CN204066780U - A kind of shield type transfer bus of solid insulation cabinet - Google Patents
A kind of shield type transfer bus of solid insulation cabinet Download PDFInfo
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- CN204066780U CN204066780U CN201420553968.2U CN201420553968U CN204066780U CN 204066780 U CN204066780 U CN 204066780U CN 201420553968 U CN201420553968 U CN 201420553968U CN 204066780 U CN204066780 U CN 204066780U
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- epoxy resin
- resin layer
- copper rod
- conduction copper
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Abstract
The utility model discloses a kind of shield type transfer bus of solid insulation cabinet, comprise one for connecting the conduction copper rod of the assembly in solid insulation cabinet, the surface of conduction copper rod is provided with an epoxy resin layer for insulating, the surface of conduction copper rod is provided with one for preventing conduction copper rod along epoxy resin layer groove in axial sliding, with one for preventing from conducting electricity the tangent plane that radially slides along epoxy resin layer of copper rod, the outer surface of epoxy resin layer is provided with an outer conducting layer for shielding, and outer conducting layer is high-temperature silica gel conductive ink layer.Realizing better shield effectiveness by arranging high-temperature silica gel conductive ink layer at the outer surface of epoxy resin layer, also another conductive layer being set at the inner surface of epoxy resin layer, make the partial discharge better effects if of epoxy resin layer.Prevent by devising on conduction copper rod the structure that epoxy resin layer is axial and radially slide again, conduction copper rod also can be fitted tightly with epoxy resin layer when being connected with other assemblies and producing external force.
Description
Technical field
The utility model relates to solid insulation cabinet field, is specifically related to a kind of shield type transfer bus of solid insulation cabinet.
Background technology
One, according to state's net Q/GDW 730-2012 " 12kV solid insulation ring main unit technical conditions " 3.2 regulations: adopt solid insulating material to decide isolation material, the palp surface-coated of people has conducts electricity or semi-conductive screen reliable ground.The mainly employing APG epoxy resin that current market is used as solid insulating material is decided insulating material, and be used as the mainly employing surface-coated conduction zinc technology of shielding, there is following shortcoming in this technology: the surface finish that 1, must will spray before epoxy resin surface coated with conductive zinc is coarse, otherwise conduction zinc is difficult to be attached on APG epoxy resin part, so takes human cost very much.2, the anti-filthy ability of conduction zinc layers of coating, some filthy materials are easy to be attached in conduction zinc layers, perishable conduction zinc layers and itself and epoxy resin part are come off.3, epoxy resin part surface because of polishing coarse injustice, when inner face have high-tension electricity by time therefore surface easily produce electric discharge phenomena, be so just difficult to reach the requirement of state's net companies ask partial discharge quantity Da Dao≤5pC under 1.2U r condition.4, solid insulation cabinet surface-coated zinc technological accumulation and inheritance pollutes large, is a kind of surperficial shield technology that need eliminate.Two, current many solid insulation cabinet is produced and is produced house and think that the shield technology of solid insulation cabinet is exactly simply just done shielding processing to it at last at solid insulation cabinet surface application one deck conductive layer, actual this method is a kind of meaning of presentation, and the requirement of this simple process to state's net companies ask partial discharge quantity Da Dao≤5pC under 1.2U r condition does not reach far away.Three, current many producers are in order to make conduction copper rod and epoxy resin insulating layers fluid-tight engagement, all adopt and carry out sandblasting grinding process to conduction copper rod surface, this process fundamentally can not prevent from conducting electricity between copper rod and epoxy resin insulating layers and produce under the effect of external force axially and radial disengaging.
Utility model content
In order to overcome the deficiencies in the prior art, the purpose of this utility model is the shield type transfer bus providing a kind of solid insulation cabinet, better shield effectiveness is realized by arranging high-temperature silica gel conductive ink layer at the outer surface of epoxy resin layer, and do not need to process epoxy resin layer surface, prevent by devising on conduction copper rod the structure that epoxy resin layer is axial and radially slide again, conduction copper rod also can be fitted tightly with epoxy resin layer when being connected with other assemblies and producing external force.
For solving the problem, the technical scheme that the utility model adopts is as follows:
A kind of shield type transfer bus of solid insulation cabinet, comprise one for connecting the conduction copper rod of the assembly in solid insulation cabinet, the surface of described conduction copper rod is provided with an epoxy resin layer for insulating, the surface of conduction copper rod has one for preventing conduction copper rod along epoxy resin layer groove in axial sliding, with one for preventing from conducting electricity the tangent plane that radially slides along epoxy resin layer of copper rod, the outer surface of described epoxy resin layer is provided with an outer conducting layer for shielding, and described outer conducting layer is high-temperature silica gel conductive ink layer.
Also be provided with an inner conducting layer between described conduction copper rod and epoxy resin layer, described inner conducting layer is made up of epoxy resin conduction paint.
The surface of described conduction copper rod is provided with multiple groove and tangent plane.
Compared to existing technology, the beneficial effects of the utility model are: realize better shield effectiveness by arranging high-temperature silica gel conductive ink layer at the outer surface of epoxy resin layer, and do not need to process epoxy resin layer surface, also another conductive layer is set at the inner surface of epoxy resin layer, makes the partial discharge better effects if of epoxy resin layer.Prevent conduction copper rod from occurring on epoxy resin layer axially and the structure radially slided by devising on conduction copper rod again, conduction copper rod also can be fitted tightly with epoxy resin layer when being connected with other assemblies and producing external force.
Accompanying drawing explanation
Fig. 1 is the structure chart of the shield type transfer bus of the utility model solid insulation cabinet.
Embodiment
Below, by reference to the accompanying drawings and embodiment, the utility model is described further:
Fig. 1 shows preferred embodiment of the present utility model, a kind of shield type transfer bus of solid insulation cabinet, comprise a conduction copper rod 1, conduction copper rod 1 is for being connected with other assembly in solid insulation cabinet, such as the end of this conduction copper rod 1 has screwed hole, is connected with other assembly by screw.The surface of conduction copper rod 1 is provided with an epoxy resin layer 2, this epoxy resin layer 2 insulating effects, fits with conduction copper rod 1, and further, epoxy resin layer 2 is the epoxy resin layer adopting APG technique, has better mechanical performance and electric property.
Owing to being a connector at conduction copper rod 1, therefore when connection or activity, the effect of external force can be subject to, thus the epoxy resin layer 2 being fitted in surface may be caused to depart from loosening with conduction copper rod 1.Based on above-mentioned defect, groove 3 and a tangent plane 4 is provided with on the surface of conduction copper rod 1, groove 3 is for preventing conduction copper rod 1 along epoxy resin layer 2 groove in axial sliding, namely prevent conduction copper rod 1 from the length direction of epoxy resin layer 2, producing displacement, the disc of conduction copper rod 1 is opened a tangent plane 4 and can prevent from conducting electricity the footpath upward sliding of copper rod 1 at epoxy resin layer 2, namely prevent from rotating.By the setting of groove 3 and tangent plane 4, the slip of conduction copper rod 1 can be limited well, make it can not depart from epoxy resin layer 2.Further, conduction copper rod 1 is provided with multiple groove 3 and tangent plane 4, makes restriction effect better, but neither be The more the better, too many change is carried out to structure and can cause some other defects.
An outer conducting layer 5 for shielding is provided with at the outer surface of epoxy resin layer 2, this outer conducting layer 5 is made up of high-temperature silica gel electrically conductive ink, be covered in the outer surface of epoxy resin layer 2 equably, have that resistance value is stablized, adhesive force is good, rub resistance, outward appearance are glossy, the advantage of tear-proof, and do not need to reprocess epoxy resin layer 2 outer surface, save manpower and because of surface uniform, the product shielded is easy to reach the requirement of partial discharge quantity Da under the 1.2U r condition of state's net corporate policy Dao≤5pC.
In addition, between epoxy resin layer 2 and conduction copper rod 1, be also provided with an inner conducting layer 6, this inner conducting layer 6 is made up of epoxy resin conduction paint, makes the partial discharge better effects if of epoxy resin layer 2.
To one skilled in the art, according to technical scheme described above and design, other various corresponding change and deformation can be made, and all these change and deformation all should belong within the protection range of the utility model claim.
Claims (3)
1. the shield type transfer bus of a solid insulation cabinet, it is characterized in that, comprise one for connecting the conduction copper rod of the assembly in solid insulation cabinet, the surface of described conduction copper rod is provided with an epoxy resin layer for insulating, the surface of conduction copper rod is provided with one for preventing conduction copper rod along epoxy resin layer groove in axial sliding, with one for preventing from conducting electricity the tangent plane that radially slides along epoxy resin layer of copper rod, the outer surface of described epoxy resin layer is provided with an outer conducting layer for shielding, and described outer conducting layer is high-temperature silica gel conductive ink layer.
2. the shield type transfer bus of solid insulation cabinet according to claim 1, is characterized in that, is also provided with an inner conducting layer between described conduction copper rod and epoxy resin layer, and described inner conducting layer is made up of epoxy resin conduction paint.
3. the shield type transfer bus of solid insulation cabinet according to claim 1, is characterized in that, the surface of described conduction copper rod is provided with multiple groove and tangent plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420553968.2U CN204066780U (en) | 2014-09-24 | 2014-09-24 | A kind of shield type transfer bus of solid insulation cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420553968.2U CN204066780U (en) | 2014-09-24 | 2014-09-24 | A kind of shield type transfer bus of solid insulation cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204066780U true CN204066780U (en) | 2014-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420553968.2U Expired - Fee Related CN204066780U (en) | 2014-09-24 | 2014-09-24 | A kind of shield type transfer bus of solid insulation cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204066780U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106992038A (en) * | 2017-04-10 | 2017-07-28 | 平高集团有限公司 | Solid insulated busbar |
| CN107017041A (en) * | 2017-04-10 | 2017-08-04 | 平高集团有限公司 | A kind of solid insulated busbar |
| CN110010315A (en) * | 2019-05-10 | 2019-07-12 | 厦门耐德电气有限公司 | A kind of casing |
| CN112007835A (en) * | 2020-09-02 | 2020-12-01 | 深圳市南锐电气技术有限公司 | Method for processing insulating part surface shielding layer in solid insulating ring main unit |
-
2014
- 2014-09-24 CN CN201420553968.2U patent/CN204066780U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106992038A (en) * | 2017-04-10 | 2017-07-28 | 平高集团有限公司 | Solid insulated busbar |
| CN107017041A (en) * | 2017-04-10 | 2017-08-04 | 平高集团有限公司 | A kind of solid insulated busbar |
| CN110010315A (en) * | 2019-05-10 | 2019-07-12 | 厦门耐德电气有限公司 | A kind of casing |
| CN110010315B (en) * | 2019-05-10 | 2024-02-02 | 厦门耐德电气有限公司 | Sleeve pipe |
| CN112007835A (en) * | 2020-09-02 | 2020-12-01 | 深圳市南锐电气技术有限公司 | Method for processing insulating part surface shielding layer in solid insulating ring main unit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 518118 Huicheng Science and Technology Industrial Plant, East of Lanjing Road and South of Jinxiu Road, Pingshan New District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HIFUTURE INFORMATION TECHNOLOGY Co.,Ltd. Address before: 518118 Huicheng Science and Technology Industrial Factory, East of Lanjing Road and South of Jinxiu Road, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN HIFUTURE ELECTRIC Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |