CN204104217U - High density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism - Google Patents

High density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism Download PDF

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Publication number
CN204104217U
CN204104217U CN201420456133.5U CN201420456133U CN204104217U CN 204104217 U CN204104217 U CN 204104217U CN 201420456133 U CN201420456133 U CN 201420456133U CN 204104217 U CN204104217 U CN 204104217U
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CN
China
Prior art keywords
circuit board
collecting machine
automatic plate
substrate
plate collecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420456133.5U
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Chinese (zh)
Inventor
付云畅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tianjin Printronics Circuit Corp
Original Assignee
Tianjin Printronics Circuit Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tianjin Printronics Circuit Corp filed Critical Tianjin Printronics Circuit Corp
Priority to CN201420456133.5U priority Critical patent/CN204104217U/en
Application granted granted Critical
Publication of CN204104217U publication Critical patent/CN204104217U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model relates to a kind of high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism, described observation window upper limit rotates installation one can to the substrate of the receipts plate lifting platform rotation of automatic plate collecting machine, multiple fan installed by this substrate, the circuit board that the air outlet of each fan is placed on described receipts plate lifting platform.In the utility model, when after the circuit board arrival receipts plate lifting platform that drying section exports, export behind next block circuit board certain hour interval, the circuit board that now cold wind of the air outlet blowout of fan will be received on plate lifting platform cools, the circuit board cooling exported at interval thus, avoids the problem of oxidation of the circuit board copper coating that the high temperature after oven dry causes.

Description

High density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism
Technical field
The utility model belongs to wet process operation automatic plate collecting machine construction applications, especially a kind of high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism.
Background technology
In high density interconnect board production, will through a cleaning line body after the electroplating technology of wet process operation completes, copper facing liquid is cleaned up, then plate 3 is received by automatic plate collecting machine, automatic plate collecting machine is provided with observation window 2, operating personnel can observe intuitively and receive plate lifting platform 10, also may be used for maintenance.The last process of cleaning line body is the drying section 1 of use 80 degrees Celsius of hot blasts, not only the moisture on circuit board is dried, when making receipts plate, circuit board surface temperature reaches 40 degrees Celsius simultaneously, because the high temperature of circuit board surface can continue a very long time, if Temperature fall is longer to 25 degrees Celsius of times, very easily occur that problem of oxidation appears in circuit board surface copper coating, impact is caused on the processing of subsequent conditioning circuit plate.Thorn width formula panel turnover machine is installed to avoid the oxidation of circuit board surface copper coating by some producer in drying section rear end, but thorn width formula panel turnover machine purchase cost is very high, at least more than 50,000, and wet process operation does not leave the locus of installing thorn width formula panel turnover machine when initial installation, so cause often occurring oxidized substandard products in following process.
Utility model content
The purpose of this utility model is to overcome the deficiencies in the prior art, provides a kind of high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism of with low cost, good cooling effect.
The technical scheme that the utility model is taked is:
A kind of high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism, comprise drying section and automatic plate collecting machine, automatic plate collecting machine is arranged on the rear end of drying section, in automatic plate collecting machine upper end, observation window is installed, it is characterized in that: described observation window upper limit rotates installation one can to the substrate of the receipts plate lifting platform rotation of automatic plate collecting machine, multiple fan installed by this substrate, the circuit board that the air outlet of each fan is placed on described receipts plate lifting platform.
And, symmetrical installation one pedestal on inner edge, described observation window both sides, the Side symmetrical that two pedestals are relative installs two screw rods, and these two screw rods are through the edge of homonymy substrate, and the nut that each screw rod end stretched into inside substrate rotates suit is fixing for substrate and two screw rods.
And the angle of described substrate and described receipts plate lifting platform is 45 degree.
And the quantity of described fan is four and connection parallel with one another.
Advantage of the present utility model and good effect are:
In the utility model, observation window on automatic plate collecting machine is two, one of them is pulled down, and then two pedestals are installed in the window frame both sides of observation window, screw rod on these two pedestals rotates installation one substrate, the air outlet of four fans that this substrate is installed is towards the circuit board on the receipts plate lifting platform of automatic plate collecting machine, the angle of substrate and described receipts plate lifting platform is 45 degree, when after the circuit board arrival receipts plate lifting platform that drying section exports, export behind next block circuit board certain hour interval, the circuit board that now cold wind of the air outlet blowout of fan will be received on plate lifting platform cools, the circuit board cooling thus interval exported, avoid the problem of oxidation of the circuit board copper coating that the high temperature after oven dry causes.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the A-A sectional view of Fig. 1;
Fig. 3 is the structural representation of prior art.
Embodiment
Below in conjunction with embodiment, further illustrate the utility model, following embodiment is illustrative, is not determinate, can not limit protection range of the present utility model with following embodiment.
A kind of high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism, as shown in Figures 1 to 3, comprise drying section 1 and automatic plate collecting machine 3, automatic plate collecting machine is arranged on the rear end of drying section, in automatic plate collecting machine upper end, observation window 2 is installed, innovation of the present utility model is: the window frame upper limit of described observation window rotates installation one can to the substrate 4 of receipts plate lifting platform 10 rotation of automatic plate collecting machine, this substrate is installed multiple fan 5, the circuit board 11 that the air outlet of each fan is placed on described receipts plate lifting platform.
In the present embodiment, symmetrical installation one pedestal 8 on inner edge, described observation window both sides, the Side symmetrical that two pedestals are relative installs two screw rods 6, and these two screw rods are through the edge of homonymy substrate, and the nut 7 that each screw rod end stretched into inside substrate rotates suit is fixing for substrate and two screw rods.
Preferred scheme is: the angle of described substrate and described receipts plate lifting platform is 45 degree.The quantity of described fan is four and connection parallel with one another by switch 9 series-connection power supplies.Cold wind such as the direction of arrow in Fig. 2 of the air outlet blowout of fan is blown on circuit board, and receive plate lifting platform and decline gradually, every block circuit board cools by cold wind.
In the utility model, observation window on automatic plate collecting machine is two, one of them is pulled down, and then two pedestals are installed in the window frame both sides of observation window, screw rod on these two pedestals rotates installation one substrate, the air outlet of four fans that this substrate is installed is towards the circuit board on the receipts plate lifting platform of automatic plate collecting machine, the angle of substrate and described receipts plate lifting platform is 45 degree, when after the circuit board arrival receipts plate lifting platform that drying section exports, export behind next block circuit board certain hour interval, the circuit board that now cold wind of the air outlet blowout of fan will be received on plate lifting platform cools, the circuit board cooling thus interval exported, avoid the problem of oxidation of the circuit board copper coating that the high temperature after oven dry causes.

Claims (4)

1. a high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism, comprise drying section and automatic plate collecting machine, automatic plate collecting machine is arranged on the rear end of drying section, in automatic plate collecting machine upper end, observation window is installed, it is characterized in that: described observation window upper limit rotates installation one can to the substrate of the receipts plate lifting platform rotation of automatic plate collecting machine, multiple fan installed by this substrate, the circuit board that the air outlet of each fan is placed on described receipts plate lifting platform.
2. high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism according to claim 1, it is characterized in that: symmetrical installation one pedestal on inner edge, described observation window both sides, the Side symmetrical that two pedestals are relative installs two screw rods, these two screw rods are through the edge of homonymy substrate, and the nut that each screw rod end stretched into inside substrate rotates suit is fixing for substrate and two screw rods.
3. high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism according to claim 2, is characterized in that: the angle of described substrate and described receipts plate lifting platform is 45 degree.
4. high density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism according to claim 3, is characterized in that: the quantity of described fan is four and connection parallel with one another.
CN201420456133.5U 2014-08-13 2014-08-13 High density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism Expired - Fee Related CN204104217U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420456133.5U CN204104217U (en) 2014-08-13 2014-08-13 High density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420456133.5U CN204104217U (en) 2014-08-13 2014-08-13 High density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism

Publications (1)

Publication Number Publication Date
CN204104217U true CN204104217U (en) 2015-01-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420456133.5U Expired - Fee Related CN204104217U (en) 2014-08-13 2014-08-13 High density interconnect circuit board wet process operation automatic plate collecting machine cooling mechanism

Country Status (1)

Country Link
CN (1) CN204104217U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104848678A (en) * 2015-04-24 2015-08-19 宁波北新建材有限公司 Method and device for automatically cooling of drying machine
CN110091585A (en) * 2019-05-14 2019-08-06 梁伟虹 A kind of paper printing heat radiating type laminating machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104848678A (en) * 2015-04-24 2015-08-19 宁波北新建材有限公司 Method and device for automatically cooling of drying machine
CN110091585A (en) * 2019-05-14 2019-08-06 梁伟虹 A kind of paper printing heat radiating type laminating machine

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20150114

Termination date: 20170813