CN204011364U - Wafer cleaning frame and cleaning machine - Google Patents
Wafer cleaning frame and cleaning machine Download PDFInfo
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- CN204011364U CN204011364U CN201420292913.0U CN201420292913U CN204011364U CN 204011364 U CN204011364 U CN 204011364U CN 201420292913 U CN201420292913 U CN 201420292913U CN 204011364 U CN204011364 U CN 204011364U
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- wafer
- cleaning
- swing span
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Abstract
The utility model aims to provide and a kind ofly can clean large wafer, cleaning performance is good, guarantee wafer cleaning machine and the rack for cleaning of wafer quality.The utility model comprises support (1), on described support (1), be provided with some groups of wafer orientation groups, described in every group, wafer orientation group is comprised of three support bars (2), these three support bar distributions triangular in shape, on every described support bar (2), be provided with some brace groove (3), the number of the brace groove (3) on three support bars (2) of wafer orientation group described in same group is consistent and identical in the upper position arranging of described support bar (2); The actuated lever assemblies that described cleaning machine also comprises cleaning case, is arranged on swing span, the motor in described cleaning case and connects described motor output shaft and described swing span, described wafer cleaning frame is arranged on described swing span.The utility model can be applicable to wafer cleaning field.
Description
Technical field
The utility model relates to a kind of rack for cleaning, relates in particular to a kind of wafer cleaning frame and wafer cleaning machine.
Background technology
The wafer using in wafer resonator needs to clean in manufacture process.According to size, wafer can be divided into large wafer and small pieces wafer.For the cleaning of small pieces wafer, as long as wafer is placed on and is cleaned on basket, then in rinse bath, rinse to and fro wafer, then dry.Yet for large wafer, while adopting cleaning basket to clean, owing to being difficult for separating between large wafer after laminating in cleaning fluid, be difficult to cleaning; Large wafer is placed on cleans while cleaning in basket, very easily causes large wafer cracked, causes wafer to be scrapped, or corner cut appears in wafer, cannot reach instructions for use; If the wafer process that occurs corner cut is become to small pieces wafer, increased widely cost, also make staff's labour intensity strengthen widely.
Utility model content
Technical problem to be solved in the utility model is to overcome the deficiencies in the prior art, provides a kind of and can clean large wafer, cleaning performance is good, guarantee the wafer cleaning machine of wafer quality, and the rack for cleaning using in this cleaning machine.
The technical scheme that the utility model wafer cleaning frame adopts is: the utility model comprises support, on described support, be provided with some groups of wafer orientation groups, described in every group, wafer orientation group is comprised of three support bars, these three support bar distributions triangular in shape, on every described support bar, be provided with some brace groove, the number position consistent and that arrange on described support bar of the brace groove on three support bars of wafer orientation group described in same group is identical.
Further, described in every group the brace groove on three support bars in wafer orientation group over against the centerline direction of described wafer orientation group.
Further, be also provided with handle frame on described support, described handle frame and described support are rotationally connected.
Further, described support is comprised of with the connecting rod that is connected two described stators the stator that is positioned at two ends, and the number of described connecting rod is identical with the number of described support bar, and a described support bar is plugged on a described connecting rod.
Further, on described stator, be provided with holddown groove, described support bar is arranged in described holddown groove and by nut check movably, and the distance described in every group between three of wafer orientation group support bars realizes adjustable by support bar movement in described holddown groove.
The technical scheme that the utility model wafer cleaning machine adopts is: this cleaning machine has comprised above-mentioned rack for cleaning, the actuated lever assemblies that also comprises cleaning case, is arranged on swing span, the motor in described cleaning case and connects described motor output shaft and described swing span, described wafer cleaning frame is arranged on described swing span, described motor drives described actuated lever assemblies motion, described actuated lever assemblies drives described swing span to swing in described cleaning case, realizes the wafer being placed on described wafer cleaning frame is cleaned.
Further, on described swing span, be provided with some groups described in wafer cleaning frame.
Further, described swing span is connected with described cleaning case by a bearing pedestal, described swing span is fixedly connected with the swinging axle being arranged in described bearing pedestal inner ring, described actuated lever assemblies comprises the first drive rod being fixedly connected with the output shaft of described motor, the second drive rod being fixedly connected with described swinging axle and the intermediate bar that is connected described the first drive rod and described the second drive rod, and two ends of described intermediate bar are hinged with one end of described the first drive rod and described the second drive rod respectively.
Further, be separated into work nest and rack for cleaning rinse bath in described cleaning case, described swing span is positioned at described work nest.
Further, on described swing span, be provided with two groups described in wafer cleaning frame.
The beneficial effects of the utility model are: in the utility model, on described support, be provided with some groups of wafer orientation groups, described in every group, wafer orientation group is comprised of three support bars, these three support bar distributions triangular in shape, on every described support bar, be provided with some brace groove, the number position consistent and that arrange on described support bar of the brace groove on three support bars of wafer orientation group described in same group is identical; The consistent brace groove of setting position on three support bars of the utility model in wafer orientation group, before carrying out wafer cleaning, wafer is placed in brace groove, by three support bars, form three strong points, wafer is stably positioned in wafer orientation group, brace groove indentation on support bar distributes, in each brace groove, locate a wafer, every group of wafer orientation group can be located multi-disc wafer, between wafer and wafer, there is gap, in cleaning process, can effectively improve cleaning performance, shorten scavenging period, increase work efficiency; In addition, wafer orientation, in brace groove, can be avoided wafer to bump in cleaning process and occur phenomenon cracked, corner cut, has guaranteed wafer cleaning quality, avoids wafer product to scrap, and has effectively controlled cost.
Owing to being provided with holddown groove on described stator, described support bar is arranged in described holddown groove and by nut check movably, distance described in every group between three of wafer orientation group support bars realizes adjustable by support bar movement in described holddown groove, so, the utility model is for the wafer of different size, can make adjustment to wafer orientation group, make the position relationship between three support bars in wafer orientation group adapt to different chip devices, thereby make application of the present utility model more extensive.
Wafer cleaning machine in the utility model utilizes wafer cleaning rack device wafer, utilize motor to drive the automatic cleaning action of having moved of swing span, reduced widely staff's labour intensity, in addition, cleaning machine automatically cleans wafer, can reduce the input of artificial aspect, for enterprise, reduce cost of labor, improved the income of enterprise.
Accompanying drawing explanation
Fig. 1 is the simple and easy plan structure schematic diagram of described wafer cleaning frame;
Fig. 2 is the easy structure schematic diagram that described support bar is combined with described connecting rod;
Fig. 3 is the easy structure schematic diagram of described wafer cleaning machine;
Fig. 4 is the easy structure schematic diagram of described cleaning case;
Fig. 5 is the easy structure schematic diagram of described swing span.
Embodiment
As shown in Figure 1 and Figure 2, structure and the operation principle of wafer cleaning machine have mainly been narrated in the present embodiment.In this wafer cleaning machine, wafer cleaning frame is a kind of new-type structure equally.A wafer cleaning machine can include a plurality of wafer cleaning framves, certainly, the number needs of wafer cleaning frame will with wafer cleaning machine on power of motor match.In the present embodiment, on wafer cleaning machine, include two described wafer cleaning framves.Described wafer cleaning frame comprises support 1, on described support 1, be provided with two groups of wafer orientation groups, described in every group, wafer orientation group is comprised of three support bars 2, these three support bar 2 distributions triangular in shape, on every described support bar 2, be provided with some brace groove 3, the number position consistent and that arrange on described support bar 2 of the brace groove 3 on three support bars 2 of wafer orientation group described in same group is identical.Brace groove 3 indentation on support bar 2 distributes.Brace groove 3 on three support bars 2 described in every group in wafer orientation group is over against the centerline direction of described wafer orientation group.On three support bars 2 in every group of wafer orientation group, the brace groove 3 at same position place forms three anchor points, in three brace groove 3 at same position place, locates a wafer, and every group of wafer orientation group can be located multi-disc wafer.On described support 1, be also provided with 4, two described handle frames 4 of two handle frames symmetrical and be rotationally connected with described support 1.Described support 1 is comprised of with the connecting rod 6 that is connected two described stators 5 stator 5 that is positioned at two ends, and the number of described connecting rod 6 is identical with the number of described support bar 2, and a described support bar 2 is plugged on a described connecting rod 6.On described stator 5, be provided with holddown groove 7, described support bar 2 is arranged in described holddown groove 7 and by nut check movably, and the distance described in every group between three of wafer orientation group support bars 2 realizes adjustable by support bar 2 in the interior movement of described holddown groove 7.
