CN204014058U - A kind of MEMS microphone - Google Patents
A kind of MEMS microphone Download PDFInfo
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- CN204014058U CN204014058U CN201420430883.5U CN201420430883U CN204014058U CN 204014058 U CN204014058 U CN 204014058U CN 201420430883 U CN201420430883 U CN 201420430883U CN 204014058 U CN204014058 U CN 204014058U
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- reinforcement
- vibrating diaphragm
- mems microphone
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- backplane
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- 230000002787 reinforcement Effects 0.000 claims abstract description 104
- 230000004888 barrier function Effects 0.000 claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000011324 bead Substances 0.000 claims description 3
- 235000012489 doughnuts Nutrition 0.000 claims description 3
- 230000010355 oscillation Effects 0.000 description 9
- 238000001514 detection method Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 230000013707 sensory perception of sound Effects 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000012806 monitoring device Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The utility model discloses a kind of MEMS microphone, comprising: substrate; Run through the operatic tunes of described substrate; Be arranged on described substrate front surface, be positioned at the first insulating barrier of described operatic tunes surrounding; Be arranged on described the first surface of insulating layer, and the vibrating diaphragm of the setting shape in the covering region relative with the described operatic tunes; Be arranged on the second insulating barrier of described front face surface and described the first insulating barrier opposed area; Be arranged on described the second surface of insulating layer, and cover the backplane of described vibrating diaphragm and described operatic tunes opposed area, described backplane shape and described vibrating diaphragm shape match; Wherein, the vibration area of described vibrating diaphragm comprises: reinforcement region and surround the line diaphragm area in described reinforcement region; Described reinforcement region division has the reinforcement with described vibration area radial parallel; Described line diaphragm area is provided with line film.Described MEMS microphone has improved the uniformity of acoustic pressure between vibrating diaphragm and backplane by described reinforcement, ensured voice signal to be converted to the performance of the signal of telecommunication.
Description
Technical field
The utility model relates to microphone techniques field, more particularly, relates to a kind of MEMS microphone.
Background technology
In recent years, utilize MEMS (Micro-Electro-Mechanical-System, being called for short MEMS) encapsulation volume is little, reliability is high, low cost and other advantages owing to having for the integrated MEMS microphone of technique, be originally widely used in the electronic products such as mobile phone, panel computer, camera, hearing aids, intelligent toy and monitoring device.
MEMS microphone is provided with at an opening part of the operatic tunes vibrating diaphragm and the backplane that are oppositely arranged.Between described vibrating diaphragm and backplane, have spacing, described vibrating diaphragm and backplane form Detection capacitance.The acoustical vibration of varying strength causes the acoustic pressure between described vibrating diaphragm and described backplane different, thereby cause described vibrating diaphragm that vibration in various degree occurs, and then described Detection capacitance is changed, by the variation of Detection capacitance described in the perception of Sound control chip, thereby realize voice signal is converted to the signal of telecommunication, realize the detection to voice signal.
Existing MEMS microphone can be different from intermediate vibration amplitude due to vibrating diaphragm surrounding, can cause the acoustic pressure between itself and backplane inhomogeneous, thereby affect MEMS microphone voice signal is converted to the performance of the signal of telecommunication.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of MEMS microphone, has improved the uniformity of acoustic pressure between vibrating diaphragm and backplane, has ensured that MEMS microphone is converted to voice signal the performance of the signal of telecommunication.
For achieving the above object, the utility model provides following technical scheme:
A kind of MEMS microphone, this MEMS microphone comprises:
Substrate;
Run through the operatic tunes of described substrate;
Be arranged on described substrate front surface, be positioned at the first insulating barrier of described operatic tunes surrounding;
Be arranged on described the first surface of insulating layer, and the vibrating diaphragm of the setting shape in the covering region relative with the described operatic tunes;
Be arranged on the second insulating barrier of described vibrating diaphragm surface and described the first insulating barrier opposed area;
Be arranged on described the second surface of insulating layer, and cover the backplane of described vibrating diaphragm and described operatic tunes opposed area, described backplane shape and described vibrating diaphragm shape match;
Wherein, the vibration area of described vibrating diaphragm comprises: reinforcement region and surround the line diaphragm area in described reinforcement region; Described reinforcement region division has the reinforcement with described vibration area radial parallel; Described line diaphragm area is provided with line film.
Preferably, in above-mentioned MEMS microphone, described reinforcement region division has many reinforcements, and described reinforcement is by the center of described vibration area, and described reinforcement is with respect to described Central Symmetry, and angle between adjacent two reinforcements is identical.
Preferably, in above-mentioned MEMS microphone, described reinforcement region division has many reinforcements, one end of described reinforcement and the center superposition of described vibration area, angle between two reinforcements of arbitrary neighborhood is identical, and any two described reinforcements are not at same straight line.
Preferably, in above-mentioned MEMS microphone, described reinforcement region comprises: central circular, the center that the center of circle of described central circular is described vibration area; Described reinforcement region division has many reinforcements, and one end of described reinforcement is towards described center and be positioned at the circular edge of described border circular areas, and the other end deviates from described center; Angle between two reinforcements of arbitrary neighborhood is identical.
Preferably, in above-mentioned MEMS microphone, also comprise:
Be arranged on the donut structural bead of described central circular.
Preferably, in above-mentioned MEMS microphone, described reinforcement is arranged on the reinforcement groove in described vibrating diaphragm front, and the bearing of trend of described reinforcement groove is parallel to described vibration area radially.
Preferably, in above-mentioned MEMS microphone, the width range of described reinforcement groove is 0.4 μ m-10 μ m, comprises endpoint value; The depth bounds of described reinforcement groove is 0.1 μ m-20 μ m, comprises endpoint value; Spacing between described reinforcement groove is 0.4 μ m-10 μ m, comprises endpoint value.
Preferably, in above-mentioned MEMS microphone, described line film is the line film groove that is arranged on described line diaphragm area.
Preferably, in above-mentioned MEMS microphone, the width range of described line film groove is 0.4 μ m-10 μ m, comprises endpoint value; The depth bounds of described line film groove is 0.1 μ m-20 μ m, comprises endpoint value; The spacing of described line film groove is 0.4 μ m-10 μ m, comprises endpoint value.
Can find out from technique scheme, MEMS microphone provided by the utility model comprises: substrate; Run through the operatic tunes of described substrate; Be arranged on described substrate front surface, be positioned at the first insulating barrier of described operatic tunes surrounding; Be arranged on described the first surface of insulating layer, and the vibrating diaphragm of the setting shape in the covering region relative with the described operatic tunes; Be arranged on the second insulating barrier of described vibrating diaphragm surface and described the first insulating barrier opposed area; Be arranged on described the second surface of insulating layer, and cover the backplane of described vibrating diaphragm and described operatic tunes opposed area, described backplane shape and described vibrating diaphragm shape match; Wherein, the vibration area of described vibrating diaphragm comprises: reinforcement region and surround the line diaphragm area in described reinforcement region; Described reinforcement region division has the reinforcement with described vibration area radial parallel; Described line diaphragm area is provided with line film.Described technical scheme has improved the uniformity of acoustic pressure between vibrating diaphragm and backplane by described reinforcement, ensured that MEMS microphone is converted to voice signal the performance of the signal of telecommunication.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, other accompanying drawing can also be provided according to the accompanying drawing providing.
The structural representation of a kind of MEMS microphone that Fig. 1 provides for the embodiment of the present application;
The structural representation of the vibrating diaphragm of a kind of MEMS microphone that Fig. 2 provides for the embodiment of the present application;
The structural representation of the vibrating diaphragm of the another kind of MEMS microphone that Fig. 3 provides for the embodiment of the present application;
The structural representation of the vibrating diaphragm of another MEMS microphone that Fig. 4 provides for the embodiment of the present application;
The structural representation of the vibrating diaphragm of another MEMS microphone that Fig. 5 provides for the embodiment of the present application.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model part embodiment, instead of whole embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
As described in background, existing MEMS microphone can be different from intermediate vibration amplitude due to vibrating diaphragm surrounding, can cause the acoustic pressure between itself and backplane inhomogeneous, thereby affect MEMS microphone voice signal is converted to the performance of the signal of telecommunication.
Inventor finds, can pass through the tension force in the time of the zone line setting of described vibrating diaphragm and the balanced described vibrating diaphragm vibration of the reinforcing rib structure of described vibrating diaphragm radial parallel, thereby can make its Oscillation Amplitude good uniformity in the time of vibration, thereby ensure the acoustic pressure uniformity between vibrating diaphragm and backplane, ensure that MEMS microphone is converted to voice signal the performance of the signal of telecommunication.
Based on above-mentioned research, the embodiment of the present application provides a kind of MEMS microphone, comprising: substrate; Run through the operatic tunes of described substrate; Be arranged on described substrate front surface, be positioned at the first insulating barrier of described operatic tunes surrounding; Be arranged on described the first surface of insulating layer, and the vibrating diaphragm of the setting shape in the covering region relative with the described operatic tunes; Be arranged on the second insulating barrier of described vibrating diaphragm surface and described the first insulating barrier opposed area; Be arranged on described the second surface of insulating layer, and cover the backplane of described vibrating diaphragm and described operatic tunes opposed area, described backplane shape and described vibrating diaphragm shape match.
Wherein, the vibration area of described vibrating diaphragm comprises: reinforcement region and surround the line diaphragm area in described reinforcement region; Described reinforcement region division has the reinforcement with described vibration area radial parallel; Described line diaphragm area is provided with line film.
Tension force when being parallel to described vibration area reinforcement radially and can be used in the vibration of balanced vibrating diaphragm by setting, the surrounding part of can balanced described vibrating diaphragm corresponding with described operatic tunes vibration area and the Oscillation Amplitude of mid portion, make surrounding part identical or close with the Oscillation Amplitude of mid portion, and then can make the acoustic pressure between backplane and vibrating diaphragm even, voice signal is converted to the better performances of the signal of telecommunication.
With reference to figure 1, the structural representation of a kind of MEMS microphone that Fig. 1 provides for the embodiment of the present application, comprising: substrate 1, the operatic tunes 6, the first insulating barrier 2, vibrating diaphragm 3, the second insulating barrier 4 and backplane 5.
Described substrate 1 is provided with the operatic tunes 6 that runs through described substrate 1.Described substrate 1 can be silicon wafer substrate, can in described substrate 1, form by the mode such as etching or laser drilling the described operatic tunes 6.
Described the first insulating barrier 2 is arranged on the front of described substrate 1, and is positioned at the surrounding of the described operatic tunes 6.Described the first insulating barrier can be silicon dioxide layer or silicon nitride layer.
Described vibrating diaphragm 3 is arranged on described the first insulating barrier 2 surfaces, and the covering region relative with the described operatic tunes 6.The vibration area of described vibrating diaphragm comprises reinforcement region and surrounds the line diaphragm area in described reinforcement region.Wherein, described vibration area is the region that described vibrating diaphragm is relative with the described operatic tunes 6, as when as described in the operatic tunes 6 while being cylindrical hole as described in vibration area for circular, in the time that the described operatic tunes 6 is rectangular through-hole, described vibration area is rectangle.Described vibration area shake described in being radially eastern regional center and the direction at the described arbitrary line in eastern area planar that shakes.
With reference to figure 2, the structural representation of the vibrating diaphragm of a kind of MEMS microphone that Fig. 2 provides for the embodiment of the present application, the line diaphragm area of described vibrating diaphragm 3 arranges line film 7.The film of line described in the present embodiment 7 is multiple circular whorl film grooves spaced apart.The positive surrounding that is described vibrating diaphragm vibration area is provided with multiple toroidal cavities spaced apart.Described vibrating diaphragm 3 is connected with external circuit by vibrating diaphragm extraction electrode 31.In Fig. 2 execution mode, described vibrating diaphragm 3 is circular.In the present embodiment, the width range that described line film groove is set is 0.4 μ m-10 μ m, comprises endpoint value; The depth bounds of described line film groove is 0.1 μ m-20 μ m, comprises endpoint value; The spacing of described line film groove is 0.4 μ m-10 μ m, comprises endpoint value.
Because described vibrating diaphragm peripheral regions is fixed on described the first insulating barrier, described vibration area is unsettled, cause the surrounding part of vibration area and tension force that mid portion is subject to inhomogeneous, this tension force that can cause surrounding to be subject to is larger, in the time that it vibrates, the Oscillation Amplitude of mid portion is greater than surrounding part, thereby makes the acoustic pressure between vibrating diaphragm 3 and backplane 5 inhomogeneous.By described circular whorl film groove is set, can disperse the tension force of described vibrating diaphragm 3 near described the first insulating barrier 2 regions, make the Oscillation Amplitude of vibration area surrounding part near the Oscillation Amplitude of intermediate portion.Break in the time that line film groove is set for fear of described vibrating diaphragm 3, relative with described circular whorl film groove 7 annular projection 8 that is provided with at described vibrating diaphragm 3 back sides.
Described reinforcement region division has the reinforcement 9 with described vibration area radial parallel.Described reinforcement 9 is for further making the acoustic pressure between described vibrating diaphragm 3 and described backplane 5 even.
Reinforcement 9 by setting with described vibration area radial parallel, in the time that described vibrating diaphragm 3 vibrates, the tension force of described reinforcement 9 on can disperse vibration direction, reduce the Oscillation Amplitude of vibrating diaphragm 3 mid portions, make intermediate portion identical or close with the Oscillation Amplitude of surrounding part, and then make to there is uniform voltage between vibrating diaphragm 3 and backplane 5, make the acoustic pressure between the two even.
Described reinforcement 9 and radial parallel described vibration area, and its bearing of trend is by the center of circle of described vibration area, the tension force that described like this reinforcement 9 can better balanced described vibrating diaphragm 3 be subject to, makes the acoustic pressure between vibrating diaphragm and backplane more even.
In Fig. 2 illustrated embodiment, described reinforcement region division has many reinforcements 9, and described reinforcement 9 is by the center of described vibration area, described reinforcement 9 is with respect to described Central Symmetry, and the angle between adjacent two reinforcements is identical, to make vibrating diaphragm planarization good, even tension.Fig. 2 illustrated embodiment preferably arranges 3 described reinforcements 9.
With reference to figure 3, the structural representation of the vibrating diaphragm of the another kind of MEMS microphone that Fig. 3 provides for the embodiment of the present application, in Fig. 3 illustrated embodiment, described reinforcement region division has many reinforcements 9, one end of described reinforcement 9 and the center superposition of described vibration area, angle identical (to make vibrating diaphragm planarization good, even tension) between two reinforcements 9 of arbitrary neighborhood, any two described reinforcements 9 are not at same straight line.It is 3 that Fig. 3 illustrated embodiment preferably arranges described reinforcement 9 numbers.
With reference to figure 4, the structural representation of the vibrating diaphragm of another MEMS microphone that Fig. 4 provides for the embodiment of the present application, in Fig. 4 illustrated embodiment, described reinforcement region comprises: central circular A, the center that the center of circle of described central circular A is described vibration area; Described reinforcement region division has many reinforcements 9, and one end of described reinforcement 9 is towards described center and be positioned at the circular edge of described border circular areas A, and the other end deviates from described center; Angle between two reinforcements 9 of arbitrary neighborhood is identical, to make vibrating diaphragm planarization good, and even tension.Fig. 4 illustrated embodiment preferably arranges 8 described reinforcements 9.In Fig. 4, dashed circle is only for described central circular A is shown, does not have this dashed circle in practical structures.
With reference to figure 5, the structural representation of the vibrating diaphragm of another MEMS microphone that Fig. 5 provides for the embodiment of the present application, Fig. 5 illustrated embodiment further comprises on the basis of Fig. 4: the donut structural bead 51 that is arranged on described central circular.
In above-mentioned each execution mode, described vibrating diaphragm 3 is circular, and in other embodiments, described vibrating diaphragm 3 can also be polygon, as quadrangle, and octagon etc.; Described reinforcement 9 can be arranged on the reinforcement groove in described vibrating diaphragm 3 fronts, and the bearing of trend of described reinforcement groove is parallel to the described operatic tunes radially.For fear of due to the uniform in uneven thickness of described vibrating diaphragm 3 that described reinforcement groove causes being set, avoid its fracture, described MEMS microphone also comprises: the back side vibrating diaphragm projection 12 relative with described reinforcement groove that is arranged on described vibrating diaphragm 3.When described reinforcement 9 is while being arranged on the reinforcement groove in described vibrating diaphragm 3 fronts, increase for fear of the spacing between the vibrating diaphragm 3 and the backplane that cause due to described reinforcement groove, described MEMS microphone also comprises: be arranged on described backplane 5 back sides backplane projection 13 relative with described reinforcement groove, for fear of increasing due to described backplane 5 thickness that described backplane projection 13 causes being set, avoid the stress distribution of backplane 5 inhomogeneous, described MEMS microphone also comprises: be arranged on the positive backplane groove 14 being oppositely arranged with described backplane projection 13 of described backplane 5.
In the present embodiment, the width range that described reinforcement groove is set is 0.4 μ m-10 μ m, comprises endpoint value; The depth bounds of described reinforcement groove is 0.1 μ m-20 μ m, comprises endpoint value; Spacing between described reinforcement groove is 0.4 μ m-10 μ m, comprises endpoint value.
Described the second insulating barrier 4 is arranged on the region surface that described vibrating diaphragm 3 is relative with described the first insulating barrier 2.Described the second insulating barrier 4 can be silicon dioxide layer or silicon nitride layer equally.
Described backplane 5 is arranged on the surface of described the second insulating barrier 4, and covers the region that described vibrating diaphragm 3 is relative with the described operatic tunes 6, and described backplane 5 does not contact with described vibrating diaphragm 3.The shape of the shape of described backplane 5 and described vibrating diaphragm 3 matches, the outer peripheral shape and structure that is the two is identical, so that described vibrating diaphragm 3 and described backplane 5 outward flanges are just to arranging, make the Detection capacitance between the two even, can ensure that the acoustic pressure between the two is even.
In order to make described backplane 5, on direction of vibration (perpendicular to the direction of vibrating diaphragm), spacing is identical or close everywhere with described vibrating diaphragm 3, make the Detection capacitance between the two even, ensure the even of acoustic pressure, the back side of described backplane 5 region division relative with described circular whorl film groove has annular projection 10.The positive region divisions relative with described annular projection 10 of described backplane 5 have annular recess 11, by described annular recess 11 is set, avoid due to the problem that described annular projection 10 is set causes described backplane 5 easy fractures.Described in the embodiment of the present application, MEMS microphone also comprises: run through the through hole of described backplane 5, described through hole, for the acoustic pressure in space between backplane 5 described in balance and described vibrating diaphragm 3, is convenient to described vibrating diaphragm 3 and is vibrated.It should be noted that, in the present embodiment accompanying drawing and not shown described through hole, setting position and the number of described through hole on described backplane 5 can be set according to demand, do not limit at this.
Tension force when MEMS microphone can vibrate with the balanced described vibrating diaphragm of reinforcing rib structure of described vibrating diaphragm radial parallel by setting described in the embodiment of the present application, thereby can make its Oscillation Amplitude good uniformity in the time of vibration, thereby ensure the acoustic pressure uniformity between vibrating diaphragm and backplane, ensure that MEMS microphone is converted to voice signal the performance of the signal of telecommunication.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (9)
1. a MEMS microphone, is characterized in that, comprising:
Substrate;
Run through the operatic tunes of described substrate;
Be arranged on described substrate front surface, be positioned at the first insulating barrier of described operatic tunes surrounding;
Be arranged on described the first surface of insulating layer, and the vibrating diaphragm of the setting shape in the covering region relative with the described operatic tunes;
Be arranged on the second insulating barrier of described vibrating diaphragm surface and described the first insulating barrier opposed area;
Be arranged on described the second surface of insulating layer, and cover the backplane of described vibrating diaphragm and described operatic tunes opposed area, described backplane shape and described vibrating diaphragm shape match;
Wherein, the vibration area of described vibrating diaphragm comprises: reinforcement region and surround the line diaphragm area in described reinforcement region; Described reinforcement region division has the reinforcement with described vibration area radial parallel; Described line diaphragm area is provided with line film.
2. MEMS microphone according to claim 1, it is characterized in that, described reinforcement region division has many reinforcements, and described reinforcement is by the center of described vibration area, described reinforcement is with respect to described Central Symmetry, and angle between adjacent two reinforcements is identical.
3. MEMS microphone according to claim 1, it is characterized in that, described reinforcement region division has many reinforcements, one end of described reinforcement and the center superposition of described vibration area, angle between two reinforcements of arbitrary neighborhood is identical, and any two described reinforcements are not at same straight line.
4. MEMS microphone according to claim 1, is characterized in that, described reinforcement region comprises: central circular, the center that the center of circle of described central circular is described vibration area; Described reinforcement region division has many reinforcements, and one end of described reinforcement is towards described center and be positioned at the circular edge of described border circular areas, and the other end deviates from described center; Angle between two reinforcements of arbitrary neighborhood is identical.
5. MEMS microphone according to claim 4, is characterized in that, also comprises:
Be arranged on the donut structural bead of described central circular.
6. MEMS microphone according to claim 1, is characterized in that, described reinforcement is arranged on the reinforcement groove in described vibrating diaphragm front, and the bearing of trend of described reinforcement groove is parallel to described vibration area radially.
7. MEMS microphone according to claim 6, is characterized in that, the width range of described reinforcement groove is 0.4 μ m-10 μ m, comprises endpoint value; The depth bounds of described reinforcement groove is 0.1 μ m-20 μ m, comprises endpoint value; Spacing between described reinforcement groove is 0.4 μ m-10 μ m, comprises endpoint value.
8. MEMS microphone according to claim 1, is characterized in that, described line film is the line film groove that is arranged on described line diaphragm area.
9. MEMS microphone according to claim 8, is characterized in that, the width range of described line film groove is 0.4 μ m-10 μ m, comprises endpoint value; The depth bounds of described line film groove is 0.1 μ m-20 μ m, comprises endpoint value; The spacing of described line film groove is 0.4 μ m-10 μ m, comprises endpoint value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420430883.5U CN204014058U (en) | 2014-07-31 | 2014-07-31 | A kind of MEMS microphone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420430883.5U CN204014058U (en) | 2014-07-31 | 2014-07-31 | A kind of MEMS microphone |
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| Publication Number | Publication Date |
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| CN204014058U true CN204014058U (en) | 2014-12-10 |
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| CN201420430883.5U Expired - Fee Related CN204014058U (en) | 2014-07-31 | 2014-07-31 | A kind of MEMS microphone |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105040A (en) * | 2014-07-31 | 2014-10-15 | 歌尔声学股份有限公司 | MEMS (Micro-electromechanical Systems) microphone |
| WO2020237640A1 (en) * | 2019-05-31 | 2020-12-03 | 万魔有限公司 | Mems device and preparation method therefor, and electronic device |
-
2014
- 2014-07-31 CN CN201420430883.5U patent/CN204014058U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104105040A (en) * | 2014-07-31 | 2014-10-15 | 歌尔声学股份有限公司 | MEMS (Micro-electromechanical Systems) microphone |
| WO2020237640A1 (en) * | 2019-05-31 | 2020-12-03 | 万魔有限公司 | Mems device and preparation method therefor, and electronic device |
| CN113348145A (en) * | 2019-05-31 | 2021-09-03 | 共达电声股份有限公司 | MEMS device, preparation method thereof and electronic device |
| CN113348145B (en) * | 2019-05-31 | 2024-08-20 | 共达电声股份有限公司 | MEMS device, manufacturing method thereof and electronic device |
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Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: Goertek Inc. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: Goertek Inc. |
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Effective date of registration: 20200615 Address after: 266104 room 103, 396 Songling Road, Laoshan District, Qingdao, Shandong Province Patentee after: Goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |
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| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 |