contact bullet pin, crimping termination, rear end and centre U-shaped buffering three part, and is fixed spacing by electrode support and wire bearing; Contact is played pin and carries out in induction chip both sides equidistantly spacing by electrode support, and fixing crimping termination, wire bearing inside, outside is fixed by fixing lock tube, realizes the axial restraint of bonding pad.
According to another embodiment of the present utility model, comprise electrode support diameter further and be less than wire bearing, pigtail splice is provided with middle U-shaped buffer portion.
According to another embodiment of the present utility model, comprise tubular oxygen sensor modularization assembly inner components further and not only comprise dead ring, sealing block, pottery briquetting, electrode support, pigtail splice, wire bearing and fixing lock tube, also has induction zirconium pipe, heating rod, interior Electrode connection snap ring, external electrode Joining clasp, heating rod inserts induction zirconium pipe inside and is fixed by interior Electrode connection snap ring, the part exposing induction zirconium pipe is welded with heat lead by silver-copper brazing alloy, the pigtail splice of this lead-in wire and outer lead (white) welds together, heating rod blocks fixing by internal tension by the bottom of interior Electrode connection snap ring, middle part is by outer tension force and induction zirconium pipe internal electrode close contact, the pigtail splice of top and outer lead (black) welds together.
According to another embodiment of the present utility model, the external electrode junction comprising induction zirconium pipe is further arranged on the step place of zirconium pipe and extends upwardly to seal area, bottom and the zirconium pipe step of external electrode Joining clasp wrap up, wherein connection strip in bottom is corresponding with the external electrode junction of extension also through seal area, the pigtail splice of top and outer lead (grey) welds together, electrode support is with positioning boss, it is placed on ceramic briquetting top for fixing and isolate heat lead and the contact conductor of this position flexibility, and with wire bearing is combined, linked into an integrated entity with ceramic briquetting by fixing lock tube, realize bonding pad axial restraint.
According to another embodiment of the present utility model, comprise ceramic briquetting main body further and induction zirconium pipe and heating rod are wrapped in centre completely, the flexible electrode lead-in wire exposed is connected with high temperature wire with heat lead, pottery briquetting top planes side corresponding to contact conductor is with detent, with the boss corresponding matching of electrode support, guarantee that bonding pad circumferencial direction is fixed.
According to another embodiment of the present utility model, comprising five live width territory tubular oxygen sensor modularization assembly inner components further comprises with the induction zirconium pipe of three electrodes, three, interior China and foreign countries Electrode connection snap ring and the dead ring with Joining clasp pilot hole, zirconium pipe step place is all arranged on electrode and external electrode junction in the induction zirconium pipe of three electrodes, and be spaced from each other journey, equally all extend upwardly to electrode in seal area identical with external electrode Joining clasp shape, its wedging position is less than the semi-ring of 180 degree, and with positioning insertion pin; Dead ring is with pilot hole, and middle electrode and external electrode Joining clasp symmetry are inserted fixing, and China and foreign countries' electrode connection equivalence contact of induction zirconium pipe is also mutually isolated.
The beneficial effects of the utility model are:
(1) pass through lambda sensor assembly standardization zoning design and then realize modularized encapsulation, improving packaging efficiency and yield rate, reducing production cost.
(2) master collet of assembly in encapsulation process only with hexagonal seat and sealing-plug by welding and rivet the sealing of realization body, do not interfere with inner components, and exceed certain distance than inner components, can on the basis not affecting exterior part size, by raising or reducing interior integrally parts, realize the design modifying of different customer requirement and applied environment.
(3) 3 part contact spring designs of pigtail splice and the front and back split of wire bearing and external diameter is stepped design in integrated chip type oxygen sensor assembly, can eliminate the rigging error because element size precision and decentraction cause, realize flexibly connecting.
(4) in tubular oxygen sensor assembly structure, zirconium pipe external electrode (comprising middle electrode) junction will be responded to be arranged on zirconium pipe step and to extend upwardly to seal area, the close contact of external electrode (middle electrode) Joining clasp and zirconium pipe step top electrode junction can be realized on the one hand by the axial downforce of ceramic briquetting to sealing block, on the other hand, the pressurized of sealing block shrinks the circumferential extruding force of formation and can guarantee to extend to the electrode connection contact of seal area closely, so just achieve external electrode (middle electrode) dual pressing contact, ensure that connection reliability.
(5) in tubular oxygen sensor assembly, ceramic briquetting main body is longer, induction zirconium pipe and heating rod are wrapped in centre completely, avoids foreign impacts; In addition ceramic briquetting top planes side corresponding to contact conductor is with detent, with the boss corresponding matching of electrode support, guarantees that bonding pad circumferencial direction is fixed.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1,2,3 is three kinds of structural representations of existing chip oxygen sensor assembly;
Fig. 4 is oxygen sensor used in vehicle functional areas distribution schematic diagrams;
Fig. 5 is the utility model integrated chip type oxygen sensor assembly structure chart;
Fig. 6 is integrated chip type oxygen sensor assembly probe seal area and bonding pad enlarged diagram;
Fig. 7 is the sealing-plug external effects figure of central filler ventilated membrane;
Fig. 8 is the utility model tubular oxygen sensor assembly structure chart;
Fig. 9 is tubular oxygen sensor assembly probe seal area and bonding pad enlarged diagram;
Figure 10 is induction zirconium pipe and Electrode connection position partial schematic diagram;
Figure 11 is that middle electrode and external electrode Joining clasp coordinate schematic diagram with band pilot hole dead ring;
Figure 12 is the induction zirconium pipe step vertical view with 3 electrodes;
Figure 13 is the induction zirconium pipe front view with 3 electrodes.
A1. induction zone in figure, A2. to pop one's head in seal area, A3. bonding pad, A4. body seal district, 11. inductive means, 11P. induction chip, 12. dead rings, 13. sealing blocks, 14. ceramic briquettings, 15. electrode supports, 16. pigtail splices, 17. wire bearings, 18. fixing lock tubes, 21. probe sheath, 22. hexagonal seats, 23. master collets, 24. sealing-plugs, 25. high temperature wires, 141. ceramic briquetting boss, 142. ceramic briquettings fall groove, end in contact bullet pin before 161. pigtail splices, the 162. U-shaped bufferings in pigtail splice stage casing, 163. pigtail splice back segment crimping terminations, d1. oxygen sensor chip can allow circumferential rigging error scope, d2. difference in height between inner components and master collet, 231. master collet tops and sealing-plug riveted joint place, 24. master collet tops and sealing-plug riveted joint place, the ventilated membrane of 241. sealing-plug central filler, 25. high temperature wires, 11G. responds to zirconium pipe, 11H. heating rod, 11O. external electrode Joining clasp, Electrode connection snap ring in 11I., external electrode bonding pad on 111. induction zirconium pipe steps, the extension area that 112. induction zirconium pipe external electrodes connect, electrode connecting region in 113. induction zirconium pipes, 141B. pottery briquetting top detent, positioning boss on 151. electrode supports, pilot hole on 121. dead rings, 11O. external electrode Joining clasp, Electrode connection snap ring in 11M., positioning insertion pin in 11a. on electrode and external electrode Joining clasp, external electrode bonding pad on 111. induction zirconium pipe steps, the extension area that 112. induction zirconium pipe external electrodes connect, middle electrode connecting region on 114. induction zirconium pipe steps, the extension area of Electrode connection in 115. induction zirconium pipes.
Embodiment
A kind of oxygen sensor used in vehicle assembly, refers to Fig. 4, can be divided into A1 induction zone, A2 pops one's head in seal area, A3 bonding pad and A4 body seal district totally 4 parts by function.
If Fig. 5 is integrated chip type oxygen sensor assembly structure schematic diagram of the present utility model, its inner components comprises 11P. induction chip, 12. dead rings, 13. sealing blocks, 14. ceramic briquettings, 15. electrode supports, 16. pigtail splices, 17. wire bearings, 18. fixing lock tubes; Its peripheral parts comprise 21. probe sheath, 22. hexagonal seats, 23. master collets, 24. sealing-plugs, 25. high temperature wires.
The long body design that pottery briquetting 14 is Intermediate Gray boss, tail end has down groove, is shown in enlarged diagram 6.Intermediate lands 141 is for compacting sealing block 13, and tail end falls groove 142 for fixing with fixing lock tube 18, and then is linked together by wire bearing 17, realizes the integration of inner components;
Brace is only exposed ceramic briquetting 14 end face by induction chip 11P, to pass through resilient contact with pigtail splice 16; Pigtail splice 16 is the design of contact spring formula, comprises front end in contact bullet pin 161, crimping termination, rear end 163 and centre U-shaped buffering 162 3 part, and is fixed spacing by electrode support 15 and wire bearing 17;
Electrode support 15 only carries out equidistantly spacing for contact is played pin 161 in oxygen sensor chip 11 both sides, guarantees the elastic force pressure uniformity of chip both sides contact point; Fixing crimping termination 163, wire bearing 16 inside, outside is fixed by fixing lock tube 18, realizes the axial restraint of bonding pad.
Electrode support 15 and wire bearing 17 in addition design feature are, electrode support 15 diameter is less than wire bearing 16, coordinate the effect of U-shaped buffering 162 in the middle of pigtail splice again, oxygen sensor chip 11 can be allowed to occur in assembling process, and circumferential deviation is in the scope of d1, and then realizes flexibly connecting.
Master collet 23 in encapsulation process only with hexagonal seat 22 and sealing-plug 24 by welding and rivet the sealing of realization body, do not interfere with inner components, and exceed certain distance d2 than inner components, can on the basis not affecting exterior part size, by raising or reducing interior integrally parts, realize the design modifying of different customer requirement and applied environment.
The connector that hexagonal seat 22 encapsulates as assembly, is realized the encapsulation of interior integrally parts, is linked into an integrated entity by welding and other peripheral parts such as probe sheath 21 and master collet 23 by riveting pottery briquetting 14.
As shown in Figure 7, with circular hole in the middle of sealing-plug 24, by the press seal at master collet riveting position 231, realize water-proof function, then by central filler ventilated membrane 241, the permeation functions of realization body.
The notable feature of this utility model is by lambda sensor assembly standardization zoning design and then realize modularized encapsulation, improves packaging efficiency and yield rate, reduces production cost.
The another kind of embodiment of this utility model is the encapsulation of the tubular oxygen sensor being tubulose for induced inside parts, as Fig. 8, shown in 9, its feature shows as inner components and not only comprises dead ring 12, sealing block 13, ceramic briquetting 14, electrode support 15, pigtail splice 16, wire bearing 17 and fixing lock tube 18, also has induction zirconium pipe 11G, heating rod 11H, interior Electrode connection snap ring 11I and external electrode Joining clasp 11O;
Heating rod 11H head heating zone inserts that induction zirconium pipe 11 is inner also to be fixed by interior Electrode connection snap ring 11I, and afterbody is welded with heat lead, and this lead-in wire is white with outer lead 25() pigtail splice 16 weld together;
Heating rod card 11H lives fixing by internal tension by the bottom of interior Electrode connection snap ring 11I, middle part by outer tension force and induction zirconium pipe internal electrode 113 close contact, top and outer lead 25(black) pigtail splice 16 weld together;
As shown in Figure 10, the external electrode junction of induction zirconium pipe 11 is arranged on the step place 111 of zirconium pipe and extends upwardly to seal area 112, bottom and the zirconium pipe step of external electrode Joining clasp 11O wrap up, connect strip in the middle part of it corresponding with the external electrode junction 112 of extension and through seal area, top and outer lead 25(grey) pigtail splice 16 weld together;
In Fig. 9, electrode support 15 is with positioning boss 151, it is placed on ceramic briquetting 14 top for fixing and isolate heat lead and the contact conductor of this position flexibility, and with wire bearing 17 is combined, linked into an integrated entity with ceramic briquetting 14 by fixing lock tube 18, realize bonding pad axial restraint.
Pottery briquetting 14 main body is longer, induction zirconium pipe 11 and heating rod 11H are wrapped in centre completely, avoids foreign impacts, and only exposes flexible electrode lead-in wire and follow high temperature wire 25 to be connected with heat lead; In addition ceramic briquetting 14 top planes side corresponding to contact conductor is with detent 141B, with boss 151 corresponding matching of electrode support, guarantees that bonding pad circumferencial direction is fixed.
3rd kind of embodiment of this utility model is for responding to the encapsulation that zirconium pipe is the tubular type five live width domain oxygen sensor with three electrodes, its being distinguished as to common tubular oxygen sensor respond to zirconium pipe 11G be with in three electrodes in China and foreign countries have corresponding bonding pad, as shown in figure 13.Interior electrode connecting region 113 and correspondence connect identical with common induction zirconium pipe; External electrode bonding pad is made up of 111 and 112, middle electrode connecting region is made up of 114 and 115, middle electrode and external electrode junction are all arranged on zirconium pipe step place, and be spaced from each other journey, the position that zirconium pipe step overlooks shown in Figure 12 111 and 114 as responded to, equally all extends upwardly to the position of seal area 112 and 115;
Middle Electrode connection snap ring 11M is identical with external electrode Joining clasp 11O shape, and its wedging position is less than the semi-ring of 180 degree, and with positioning insertion pin 11a, as shown in figure 11.
Dead ring 12 is with pilot hole 121, so that the positioning insertion pin 11a symmetry of middle electrode and external electrode Joining clasp is inserted fixing, guarantees to contact with China and foreign countries' electrode connection equivalence of induction zirconium pipe and mutually isolated with this.
Integrated chip type oxygen sensor assembly encapsulation specific embodiment:
(1) spherical for micron talcum powder end is pressed into round outside but spuare inside shape sealing block 13 in advance, by filling out the quality of powder Altitude control sealing block;
(2) alumina ceramics dead ring 12, sealing block 13 and alumina ceramics pottery briquetting 14 is superposed successively and is through on oxygen sensor chip 11P, and entirety is put in hexagonal seat 22, by applying 200 ~ 500 kilograms of pressure on ceramic briquetting 14, by sealing block 13 compacting, guarantee that probe A 2 seal area seals completely, and in the process by fixture location make oxygen sensor chip 11P tail end only brace expose the end face of ceramic briquetting 14;
(3) at room temperature to be pressed hexagonal seat 22 upper port edge by fixture, ceramic briquetting 14 intermediate lands 141 is fastened and compresses, completes cold riveting pressure, then hexagonal seat 22 entirety is heated to 500 degree ~ 700 degree, and rivet hot pressure rapidly;
(4) by laser bonding, double-deck probe sheath is welded to position, hexagonal seat 22 front end, and then completes seal encapsulation;
(5) the cutting wire also upper pigtail splice 16 of crimping, puts on wire bearing 17, sealing-plug 24, fixing lock tube 18 and master collet 23, sealing-plug 24 central filler waterproof ventilated membrane successively;
(6) end in contact bullet pin 161 entirety before pigtail splice 16 is put electrode support 15 circumference spacing, carry out inserting afterwards again with chip tail end, make four to contact and play four the brace one_to_one corresponding of pin 161 with oxygen sensor chip 11P, guarantee that white line wire is connected with heating circuit, electrode in black conductive contact chip, grey conductive contact off-chip capacitive pole;
(7) fixing lock tube 18 is crimped with ceramic briquetting 14, and fixed by the groove 142 that falls on ceramic briquetting 14, ceramic briquetting 14 and wire bearing 17 are linked into an integrated entity;
(8) by master collet 23 through hexagonal seat 22 is pressed onto position, then by laser, circumference soldering to be got up;
(9) finally sealing-plug 24 and master collet 23 are sealed by circumference riveting and be fixed up, and then realization body end waterproof and breathable.
More than illustrate the utility model just illustrative; and it is nonrestrictive; those of ordinary skill in the art understand; when not departing from the spirit and scope that claims limit; many amendments, change or equivalence can be made, but all will fall in protection domain of the present utility model.
Claims (8)
1. an oxygen sensor used in vehicle modularization assembly, be divided into induction zone (A1), probe seal area (A2), bonding pad (A3) and body seal district (A4) four parts, described four parts are made up of peripheral parts and inner components, described peripheral parts comprise probe sheath (21), hexagonal seat (22), master collet (23), sealing-plug (24) and high temperature wire (25), described inner components comprises inductive means (11), dead ring (12), sealing block (13), pottery briquetting (14), electrode support (15), pigtail splice (16), wire bearing (17) and fixing lock tube (18), it is characterized in that, described ceramic briquetting (14) is Intermediate Gray boss (141), tail end has down the long body design of groove (142), described intermediate lands (141) compacting sealing block (13), described tail end falls groove (142) and fixes with fixing lock tube (18), described fixing lock tube (18) and wire bearing (17) link together, described master collet (23) in encapsulation process only with hexagonal seat (22) and sealing-plug (24) by welding and rivet the sealing of realization body, described master collet (23) exceeds certain distance d2 than inner components, the connector that described hexagonal seat (22) is assembly, realizes connection and the sealing of inner components by riveting pottery briquetting (14), by with probe sheath (21) and master collet (23) weld the connection realizing peripheral parts, with circular hole in the middle of described sealing-plug (24), in described circular hole, fill is for there being ventilated membrane.
2. a kind of oxygen sensor used in vehicle modularization assembly according to claim 1, it is characterized in that, described inductive means (11) can be induction chip (11P), common induction zirconium pipe or five live width territories induction zirconium pipe (11G) with three electrodes, according to the difference of inductive means (11), be called integrated chip type oxygen sensor modularization assembly, common tubular oxygen sensor modularization assembly and five live width territory tubular oxygen sensor modularization assemblies respectively.
3., according to a kind of oxygen sensor used in vehicle modularization assembly according to claim 1 or claim 2, it is characterized in that brace is only exposed ceramic briquetting (14) end face by described induction chip (11P), the height exposed is lower than electrode support (15); Described pigtail splice (16) is the design of contact spring formula, comprises front end in contact bullet pin (161), crimping termination, rear end (163) and centre U-shaped buffering (162) three part, and is fixed spacing by described electrode support (15) and wire bearing (17); Contact is played pin (161) and carries out equidistantly spacing in induction chip (11P) both sides by described electrode support (15), described wire bearing (17) inside fixing crimping termination (163), outside fixing by fixing lock tube (18), realize the axial restraint of bonding pad (A3).
4. a kind of oxygen sensor used in vehicle modularization assembly according to claim 3, it is characterized in that, described electrode support (15) diameter is less than wire bearing (17), and diameter difference is d2, and described pigtail splice (16) is provided with middle U-shaped buffering (162) part.
5. according to a kind of oxygen sensor used in vehicle modularization assembly according to claim 1 or claim 2, it is characterized in that described tubular oxygen sensor modularization assembly inner components not only comprises dead ring (12), sealing block (13), pottery briquetting (14), electrode support (15), pigtail splice (16), wire bearing (17) and fixing lock tube (18), also has induction zirconium pipe (11G), heating rod (11H), interior Electrode connection snap ring (11I), external electrode Joining clasp (11O), it is inner and fixing by interior Electrode connection snap ring (11I) that described heating rod (11H) inserts induction zirconium pipe (11G), the part exposing induction zirconium pipe (11G) is welded with heat lead by silver-copper brazing alloy, the pigtail splice of this lead-in wire and outer lead (white) welds together, heating rod (11H) blocks fixing by internal tension by the bottom of described interior Electrode connection snap ring (11I), middle part is by outer tension force and induction zirconium pipe (11G) internal electrode close contact, the pigtail splice (16) of top and outer lead (black) welds together.
