CN204067427U - A kind of high-efficient heat-dissipating LED lamp - Google Patents
A kind of high-efficient heat-dissipating LED lamp Download PDFInfo
- Publication number
- CN204067427U CN204067427U CN201420454257.XU CN201420454257U CN204067427U CN 204067427 U CN204067427 U CN 204067427U CN 201420454257 U CN201420454257 U CN 201420454257U CN 204067427 U CN204067427 U CN 204067427U
- Authority
- CN
- China
- Prior art keywords
- heat
- led lamp
- lens
- heat sink
- efficient heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a kind of high-efficient heat-dissipating LED lamp, comprising: LED bulb, phosphor powder layer, lens, pedestal, heat sink, spun gold; Described LED bulb is connected with heat sink by connecting material; Described spun gold is connected with LED bulb; LED bulb is wrapped in interior and is connected with heat sink by described phosphor powder layer; Phosphor powder layer is wrapped in interior and is connected with pedestal by described lens.A kind of high-efficient heat-dissipating LED lamp in the utility model is reasonable in design, can either realize divergent light source, can also ensure the heat radiation of bulb, improves useful life and the fail safe of LED.
Description
Technical field
The utility model relates to energy-conserving and environment-protective field, is specifically related to a kind of high-efficient heat-dissipating LED lamp.
Background technology
A kind of high-efficient heat-dissipating LED lamp in currently available technology many employings bulb, or spirality, or cylindricality, any design is not done in bulb periphery, causes light source too concentrated, very dazzling; In addition, present most of building is all very intensive causes daylighting poor, and LED is used on a large scale as environment-friendly type lamp, may be all in running order up to 16 hours in the middle of one day, this has caused the problem of LED bulb heat radiation, the patent No. is 201120126782.5 radiator structures disclosing LED daylight lamp, by crossing hot hole and radiating tube and heat conductive silica gel, heat is distributed, according to diagram, the distribution of louvre is not concentrated, can not realize heat conduction efficiently, and louvre is arranged in LED lamp panel, the result of use of lamp plate can be had influence on.
Utility model content
1. the utility model technical problem that will solve
The purpose of this utility model is to overcome above-mentioned technical deficiency, provides a kind of reasonable in design, can either divergent light source, can play again a kind of high-efficient heat-dissipating LED lamp of high efficiency and heat radiation effect.
2. technical scheme
For achieving the above object, the technical scheme that the utility model provides is:
A kind of high-efficient heat-dissipating LED lamp of the present utility model, comprising: LED bulb, phosphor powder layer, lens, pedestal, heat sink, spun gold;
Described LED bulb is connected with heat sink by connecting material; Described spun gold is connected with LED bulb; LED bulb is wrapped in interior and is connected with heat sink by described phosphor powder layer; Phosphor powder layer is wrapped in interior and is connected with pedestal by described lens.
Further improve as the utility model, described lens are dome-type, and have filler in lens.
Further improve as the utility model, described pedestal lays respectively at heat sink surrounding, is connected respectively with lens with heat sink.
Further improve as the utility model, spun gold comprises anode and negative electrode.
Further improve as the utility model, described filler is heat-conducting interface material.
3. beneficial effect
The technical scheme adopting the utility model to provide, compared with prior art, has following beneficial effect:
1, lens adopt dome-type, and the light source of LED bulb can be made to reflect dispersion as far as possible, even indoor integrated light source.
2, lens interior is filled with heat-conducting interface material, can realize heat conduction even, also can reflect divergent light source further.
3, LED bulb be positioned at heat sink on, contact-making surface can realize high efficiency and heat radiation greatly.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of high-efficient heat-dissipating LED lamp in the utility model.
Embodiment
For understanding content of the present utility model further, in conjunction with the accompanying drawings and embodiments the utility model is described in detail.
Embodiment
As shown in Figure 1, a kind of high-efficient heat-dissipating LED lamp of the present utility model, comprising: LED bulb 1, phosphor powder layer 2, lens 3, pedestal 5, heat sink 6, spun gold 7;
Described LED bulb 1 is connected with heat sink 6 by connecting material; Described spun gold 7 is connected with LED bulb 1; LED bulb 1 is wrapped in interior and is connected with heat sink 6 by described phosphor powder layer 2; Phosphor powder layer 2 is wrapped in interior and is connected with pedestal 5 by described lens 3.
Described lens 3 in dome-type, and have filler 4 in lens 3.
Described pedestal 5 lays respectively at heat sink 6 surroundings, is connected respectively with lens 3 with heat sink 6.
Spun gold 7 comprises anode and negative electrode.
Described filler 4 is heat-conducting interface material.
Schematically above be described the utility model and execution mode thereof, this description does not have restricted, and also just one of the execution mode of the present utility model shown in accompanying drawing, actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the utility model and creating aim, design the frame mode similar to this technical scheme and embodiment without creationary, protection range of the present utility model all should be belonged to.
Claims (5)
1. a high-efficient heat-dissipating LED lamp, is characterized in that, comprising: LED bulb (1), phosphor powder layer (2), lens (3), pedestal (5), heat sink (6), spun gold (7);
Described LED bulb (1) is connected with heat sink (6) by connecting material; Described spun gold (7) is connected with LED bulb (1); LED bulb (1) is wrapped in interior and is connected with heat sink (6) by described phosphor powder layer (2); Phosphor powder layer (2) is wrapped in interior and is connected with pedestal (5) by described lens (3).
2. a kind of high-efficient heat-dissipating LED lamp according to claim 1, is characterized in that, described lens (3) in dome-type, and have filler (4) in lens (3).
3. a kind of high-efficient heat-dissipating LED lamp according to claim 1, is characterized in that, described pedestal (5) lays respectively at heat sink (6) surrounding, is connected respectively with lens (3) with heat sink (6).
4. a kind of high-efficient heat-dissipating LED lamp according to claim 1, is characterized in that, spun gold (7) comprises anode and negative electrode.
5. a kind of high-efficient heat-dissipating LED lamp according to claim 2, is characterized in that, described filler (4) is heat-conducting interface material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420454257.XU CN204067427U (en) | 2014-08-12 | 2014-08-12 | A kind of high-efficient heat-dissipating LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420454257.XU CN204067427U (en) | 2014-08-12 | 2014-08-12 | A kind of high-efficient heat-dissipating LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204067427U true CN204067427U (en) | 2014-12-31 |
Family
ID=52208881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420454257.XU Expired - Fee Related CN204067427U (en) | 2014-08-12 | 2014-08-12 | A kind of high-efficient heat-dissipating LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204067427U (en) |
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2014
- 2014-08-12 CN CN201420454257.XU patent/CN204067427U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20160812 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |