CN204138342U

CN204138342U - A kind of MEMS body silicon wet method processing technology one side protective device

Info

Publication number: CN204138342U
Application number: CN201420135788.2U
Authority: CN
Inventors: 付博
Original assignee: WUXI EASYMEMS TECHNOLOGY Co Ltd
Current assignee: WUXI EASYMEMS TECHNOLOGY Co Ltd
Priority date: 2014-03-25
Filing date: 2014-03-25
Publication date: 2015-02-04
Anticipated expiration: 2024-03-25

Abstract

The utility model discloses a kind of MEMS body silicon wet method processing technology one side protective device; be through-hole structure in the middle of the substrate of this MEMS body silicon wet method processing technology one side protective device; sealed by sealing ring between substrate and retainer ring; and be locked with lock screw; be threaded connection between substrate and holding rod; to be connected and at interface by screw-threaded coupling by switching mouth and wireway between gas port with holding rod; holding rod is connected by plug screw with plug ring, and wireway and holding rod are fixed by plug ring.Entirety of the present utility model selects polyetheretherketonematerials materials, thermal coefficient of expansion is low, can not cause leakage because of expanding with heat and contract with cold, Intermediate substrate carries out via design, without pressure reduction in assurance device cavity, the through hole of substrate is connected by wireway with the external world, ensure that the gas of corrosive liquid heating rear chamber internal expansion is got rid of in time, avoid the fragment that thermal expansion causes, reduce technology difficulty, avoid organic material to dispel not only on the impact of MEMS performance, improve yield rate.

Description

A kind of MEMS body silicon wet method processing technology one side protective device

Technical field

The utility model belongs to MEMS body silicon wet method processing technology field, particularly relates to a kind of MEMS body silicon wet method processing technology one side protective device.

Background technology

In MEMS process for making; wet method processing technology is absolutely necessary; traditional protected mode can not meet the requirement of current process; particularly in traditional handicraft with protecting glue or the organic material such as pitch-dark as protective finish; the non-structural face of silicon chip is protected; not only dispel that difficulty is large, yield rate is low, and easily give in technique and bring pollution.

Utility model content

The purpose of this utility model is to provide a kind of MEMS body silicon wet method processing technology one side protective device; to be intended to solve in the traditional handicraft process manufactured at MEMS with protecting glue or the organic material such as pitch-dark as protective finish; the non-structural face of silicon chip is protected; not only dispel that difficulty is large, yield rate is low, and easily give the problem bringing pollution in technique.

The utility model is achieved in that a kind of MEMS body silicon wet method processing technology one side protective device comprises substrate, retainer ring, sealing ring, gas port, wireway, holding rod, lock screw, plug screw, switching mouth, plug ring;

Be through-hole structure in the middle of described substrate, sealed by sealing ring between substrate and retainer ring, and be locked with lock screw, be threaded connection between substrate and holding rod, to be connected and at interface by screw-threaded coupling by switching mouth and wireway between gas port with holding rod, holding rod is connected by plug screw with plug ring, and wireway and holding rod are fixed by plug ring.

Further, described MEMS body silicon wet method processing technology one side protective device entirety adopts polyetheretherketonematerials materials to make.

Entirety of the present utility model selects polyetheretherketonematerials materials; thermal coefficient of expansion is low; even if temperature generation strong variations also can not cause leakage because of expanding with heat and contract with cold; Intermediate substrate carries out via design; without pressure reduction in assurance device cavity; the through hole of substrate is connected by wireway with the external world; ensure that the gas of corrosive liquid heating rear chamber internal expansion is got rid of in time; avoid the fragment that thermal expansion causes; compared with conventional coatings guard method; reduce technology difficulty, avoid organic material and dispel not only on the impact of MEMS performance, effectively improve yield rate.

Accompanying drawing explanation

Fig. 1 is the structural representation of the MEMS body silicon wet method processing technology one side protective device that the utility model embodiment provides;

Fig. 2 is the explosive view of the MEMS body silicon wet method processing technology one side protective device that the utility model embodiment provides;

In figure: 1, substrate; 2, retainer ring; 3, sealing ring; 4, gas port; 5, wireway; 6, holding rod; 7, lock screw; 8, plug screw; 9, switching mouth; 10, plug ring; 11, corrosion of silicon is treated.

Detailed description of the invention

In order to make the purpose of this utility model, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.

Fig. 1 and Fig. 2 shows the structure of MEMS body silicon wet method processing technology one side protective device of the present utility model, as shown in the figure, the utility model is achieved in that a kind of MEMS body silicon wet method processing technology one side protective device comprises substrate 1, retainer ring 2, sealing ring 3, gas port 4, wireway 5, holding rod 6, lock screw 7, plug screw 8, switching mouth 9, plug ring 10;

Be through-hole structure in the middle of described substrate 1, sealed by sealing ring 3 between substrate 1 and retainer ring 2, and be locked with lock screw 7, be threaded connection between substrate 1 and holding rod 6, to be connected by transfer mouth 9 and wireway 5 between gas port 4 with holding rod 6 and at interface by screw-threaded coupling, holding rod 6 is connected by plug screw 8 with plug ring 10, and wireway 5 is fixed by plug ring 10 with holding rod 6.

As follows in using method:

The first step, assembles wireway 5, switching mouth 9, holding rod 6, substrate 1;

Second step, slips into substrate 1 and retainer ring 2 by wireway 5 and sealing ring 3;

3rd step, will treat that corrosion of silicon 11 puts into substrate 1;

4th step, carries out horizontal shutting by retainer ring 2 and substrate 1;

5th step, locks retainer ring 2 and substrate 1 with lock screw 7;

6th step, puts into corrosive liquid by this device and carries out wet processing;

7th step, is undertaken rinsing and drying up by deionized water after etching;

8th step, turns on lock screw 7, takes down retainer ring 2;

9th step, takes out the silicon chip corroded.

Entirety of the present utility model selects polyetheretherketonematerials materials, thermal coefficient of expansion is low, even if temperature generation strong variations also can not cause leakage because of expanding with heat and contract with cold, Intermediate substrate carries out via design, without pressure reduction in assurance device cavity, the through hole of substrate is connected by wireway with the external world, ensure that the gas of corrosive liquid heating rear chamber internal expansion is got rid of in time, avoid the fragment that thermal expansion causes, other process need not be carried out and can enter next process procedure, effectively control the process time and decrease unnecessary pollution, compared with conventional coatings guard method, reduce technology difficulty, avoiding organic material dispels not only on the impact of MEMS performance, effectively improve yield rate.

By reference to the accompanying drawings detailed description of the invention of the present utility model is described although above-mentioned; but the restriction not to the utility model protection domain; one of ordinary skill in the art should be understood that; on the basis of the technical solution of the utility model, those skilled in the art do not need to pay various amendment or distortion that performing creative labour can make still within protection domain of the present utility model.

Claims

1. a MEMS body silicon wet method processing technology one side protective device, it is characterized in that, described MEMS body silicon wet method processing technology one side protective device comprises substrate, retainer ring, sealing ring, gas port, wireway, holding rod, lock screw, plug screw, switching mouth, plug ring;

2. MEMS body silicon wet method processing technology one side protective device as claimed in claim 1, is characterized in that, described MEMS body silicon wet method processing technology one side protective device entirety adopts polyetheretherketonematerials materials to make.