CN204142900U - Test fixture, the device of short-circuit risks between a kind of thin core layer - Google Patents

Test fixture, the device of short-circuit risks between a kind of thin core layer Download PDF

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Publication number
CN204142900U
CN204142900U CN201420556332.3U CN201420556332U CN204142900U CN 204142900 U CN204142900 U CN 204142900U CN 201420556332 U CN201420556332 U CN 201420556332U CN 204142900 U CN204142900 U CN 204142900U
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CN
China
Prior art keywords
current
carrying plate
short
central layer
circuit
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Expired - Fee Related
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CN201420556332.3U
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Chinese (zh)
Inventor
李文杰
王剑
宫立军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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Shenzhen Fastprint Circuit Tech Co Ltd
Yixing Silicon Valley Electronic Technology Co Ltd
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Priority to CN201420556332.3U priority Critical patent/CN204142900U/en
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Publication of CN204142900U publication Critical patent/CN204142900U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

The utility model discloses test fixture, the device of short-circuit risks between a kind of thin core layer, between thin core layer, the proving installation of short-circuit risks comprises Hi-pot Tester, the first current-carrying plate, the second current-carrying plate, the positive pole of described Hi-pot Tester is electrically connected with described first current-carrying plate by wire, and the negative pole of described Hi-pot Tester is electrically connected with described second current-carrying plate by wire.Because the first current-carrying plate, the second current-carrying plate are in electrical contact with thin central layer respectively, if at this moment thin central layer has between the counter conductor of optional position circuit defect or remaining media thickness too little time, all can be punctured and short circuit by proof voltage.Therefore can judge whether this thin central layer has short-circuit risks, if having, can choose and scrap, and can not continue misuse cause monoblock PCB to scrap to during Electronic Testing below.Visible, the utility model can find the thin central layer that there is short-circuit risks before Quick, and avoids misuse to follow-up lamination step, can greatly cost-saving and work efficiency.

Description

Test fixture, the device of short-circuit risks between a kind of thin core layer
Technical field
The utility model relates to circuit board testing technical field, especially relates to test fixture and the proving installation of short-circuit risks between a kind of thin core layer.
Background technology
Along with electronic product is constantly to the future development of multifunction, miniaturization and, high performance, the number of plies of printed wiring board is more and more higher, and the dielectric thickness of copper-clad plate central layer used also more and more thinner (general at below 76um at present).Thinning along with thin central layer (alleged by the utility model, thin central layer dinger thickness degree is at the two-sided central layer with etched figure of below 80um) dielectric thickness, if the Copper Foil copper dental length on foreign material size or central layer two sides is bigger than normal a little to some extent in medium, the insulating property between thin core layer will be made to decline to a great extent, and this defect cannot detect in the conventional sense of AOI in early stage.
At present, the following two kinds method is usually adopted to test between thin core layer whether have short circuit phenomenon:
One, universal electric meter is adopted to test one by one the test point on thin central layer;
Two, after thin central layer being laminated to multilayer printed wiring board, with test machine, multilayer printed wiring board is tested.
But, test point on thin central layer is hundreds and thousands of, universal electric meter is adopted to test one by one will lose time greatly to the test point of thin central layer, and whether short circuit can only to be obtained between thin core layer, if owing to there being the long inter-level dielectric thickness that causes of the layers of copper copper tooth on foreign material or central layer two sides too little in medium on thin central layer, but cannot know with universal electric meter, namely cannot know whether thin central layer exists short-circuit risks.Carry out Electronic Testing according to test machine to multilayer printed wiring board, although can test out the multilayer printed wiring board that there is short-circuit risks, multilayer printed wiring board can be caused to be given up by whole blackboard newspaper, and it wastes sheet material greatly, and economic benefit is low.And the test point device of test machine needs to make according to multilayer printed wiring board, the i.e. each sandwich circuit figure of first Water demand multilayer circuit board, proving installation point is produced according to analysis result, and produce device, operation steps is various, be unsuitable for the various printed wiring board of batch testing, testing efficiency is lower.
Utility model content
Based on this, the utility model is the defect overcoming prior art, provides the proving installation of short-circuit risks between a kind of structure is simple, testing efficiency is high thin core layer.
The proving installation of short-circuit risks between the thin core layer that the utility model provides a kind of structure simple, with low cost.
Its technical scheme is as follows: the proving installation of short-circuit risks between a kind of thin core layer, comprise Hi-pot Tester, the first current-carrying plate, the second current-carrying plate, the positive pole of described Hi-pot Tester is electrically connected with described first current-carrying plate by wire, and the negative pole of described Hi-pot Tester is electrically connected with described second current-carrying plate by wire.
A test fixture for short-circuit risks between thin core layer, comprises described first current-carrying plate, the second current-carrying plate, and described first current-carrying plate and described second current-carrying plate are rotatably connected, and are connected by insulating part between described first current-carrying plate with described second current-carrying plate.
Below further technical scheme is described:
Preferably, the side of described first current-carrying plate, the second current-carrying plate all lays insulating material, and when described first current-carrying plate and the second current-carrying plate are stacked together, the first current-carrying plate and described second current-carrying plate are kept apart by described insulating material.
Preferably, described first current-carrying plate and described second current-carrying plate are rotatably connected, and are connected by insulating part between described first current-carrying plate with described second current-carrying plate.
Preferably, the side of described first current-carrying plate, the second current-carrying plate all lays insulating material, and when described first current-carrying plate and the second current-carrying plate are stacked together, the first current-carrying plate and described second current-carrying plate are kept apart by described insulating material.
Preferably, described first current-carrying plate, the second current-carrying plate are provided with test end points respectively.
Below the principle, effect etc. of preceding solution are described:
1, the two sides of thin central layer is in electrical contact with the first current-carrying plate, the second current-carrying plate respectively, and apply positive voltage and negative voltage respectively at the first current-carrying plate, the second current-carrying plate, due to current-carrying plate and thin central layer in electrical contact, default test voltage (as 250V) has just been applied between the conductive pattern on i.e. thin central layer two sides, at this moment if thin central layer has between the counter conductor of optional position circuit defect or remaining media thickness too little time, all can be punctured and short circuit by proof voltage.Therefore can judge whether this thin central layer has short-circuit risks, if having, can choose and scrap, and can not continue misuse cause monoblock PCB to scrap to during Electronic Testing below.Visible, the utility model can find the thin central layer that there is short-circuit risks before Quick, and avoids misuse to follow-up lamination step, can greatly cost-saving and work efficiency.
2, the side of the first current-carrying plate and the second current-carrying plate lays insulating material, by insulating material, the first current-carrying plate and the second current-carrying plate are isolated, contact short circuit between the first current-carrying plate and the second current-carrying plate can be avoided, and the first current-carrying plate can be avoided, the second current-carrying plate contacts with operating personnel, security performance is high.
3, the first current-carrying plate and the second current-carrying plate insulating part are rotatably connected, and can be clamped by thin central layer comparatively for convenience, easy to use.
Accompanying drawing explanation
Fig. 1 is short-circuit risks proving installation schematic diagram between thin core layer described in the utility model embodiment;
Fig. 2 is short-circuit risks test fixture structural representation between thin core layer described in the utility model embodiment;
Fig. 3 is short-circuit risks method of testing process flow diagram between thin core layer described in the utility model embodiment.
Description of reference numerals:
10, Hi-pot Tester, the 20, first current-carrying plate, the 30, second current-carrying plate, 40, insulating material, 50, test end points, 60, insulating part.
Embodiment
Below embodiment of the present utility model is described in detail:
As shown in Figure 1, the proving installation of short-circuit risks between a kind of thin core layer, comprise Hi-pot Tester 10, first current-carrying plate 20, second current-carrying plate 30, the positive pole of described Hi-pot Tester 10 is electrically connected with described first current-carrying plate 20 by wire, and the negative pole of described Hi-pot Tester 10 is electrically connected with described second current-carrying plate 30 by wire.
The two sides of thin central layer is in electrical contact with the first current-carrying plate 20, second current-carrying plate 30 respectively, and apply positive voltage and negative voltage at the first current-carrying plate 20, second current-carrying plate 30 respectively, due to current-carrying plate and thin central layer in electrical contact, default test voltage (as 250V) has just been applied between the conductive pattern on i.e. thin central layer two sides, at this moment if thin central layer has between the counter conductor of optional position circuit defect or remaining media thickness too little time, all can be punctured and short circuit by proof voltage.Therefore can judge whether this thin central layer has short-circuit risks, if having, can choose and scrap, and can not continue misuse cause monoblock PCB to scrap to during Electronic Testing below.Visible, the utility model can find the thin central layer that there is short-circuit risks before Quick, and avoids misuse to follow-up lamination step, can greatly cost-saving and work efficiency.
Wherein, the side of described first current-carrying plate 20, second current-carrying plate 30 all lays insulating material 40, and when described first current-carrying plate 20 and the second current-carrying plate 30 are stacked together, the first current-carrying plate 20 is kept apart with described second current-carrying plate 30 by described insulating material 40.Therefore, the first current-carrying plate 20, second current-carrying plate 30 electrical contact can be avoided.Described first current-carrying plate 20 is rotatably connected with described second current-carrying plate 30, and is connected by insulating part 60 between described first current-carrying plate 20 with described second current-carrying plate 30.Comparatively for convenience thin central layer can be clamped, easy to use.
As shown in Figure 2, the test fixture of short-circuit risks between a kind of thin core layer, comprise described first current-carrying plate 20, second current-carrying plate 30, described first current-carrying plate 20 is rotatably connected with described second current-carrying plate 30, and is connected by insulating part 60 between described first current-carrying plate 20 with described second current-carrying plate 30.
Wherein, the side of described first current-carrying plate 20, second current-carrying plate 30 all lays insulating material 40, and when described first current-carrying plate 20 and the second current-carrying plate 30 are stacked together, the first current-carrying plate 20 is kept apart with described second current-carrying plate 30 by described insulating material 40.Described first current-carrying plate 20, second current-carrying plate 30 is provided with test end points 50 respectively.
As shown in Figure 3, the method for testing of short-circuit risks between a kind of thin core layer, have employed the proving installation of short-circuit risks between thin core layer described in the utility model, comprises the steps:
S301, thin central layer to be measured to be placed between the first current-carrying plate 20 and the second current-carrying plate 30, to make the two sides of thin central layer in electrical contact with the first current-carrying plate 20, second current-carrying plate 30 respectively;
S302, use Hi-pot Tester 10 apply voltage to the first current-carrying plate 20, second end current-carrying plate;
Wherein, described applying voltage is arranged according to the thickness of thin central layer, and increases along with the thickness increase of thin central layer.
S303, obtain test leakage current between the first current-carrying plate 20, second current-carrying plate 30 or test insulation resistance;
S304, according to test leakage current or test insulation resistance judge whether thin central layer exists short-circuit risks and short circuit.
When test leakage current is higher than default leakage current or when testing insulation resistance lower than default insulating resistance value, then represent that thin central layer exists short-circuit risks and short circuit; When test leakage current is lower than default leakage current or when testing insulation resistance higher than default insulating resistance value, then represent that thin central layer is normal.
To sum up, the utility model tool has the following advantages:
1, the two sides of thin central layer is in electrical contact with the first current-carrying plate 20, second current-carrying plate 30 respectively, and apply positive voltage and negative voltage at the first current-carrying plate 20, second current-carrying plate 30 respectively, due to current-carrying plate and thin central layer in electrical contact, default test voltage (as 250V) has just been applied between the conductive pattern on i.e. thin central layer two sides, at this moment if thin central layer has between the counter conductor of optional position circuit defect or remaining media thickness too little time, all can be punctured and short circuit by proof voltage.Therefore can judge whether this thin central layer has short-circuit risks, if having, can choose and scrap, and can not continue misuse cause monoblock PCB to scrap to during Electronic Testing below.Visible, the utility model can find the thin central layer that there is short-circuit risks before Quick, and avoids misuse to follow-up lamination step, can greatly cost-saving and work efficiency.
2, the side of the first current-carrying plate 20 and the second current-carrying plate 30 lays insulating material 40, by insulating material 40, first current-carrying plate 20 and the second current-carrying plate 30 are isolated, contact short circuit between the first current-carrying plate 20 and the second current-carrying plate 30 can be avoided, and the first current-carrying plate 20, second current-carrying plate 30 can be avoided to contact with operating personnel, security performance is high.
3, the first current-carrying plate 20 and the second current-carrying plate 30 insulating part 60 are rotatably connected, and can be clamped by thin central layer comparatively for convenience, easy to use.
The above embodiment only have expressed embodiment of the present utility model, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection domain of the present utility model.

Claims (6)

1. the proving installation of short-circuit risks between a thin core layer, it is characterized in that, comprise Hi-pot Tester, the first current-carrying plate, the second current-carrying plate, the positive pole of described Hi-pot Tester is electrically connected with described first current-carrying plate by wire, and the negative pole of described Hi-pot Tester is electrically connected with described second current-carrying plate by wire.
2. the proving installation of short-circuit risks between thin core layer according to claim 1, it is characterized in that, the side of described first current-carrying plate, the second current-carrying plate all lays insulating material, when described first current-carrying plate and the second current-carrying plate are stacked together, the first current-carrying plate and described second current-carrying plate are kept apart by described insulating material.
3. the proving installation of short-circuit risks between thin core layer according to claim 1, it is characterized in that, described first current-carrying plate and described second current-carrying plate are rotatably connected, and are connected by insulating part between described first current-carrying plate with described second current-carrying plate.
4. the test fixture of short-circuit risks between a thin core layer, it is characterized in that, comprise the first current-carrying plate, the second current-carrying plate, described first current-carrying plate and described second current-carrying plate are rotatably connected, and are connected by insulating part between described first current-carrying plate with described second current-carrying plate.
5. the test fixture of short-circuit risks between thin core layer according to claim 4, it is characterized in that, the side of described first current-carrying plate, the second current-carrying plate all lays insulating material, when described first current-carrying plate and the second current-carrying plate are stacked together, the first current-carrying plate and described second current-carrying plate are kept apart by described insulating material.
6. the test fixture of short-circuit risks between thin core layer according to claim 4, it is characterized in that, described first current-carrying plate, the second current-carrying plate are provided with test end points respectively.
CN201420556332.3U 2014-09-25 2014-09-25 Test fixture, the device of short-circuit risks between a kind of thin core layer Expired - Fee Related CN204142900U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420556332.3U CN204142900U (en) 2014-09-25 2014-09-25 Test fixture, the device of short-circuit risks between a kind of thin core layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420556332.3U CN204142900U (en) 2014-09-25 2014-09-25 Test fixture, the device of short-circuit risks between a kind of thin core layer

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104237752A (en) * 2014-09-25 2014-12-24 广州兴森快捷电路科技有限公司 Test method, test fixture and test device for thin core board layer short risks
CN109828152A (en) * 2019-01-28 2019-05-31 东莞市硅翔绝缘材料有限公司 The automated test device of battery heating sheet
CN117129559A (en) * 2023-10-24 2023-11-28 宁德时代新能源科技股份有限公司 Detection device and detection method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104237752A (en) * 2014-09-25 2014-12-24 广州兴森快捷电路科技有限公司 Test method, test fixture and test device for thin core board layer short risks
CN109828152A (en) * 2019-01-28 2019-05-31 东莞市硅翔绝缘材料有限公司 The automated test device of battery heating sheet
CN117129559A (en) * 2023-10-24 2023-11-28 宁德时代新能源科技股份有限公司 Detection device and detection method

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150204

Termination date: 20200925