6. according to a kind of oxygen sensor used in vehicle modularization assembly according to claim 1 or claim 2, it is characterized in that the external electrode junction of described induction zirconium pipe (11G) is arranged on the step place of zirconium pipe and extends upwardly to seal area, bottom and the zirconium pipe step of external electrode Joining clasp wrap up, wherein connection strip in bottom is corresponding with the external electrode junction of extension also through seal area, the pigtail splice (16) of top and outer lead (grey) welds together, described electrode support (15) is with positioning boss (151), it is placed on heat lead and contact conductor that ceramic briquetting (14) top is used for fixing and isolating this position flexibility, and with wire bearing (17) is combined, linked into an integrated entity with ceramic briquetting (14) by fixing lock tube (18), realize bonding pad (A3) axial restraint.
7. according to a kind of oxygen sensor used in vehicle modularization assembly according to claim 1 or claim 2, it is characterized in that described ceramic briquetting (14) main body will respond to zirconium pipe (11G) and heating rod (11H) wraps in centre completely, the flexible electrode lead-in wire exposed is connected with high temperature wire (25) with heat lead, described ceramic briquetting (14) top planes side corresponding to contact conductor is with detent (141B), with boss (151) corresponding matching of electrode support (15), guarantee that bonding pad (A3) circumferencial direction is fixed.
8. according to a kind of oxygen sensor used in vehicle modularization assembly according to claim 1 or claim 2, it is characterized in that described inner components comprises the induction zirconium pipe (11G) with three electrodes, three, interior China and foreign countries Electrode connection snap ring and the dead ring (12) with Joining clasp pilot hole (121), middle electrode and the external electrode junction of the described induction zirconium pipe (11G) with three electrodes are all arranged on zirconium pipe step place, and be spaced from each other journey, equally all extend upwardly to seal area, described middle electrode is identical with external electrode Joining clasp shape, its wedging position is less than the semi-ring of 180 degree, and with positioning insertion pin (11a), described dead ring (12) is with pilot hole (121), and described middle electrode and external electrode Joining clasp symmetry are inserted fixing, and China and foreign countries' electrode connection equivalence contact of described induction zirconium pipe (11G) is also mutually isolated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420187021.4U CN204165924U (en) | 2014-04-17 | 2014-04-17 | A kind of oxygen sensor used in vehicle modularization assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420187021.4U CN204165924U (en) | 2014-04-17 | 2014-04-17 | A kind of oxygen sensor used in vehicle modularization assembly |
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| CN204165924U true CN204165924U (en) | 2015-02-18 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103913485A (en) * | 2014-04-17 | 2014-07-09 | 常州联德电子有限公司 | Modular assembly of automotive oxygen sensor and encapsulation method of assembly |
| CN106596848A (en) * | 2016-11-15 | 2017-04-26 | 莱鼎电子材料科技有限公司 | Novel oxygen sensor and encapsulating method thereof |
-
2014
- 2014-04-17 CN CN201420187021.4U patent/CN204165924U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103913485A (en) * | 2014-04-17 | 2014-07-09 | 常州联德电子有限公司 | Modular assembly of automotive oxygen sensor and encapsulation method of assembly |
| CN103913485B (en) * | 2014-04-17 | 2017-03-08 | 常州联德电子有限公司 | A kind of oxygen sensor used in vehicle modularity assembly and method for packing |
| CN106596848A (en) * | 2016-11-15 | 2017-04-26 | 莱鼎电子材料科技有限公司 | Novel oxygen sensor and encapsulating method thereof |
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| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20150218 Effective date of abandoning: 20171114 |