CN204127722U - Lighting device - Google Patents
Lighting device Download PDFInfo
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- CN204127722U CN204127722U CN201420564565.8U CN201420564565U CN204127722U CN 204127722 U CN204127722 U CN 204127722U CN 201420564565 U CN201420564565 U CN 201420564565U CN 204127722 U CN204127722 U CN 204127722U
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- interarea
- lighting device
- circuit unit
- power circuit
- illuminating part
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Abstract
The utility model provides a kind of lighting device, its framework has abutment portion and circuit accommodator, this abutment portion has ring-type and configures the 1st interarea of multiple illuminating part and be positioned at the 2nd interarea of opposition side of the 1st interarea, this circuit accommodator is the tubular erected from the 2nd interarea, power circuit unit is held in inside, during by the boundary line upright projection of the outer peripheral face of the 2nd interarea and circuit accommodator to the 1st interarea, on the 1st interarea, multiple illuminating part is configured in side more outer than the boundary line of upright projection.
Description
Technical field
The utility model relates to lighting device, particularly relates to the technology of the thermal diffusivity improving light source and circuit unit.
Background technology
In recent years, as the light source of illuminating part, high-luminous-efficiency and the lighting device of the semiconductor light-emitting elements such as long-life LED (Light Emitting Diode) is used to popularize gradually.In such lighting device, need the power circuit unit of powering to illuminating part.In patent document 1, disclose lighting device illuminating part and power circuit unit are contained in respectively in different frameworks.In this case, the framework holding power circuit unit is arranged on the inboard of ceiling or wall.
On the other hand, in the building being provided with lighting device, lay the thermal insulation barriers of the thermal insulation for improving inner space and the reinforcement for improving vibration strength through the inboard of be everlasting ceiling or wall.In this case, the sufficient space of guaranteeing in the inboard of ceiling or wall for arranging lighting device is difficult to.At this, lighting device 90 is as shown in figure 12 such, proposes the lighting device (such as with reference to patent document 2) illuminating part 922 and power circuit unit 960 being configured at same framework 910.
In lighting device 90, the circuit accommodator 912 that framework 910 has flat abutment portion 911 and erects with tubular from the interarea of abutment portion 911.In addition, with semiconductor light-emitting elements be the illuminating part 922 of light source be configured in abutment portion 911 with on the interarea of the interarea opposition side of circuit accommodator 912 side, power circuit unit 960 is contained in the inside of circuit accommodator 912.
Patent document 1: Japanese Unexamined Patent Publication 2010-102897 publication
Patent document 2: Japanese Unexamined Patent Publication 2011-243510 publication
The electric power of supply all cannot be transformed to light by semiconductor light-emitting elements.In addition, whole electric power also cannot be supplied to illuminating part by power circuit unit.The electric power major part that these cannot use becomes heat energy.That is, when taking semiconductor light-emitting elements as the lighting device action of light source, illuminating part and power circuit unit produce heat.
At this, in lighting device 90, as shown in figure 12, on the direction orthogonal with the interarea of abutment portion 911, illuminating part 922 and circuit accommodator 912 adjoin via abutment portion 911.In this case, the thermal capacitance produced respectively is easily transmitted mutually, so illuminating part 922 or power circuit unit 960 may excessive temperature rise.Concerning illuminating part 922 and power circuit unit 960, there is the problem of infringement action stability in such intensification.
Utility model content
At this, the purpose of this utility model is, provides a kind of lighting device, can reduce to arrange required space, and suppress the excessive temperature rise of illuminating part and power circuit unit.
The lighting device of a mode of the present utility model, being configured with in framework is multiple illuminating part of light source and the power circuit unit of powering to described multiple illuminating part respectively with semiconductor light-emitting elements.And, framework has abutment portion and circuit accommodator, described abutment portion has the 1st interarea of the described multiple illuminating part of ring-type configuration and is positioned at the 2nd interarea of opposition side of the 1st interarea, and described circuit accommodator is the tubular erected from the 2nd interarea, and holds power circuit unit in inside.And then during by the boundary line upright projection of the outer peripheral face of the 2nd interarea and circuit accommodator to the 1st interarea, on described 1st interarea, described multiple illuminating part is configured in side more outer than the boundary line of upright projection.
In addition, the lighting device of another way of the present utility model, also possesses the heat insulating member be configured between power circuit unit and the 2nd interarea.
In addition, the lighting device of another way of the present utility model, also has the circuit cover of bottom tube-like, and this circuit cover has: side surface part, surrounds power circuit unit at the private side of circuit accommodator; And bottom surface sections, when observing from power circuit unit, be positioned at the opposition side of abutment portion.Further, the bottom surface sections of power circuit unit and circuit cover and side surface part thermal coupling, less than the thermal resistance from power circuit unit to the side surface part of circuit cover to the thermal resistance of the bottom surface sections of circuit cover from power circuit unit.
In addition, the lighting device of another way of the present utility model, also possesses light guide plate, and this light guide plate has the 3rd interarea of covering the 1st interarea and is positioned at the 4th interarea of opposition side of the 3rd interarea.Further, it is inner that the light that described multiple illuminating part sends by described light guide plate imports light guide plate from the 3rd interarea side, and from the 4th interarea side with planar outgoing.
In addition, the lighting device of another way of the present utility model, circuit accommodator attenuates along with away from abutment portion.
In addition, the lighting device of another way of the present utility model, the inner peripheral surface of circuit accommodator is orthogonal with the 2nd interarea.
In addition, " upright projection " perspective plane of referring in parallel projection is vertical with projection line angulation.In addition, " parallel projection " refers to the projection using infinite point as viewpoint.Therefore, in parallel projection, projection line is parallel to each other.
The effect of utility model:
In the lighting device of aforesaid way, each illuminating part and power circuit unit are configured at same framework and save space, so can reduce to arrange required space.In addition, in the lighting device of aforesaid way, on any one direction in the direction of the main surface parallel with abutment portion and orthogonal direction, the inside of each illuminating part and the circuit accommodator that holds power circuit unit is all kept off.Therefore, do not readily conduct heat between each illuminating part and power circuit unit, the excessive temperature rise of each illuminating part and power circuit unit can be suppressed.
Accompanying drawing explanation
Fig. 1 is the stereogram of the lighting device 1 representing a mode of the present utility model.
Fig. 2 represents the sectional view of lighting device 1 to the installment state of ceiling.
Fig. 3 is the exploded perspective view observing lighting device 1 from face side.
Fig. 4 is the exploded perspective view observing lighting device 1 from rear side.
Fig. 5 is the front elevation representing lighting device 1.
Fig. 6 is the enlarged cross section figure of the part shown in the A of Fig. 2.
Fig. 7 is the schematic section of the thermaltransmission mode illustrated in lighting device 1.
Fig. 8 is the schematic section that the thermaltransmission mode possessed in the lighting device 1 of thermal insulation board 18 is described.
Fig. 9 illustrates the schematic section possessing the thermaltransmission mode of the lighting device 1 of terminal board 70.
Figure 10 is the schematic section representing the framework 210 that the lighting device of variation 1 possesses.
Figure 11 is the schematic section representing the framework 310 that the lighting device of variation 2 possesses.
Figure 12 is the sectional view of the lighting device 90 representing prior art.
Symbol description:
1,90 lighting devices; 10,210,310,910 frameworks; 11,911 abutment portion; Interarea (the 2nd interarea) on the upside of 11a; Interarea (the 1st interarea) on the downside of 11b; 12,212,312,912 circuit accommodator; 12a, 212a, 312a inner peripheral surface; 12b, 212b, 312b outer peripheral face; 12c, 212c, 312c boundary line; 18 thermal insulation boards (heat insulating member); 20 luminescence units; 22,922 illuminating parts; 30 reflecting plates; 40 light guide plates; Interarea (the 3rd interarea) on the upside of 40a; Interarea (the 4th interarea) on the downside of 40b; 50 covers; 60,960 power circuit unit; 70 terminal boards (circuit cover); 70a bottom surface sections; 70b side surface part; 80 installing components
Detailed description of the invention
< embodiment >
Hereinafter, with reference to the accompanying drawings of the lighting device 1 of a mode of the present utility model.In addition, the ratio of the parts in each figure is sometimes different from actual product.
1. the formation of lighting device 1
Use Fig. 1 ~ Fig. 4 that the formation of lighting device 1 is described.Fig. 1 is the stereogram representing lighting device 1, represents the state of being taken off by cover 50.Fig. 2 represents the sectional view of lighting device 1 to the installment state of ceiling.Fig. 3 is the exploded perspective view observing lighting device 1 from face side.Fig. 4 is the exploded perspective view observing lighting device 1 from rear side.
As shown in Figure 1, lighting device 1 is ceiling lamp, is that multiple illuminating parts 22 of light source are configured in framework 10 respectively with semiconductor light-emitting elements.In addition, as shown in Figure 2, lighting device 1 is such as the lighting device of the power circuit internally-arranged type being arranged at ceiling 2 and being directly connected with commercial ac power source by external power cord 3.In addition, lighting device 1 is not limited to ceiling lamp, such as, also can be lower illuminator, spotlight, tray lamp, desk lamp etc.In addition, in the following description, when observing from lighting device 1, using ceiling 2 side as upside, using its opposition side as downside.Therefore, the upper side of lighting device 1 becomes the back side, and downside becomes front.
As shown in Figures 3 and 4, lighting device 1 such as possesses framework 10, luminescence unit 20, reflecting plate 30, light guide plate 40, cover 50, power circuit unit 60, terminal board 70, installing component 80.
(1) formation of each parts
The formation of each parts is below described.
A. framework 10
Framework 10 is such as made up of metal materials such as aluminium diecastings, possesses abutment portion 11 and the circuit accommodator 12 of circular plate, and this abutment portion 11 has upside interarea 11a and downside interarea 11b, and this circuit accommodator 12 erects with cylindrical shape from the interarea 11a of upside.
Abutment portion 11 has: circular opening portion 13, is formed in the central authorities of abutment portion 11; Little screw 14, is spaced apartly formed in the position clipping opening portion 13; And through hole 15, be formed in the position on the summit of the equilateral triangle be equivalent to centered by opening portion 13.In addition, on the upside interarea 11a of abutment portion 11, protruding 16 are formed with in the position rotating 30 degree from each through hole 15 centered by opening portion 13.Little screw 14, through hole 15 and protruding 16 are all configured in the private side of circuit accommodator 12, and under the state after lighting device 1 is assembled, these parts do not expose.
In circuit accommodator 12, near the above-below direction central authorities of the outer peripheral face 12b suitable with the side of cylinder, be formed with circular outer blade of a sword portion 17 outward highlightedly.In addition, in the inside of circuit accommodator 12, it is such as the thermal insulation board 18 that thermal insulation barriers etc. is formed by the fiber system thermal insulation barriers such as mineral wool, ceramic fibre, phenol formaldehyde foam, polyurethane foam or foaming that upside interarea 11a is configured with.Thermal insulation board 18 entreats the tabular with circular open portion wherein, with cover upside interarea 11a and expose through hole 15 and protruding 16 mode be formed as such as hexagon.
B. luminescence unit 20
Luminescence unit 20 has plate 21, multiple illuminating part 22, power supply terminal 23.
Substrate 21 is the circular plate with less than abutment portion 11 and larger than the external diameter of circuit accommodator 12 diameter, such as on the electric insulation layer be made up of pottery or heat conductivity resin etc. by metal layer patterningly forming of being made up of aluminium or copper etc.The function of the radiating part that metal level plays the wiring each illuminating part 22 and power supply terminal 23 are electrically connected, the photo-emission part of face side of the lighting device 1 that to be led efficiently by the light that each illuminating part 22 sends, heat that each illuminating part 22 is sent are dispersed efficiently etc., is suitable for the material of this function respectively in the station diagram patterning of necessity.In addition, substrate 21 and abutment portion 11 accordingly, have the opening portion 24 of the circle being formed at its central authorities, are formed at the little through hole 25 of the position corresponding with little screw 14, are formed at the through hole 26 of the position corresponding with through hole 15.
Illuminating part 22 take semiconductor light-emitting elements as light source, such as, be the LED of the surface installing type sending white light.In addition, illuminating part 22 exists multiple, the downside interarea of substrate 21 is configured to circular.And then, the main exit direction of the light that each illuminating part 22 sends with it towards downside, namely the mode of the face side of lighting device 1 be installed on substrate 21.
Power supply terminal 23 is input parts of the electric power to each illuminating part 22 supply, such as, can turn on/off power line as socket, such as, also can be welded by power line as metal pad.Power supply terminal 23 is configured near the opening portion 24 on the downside interarea of substrate 21.
C. reflecting plate 30
Reflecting plate 30 is the circular plate with less than abutment portion 11 and larger than substrate 21 diameter, such as, be made up of the material that the light reflectivities such as highly reflective polycarbonate resin, high reverse--bias nylon resin, high reverse--bias PBT resin, high reverse--bias Foamex are high.Reflecting plate 30 has: aperture 31, is formed in the central authorities of reflecting plate 30; Fenestra 32, is formed in the position corresponding with each illuminating part 22; Depressed part 33, comprises fenestra 32 and caves in upside with circular; And through hole 34, the position on the orthohexagonal summit be equivalent to centered by aperture 31 is formed in circumference.
In addition, be formed at the upside interarea of reflecting plate 30: jut 35, be positioned at the position corresponding with the openend of opening portion 24 in the mode of surrounding aperture 31; Protruding 36, be positioned at the position corresponding with through hole 15; And protrusion 37, through hole 34 is passed each other with arc-shaped in the periphery along reflecting plate 30.The diameter of the circular arc that protrusion 37 is formed is roughly the same with the diameter of substrate 21.
In addition, the downside interarea of side and depressed part 33 that reflecting plate 30 at least comprises fenestra 32 is made up of the material that light reflectivity is high, and jut 35, protruding 36, protrusion 37 and upside interarea can be made up of materials such as the low resins of light reflectivity.
D. light guide plate 40
Light guide plate 40 has upside interarea 40a and downside interarea 40b, is the circular plate with the equal size with reflecting plate 30, such as, is made up of translucent materials such as acryl resin, polycarbonate resin, polystyrene resin, glass.Light guide plate 40 has the depressed part 41 caved in upside in the position corresponding with the annulus that illuminating part 22 is formed and the through hole 42 being formed at the position corresponding with through hole 34.In addition, jut 43 is formed with in the central authorities of upside interarea 40a.
E. 50 are covered
Cover 50 be to downside depression dome-shaped, be such as made up of translucent materials such as silicones, acryl resin, polycarbonate resin, glass.In the top side of cover 50, be formed with jut 51 in the position corresponding with through hole 34.The external diameter of cover 50 is roughly the same with the diameter of abutment portion 11.
F. power circuit unit 60
Power circuit unit 60 has circuit substrate 61, circuit component 62, lead-in wire 63, connector 64.
Circuit substrate 61 is circular tabulars that diameter is less than the internal diameter of circuit accommodator 12, such as, be made up of the electrical insulating property such as paper phenol or glass epoxy resin material.Roughly semicircular opening portion 61a is formed in the central authorities of circuit substrate 61.In addition, circuit substrate 61 is formed by the wiring of the conductive material patternings such as metal, circuit component 62, lead-in wire 63 and connector 64 are electrically connected by this wiring.
Circuit component 62 is such as the electronic components such as control IC, transistor, diode, resistance, coil, electric capacity, is arranged on two interareas of circuit substrate 61.
Lead-in wire 63 is connected with the power supply terminal 23 of luminescence unit 20 and luminescence unit 20 and power circuit unit 60 is electrically connected, and its front end becomes such as from the wire etc. that plug or covering thread stretch out according to the kind of power supply terminal 23.Connector 64 is input parts of the electric power to power circuit unit 60 supply, such as, be the flat board of pair of metal.
G. terminal board 70
Terminal board 70 is bottomed cylindricals of the bottom surface sections 70a with circular plate and the side surface part 70b erected with cylindrical shape from the downside interarea of bottom surface sections 70a, such as, be made up of electrical insulating property materials such as pottery or heat conductivity resins.In addition, be formed with the portion of terminal 71 of the cylindrical shape of the core of this bottom surface sections 70a through at bottom surface sections 70a and be positioned at the through hole 72 with protruding 16 corresponding positions.In addition, the claw 73 outstanding to the private side of terminal board 70 is formed with at side surface part 70b.
The protuberance 71a of roughly semi-annular shape is formed at the fore-end of the downside of portion of terminal 71.In addition, in portion of terminal 71, insert the connector 64 of external power cord 3 and power circuit unit 60 and form splicing ear 71b power circuit unit 60 and external power source are electrically connected.
At this, the internal diameter of side surface part 70b is larger than the diameter of circuit substrate 61, and the external diameter of side surface part 70b is less than the internal diameter of circuit accommodator 12.
H. installing component 80
Installing component 80 is that upside has the bottom of circular plate and sidepiece is cylindric bottomed cylindrical, such as, be made up of the metal material such as aluminium or iron, pottery or the resin material with heat conductivity.Installing component 80 has: circular opening portion 81, is formed in the bottom center of this installing component 80; Through hole 82, spaced apart and be formed in the position clipping opening portion 81 in bottom; And interior blade of a sword portion 83, inwardly projecting near the above-below direction central authorities of the inner peripheral surface of sidepiece and formed circular.In addition, the internal diameter of installing component 80 is larger than the external diameter of circuit accommodator 12.
Be explained above the formation of each parts, but above-mentioned formation is an example of lighting device 1, is not limited thereto.In lighting device 1, can above-mentioned each parts suitably be added, change, be deleted, such as, can carry out the deletion of the adding of the quantity of opening in each parts or projection etc. or the change, thermal component strengthening part etc. of position, reflecting plate 30 or light guide plate 40 etc.In addition, by multiple part integration, such as, by light guide plate 40 and cover 50 integration, also in framework 10, directly each illuminating part 22 and power circuit unit 60 can can be configured.
(2) assembling of lighting device 1 and method to set up
Assembling and the method to set up of lighting device 1 are below described.But be below an example, assembling and the method to set up of lighting device 1 are not limited thereto.
First, with the mode placing luminescence unit 20 that each illuminating part 22 exposes on the downside interarea 11b of abutment portion 11, the Screw 27 inserting little through hole 25 from luminescence unit 20 side is screwed togather little screw 14.Thus, luminescence unit 20 is fixed on the downside interarea 11b of abutment portion 11.In addition, at this moment, multiple illuminating part 22 is equipped with at downside interarea 11b with cyclic ligand.That is, interarea 11b in downside is a mode of the 1st interarea of abutment portion in present embodiment, and upside interarea 11a is a mode of the 2nd interarea of abutment portion in present embodiment.In addition, the diameter of substrate 21 is less than the diameter of abutment portion 11, so downside interarea 11b exposes around luminescence unit 20.
Then, lead-in wire 63 is inserted successively the opening portion of thermal insulation board 18, opening portion 13, opening portion 24 and be connected to power supply terminal 23 from circuit accommodator 12 side.Thus, each illuminating part 22 and power circuit unit 60 are electrically connected.In addition, at this moment, between power circuit unit 60 and the upside interarea 11a of abutment portion 11, thermal insulation board 18 is configured with.Therefore, thermal insulation board 18 is equivalent to a mode of the heat insulating member in present embodiment.In addition, as long as thermal insulation board 18 uses the material with electrical insulating property, the unnecessary energising between power circuit unit 60 and side, its underpart (luminescence unit 20 etc.) can just be prevented.
Then, under the state depressed part 41 of light guide plate 40, jut 43 being inserted respectively the depressed part 33 of reflecting plate 30, aperture 31, the jut 51 of cover 50 is inserted through hole 42 and through hole 34 from light guide plate 40 side.Then, make to be plastic deformation to the shape that can not depart from from through hole 34 from the front end of the outstanding jut 51 of through hole 34 by laser etc.Thus, reflecting plate 30 and light guide plate 40 are fixed to the inside of cover 50.In addition, light guide plate 40 can rotate relative to reflecting plate 30 under the state fixing with the position relationship of reflecting plate 30 at the depressed part 41 by being inserted into reflecting plate 30 and jut 43.Therefore, the contraposition of through hole 34 and through hole 42 is easily carried out when inserting jut 51.
Then, under the state that luminescence unit 20 is pressed into abutment portion 11 by protrusion 37, the screw 19 inserting through hole 15 and through hole 26 from circuit accommodator 12 side is screwed togather with protruding 36.Thus, reflecting plate 30, light guide plate 40 and cover 50 are fixed on framework 10.In addition, at this moment, the upside interarea 40a of light guide plate 40 covers downside interarea 11b.That is, interarea 40a in upside is a mode of the 3rd interarea of light guide plate in present embodiment, and downside interarea 40b is a mode of the 4th interarea of light guide plate in present embodiment.In addition, the front end of the side of cover 50 is touched with the downside interarea 11b exposed from the surrounding of luminescence unit 20, and thus, luminescence unit 20, reflecting plate 30, light guide plate 40 are hidden and can not see from the outside of lighting device 1.
In addition, reflecting plate 30 has jut 35, this jut 35 is positioned at the position of the end along opening portion 24, reflecting plate 30 can rotate relative to luminescence unit 20 under the state fixing at the position relationship with luminescence unit 20, so easily carry out the contraposition of through hole 15 and through hole 26 and projection 36.In addition, at this moment, each illuminating part 22 exposes from each fenestra 32 of reflecting plate 30, so the light of each illuminating part 22 outgoing can not be blocked by reflecting plate 30.And then the side of fenestra 32 connects with the downside interarea of substrate 21 and around each illuminating part 22, thus, the light preventing each illuminating part 22 from sending enters between luminescence unit 20 and reflecting plate 30.
In addition, when screw 19 screws togather to protruding 36, between the side of cover 50 and the protrusion 37 of reflecting plate 30, configure pad 52, fill up the space between abutment portion 11 and reflecting plate 30 and cover 50, thereby, it is possible to improve the adhesion (with reference to Fig. 2) of framework 10 and cover 50.By this structure, can prevent the foreign matters such as dust, insect, moisture from entering cover 50 inner.In addition, pad 52 is preferably by having retractility and the resin with hydrophobic material, such as silicon etc. is formed.
Then, for power circuit unit 60 and terminal board 70, by protuberance 71a insertion opening portion 61a, connector 64 is inserted splicing ear 71b, the perimembranous of circuit substrate 61 and claw 73 are fitted together to.Thus, power circuit unit 60 is fixed on the inside of terminal board 70, and the bottom surface sections 70a of power circuit unit 60 and terminal board 70 and side surface part 70b thermal coupling.And then power circuit unit 60 and portion of terminal 71 are electrically connected.At this, heat passes through electron-propagation usually in the same manner as electricity, conductivity and pyroconductivity have positive correlation, so the bottom surface sections 70a with the portion of terminal 71 be electrically connected with power circuit unit 60 is compared with side surface part 70b, more easily transmit the heat from power circuit unit 60.That is, less than the thermal resistance from power circuit unit 60 to side surface part 70b to the thermal resistance of bottom surface sections 70a from power circuit unit 60.
Then, become the mode of upside with the bottom surface sections 70a of terminal board 70, the side surface part 70b of terminal board 70 is inserted the inside of circuit accommodator 12, the screw 74 being inserted into through hole 72 is screwed to protruding 16 from bottom surface sections 70a side.Thus, terminal board 70 is fixed in the circuit accommodator 12 of framework 10, and power circuit unit 60 is received into the inside of circuit accommodator 12.In addition, at this moment, side surface part 70b surrounds at the private side of circuit accommodator 12 power circuit unit 60, bottom surface sections 70a is positioned at abutment portion 11 opposition side when observing from power circuit unit 60.Therefore, terminal board 70 is equivalent to a mode of the circuit cover in present embodiment.
In addition, power circuit unit 60 is contained in the private side that the major part referring to power circuit unit 60 in circuit accommodator 12 is positioned at circuit accommodator 12.Therefore, a part for power circuit unit 60, such as, there is the higher part such as insert type framework, lead-in wire 63, connector 64 etc. can stretch out to upside from circuit accommodator 12 in circuit component 62.In addition, the bottom surface sections 70a of terminal board 70 can expose to upside than circuit accommodator 12.
Then, making external power cord 3 from the state that opening portion 81 is exposed, the bottom of installing component 80 and ceiling 2 being touched, by the wood screw 84 that is inserted into through hole 82 from downside, installing component 80 being fixed on the assigned position of ceiling 2.And then, by the external power cord 3 that exposes from opening portion 81 from inserted terminals portion, bottom surface sections 70a side 71.Thus, external power source and power circuit unit 60 are electrically connected by portion of terminal 71.
Finally, framework 10 is inserted installing component 80 from downside, make the interior blade of a sword portion 83 of the outer blade of a sword portion 17 of framework 10 and installing component 80 chimeric (with reference to Fig. 2), framework 10 is fixed on the assigned position of ceiling 2.Outer blade of a sword portion 17 and interior blade of a sword portion 83 such as by making either one or both elastic deformation of circuit accommodator 12 and installing component 80 to carry out, also can be formed as screw-like and screw togather carrying out by the chimeric method in outer blade of a sword portion 17 and interior blade of a sword portion 83.In addition, in order to improve the thermal diffusivity of framework 10, be preferably framework 10 and installing component 80 thermal coupling.In addition, also in the lateral outer of installing component 80, heat sink etc. can be installed, improve thermal diffusivity further.
By above method, the assembling of lighting device 1 and being provided with.
2. the action of lighting device 1
In lighting device 1, supply alternating electromotive force via portion of terminal 71 and connector 64 to power circuit unit 60 from external power cord 3.Power circuit unit 60 forms rectifier smoothing circuit, booster circuit, reduction voltage circuit, lighting control circuit etc. by circuit component 62.By these circuit, the alternating electromotive force supplied from external power source is transformed to the direct current power with assigned voltage.Power circuit unit 60 supplies this direct current power via lead-in wire 63 and power supply terminal 23 to each illuminating part 22, carries out lighting control to each illuminating part 22.
The each illuminating part 22 being supplied to electric power is luminous to downside (face side of lighting device 1) via fenestra 32.At this moment, it is inner that the light that each illuminating part 22 sends by light guide plate 40 imports light guide plate 40 from interarea 40a side, upside via depressed part 41, in light guide plate 40 internal reflection and scattering, and from interarea 40b side, downside with planar outgoing.
Therefore, lighting device 1, can from the whole face emergent light equably of its face side by possessing light guide plate 40, sense of discomfort when can realize the reduction of illumination spot, direct viewing lighting device 1 and the reduction etc. of stimulation.In addition, by the structure of light guide plate 40, the light making to import to light guide plate 40 inside, to the outer side reflection of lighting device 1 and refraction, can also expand the light distribution angle of lighting device 1.
On the other hand, carry out reflection and scattering etc. by light guide plate 40, direct of travel is the light of the rear side of lighting device 1 is reflected to lighting device 1 face side by the downside interarea of reflecting plate 30.Therefore, lighting device 1 by possessing reflecting plate 30, the face side of the lighting device 1 that the light that each illuminating part 22 sends can be led efficiently.
From the light transmission cover 50 of the downside interarea outgoing of light guide plate 40 from the face side outgoing of lighting device 1.In addition, at this moment, by implementing light scattering process to cover 50, the brightness spot of the light from light guide plate 40 outgoing can be reduced further.
Like this, lighting device 1 can throw light on to the space of regulation.
3. the effect obtained
(1) formation that has of lighting device 1
Use Fig. 5 that the formation that lighting device 1 has is described.Fig. 5 is the front elevation representing lighting device 1.In addition, alleged here front elevation refers to lighting device 1 upright projection to the figure in the plane parallel with the downside interarea 11b of the abutment portion 11 being configured with each illuminating part 22.In addition, in Figure 5, as the internal structure of lighting device 1, illustrate with dashed lines circuit accommodator 12 and each illuminating part 22.In addition, in Figure 5, the dotted line of the outer peripheral face 12b of indication circuit accommodation section 12 is equivalent to the boundary line 12c of upside interarea 11a and outer peripheral face 12b, and is equivalent to the line of boundary line 12c upright projection to downside interarea 11b simultaneously.
In lighting device 1, on the interarea 11b of downside, each illuminating part 22 is configured in side more outer than the boundary line 12c of above-mentioned upright projection.In addition, " side more outer than boundary line 12c " does not comprise on the boundary line 12c of above-mentioned upright projection.
Sum up the content and above-mentioned content that illustrate in 1. and 2., in lighting device 1, configuring in framework 10 is multiple illuminating parts 22 of light source and the power circuit unit 60 of to power to each illuminating part 22 respectively with semiconductor light-emitting elements.In addition, framework 10 has abutment portion 11 and circuit accommodator 12, this abutment portion 11 has and is equipped with the 1st interarea (downside interarea) 11b of each illuminating part 22 with cyclic ligand and is positioned at the 2nd interarea (upside interarea) 11a of opposition side of the 1st interarea 11b, this circuit accommodator 12 is the tubulars erected from the 2nd interarea 11a, holds power circuit unit 60 in inside.And then during by the boundary line 12c upright projection of the outer peripheral face 12b of the 2nd interarea and circuit accommodator 12 to the 1st interarea 11b, on the 1st interarea 11b, each illuminating part 22 is configured in side more outer than the boundary line 12c of upright projection.
In addition, above-mentioned " being configured with the 1st interarea 11b of each illuminating part 22 " refers to, except each illuminating part 22 is directly configured in the state directly over the 1st interarea 11b, such as, also comprise the such each illuminating part 22 of lighting device 1 and be configured in state etc. on the 1st interarea 11b via substrate 21.But, do not comprise the state that each illuminating part 22 state, i.e. each illuminating part 22 be configured in via abutment portion 11 on the 1st interarea 11b itself is present in the 2nd interarea 11a side.
(2) effect of above-mentioned formation
Below, use Fig. 6, Fig. 7 that the effect that the formation described in (1) obtains is described.Fig. 6 is the enlarged cross section figure of part shown in Fig. 2 A, and Fig. 7 is the schematic section of the thermaltransmission mode illustrated in lighting device 1.
As shown in Figure 6, lighting device 1 is overlapping and form by the parts of multiple tabular and tubular, but in lighting device 1, what mainly send heat is each illuminating part 22 and power circuit unit 60.At this, observe the transfer mode of the heat that each illuminating part 22 and power circuit unit 60 send, as shown in Figure 7, only consider the major part in Fig. 6.In addition, for convenience of explanation, using the region on the downside of the abutment portion 11 existing for each illuminating part 22 as emitting space LS, using the inside of the circuit accommodator 12 existing for power circuit unit 60 as inner space IS1.In addition, using on the upside of abutment portion 11 and around the region of the outer peripheral face 12b of circuit accommodator 12 as space outerpace OS (with reference to Fig. 7).
First, each illuminating part 22 and power circuit unit 60 are configured in same framework 10 by lighting device 1, as compared to the lighting device that illuminating part and power circuit unit are configured in different framework respectively, more save space.Therefore, lighting device 1 can reduce and arranges required space, lays building of thermal insulation barriers or reinforcement etc., when fully cannot guarantee the space arranging lighting device, also causes obstacle to setting hardly in the inboard of ceiling or wall.
Then, in lighting device 1, same with the lighting device 90 of the prior art shown in Figure 12, each illuminating part 22 is present in the interarea 11b side, downside of abutment portion 11, and inner space IS1 is present in the interarea 11a side, upside of abutment portion 11.Therefore, on the direction parallel with abutment portion 11, each illuminating part 22 and inner space IS1 do not adjoin.
In addition, in lighting device 1, during by boundary line 12c upright projection to the 1st interarea 11b, on the 1st interarea 11b, each illuminating part 22 is configured in side more outer than the boundary line 12c of upright projection.
At this, boundary line 12c is also the boundary line of circuit accommodator 12 directly over the 2nd interarea 11a and space outerpace OS.Therefore, via each illuminating part 22 of abutment portion 11 positive behind (directly over) become space outerpace OS.That is, in lighting device 1, different from lighting device 90, on the direction orthogonal with abutment portion 11, each illuminating part 22 and inner space IS1 do not adjoin via abutment portion 11.
That is, in lighting device 1, except the direction parallel with abutment portion 11, each illuminating part 22 and inner space IS1 also keep off on the direction orthogonal with abutment portion 11.Thus, as shown in arrow T1, the heat that each illuminating part 22 sends is not directly delivered to inner space IS1.In addition, as shown in arrow T2, the heat that power circuit unit 60 sends is not directly delivered to each illuminating part 22.
And then in lighting device 1, as described above, on the direction orthogonal with abutment portion 11, each illuminating part 22 adjoins via abutment portion 11 and space outerpace OS.In addition, inner space IS1 adjoins via circuit accommodator 12 and space outerpace OS.At this, heat moves from high temperature side to low temperature side usually, but compared with the emitting space LS that there is thermal source and inner space IS1, the temperature that there is not the space outerpace OS of thermal source is lower.Therefore, in lighting device 1, thermal capacitance easily to move from emitting space LS side direction space outerpace OS side from IS1 side direction space outerpace OS side, inner space, not easily moves in the other direction to it.That is, heat is difficult to indirectly transmit between each illuminating part 22 and power circuit unit 60.
As previously discussed, in lighting device 1, heat is not directly transmitted between each illuminating part 22 and power circuit unit 60, and not easily indirectly transmits.Thus, in lighting device 1, heat is not easily transmitted between each illuminating part 22 and power circuit unit 60, can suppress the excessive temperature rise of each illuminating part 22 and power circuit unit 60.
In addition, in lighting device 1, each illuminating part 22 does not only adjoin with power circuit unit 60, does not also adjoin via abutment portion 11 and the inner space IS1 existing for power circuit unit 60.That is, each illuminating part 22 and the isolation of inner space IS1 heat.By this formation, lighting device 1 easily carries out thermal design and quality guarantee, and reliability improves.Below illustrate this effect.
The circuit component 62 of power circuit unit 60 is electronic components of semiconductor etc., and its absolute maximum rating decides based on surrounding (environment) temperature mostly.Although the rated power that can to obtain with the case temperature of electronic component be benchmark, need to use the actual substrate that adopts in product for this reason and verified by the producer of electronic component.In most cases, the producer of product is different with the producer of electronic component, in this case, exists in the future to other people open product and concerning problems such as the long life of the checking that the confirming operation of unfamiliar substrate the producer of electronic component causes.And then the ceiling temperature obtained by such checking and other rated values do not become the guarantee value of electronic component as a rule, and process as with reference to value.
Therefore, for the product comprising electronic component, be preferably and also consider that environment temperature carries out thermal design and quality guarantee except case temperature.At this, in lighting device 1, each illuminating part 22 and the isolation of inner space IS1 heat, when the temperature computation of the environment temperature of power circuit unit 60, i.e. inner space IS1, can get rid of this external cause of heating of each illuminating part 22.Therefore, in lighting device 1, easily carry out thermal design and quality guarantee, reliability improves.
And then in lighting device 1, any one of multiple illuminating part 22 is not close with inner space IS, not easily between power circuit unit 60, transmit heat.Therefore, the excessive temperature rise of the power circuit unit 60 reliably suppressing the heating of each illuminating part 22 to cause, and suppress a part of illuminating part 22 excessive temperature rise and the generation of the brightness spot that function stop causes.
(3) other effects
A. the effect of thermal insulation board 18 (heat insulating member)
Lighting device 1 possesses the thermal insulation board 18 between the upside interarea 11a being configured at power circuit unit 60 and abutment portion 11.Use Fig. 8 that the effect of this formation is described.Fig. 8 is the schematic section that the thermaltransmission mode possessed in the lighting device 1 of thermal insulation board 18 is described.
In lighting device 1, emitting space LS and inner space IS1 adjoins via abutment portion 11.Therefore, when not configuring thermal insulation board 18, the heat that power circuit unit 60 sends is directly delivered to emitting space LS (the downward arrow T2 with reference to Fig. 7).Therefore, the heat that power circuit unit 60 sends may be transmitted indirectly to illuminating part 22.On the other hand, when configuration thermal insulation board 18, the heat that power circuit unit 60 sends only is transmitted to the direction T32 towards direction, back side T31 and space outerpace OS, does not directly transmit to emitting space LS.That is, by possessing thermal insulation board 18, in lighting device 1, not only each illuminating part 22 and the isolation of inner space IS1 heat, emitting space LS and inner space IS1 also heat isolation.
As described above, in lighting device 1, by possessing the thermal insulation board 18 with above-mentioned formation, heat is difficult to transmit between each illuminating part 22 and power circuit unit 60 more, can suppress the excessive temperature rise of each illuminating part 22 and power circuit unit 60 further.In addition, in lighting device 1, when the temperature computation of the environment temperature of each illuminating part 22, i.e. emitting space LS, this external cause of heating of power circuit unit 60 can be got rid of, more easily can carry out thermal design and quality guarantee, improve the reliability of product further.
B. the effect of terminal board 70 (circuit cover)
Lighting device 1 has the terminal board 70 of bottom tube-like, and this terminal board 70 has the bottom surface sections 70a being positioned at the opposition side of abutment portion 11 when the private side of circuit accommodator 12 surrounds the side surface part 70b of power circuit unit 60 and observes from power circuit unit 60.And then, the bottom surface sections 70a of power circuit unit 60 and terminal board 70 and side surface part 70b thermal coupling.Further, less than the thermal resistance from power circuit unit 60 to side surface part 70b to the thermal resistance of bottom surface sections 70a from power circuit unit 60.Use Fig. 9 that the effect of this formation is described.Fig. 9 is the schematic section that the thermaltransmission mode possessed in the lighting device 1 of terminal board 70 is described.In addition, same with Fig. 8 in fig .9, consider thermal insulation board 18.
In lighting device 1, inner space IS1 is split by terminal board 70.At this, using the private side of terminal board 70 as inner space IS11, using the outer side of terminal board 70 as inner space IS12.
The heat that power circuit unit 60 sends in the IS11 of inner space, due to the effect of thermal insulation board 18 to the bottom surface sections 70a of terminal board 70 and side surface part 70b heat radiation.At this moment, due to the difference of thermal resistance, the heat dissipation capacity to bottom surface sections direction T41 is larger than the heat dissipation capacity to side surface part direction T42.
Then, the heat being delivered to inner space IS12 via side surface part 70b rearwardly direction T43 and circuit accommodator direction T44 is dispelled the heat.At this moment, air can be flowed and be dispelled the heat by convection current by direction T43 overleaf, so rearwardly the heat dissipation capacity of direction T43 is larger than the heat dissipation capacity to circuit accommodator direction T44.
Sum up, about the heat that power circuit unit 60 sends, the size to the heat dissipation capacity of direction T41 ~ T44 becomes T41 > T42 > T43 > T44.That is, the major part of heat that power circuit unit 60 sends is released to the rear side (T41, T43) of lighting device 1.On the other hand, the major part of heat that sends of each illuminating part 22 is released to the face side of lighting device 1 and side.Therefore, the heat dissipation path of each illuminating part 22 is separated with the heat dissipation path of power circuit unit 60.
Namely, lighting device 1 is by possessing the terminal board 70 with above-mentioned formation, the heat dissipation path of each illuminating part 22 is separated with the heat dissipation path of power circuit unit 60, heat is not easily transmitted between each illuminating part 22 and power circuit unit 60, can suppress the excessive temperature rise of each illuminating part 22 and power circuit unit 60 further.
< variation >
Be explained above an embodiment of the present utility model, but the utility model is not limited thereto.The variation of the lighting device of a mode of the present utility model is described referring to accompanying drawing.In addition, when using the parts identical with the parts illustrated, give the symbol identical with these parts and simple or omit the description.In addition, the scale of components in each figure may be different from actual product.
1. variation 1
In the framework 10 of above-mentioned embodiment, circuit accommodator 12 is the shapes vertically erected from the upside interarea 11a of abutment portion 11, but the utility model is not limited thereto.
Figure 10 is the schematic section representing the framework 210 that the lighting device of variation 1 possesses.The circuit accommodator 212 that framework 210 has abutment portion 11 and erects with tubular from the upside interarea 11a of abutment portion 11.In addition, in the lighting device of variation 1, except the shape of circuit accommodator 212, construct identical with the lighting device 1 of above-mentioned embodiment.
In the lighting device of variation 1, circuit accommodator 212 is along with away from abutment portion 11, front end attenuates.That is, the circular cone shape that the profile of circuit accommodator 212 is is bottom with abutment portion 11.By this formation, in the lighting device of variation 1, along with away from abutment portion 11, the inner space IS2 of circuit accommodator 212 diminishes, and is accompanied by this, and can increase the volume of space outerpace OS.Space outerpace OS has the effect same with radiator for illuminating part 22, so in the lighting device of variation 1, improves the thermal diffusivity of illuminating part 22.And then, by above-mentioned formation, in the lighting device of variation 1, overall height need not be changed, just can the area of outer peripheral face 212b of increasing circuit accommodation section 212, setting property and aesthetic appearance need not be sacrificed, just can improve the thermal diffusivity of power circuit unit 60.
In addition, in the lighting device of variation 1, upside interarea 11a is identical with lighting device 1 with the position relationship of each illuminating part 22 with the boundary line 212c of the outer peripheral face 212b of circuit accommodator 212.Therefore, heat is not easily transmitted between each illuminating part 22 and power circuit unit 60, can suppress the excessive temperature rise of each illuminating part 22 and power circuit unit 60.
2. variation 2
In the circuit accommodator of above-mentioned embodiment and variation 1, its wall thickness is certain, but the utility model is not limited thereto.
Figure 11 is the schematic section representing the framework 310 that the lighting device of variation 2 possesses.The circuit accommodator 312 that framework 310 has abutment portion 11 and erects with tubular from the upside interarea 11a of abutment portion 11.In addition, in the lighting device of variation 2, except the shape of circuit accommodator 312, construct identical with the lighting device 1 of above-mentioned embodiment.
In the lighting device of variation 2, the profile of circuit accommodator 312 is identical with variation 1, is the circular cone shape that is bottom with abutment portion 11.On the other hand, the inner peripheral surface 312a of the circuit accommodator 312 and upside interarea 11a of abutment portion 11 is orthogonal.By this formation, the framework 310 of variation 2 is more easily shaped compared with the framework 210 of variation 1.Specifically, in variation 1, the internal diameter of circuit accommodator 212 diminishes along with away from abutment portion 11, so when such as framework 210 being shaped by mould, is difficult to the mould withdrawing pattern of the inner peripheral surface 212a side of circuit accommodator 212.On the other hand, in variation 2, the inner peripheral surface 312a of circuit accommodator 312 is orthogonal with the upside interarea 11a of abutment portion 11, so by the mould withdrawing pattern simply of the inner peripheral surface 312a side of circuit accommodator 312, easily can be shaped when being shaped.
In addition, in the lighting device of variation 2, the 2nd interarea 11a is identical with lighting device 1 with the position relationship of each illuminating part 22 with the boundary line 312c of the outer peripheral face 312b of circuit accommodator 312.Therefore, heat is not easily transmitted between each illuminating part 22 and power circuit unit 60, can suppress the excessive temperature rise of each illuminating part 22 and power circuit unit 60.
In addition, in the lighting device of variation 2, circuit accommodator 312 is along with away from abutment portion 11, front end attenuates, and the thermal diffusivity of each illuminating part 22 and power circuit unit 60 improves.
3. other variation
In the lighting device of above-mentioned embodiment and variation, abutment portion is circular plate, but the circle of being not limited to, also can be such as polygon or ellipse etc.In addition, abutment portion is not limited to the completely smooth tabular of interarea, also can there is opening or a little concavo-convex at interarea.
In addition, in the lighting device of above-mentioned embodiment and variation, circuit accommodator is cylindric or circular cone shape, but is not limited thereto, as long as from the tubular that the interarea of abutment portion erects, such as, also can be the polygon column or oval column etc. in inside with space.
In addition, in the lighting device of above-mentioned embodiment and variation, multiple illuminating part is configured to circular, but is not limited thereto, such as, also can be configured to the ring-type of polygonal ring-type or ellipse.In addition, the ring that multiple illuminating part is formed also can configure multiple.
In addition, in the lighting device of above-mentioned embodiment and variation, as illuminating part exemplified with the LED sending white light, but being not limited thereto, such as, also can be the LED of the light sent beyond white light, can also be that multiple illuminating part sends different colours.In addition, also can add light adjusting circuit, by the signal from outside, such as change glow color and send daylight look, daytime white, white, temperature white, light bulb color etc.
In addition, as LED exemplified with surface mounting LED, but being not limited thereto, also can be bullet cut LED, can also be the LED (COB:Chip On Board) directly installing LED chip on substrate.When the LED of COB type, also multiple LED ring-type or dome-type resin can be covered and integrated.In this case, if using LED chip unit as illuminating part, multiple illuminating part is configured to ring-type.
In addition, the light source of illuminating part, except LED, also can be LD (laser diode) or EL (electroluminescent) element.In addition, the quantity of these illuminating parts does not limit.
In addition, in the lighting device of above-mentioned embodiment and variation, power circuit unit utilizes the alternating electromotive force from external power source supply, but is not limited thereto, such as, also can utilize the direct current power of battery etc.In addition, also can by such on-chip power in power circuit unit.
In addition, in the lighting device of above-mentioned embodiment and variation, as a mode of heat insulating member exemplified with hexagonal flat thermal insulation board, but be not limited thereto.Such as heat insulating member may not be hexagon, but circular, also can be the polygon beyond hexagon.In addition, may not be tabular, but there is concavo-convex shape etc. at opening or surface.In addition, may not be independently parts, but on the substrate of framework or power circuit unit the film etc. of film.
In addition, in the lighting device of above-mentioned embodiment and variation, be circular as a mode of circuit cover exemplified with bottom surface sections and side surface part is cylindric and possesses the terminal board of portion of terminal, but be not limited thereto.Also can be such as bottom surface sections be polygon or ellipse etc.In addition, the tubular etc. of also can be such as side surface part be polygon or ellipse.In addition, also can be such as the simple cover not possessing portion of terminal.At this moment, the area such as area at the thermal coupling position of the bottom surface sections side of power circuit unit and circuit cover being set to the thermal coupling position of the side surface part side than power circuit unit and circuit cover is large, and the thermal resistance to bottom surface sections side just can be made to be less than thermal resistance to side surface part side.In addition, the thermal coupling methods of circuit cover and power circuit unit is not limited to directly chimeric, the electrical connection etc. based on claw or protuberance, such as, also can be welding, screw joint, to screw togather, via the crimping etc. of heat exchange sheet.
Describe mode of the present utility model based on above-mentioned embodiment and variation above, but the utility model is not limited to above-mentioned embodiment and variation.Such as, also can be that the part of above-mentioned embodiment and variation is formed appropriately combined formation.In addition, the material described in above-mentioned embodiment, numerical value etc. merely illustrate preferred example, are not limited thereto.In addition, in the scope not departing from technological thought of the present utility model, suitably can change/add formation/delete.The utility model can be widely used in all lighting uses.
Claims (6)
1. a lighting device,
Being configured with in framework is multiple illuminating part of light source and the power circuit unit of powering to described multiple illuminating part respectively with semiconductor light-emitting elements,
Described framework has abutment portion and circuit accommodator, described abutment portion has the 1st interarea of the described multiple illuminating part of ring-type configuration and is positioned at the 2nd interarea of opposition side of described 1st interarea, described circuit accommodator is the tubular erected from described 2nd interarea, and hold described power circuit unit in inside
During by the boundary line upright projection of the outer peripheral face of described 2nd interarea and described circuit accommodator to described 1st interarea, on described 1st interarea, described multiple illuminating part is configured in side more outer than the described boundary line of upright projection.
2. lighting device as claimed in claim 1,
Also possesses the heat insulating member be configured between described power circuit unit and described 2nd interarea.
3. lighting device as claimed in claim 1,
Also have the circuit cover of bottom tube-like, this circuit cover has: side surface part, surrounds described power circuit unit at the private side of described circuit accommodator; And bottom surface sections, when observing from described power circuit unit, be positioned at the opposition side of described abutment portion,
The bottom surface sections of described power circuit unit and described circuit cover and side surface part thermal coupling,
Less than the thermal resistance from described power circuit unit to the side surface part of described circuit cover to the thermal resistance of the bottom surface sections of described circuit cover from described power circuit unit.
4. lighting device as claimed in claim 1,
Also possess light guide plate, this light guide plate has the 4th interarea of the 3rd interarea covering described 1st interarea and the opposition side being positioned at described 3rd interarea,
The light that described multiple illuminating part sends by described light guide plate imports described light guide plate from described 3rd interarea side inner, and from described 4th interarea side with planar outgoing.
5. lighting device as claimed in claim 1,
Described circuit accommodator attenuates along with away from described abutment portion.
6. lighting device as claimed in claim 5,
The inner peripheral surface of described circuit accommodator is orthogonal with described 2nd interarea.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013208457A JP6241723B2 (en) | 2013-10-03 | 2013-10-03 | Lighting device |
| JP2013-208457 | 2013-10-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204127722U true CN204127722U (en) | 2015-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420564565.8U Expired - Fee Related CN204127722U (en) | 2013-10-03 | 2014-09-28 | Lighting device |
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| Country | Link |
|---|---|
| JP (1) | JP6241723B2 (en) |
| CN (1) | CN204127722U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111853562A (en) * | 2019-04-18 | 2020-10-30 | 松下知识产权经营株式会社 | Light source for illumination and illumination device |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4797970B2 (en) * | 2006-12-22 | 2011-10-19 | パナソニック電工株式会社 | LED lighting device |
| JP2012084316A (en) * | 2010-10-08 | 2012-04-26 | Toshiba Lighting & Technology Corp | Lighting fixture |
| JP5946008B2 (en) * | 2011-08-05 | 2016-07-05 | 東芝ライテック株式会社 | lighting equipment |
| US8783937B2 (en) * | 2011-08-15 | 2014-07-22 | MaxLite, Inc. | LED illumination device with isolated driving circuitry |
| JP2013201016A (en) * | 2012-03-23 | 2013-10-03 | Toshiba Corp | Flat lamp device |
| JP5374662B2 (en) * | 2013-06-25 | 2013-12-25 | シャープ株式会社 | Lighting device |
-
2013
- 2013-10-03 JP JP2013208457A patent/JP6241723B2/en active Active
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111853562A (en) * | 2019-04-18 | 2020-10-30 | 松下知识产权经营株式会社 | Light source for illumination and illumination device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015072826A (en) | 2015-04-16 |
| JP6241723B2 (en) | 2017-12-06 |
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