CN204054804U - A kind of layered copper plate - Google Patents
A kind of layered copper plate Download PDFInfo
- Publication number
- CN204054804U CN204054804U CN201420384941.5U CN201420384941U CN204054804U CN 204054804 U CN204054804 U CN 204054804U CN 201420384941 U CN201420384941 U CN 201420384941U CN 204054804 U CN204054804 U CN 204054804U
- Authority
- CN
- China
- Prior art keywords
- copper
- copper coin
- panel substrate
- steel panel
- layered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Laminated Bodies (AREA)
Abstract
The utility model discloses a kind of layered copper plate; comprise steel panel substrate; epoxy resin insulating layers, copper powder, copper coin, conductive fiber and fibrous protective layer; the epoxy resin insulating layers of uniform thickness is coated in described steel panel substrate top and bottom; described steel panel substrate is inlayed the cuboid copper coin of band cavity; inject copper powder in the cavity of described copper coin, described conductive fiber is coated on the surface of copper coin.This layered copper plate, has excellent heat radiation, conduction, antistatic and electromagnetic wave shielding performance, machining property, capability of electromagnetic shielding, can be good at being applied to automobile, motorcycle, office automation, high-power electric appliance equipment and power-supply device.
Description
Technical field
The utility model relates to copper coin technical field, is specially a kind of layered copper plate.
Background technology
Along with the develop rapidly of electronics industry, the volume size of electronic product is more and more less, power density is increasing, solve the referred new height of the problem of heat radiation, this is to one of electronics industry design huge challenge, but existing copper-clad plate thermal diffusivity is bad, the development trend of electronics industry cannot be adapted to, often easily occur the situation of distortion in the process that copper coin uses in some occasions because intensity is lower, for above-mentioned two problems, we propose a kind of layered copper plate.
Utility model content
The purpose of this utility model is to provide a kind of layered copper plate, to solve the problem proposed in above-mentioned background technology.
For achieving the above object; the utility model provides following technical scheme: a kind of layered copper plate; comprise steel panel substrate; epoxy resin insulating layers, copper powder, copper coin, conductive fiber and fibrous protective layer; the epoxy resin insulating layers of uniform thickness is coated in described steel panel substrate top and bottom; described steel panel substrate is inlayed the cuboid copper coin of band cavity, inject copper powder in the cavity of described copper coin, described conductive fiber is coated on the surface of copper coin.
Preferably, the junction of described steel panel substrate and copper coin embeds in copper coin.
Preferably, the thickness of described steel panel substrate is 0.5-0.8CM, and the thickness of epoxy resin insulating layers is 50-150um.
Preferably, the thickness of described copper coin is 0.3-0.8CM, and the cavity height of copper coin is 1.5-2CM.
Preferably, the thickness 0.2-0.3CM of described conductive fiber, and surface is coated with the fibrous protective layer of 200-250um.
Compared with prior art, the beneficial effects of the utility model are: this layered copper plate, there is excellent heat radiation, conduction, antistatic and electromagnetic wave shielding performance, machining property, capability of electromagnetic shielding, can be good at being applied to automobile, motorcycle, office automation, high-power electric appliance equipment and power-supply device.
Accompanying drawing explanation
Fig. 1 is the utility model structural representation.
Detailed description of the invention
Below in conjunction with the accompanying drawing in the utility model embodiment, be clearly and completely described the technical scheme in the utility model embodiment, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Refer to Fig. 1, the utility model provides a kind of technical scheme: a kind of layered copper plate, comprise steel panel substrate 1, epoxy resin insulating layers 2, copper powder 3, copper coin 4, conductive fiber 5 and fibrous protective layer 6, the epoxy resin insulating layers 2 of uniform thickness is coated in described steel panel substrate 1 top and bottom, epoxy resin insulating layers 2 can prevent steel panel substrate 1 from becoming conductor, produce a large amount of heat, described steel panel substrate 1 is inlayed the cuboid copper coin 4 of band cavity, described steel panel substrate 1 embeds in copper coin 1 with the junction of copper coin 4, the intensity of copper coin can well be increased, copper powder 3 is injected in the cavity of described copper coin 4, copper powder 3 due to density lower relative to copper coin, heat dispersion is also relatively better, and the performance of copper coin can not be affected, the thickness of described steel panel substrate 1 is 0.5-0.8CM, the thickness of epoxy resin insulating layers 2 is 50-150um, the thickness of described copper coin 4 is 0.3-0.8CM, the cavity height of copper coin 4 is 1.5-2CM, described conductive fiber 5 is coated on the surface of copper coin 4, the thickness 0.2-0.3CM of described conductive fiber 5, and the fibrous protective layer 6 that surface is coated with 200-250um is used for preventing fibrous protective layer 6 be oxidized and come off, conductive fiber 5 is interactions of hydroxyl by polyvinyl alcohol molecule and each metal ion species, the high conductivity vinal of copper sulphide nano ion is formed at fibrous inside, by carrying out compound to the metal particle of nano-scale, find to increase specific area and reduce interparticle distance to increase from the electric conductivity of product can be made, conducting pathway is there is at fibrous inside, bending, the effects such as friction are also difficult to its outside is sustained damage, therefore there is excellent durability, the advantage such as the high and electric conductivity of the free degree of product is controlled, also antistatic and electromagnetic wave shielding can be prevented, in the manufacture process of layered copper plate, most critical be exactly make epoxy resin insulating layers 2, the manufacturing process of epoxy resin insulating layers 2 is as follows, first surface treatment is carried out to inorganic filler, treated filler, can organically be combined with epoxy resin, so not only gelatin viscosity can be reduced, reduce solvent load, and eliminate effect of the interface, improve process operability, and then improve the properties of sheet material, as for the consumption of filler, theoretically, the larger thermal conductivity of amount of filler is better, but the difference of some physical propertys such as particle size, grain shape, specific area, oil absorption due to filler, makes the consumption of filler in resin system have larger difference.Although as boron nitride has higher thermal conductivity, and have high breakdown strength.But its amount of being used alone is too much unsuitable, because boron nitride density less (2.25g/cm3), (density of general filler is mostly at about 3g/cm3), when Boron nitride exceedes 40% of resin system, resin viscosity increase, skewness, mixed glue are very difficult, although sheet material breakdown potential is pressed with raising by a relatively large margin, its thermal resistance does not obviously reduce.Mixing is according to a certain percentage tested, and show that allotment resin is 1: 3 with the best ratio of mixed fillers.
To those skilled in the art, obvious the utility model is not limited to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present utility model or essential characteristic, can realize the utility model in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present utility model is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the utility model.Any Reference numeral in claim should be considered as the claim involved by limiting.
In addition, be to be understood that, although this description is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should by description integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.
Claims (5)
1. a layered copper plate; comprise steel panel substrate; epoxy resin insulating layers, copper powder, copper coin, conductive fiber and fibrous protective layer; it is characterized in that: the epoxy resin insulating layers of uniform thickness is coated in described steel panel substrate top and bottom; described steel panel substrate is inlayed the cuboid copper coin of band cavity; inject copper powder in the cavity of described copper coin, described conductive fiber is coated on the surface of copper coin.
2. a kind of layered copper plate according to claim 1, is characterized in that: the junction of described steel panel substrate and copper coin embeds in copper coin.
3. a kind of layered copper plate according to claim 1, is characterized in that: the thickness of described steel panel substrate is 0.5-0.8CM, and the thickness of epoxy resin insulating layers is 50-150um.
4. a kind of layered copper plate according to claim 1, is characterized in that: the thickness of described copper coin is 1-1.5CM, and the cavity height of copper coin is 1.5-2CM.
5. a kind of layered copper plate according to claim 1, is characterized in that: the thickness 0.2-0.3CM of described conductive fiber, and surface is coated with the fibrous protective layer of 200-250um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420384941.5U CN204054804U (en) | 2014-07-14 | 2014-07-14 | A kind of layered copper plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420384941.5U CN204054804U (en) | 2014-07-14 | 2014-07-14 | A kind of layered copper plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204054804U true CN204054804U (en) | 2014-12-31 |
Family
ID=52196382
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420384941.5U Expired - Fee Related CN204054804U (en) | 2014-07-14 | 2014-07-14 | A kind of layered copper plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204054804U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116461169A (en) * | 2023-04-24 | 2023-07-21 | 江阴百士特控制显示设备有限公司 | Efficient heat-dissipating plate for automobile control room equipment cabinet and preparation method thereof |
-
2014
- 2014-07-14 CN CN201420384941.5U patent/CN204054804U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116461169A (en) * | 2023-04-24 | 2023-07-21 | 江阴百士特控制显示设备有限公司 | Efficient heat-dissipating plate for automobile control room equipment cabinet and preparation method thereof |
| CN116461169B (en) * | 2023-04-24 | 2024-04-26 | 江阴百士特控制显示设备有限公司 | Efficient heat-dissipating plate for automobile control room equipment cabinet and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Lee et al. | Low percolation 3D Cu and Ag shell network composites for EMI shielding and thermal conduction | |
| Sohi et al. | Dielectric property and electromagnetic interference shielding effectiveness of ethylene vinyl acetate‐based conductive composites: Effect of different type of carbon fillers | |
| Valentini et al. | Electromagnetic properties and performance of exfoliated graphite (EG)–Thermoplastic polyurethane (TPU) nanocomposites at microwaves | |
| Li et al. | PVDF/PS/HDPE/MWCNTs/Fe3O4 nanocomposites: effective and lightweight electromagnetic interference shielding material through the synergetic effect of MWCNTs and Fe3O4 nanoparticles | |
| CN103571215A (en) | High thermal conductivity and EMI sheltering high polymer composite material | |
| TWI556721B (en) | Electromagnetic wave interference suppressor | |
| CN101747619A (en) | High performance emi/rfi shielding polymer composite | |
| CN102634177B (en) | A kind of composite electromagnetic shield materials for cable | |
| Ali Raza et al. | Effect of nanosized carbon black on the morphology, transport, and mechanical properties of rubbery epoxy and silicone composites | |
| Wu et al. | Interlayer decoration of expanded graphite by polyimide resins for preparing highly thermally conductive composites with superior electromagnetic shielding performance | |
| Pawar et al. | Extraordinary synergy in attenuating microwave radiation with cobalt‐decorated graphene oxide and carbon nanotubes in polycarbonate/poly (styrene‐co‐acrylonitrile) blends | |
| CN103665876B (en) | Conductive rubber | |
| CN103304910A (en) | High-strength polystyrene conductive plastic and preparation method thereof | |
| Merlini et al. | Electromagnetic interference shielding effectiveness of composites based on polyurethane derived from castor oil and nanostructured carbon fillers | |
| CN105254993A (en) | Electrically conductive polymeric material and preparation method thereof | |
| CN104363743A (en) | Electromagnetic wave radiation shield cover for printed circuit board | |
| CN102391646A (en) | Enhanced high-insulation composite material and preparation method thereof | |
| CN204054804U (en) | A kind of layered copper plate | |
| Xu et al. | Electromagnetic interference shielding boards produced using Tetra Paks waste and iron fiber | |
| CN204968327U (en) | Compound fin of natural graphite aluminium | |
| Zhou et al. | Flexible MXene-based Janus film with superior heat dissipation capability for ultra-efficient electromagnetic interference shielding and Joule heating | |
| CN202439289U (en) | Graphite composite membrane | |
| Khamis et al. | Fabrication and characterization of Fe2O3‐OPEFB‐PTFE nanocomposites for microwave shielding applications | |
| CN209964365U (en) | Waterproof functional precoating structure of electronic component | |
| CN104558777B (en) | Preparation method of natural graphite/polymer electromagnetic shielding composite |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170327 Address after: 335200 Honghu Industrial Park, Yujiang, Jiangxi, Yingtan Patentee after: Yujiang County Pioneer Industrial Co. Ltd. Address before: 335200 Yingtan County, Jiangxi, Honghu copper processing base of Yujiang Patentee before: JIANGXI YAFEIDA COPPER LIMITED COMPANY |
|
| TR01 | Transfer of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141231 Termination date: 20180714 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |