CN204067325U - A kind of TO-220 or ITO-220F encapsulating products tool - Google Patents
A kind of TO-220 or ITO-220F encapsulating products tool Download PDFInfo
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- CN204067325U CN204067325U CN201420414734.XU CN201420414734U CN204067325U CN 204067325 U CN204067325 U CN 204067325U CN 201420414734 U CN201420414734 U CN 201420414734U CN 204067325 U CN204067325 U CN 204067325U
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- chip
- sucker
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- hole
- chip set
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Abstract
The utility model relates to a kind of TO-220 or ITO-220F encapsulating products tool, comprise the first chip sucker, chip changeover panel, second chip sucker, 3rd chip sucker, framework location-plate and framework, some first chip set holes are provided with in first chip sucker, vacuum sucking holes is equipped with in first chip set hole, the second chip set hole is provided with in chip changeover panel, the 3rd chip set hole is provided with in second chip sucker, vacuum sucking holes is provided with in 3rd chip set hole of odd column, the 4th chip set hole is provided with in 3rd chip sucker, vacuum sucking holes is provided with in 4th chip set hole of even column.The beneficial effects of the utility model are: can to make point to operation easier, operability is good, efficiency is high, chip is avoided to divide tweezer point in process to contact with the direct of chip itself, avoid occurring latent failure in processing procedure process, effectively improve product reliability, and applicable chip size is in extensive range, between tool, closely cooperating property is good, reduces the probability appearance of off normal, rotary chip.
Description
(1) technical field
The utility model relates to a kind of TO-220 or ITO-220F encapsulating products tool, and particularly a kind of TO or ITO encapsulates GPP chip common anode (N-P-P-N) or monoyin and monoyang (P-N-P-N) or single core (P-N) structure operation tool.
(2) background technology
Existing TO-220 or ITO-220F encapsulating products generally selects common cathode (P-N-N-P) or single core (N-P) encapsulating structure, along with the demand in market, the product needed of a large amount of TO-220 or ITO-220F packing forms adopts chip common anode (N-P-P-N) or monoyin and monoyang (P-N-P-N) or single core (P-N) encapsulating structure form, be related specifically to HER (UF)/SF series of products, if adopt original tool chip to be divided the conversion that cannot complete PN face backward, and adopt people's work point to inefficiency, poor operability, when dividing use tweezers gripping in process, forceps tips inevitably makes chip glass layer suffer damage, cause potential product failure.
(3) summary of the invention
The utility model in order to make up the deficiencies in the prior art, provide a kind of point to easy and simple to handle, efficiency is high, product reliability is high, be suitable for wide TO-220 or the ITO-220F encapsulating products tool of chip size scope.
The utility model is achieved by the following technical solution:
A kind of TO-220 or ITO-220F encapsulating products tool, it is characterized in that: comprise the first chip sucker, chip changeover panel, second chip sucker, 3rd chip sucker, framework location-plate and framework, some first chip set holes are provided with in described first chip sucker, vacuum sucking holes is equipped with in first chip set hole, the second chip set hole is provided with in chip changeover panel, the 3rd chip set hole is provided with in second chip sucker, vacuum sucking holes is provided with in 3rd chip set hole of odd column, the 4th chip set hole is provided with in 3rd chip sucker, vacuum sucking holes is provided with in 4th chip set hole of even column.
Described first chip sucker, chip changeover panel, the second chip sucker and the 3rd equal correspondence in chip sucker both sides are provided with some suctions pin-and-hole, inhale in a pin-and-hole and are equipped with vacuum sucking holes, and a suction pin-and-hole of both sides is inserted with chip suction pen by inhaling an alignment pin.
Described first chip sucker and the 3rd equal diagonal angle of chip sucker are provided with alignment pin, and chip changeover panel diagonal angle is provided with dowel hole, and the second chip sucker respectively diagonal angle is provided with alignment pin and dowel hole.
The beneficial effects of the utility model are: provide a kind of point to conversion tool, can to make point to operation easier, operability is good, efficiency is high, avoids chip to divide tweezer point in process to contact with the direct of chip itself, avoids occurring latent failure in processing procedure process, effectively improve product reliability, and applicable chip size is in extensive range, between tool, closely cooperating property is good, reduces the probability appearance of off normal, rotary chip.
(4) accompanying drawing explanation
Below in conjunction with accompanying drawing, the utility model is further described.
Accompanying drawing 1 is the first chip sucker structure schematic diagram of the present utility model;
Accompanying drawing 2 is chip changeover panel structural representation of the present utility model;
Accompanying drawing 3 is the second chip sucker structure schematic diagram of the present utility model;
Accompanying drawing 4 is the 3rd chip sucker structure schematic diagram of the present utility model;
Accompanying drawing 5 is framework location-plate plan structure schematic diagram of the present utility model;
Accompanying drawing 6 is framework location-plate side-looking structural representation of the present utility model;
Accompanying drawing 7 is that chip of the present utility model inhales a plan structure schematic diagram;
Accompanying drawing 8 is that chip of the present utility model inhales the main TV structure schematic diagram of pen;
Accompanying drawing 9 is frame structure schematic diagram of the present utility model;
Accompanying drawing 10 is the first chip set hole plan structure schematic diagram of the present utility model;
Accompanying drawing 11 is the first main TV structure schematic diagram in chip set hole of the present utility model;
Accompanying drawing 12 is the second chip set hole plan structure schematic diagram of the present utility model;
Accompanying drawing 13 is the second main TV structure schematic diagram in chip set hole of the present utility model;
Accompanying drawing 14 is the 3rd chip set hole plan structure schematic diagram of the present utility model;
Accompanying drawing 15 is the 3rd main TV structure schematic diagram in chip set hole of the present utility model;
Accompanying drawing 16 is the 4th chip set hole plan structure schematic diagram of the present utility model;
Accompanying drawing 17 is the 4th main TV structure schematic diagram in chip set hole of the present utility model;
In figure, 1 first chip sucker, 2 chip changeover panels, 3 second chip suckers, 4 the 3rd chip suckers, 5 framework location-plates, 6 frameworks, 7 first chip set holes, 8 vacuum sucking holes, 9 second chip set holes, 10 the 3rd chip set holes, 11 the 4th chip set holes, 12 inhale a pin-and-hole, and 13 inhale an alignment pin, and 14 chips inhale pen, 15 alignment pins, 16 dowel holes.
(5) embodiment
Accompanying drawing is a kind of specific embodiment of the present utility model.This embodiment comprises the first chip sucker 1, chip changeover panel 2, second chip sucker 3, 3rd chip sucker 4, framework location-plate 5 and framework 6, some first chip set holes 7 are provided with in first chip sucker 1, vacuum sucking holes 8 is equipped with in first chip set hole 7, the second chip set hole 9 is provided with in chip changeover panel 2, the 3rd chip set hole 10 is provided with in second chip sucker 3, vacuum sucking holes 8 is provided with in 3rd chip set hole 10 of odd column, the 4th chip set hole 11 is provided with in 3rd chip sucker 4, vacuum sucking holes 8 is provided with in 4th chip set hole 11 of even column.First chip sucker 1, chip changeover panel 2, second chip sucker 3 and the 3rd equal correspondence in chip sucker 4 both sides are provided with some suctions pin-and-hole 12, inhale in a pin-and-hole 12 and be equipped with vacuum sucking holes 8, a suction pin-and-hole 12 of both sides is inserted with chip suction pen 14 by inhaling an alignment pin 13.First chip sucker 1 and the 3rd chip sucker 4 are all provided with alignment pin 15 in diagonal angle, and chip changeover panel 2 diagonal angle is provided with dowel hole 16, and the second chip sucker 3 respectively diagonal angle is provided with alignment pin 15 and dowel hole 16.
Adopt TO-220 or ITO-220F encapsulating products tool of the present utility model, adopting combination that is a kind of or two kinds of tool fixture to realize chip divides to function, chip size is applied widely, tool design can expand according to frame size size reasonable or reduce, be not limited to restriction, overturning jig frame adopts fine positioning finger setting, accurate positioning, uses pull of vacuum to adsorb chip, and overturning jig collocation screen tray and chip are inhaled pen and reached and point be converted to frame welding the window's position backward.
Adopt TO-220 or ITO-220F encapsulating products tool of the present utility model, common anode (N-P-P-N): framework 6 is placed in framework location-plate 5, chip put into by first chip sucker 1, rock sucker, chip is made naturally to divide to the first chip set hole 7, add vacuum simultaneously, now chip P is towards upper, N faces down, chip divides and is adsorbed in vacuum sucking holes 8 backward, point to after completing, chip changeover panel 2 is overturn, alignment pin 15 and dowel hole 16 closely cooperate and locate, first chip set hole 7 is corresponding with the second position, chip set hole 9, first chip sucker 1 closely cooperates with chip changeover panel 2, cut off vacuum, overturn back chip changeover panel 2, complete chip conversion, now chip N face is upper, P face under, chip is inhaled pen 14 to be positioned over chip changeover panel 2 and then to inhale an alignment pin 13 by the pin-and-hole of the suction on changeover panel 2 12 and chip and locate, inhale on pen 14 at chip and add vacuum, pick up chip, be positioned on the corresponding window of framework 6 on framework location-plate 5, complete point to upset.
Adopt TO-220 or ITO-220F encapsulating products tool of the present utility model, monoyin and monoyang (P-N-P-N): framework 6 is placed in framework location-plate 5, chip put into by second chip sucker 3, rock sucker, chip is made naturally to divide to the 3rd chip set hole 10, add vacuum simultaneously, now chip P is towards upper, N faces down, chip divides and is adsorbed in vacuum sucking holes 8 backward, because vacuum sucking holes 8 one is only opened in the 3rd chip set hole 10, point to after completing, second chip sucker 3 is overturn, adjacent chips is not fallen by adsorbing, get the 3rd chip sucker 4 and repeat above action, then the 3rd chip sucker 4 is overturn, the dowel hole 16 of its alignment pin 15 and the second chip sucker 3 closely cooperates, cut off vacuum, chip falls the 3rd position, chip set hole 10 of the second chip sucker 3, overturn back the 3rd chip sucker 4, complete chip conversion, now a chips P face upper N face under, one chips P face in lower N face upper, complete point to conversion, chip is inhaled pen 14 and be positioned over the second chip sucker 3, then inhale on pen 14 at chip and add vacuum, pick up chip, be positioned on the corresponding window of framework 6 on framework location-plate 5, complete point to upset.
Adopt TO-220 or ITO-220F encapsulating products tool of the present utility model, single core (P-N): framework 6 is placed in framework location-plate 5, chip put into by second chip sucker 3, rock sucker, chip is made naturally to divide to the 3rd chip set hole 10, add vacuum simultaneously, now chip P is towards upper, N faces down, chip divides and is adsorbed in vacuum sucking holes 8 backward, because vacuum sucking holes 8 one is only opened in the 3rd chip set hole 10, point to after completing, second chip sucker 3 is overturn, adjacent chips is not fallen by adsorbing, chip changeover panel 2 is overturn, the alignment pin 15 of the second chip sucker 3 closely cooperates with the dowel hole 16 of chip changeover panel 2 and locates, chip falls into the second chip set hole 9 of chip changeover panel 2, complete point to action, now chip P face under, N face is upper, chip is inhaled pen 14 to be positioned over chip changeover panel 2 and then to inhale an alignment pin 13 by the pin-and-hole of the suction on chip changeover panel 2 12 and chip and locate, inhale on pen 14 at chip and add vacuum, pick up chip, be positioned on the corresponding window of framework 6 on framework location-plate 5, complete point to upset.
Claims (3)
1. a TO-220 or ITO-220F encapsulating products tool, it is characterized in that: comprise the first chip sucker (1), chip changeover panel (2), second chip sucker (3), 3rd chip sucker (4), framework location-plate (5) and framework (6), some first chip set holes (7) are provided with in described first chip sucker (1), vacuum sucking holes (8) is equipped with in first chip set hole (7), the second chip set hole (9) is provided with in chip changeover panel (2), the 3rd chip set hole (10) is provided with in second chip sucker (3), vacuum sucking holes (8) is provided with in 3rd chip set hole (10) of odd column, the 4th chip set hole (11) is provided with in 3rd chip sucker (4), vacuum sucking holes (8) is provided with in 4th chip set hole (11) of even column.
2. a kind of TO-220 or ITO-220F encapsulating products tool according to claim 1, it is characterized in that: described first chip sucker (1), chip changeover panel (2), the second chip sucker (3) and the 3rd equal correspondence in chip sucker (4) both sides are provided with some suctions pin-and-hole (12), inhale in a pin-and-hole (12) and be equipped with vacuum sucking holes (8), a suction pin-and-hole (12) of both sides is inserted with chip suction pen (14) by inhaling an alignment pin (13).
3. a kind of TO-220 or ITO-220F encapsulating products tool according to claim 1, it is characterized in that: described first chip sucker (1) and the 3rd chip sucker (4) are all provided with alignment pin (15) in diagonal angle, chip changeover panel (2) diagonal angle is provided with dowel hole (16), and the second chip sucker (3) respectively diagonal angle is provided with alignment pin (15) and dowel hole (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420414734.XU CN204067325U (en) | 2014-07-26 | 2014-07-26 | A kind of TO-220 or ITO-220F encapsulating products tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420414734.XU CN204067325U (en) | 2014-07-26 | 2014-07-26 | A kind of TO-220 or ITO-220F encapsulating products tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204067325U true CN204067325U (en) | 2014-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420414734.XU Expired - Fee Related CN204067325U (en) | 2014-07-26 | 2014-07-26 | A kind of TO-220 or ITO-220F encapsulating products tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204067325U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977191A (en) * | 2016-07-15 | 2016-09-28 | 常州银河电器有限公司 | Screening tool and screening method for hexagonal chip |
| CN107687466A (en) * | 2017-09-30 | 2018-02-13 | 东莞市昊英橡塑制品有限公司 | A kind of gum pad bat printing tool |
-
2014
- 2014-07-26 CN CN201420414734.XU patent/CN204067325U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977191A (en) * | 2016-07-15 | 2016-09-28 | 常州银河电器有限公司 | Screening tool and screening method for hexagonal chip |
| CN105977191B (en) * | 2016-07-15 | 2019-09-24 | 常州银河电器有限公司 | Screening tooling and screening technique for hexagonal chip |
| CN107687466A (en) * | 2017-09-30 | 2018-02-13 | 东莞市昊英橡塑制品有限公司 | A kind of gum pad bat printing tool |
| CN107687466B (en) * | 2017-09-30 | 2023-12-19 | 东莞市喜顺科技有限公司 | Pad printing jig for back adhesive gasket |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20210726 |