CN204052200U - For the blanking equipment of ball grid array structure chip - Google Patents
For the blanking equipment of ball grid array structure chip Download PDFInfo
- Publication number
- CN204052200U CN204052200U CN201420497227.7U CN201420497227U CN204052200U CN 204052200 U CN204052200 U CN 204052200U CN 201420497227 U CN201420497227 U CN 201420497227U CN 204052200 U CN204052200 U CN 204052200U
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- chip
- iron plate
- vacuum
- ball grid
- grid array
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- Withdrawn - After Issue
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Abstract
The utility model relates to the blanking equipment for ball grid array structure chip, by the chip tray placement platform (1) be erected in bottom pallet and control system (7), array mechanism (2), vacuum pick and place machine structure (3), CCD testing agency (4), mechanical hand (5), Reflow Soldering iron plate conveying mechanism (6) forms, chip tray placement platform (1) and Reflow Soldering iron plate conveying mechanism (6) place pallet and iron plate that chip is housed respectively, array mechanism (2), vacuum pick and place machine structure (3), CCD testing agency (4) is mounted on mechanical hand (5).Compared with prior art, the utility model can automatically screen, enhance productivity by difficulty action accomplishment, and simple to operate, easy to use.
Description
Technical field
The utility model relates to a kind of blanking equipment, especially relates to the blanking equipment for ball grid array structure chip.
Background technology
BGA (Ball Grid Array ball grid array structure) encapsulation technology starts from the sixties in last century, along with succeeding in developing of the high-end sealed in units such as ball attachment machine, has now become market mainstream packaged type.In actual production, costly, and the damage of wafer damage often just tin ball pin, its internal circuit is intact for bga chip.Thus, chip repairing just becomes very necessary.At present, chip repairing mode has three kinds: manually reprocess by hand, simple and easy device for repairing, chip repairing ball attachment machine.Artificial craft is reprocessed and can only be carried out reprocessing operation for a small amount of chip with simple and easy device for repairing, and efficiency is low, output is not high.Although chip repairing ball attachment machine cost costly, its efficient productivity ratio makes bga chip price significantly reduce.Current, to be detected the chip blanking after reprocessing and artificial naked eyes by artificial hand-held tweezers and plant ball effect not only inefficiency, and testing result varies with each individual, instability is also unreliable.Because the hand-held tweezers of people directly contact with chip, be easy to error, cause the tin ball of having planted to be destroyed, make product fraction defective increase.
Blanking manually has following inevitable shortcoming: efficiency is low, once can only clamp a chip with tweezers and carry out blanking, the at substantial time, affect production capacity.Artificial hand-held tweezers directly contact with chip, misoperation, cause product fraction defective to rise.Artificial naked eyes detect plants ball quality, unreliable also unstable.Can not match with efficient chip repairing ball attachment machine production capacity.
Application number be 200310123414.5 Chinese patent disclose ball grid array base plate checkout gear and constructive method thereof, mainly on the loading plate of a circuit board test machine station, be provided with at least one signal socket, recycle at least one RCA to be electrically connected at signal socket, a circuit board testing like this puts module or BGA test storing module can be selected corresponding signal socket and be electrically connected at the microprocessor be fixedly arranged in circuit board test machine station, and trace routine is carried out to the circuit board under test be present in circuit board testing storing module or the BGA substrate to be measured be present in BGA test storing module, and testing result will find expression in a result output device be electrically connected with microprocessor, to reach the object that same circuit board test machine station shared by circuit board under test or BGA substrate to be measured, but, this patent application powers on to chip to carry out electric performance test, it is the platform of a test, people is also needed to take off chip by hand, use inconvenience, automaticity is lower.
Utility model content
The purpose of this utility model is exactly provide the screening of a kind of automatic difficulty action accomplishment, the blanking equipment for ball grid array structure chip of enhancing productivity to overcome defect that above-mentioned prior art exists.
The purpose of this utility model can be achieved through the following technical solutions:
For the blanking equipment of ball grid array structure chip, be made up of the chip tray placement platform be erected in bottom pallet and control system, array mechanism, vacuum pick and place machine structure, CCD testing agency, mechanical hand, Reflow Soldering iron plate conveying mechanism,
Described chip tray placement platform and Reflow Soldering iron plate conveying mechanism place pallet and iron plate that chip is housed respectively,
Described array mechanism, vacuum pick and place machine structure, CCD testing agency are mounted on described mechanical hand, ball quality testing is planted to chip placement in pallet by described CCD testing agency, described vacuum pick and place machine structure picks up the chip by detecting and is placed on iron plate, and described array mechanism carries out array arrangement to the chip on iron plate makes it neat.
The top that described mechanical hand carries vacuum pick and place machine structure, CCD testing agency moves to the chip that pallet is placed from initial position, utilizes CCD testing agency detection chip to plant ball quality.
Described vacuum pick and place machine structure opens vacuum, picks up the chip by detecting, and carry through mechanical hand and move to chip putting position, close vacuum, chip is positioned on iron plate by vacuum pick and place machine structure.
Described bottom pallet and control system are also covered with safety top cover, and chip tray placement platform, array mechanism, vacuum pick and place machine structure, CCD testing agency, mechanical hand, Reflow Soldering iron plate conveying mechanism are all located in safety guard.
Described safety top cover comprises shell body division board, touch-screen, button and three look alarm lamps.
Described array mechanism is made up of array board, pillar, connecting plate and fixed head, and described pillar is connected and fixed plate and connecting plate, and this connecting plate is connected with mechanical hand, and described fixed head has through hole, and described array board is connected to the rear end face of fixed head.
Described vacuum pick and place machine structure is made up of suction nozzle, vacuum shaft, spring, retainer ring and vacuum generator, described suction nozzle, spring, retainer ring and vacuum generator are connected on vacuum shaft, vacuum shaft is through the through hole that fixed head is offered, vacuum shaft has 5 groups, often organize 8, once draw 40 chips at most.
Described CCD testing agency is made up of camera fixed head, CCD camera, card slot panel beating, solidus panel beating, card slot panel beating, solidus panel beating are fixedly connected on connecting plate by described camera fixed head, in the space that described CCD camera is fastened on card slot panel beating, solidus panel beating is formed.
Described Reflow Soldering iron plate conveying mechanism adopts motor and module type of drive, once supplies one piece of iron plate from the bottom up.
Described Reflow Soldering iron plate conveying mechanism is made up of holder, back-up block, gripper shoe, module and motor, and described module is connected to the below of gripper shoe, drives the motion of gripper shoe through motor, and described back-up block connects the motion promoting iron plate on the supporting plate.
Compared with prior art, the utility model has the following advantages:
(1) the utility model completes the screening of planting ball quality testing and non-defective unit and defective products of chip automatically, improves production efficiency.
(2) the utility model makes people directly not contact with chip, reduces and plants the good chip of ball impaired risk before curing, improve product yield.
(3) can the chip of corresponding different size carry out detecting, screen and picking up putting operation, when changing product, without the need to complex operations such as various data entry, simple to operate, easy to use.
(4) the utility model can match with the production capacity of chip repairing ball attachment machine.
Accompanying drawing explanation
Fig. 1 is main TV structure schematic diagram of the present utility model;
Fig. 2 is plan structure schematic diagram of the present utility model;
Fig. 3 is the main TV structure schematic diagram of the utility model with safety top cover;
Fig. 4 is the partial structurtes schematic diagram of vacuum pick and place machine structure, array mechanism, CCD testing agency;
Fig. 5 is the partial structurtes schematic diagram of vacuum pick and place machine structure, array mechanism, CCD testing agency;
Fig. 6 is the partial structurtes schematic diagram of Reflow Soldering iron plate conveying mechanism.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is described in detail.
Embodiment
For the blanking equipment of ball grid array structure chip, as shown in Figure 1-2, this equipment is made up of the chip tray placement platform 1 be erected in bottom pallet and control system 7, array mechanism 2, vacuum pick and place machine structure 3, CCD testing agency 4, mechanical hand 5, Reflow Soldering iron plate conveying mechanism 6 its structure.Bottom pallet and control system 7 can also be covered with safety top cover, as shown in Figure 3, chip tray placement platform 1, array mechanism 2, vacuum pick and place machine structure 3, CCD testing agency 4, mechanical hand 5, Reflow Soldering iron plate conveying mechanism 6 are all located in safety guard.
The partial structurtes of vacuum pick and place machine structure, array mechanism, CCD testing agency as illustrated in figures 4-5, wherein, array mechanism 2 is made up of array board 21, pillar 22, connecting plate 23 and fixed head 24, pillar 22 is connected and fixed plate 24 and connecting plate 23, this connecting plate 23 is connected with mechanical hand 5, fixed head 24 has through hole, and array board 21 is connected to the rear end face of fixed head (24).Vacuum pick and place machine structure 3 is made up of suction nozzle 31, vacuum shaft 32, spring 33, retainer ring 34 and vacuum generator 35, suction nozzle 31, spring 33, retainer ring 34 and vacuum generator 35 are connected on vacuum shaft 32, vacuum shaft 32 is through the through hole that fixed head 24 is offered, vacuum shaft 32 has 5 groups, often organize 8, once draw 40 chips at most.CCD testing agency 4 is made up of camera fixed head 41, CCD camera 42, card slot panel beating 43, solidus panel beating 44, card slot panel beating 43, solidus panel beating 44 are fixedly connected on connecting plate 23 by camera fixed head 41, in the space that CCD camera 42 is fastened on card slot panel beating 43, solidus panel beating 44 is formed.
Reflow Soldering iron plate conveying mechanism 6 adopts motor and module type of drive, once supply one piece of iron plate 63 from the bottom up, its structure as shown in Figure 6, be made up of holder 61, back-up block 62, gripper shoe 66, module 64 and motor 65, module 64 is connected to the below of gripper shoe 66, drive the motion of gripper shoe 66 through motor 65, back-up block 62 is connected to motion gripper shoe 66 promoting iron plate 63.
The pallet that chip is housed is placed on chip tray placement platform 1 by operator, and 50 pieces of iron plates be positioned on Reflow Soldering iron plate conveying mechanism 6, material loading operation completes, and presses start button, device start.Mechanical hand 5 carries CCD testing agency 4 and vacuum pick and place machine structure 3 evades position from right toward moving left from initial, and the chip in CCD testing agency 4 pairs of pallets plants ball quality testing.Vacuum pick and place machine structure 3 opens vacuum, picks up the chip by detecting (namely planting ball up-to-standard).Mechanical hand 5 moves to chip putting position, and vacuum pick and place machine structure 3 closes vacuum, and chip placement is on iron plate.Mechanical hand 5 carries array mechanism 2 and carries out array to the chip be placed on iron plate, makes it uniform.Mechanical hand 5 moves to evades position, and equipment suspends, and indicator lamp flicker also buzzing, reminds operator to pallet blanking and material loading operation.After repeating above action 1 time, iron plate has been put 2 groups and detected qualified chip, the Z axis of Reflow Soldering iron plate conveying mechanism 6 rises to blanking position, and equipment suspends, indicator lamp flicker buzzing, reminds operator to carry out blanking operation to the iron plate occupying chip.
Claims (10)
1. for the blanking equipment of ball grid array structure chip, it is characterized in that, this equipment is made up of the chip tray placement platform (1) be erected in bottom pallet and control system (7), array mechanism (2), vacuum pick and place machine structure (3), CCD testing agency (4), mechanical hand (5), Reflow Soldering iron plate conveying mechanism (6)
Described chip tray placement platform (1) and Reflow Soldering iron plate conveying mechanism (6) place pallet and iron plate that chip is housed respectively,
Described array mechanism (2), vacuum pick and place machine structure (3), CCD testing agency (4) are mounted on described mechanical hand (5), ball quality testing is planted to chip placement in pallet by described CCD testing agency (4), described vacuum pick and place machine structure (3) picks up the chip by detecting and is placed on iron plate, and described array mechanism (2) carries out array arrangement to the chip on iron plate makes it neat.
2. the blanking equipment for ball grid array structure chip according to claim 1, it is characterized in that, the top that described mechanical hand (5) carries vacuum pick and place machine structure (3), CCD testing agency (4) moves to the chip that pallet is placed from initial position, utilizes CCD testing agency (4) detection chip to plant ball quality.
3. the blanking equipment for ball grid array structure chip according to claim 1, it is characterized in that, described vacuum pick and place machine structure (3) opens vacuum, pick up the chip by detecting, carry through mechanical hand (5) and move to chip putting position, close vacuum, chip is positioned on iron plate by vacuum pick and place machine structure (3).
4. the blanking equipment for ball grid array structure chip according to claim 1, it is characterized in that, described bottom pallet and control system (7) are also covered with safety top cover, and chip tray placement platform (1), array mechanism (2), vacuum pick and place machine structure (3), CCD testing agency (4), mechanical hand (5), Reflow Soldering iron plate conveying mechanism (6) are all located in safety guard.
5. the blanking equipment for ball grid array structure chip according to claim 4, is characterized in that, described safety top cover comprises shell body division board, touch-screen, button and three look alarm lamps.
6. the blanking equipment for ball grid array structure chip according to claim 1, it is characterized in that, described array mechanism (2) is made up of array board (21), pillar (22), connecting plate (23) and fixed head (24), described pillar (22) is connected and fixed plate (24) and connecting plate (23), this connecting plate (23) is connected with mechanical hand (5), described fixed head (24) has through hole, and described array board (21) is connected to the rear end face of fixed head (24).
7. the blanking equipment for ball grid array structure chip according to claim 1, it is characterized in that, described vacuum pick and place machine structure (3) is by suction nozzle (31), vacuum shaft (32), spring (33), retainer ring (34) and vacuum generator (35) composition, described suction nozzle (31), spring (33), retainer ring (34) and vacuum generator (35) are connected on vacuum shaft (32), vacuum shaft (32) is through the through hole that fixed head (24) is offered, vacuum shaft (32) has 5 groups, often organize 8, once draw 40 chips at most.
8. the blanking equipment for ball grid array structure chip according to claim 1, it is characterized in that, described CCD testing agency (4) is made up of camera fixed head (41), CCD camera (42), card slot panel beating (43), solidus panel beating (44), card slot panel beating (43), solidus panel beating (44) are fixedly connected on connecting plate (23) by described camera fixed head (41), in the space that described CCD camera (42) is fastened on card slot panel beating (43), solidus panel beating (44) is formed.
9. the blanking equipment for ball grid array structure chip according to claim 1, it is characterized in that, described Reflow Soldering iron plate conveying mechanism (6) adopts motor and module type of drive, once supplies one piece of iron plate (63) from the bottom up.
10. the blanking equipment for ball grid array structure chip according to claim 9, it is characterized in that, described Reflow Soldering iron plate conveying mechanism (6) is made up of holder (61), back-up block (62), gripper shoe (66), module (64) and motor (65), described module (64) is connected to the below of gripper shoe (66), drive the motion of gripper shoe (66) through motor (65), described back-up block (62) is connected to motion gripper shoe (66) promoting iron plate (63).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497227.7U CN204052200U (en) | 2014-08-29 | 2014-08-29 | For the blanking equipment of ball grid array structure chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420497227.7U CN204052200U (en) | 2014-08-29 | 2014-08-29 | For the blanking equipment of ball grid array structure chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204052200U true CN204052200U (en) | 2014-12-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420497227.7U Withdrawn - After Issue CN204052200U (en) | 2014-08-29 | 2014-08-29 | For the blanking equipment of ball grid array structure chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204052200U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436095A (en) * | 2014-08-29 | 2016-03-30 | 上海微松工业自动化有限公司 | Ball grid array structure chip blanking apparatus |
-
2014
- 2014-08-29 CN CN201420497227.7U patent/CN204052200U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436095A (en) * | 2014-08-29 | 2016-03-30 | 上海微松工业自动化有限公司 | Ball grid array structure chip blanking apparatus |
| CN105436095B (en) * | 2014-08-29 | 2018-03-27 | 上海微松工业自动化有限公司 | A kind of ball grid array structure chip blanking equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI WEISONG INDUSTRIAL AUTOMATION CO., LTD. Free format text: FORMER OWNER: SHANGHAI MIAOZE ELECTROMECHANICAL TECHNOLOGY CO., LTD. Effective date: 20150526 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150526 Address after: 201114 Shanghai city Minhang District new Chun Road 188, 15-102 Patentee after: Shanghai Weisong Industry Automation Co., Ltd. Address before: 201114 Shanghai city Minhang District new Jun Ring Road No. 189 floor room C107 Patentee before: SHANGHAI MIAOZE ELECTROMECHANICAL TECHNOLOGY CO., LTD. |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20141231 Effective date of abandoning: 20180327 |