CN204164710U - The specular removal height of low thermal resistance is aobvious refers to double-side white light LEDs - Google Patents
The specular removal height of low thermal resistance is aobvious refers to double-side white light LEDs Download PDFInfo
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- CN204164710U CN204164710U CN201420454664.0U CN201420454664U CN204164710U CN 204164710 U CN204164710 U CN 204164710U CN 201420454664 U CN201420454664 U CN 201420454664U CN 204164710 U CN204164710 U CN 204164710U
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Abstract
The utility model relates to a kind of specular removal height aobvious finger double-side white light LEDs of low thermal resistance.Solve the problem that non-uniform light in prior art, radiating effect are bad.LED comprises transparent substrate, substrate arranges luminescence chip, described substrate luminescence chip place one side is packaged with dielectric layer, be packaged with dielectric layer at substrate back or be coated with phosphor powder layer, described size of substrate is directly proportional to LED power, concavo-convexly on the surface of described substrate both sides is formed with one deck extension layer.The utility model has the advantages that and improve LED uniformity of luminance, make lighting angle reach 360 degree, solve LED little for bulb lamp lighting angle, the problem of non-uniform light.Substrate both sides are provided with extension layer, and extension layer had both made LED luminescence more even, and added area of dissipation, improve radiating effect, made to make more high-power LED.Be provided with louvre in substrate, further increase radiating effect.
Description
Technical field
The utility model relates to a kind of LED technology field, especially relates to a kind of specular removal height aobvious finger double-side white light LEDs of low thermal resistance.
Background technology
The osram lamp of artificial light sources from is to state-of-the art electricity-saving lamp, and their illumination mode is to all the winds luminous all the time, is all the illuminating product of 360 degree of luminescences.The luminous characteristics of traditional LED lamp tool has direction one to property, only to project a light beam to a fixing direction.Clearly traditional LED is applied to room lighting towards the photocurrent versus light intensity that a specific direction sends out light beam and can be very restricted, and can not come into huge numbers of families like a cork.For making LED illumination product can be widely used in the fields such as indoor general lighting, commercial lighting, office lighting, fill up the deficiency of traditional LED illumination, studying 360 degree of beam angle space luminescence LED product becomes the problem being badly in need of solving.Also there is the LED product of 360 degree of luminescences in the market, if the patent No. is 201120148195.6, the Chinese utility model patent of the high efficiency LED of a kind of LED chip 4 of title π bright dipping, its structure is for install LED chip on the transparent substrate, and coating or the mixing of encapsulation one deck are by the transparent dielectric layer of fluorescent material, reach the effect of 360 degree of luminescences.But the patented product exists several shortcoming: 1. luminescence is even not, there is blue light overflow problem, the pole forceful rays of short-term can cause the damage of cornea, retina especially macula area.2. substrate area of dissipation is little, and light fixture radiating effect is poor, receives the whole lamp power of heat radiation restriction low.
Summary of the invention
The utility model mainly solves the bad problem of non-uniform light in prior art, radiating effect, provides that a kind of specular removal height of low thermal resistance is aobvious refers to double-side white light LEDs.
Above-mentioned technical problem of the present utility model is mainly solved by following technical proposals: a kind of specular removal height of low thermal resistance is aobvious refers to double-side white light LEDs, comprise transparent substrate, substrate arranges luminescence chip, described substrate luminescence chip place one side is packaged with dielectric layer, be packaged with dielectric layer at substrate back or be coated with phosphor powder layer, described size of substrate is directly proportional to LED power, concavo-convexly on the surface of described substrate both sides is formed with one deck extension layer.The utility model adopts double-side, certain depth improves LED uniformity of luminance, makes lighting angle reach 360 degree, solve LED little for bulb lamp lighting angle, the problem of non-uniform light.Substrate both sides are provided with extension layer, and extension layer had both made LED luminescence more even, and added area of dissipation, improve radiating effect, made to make more high-power LED.
As a kind of preferred version, described LED power every 1W counterpart substrate area 1 ~ 5cm
2.Namely LED makes how much power, and the substrate area of LED is that power number is multiplied by 1cm
2~ rate number is multiplied by 1cm
2, this substrate can do the polygonal shape on triangularity, quadrangle, trapezoidal or more limit.
As a kind of preferred version, described sheet metal is provided with Ka Zui, side, portion, card gonys is provided with card article along edge, described base ends on the surface correspondence be provided with draw-in groove, the both sides of Ka Zui are respectively arranged with discount, substrate on both sides, end respectively correspondence be provided with catching groove, sheet metal is arranged on after on substrate, card article is entrapped in draw-in groove, and discount is fastened in catching groove.Sheet metal is not easily movable and move up and down, and what it is such that sheet metal can be more fastening is wrapped on substrate, not easily departs from, improves product yield and quality.
As a kind of preferred version, described extension layer comprises some projections and some grooves, described projection and the groove arranged adjacent that interlocks becomes several rows, and row and row between projection and groove also interlaced, described projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.This diffusion layer makes source light to carry out multiple reflections and refraction, and make luminescence more even, diffusion layer too increases the contact area of substrate side surfaces and air in addition, adds the radiating effect of substrate, effectively improves the making power of LED.
As a kind of preferred version, in described substrate, be provided with some louvres along its length, the perforate in substrate both ends of the surface respectively of described louvre two ends.This louvre adds the contact area of substrate and air, and the heat of substrate inside can directly be derived by louvre, further increases the radiating effect of substrate, solves existing 360 degree of emitting led problems low by the whole lamp power of heat radiation restriction.The existence of louvre also makes light source luminescent more even in addition, too increases brightness and illumination simultaneously.
As a kind of preferred version, described louvre density of setting in substrate reduces to surrounding gradually by near luminescence chip.Luminescence chip position heat is more, and by rationally arranging louvre density, the position heat radiation making heat in substrate many is faster.
As a kind of preferred version, only encapsulation medium layer above described luminescence chip, the dielectric layer after encapsulation is elongate in shape.In order to reduce costs, not encapsulation medium layer on whole substrate surface, and only encapsulate directly over luminescence chip, form the dielectric layer of elongate in shape.
As a kind of preferred version, the dielectric layer on described substrate positive and negative is the same fluorescent glue, or the dielectric layer in substrate side is yellow fluorescent glue, and the dielectric layer on another side is red fluorescent glue.Dielectric layer is fluorescent glues that are a kind of, two kinds or more fluorescent material mixing.Positive and negative encapsulates different fluorescent glues, avoids redness, yellow fluorescent powder mixes, and causes part fluorescent material to be absorbed, and improves the utilization rate of fluorescent material.
As a kind of preferred version, described substrate positive and negative is rough structure.Reverse side carries out roughening treatment, forms rough structure, achieves the multiple reflections of light in transparency carrier, reach the lifting of the extraction efficiency of substrate exterior light by regularly arranged rough structure, effectively prevent the blue light spilling that LED wafer sends.
As a kind of preferred version, the luminescence chip in described substrate front side and the luminescence chip on substrate back side stagger and arrange.Positive and negative luminescence chip staggers setting, avoids causing mutual extinction in positive and negative symmetric position, reduces the luminous efficiency of product.
The bulb adopting this LED to make, includes bulb shield, includes three LED in bulb shield, and three LED are downward radial arrangement, and in 120 degree between LED, each LED is fixed in bulb respectively by pillar.
Therefore, the utility model has the advantages that: 1. improve LED uniformity of luminance, make lighting angle reach 360 degree, solve LED little for bulb lamp lighting angle, the problem of non-uniform light.2. substrate both sides are provided with extension layer, and extension layer had both made LED luminescence more even, and added area of dissipation, improve radiating effect, made to make more high-power LED.3. be provided with louvre in substrate, further increase radiating effect.
Accompanying drawing explanation
Accompanying drawing 1 is a kind of structural representation of the utility model side-looking;
Accompanying drawing 2 is a kind of structural representations of the utility model;
Accompanying drawing 3 is the another kind of structural representations of the utility model;
Accompanying drawing 4 be in accompanying drawing 2 A-A to cross-sectional view;
Accompanying drawing 5 is a kind of structural representations of substrate side surfaces extension layer in the utility model;
Accompanying drawing 6 is a kind of structural representations of the bulb that the utility model is made.
1-substrate 2-luminescence chip 3-dielectric layer 4-louvre 5-projection 6-groove.
Detailed description of the invention
Below by embodiment, and by reference to the accompanying drawings, the technical solution of the utility model is described in further detail.
Embodiment:
The specular removal height of a kind of low thermal resistance of the present embodiment is aobvious refers to double-side white light LEDs, as depicted in figs. 1 and 2, comprise substrate 1, this substrate is transparency carrier, the front of substrate is provided with luminescence chip 2, luminescence chip linear array along its length in substrate front side.Size of substrate by LED power decision, with the corresponding 5cm of every 1W power in the present embodiment
2for example, as 10W, then substrate area size is 50 cm
2.Be packaged with dielectric layer 3 in substrate front side, be coated with phosphor powder layer at substrate back.Also can be provided with luminescence chip at substrate back, the luminescence chip in substrate front side and the luminescence chip on substrate back stagger and arrange.Dielectric layer 3 is packaged with respectively at the positive and negative of substrate.As shown in Figure 2, dielectric layer is encapsulated on the obverse and reverse of whole substrate, and dielectric layer is fluorescent glues that are a kind of, two kinds or more fluorescent material mixing, and the dielectric layer in the present embodiment in substrate front side is yellow fluorescent glue, and the dielectric layer on reverse side is red fluorescent glue.In order to reduce costs, as shown in Figure 3, give dielectric layer another kind of structure, only encapsulation medium layer above luminescence chip, the dielectric layer after encapsulation is elongate in shape.
In order to improve radiating effect and ensure evenly luminous, concavo-convexly on the surface of substrate both sides be formed with one deck extension layer, as shown in Figure 5, extension layer comprises some projections 5 and some grooves 6, projection and the groove arranged adjacent that interlocks becomes several rows, and between row and row projection and groove also interlaced, projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.
As shown in Figure 4, in order to improve radiating effect further, in substrate 1, be provided with some louvres 4 along its length, the perforate in substrate both ends of the surface respectively of described louvre two ends.Louvre density of setting in substrate 1 reduces to surrounding gradually by near luminescence chip.
As shown in Figure 6, adopt the bulb that above-mentioned LED makes, this bulb comprises three LED, and three LED are downward radial arrangement, and in 120 degree between LED, each LED is fixed in bulb respectively by pillar.
Specific embodiment described herein is only to the explanation for example of the utility model spirit.The utility model person of ordinary skill in the field can make various amendment or supplements or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present utility model or surmount the scope that appended claims defines.
Although more employ the terms such as substrate, luminescence chip, dielectric layer, louvre, projection herein, do not get rid of the possibility using other term.These terms are used to be only used to describe and explain essence of the present utility model more easily; The restriction that they are construed to any one additional is all contrary with the utility model spirit.
Claims (9)
1. the specular removal height of a low thermal resistance is aobvious refers to double-side white light LEDs, comprise transparent substrate, substrate arranges luminescence chip, comprise transparent substrate, it is characterized in that: on substrate (1), arrange luminescence chip (2), described substrate luminescence chip place one side is packaged with dielectric layer (3), is packaged with dielectric layer or is coated with phosphor powder layer at substrate back, described size of substrate is directly proportional to LED power, concavo-convexly on the surface of described substrate both sides is formed with one deck extension layer.
2. the specular removal height of low thermal resistance according to claim 1 is aobvious refers to double-side white light LEDs, it is characterized in that described LED power every 1W counterpart substrate area 1 ~ 5cm
2.
3. the specular removal height of a kind of low thermal resistance according to claim 1 is aobvious refers to double-side white light LEDs, it is characterized in that described extension layer comprises some projections (5) and some grooves (6), described projection and the groove arranged adjacent that interlocks becomes several rows, and row and row between projection and groove also interlaced, described projection structure wide at the top and narrow at the bottom, projection and groove are close to mutually, make groove form the large structure of the little inner chamber of opening.
4. the specular removal height of low thermal resistance according to claim 3 is aobvious refers to double-side white light LEDs, it is characterized in that being provided with some louvres (4) along its length in described substrate (1), the perforate in substrate both ends of the surface respectively of described louvre two ends.
5. the specular removal height of low thermal resistance according to claim 4 is aobvious refers to double-side white light LEDs, it is characterized in that reducing gradually to surrounding by near luminescence chip at described louvre (4) density of setting in substrate (1).
6. the specular removal height of the low thermal resistance according to any one of claim 1-5 is aobvious refers to double-side white light LEDs, it is characterized in that the dielectric layer after encapsulation is elongate in shape only at described luminescence chip (2) top encapsulation medium layer.
7. the specular removal height of the low thermal resistance according to any one of claim 1-5 is aobvious refers to double-side white light LEDs, it is characterized in that the dielectric layer on described substrate (1) positive and negative is the same fluorescent glue, or the dielectric layer in substrate side is yellow fluorescent glue, the dielectric layer on another side is red fluorescent glue.
8. the specular removal height of the low thermal resistance according to any one of claim 1-5 is aobvious refers to double-side white light LEDs, it is characterized in that described substrate (1) positive and negative is rough structure.
9. the specular removal height of the low thermal resistance according to any one of claim 1-5 is aobvious refers to double-side white light LEDs, it is characterized in that the luminescence chip (2) on described substrate (1) front and the luminescence chip on substrate back side stagger and arranges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420454664.0U CN204164710U (en) | 2014-08-13 | 2014-08-13 | The specular removal height of low thermal resistance is aobvious refers to double-side white light LEDs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420454664.0U CN204164710U (en) | 2014-08-13 | 2014-08-13 | The specular removal height of low thermal resistance is aobvious refers to double-side white light LEDs |
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| Publication Number | Publication Date |
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| CN204164710U true CN204164710U (en) | 2015-02-18 |
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| CN201420454664.0U Active CN204164710U (en) | 2014-08-13 | 2014-08-13 | The specular removal height of low thermal resistance is aobvious refers to double-side white light LEDs |
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| CN (1) | CN204164710U (en) |
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