As shown in Fig. 3, Fig. 4 and Fig. 5, described wafer cleaning machine comprises two above-mentioned wafer cleaning framves, the actuated lever assemblies that it also comprises cleaning case 8, is arranged on swing span 9, the motor 10 in described cleaning case 8 and connects described motor 10 output shafts and described swing span 9, described wafer cleaning frame is arranged on described swing span 9, described motor 10 drives described actuated lever assemblies motion, described actuated lever assemblies drives described swing span 9 in the interior swing of described cleaning case 8, realizes the wafer being placed on described wafer cleaning frame is cleaned.Described swing span 9 is connected with described cleaning case 8 by a bearing pedestal, and described swing span 9 is fixedly connected with the swinging axle 11 being arranged in described bearing pedestal inner ring.Described actuated lever assemblies comprises the first drive rod 12 being fixedly connected with the output shaft of described motor 10, the second drive rod 13 being fixedly connected with described swinging axle 11 and the intermediate bar 14 that is connected described the first drive rod 12 and described the second drive rod 13, and two ends of described intermediate bar 14 are hinged with one end of described the first drive rod 12 and described the second drive rod 13 respectively.In described cleaning case 8, be separated into work nest 15 and rack for cleaning rinse bath 16, described swing span 9 is positioned at described work nest 15.
The utility model is a kind of brand-new design, and staff, according to the size of wafer, adjusts the position relationship between three support bars 2 in every group of wafer orientation group, makes three formed three strong points of support bar 2 just in time stably support wafer.The utility model is before carrying out wafer cleaning, wafer is placed in brace groove 3, by three support bars 2, forms three strong points, wafer is stably positioned in wafer orientation group, brace groove 3 indentation on support bar 2 distributes, in each brace groove 3, locate a wafer, every group of wafer orientation group can be located multi-disc wafer, between wafer and wafer, has gap, in cleaning process, can effectively improve cleaning performance, shorten scavenging period, increase work efficiency; In addition, wafer orientation, in brace groove 3, can be avoided wafer to bump in cleaning process and occur phenomenon cracked, corner cut, has guaranteed wafer cleaning quality, avoids wafer product to scrap, and has effectively controlled cost.
The utility model can be applicable to wafer cleaning field.
It should be noted that, above-mentionedly only with preferred embodiment, the utility model is illustrated, can not limit to interest field of the present utility model at this point, therefore in the situation that not departing from the utility model thought, the equivalence that the content of all utilization the utility model specifications and accompanying drawing part is carried out changes, and all reason is with being included within the scope of claim of the present utility model.
Claims (10)
1. a wafer cleaning frame, this rack for cleaning comprises support (1), it is characterized in that: on described support (1), be provided with some groups of wafer orientation groups, described in every group, wafer orientation group is comprised of three support bars (2), the distribution triangular in shape of these three support bars (2), on every described support bar (2), be provided with some brace groove (3), the number of the brace groove (3) on three support bars (2) of wafer orientation group described in same group is consistent and identical in the upper position arranging of described support bar (2).
2. wafer cleaning frame according to claim 1, is characterized in that: the brace groove (3) on three support bars (2) described in every group in wafer orientation group is over against the centerline direction of described wafer orientation group.
3. wafer cleaning frame according to claim 1, is characterized in that: on described support (1), be also provided with handle frame (4), described handle frame (4) is rotationally connected with described support (1).
4. according to the wafer cleaning frame described in claims 1 to 3 any one, it is characterized in that: described support (1) is comprised of with the connecting rod (6) that is connected two described stators (5) the stator (5) that is positioned at two ends, the number of described connecting rod (6) is identical with the number of described support bar (2), and a described support bar (2) is plugged on a described connecting rod (6).
5. wafer cleaning frame according to claim 4, it is characterized in that: on described stator (5), be provided with holddown groove (7), described support bar (2) is arranged in described holddown groove (7) and by nut check movably, and the distance described in every group between three of wafer orientation group support bars (2) realizes adjustable by support bar (2) movement in described holddown groove (7).
6. a wafer cleaning machine that comprises wafer cleaning frame as claimed in claim 1, it is characterized in that: it also comprises cleaning case (8), be arranged on the swing span (9) in described cleaning case (8), motor (10) and connect described motor (10) output shaft and the actuated lever assemblies of described swing span (9), described wafer cleaning frame is arranged on described swing span (9), described motor (10) drives described actuated lever assemblies motion, described actuated lever assemblies drives described swing span (9) to swing in described cleaning case (8), realization is cleaned the wafer being placed on described wafer cleaning frame.
7. wafer cleaning machine according to claim 6, is characterized in that: wafer cleaning frame be provided with some groups on described swing span (9) described in.
8. wafer cleaning machine according to claim 7, it is characterized in that: described swing span (9) is connected with described cleaning case (8) by a bearing pedestal, described swing span (9) is fixedly connected with the swinging axle (11) being arranged in described bearing pedestal inner ring, described actuated lever assemblies comprises the first drive rod (12) being fixedly connected with the output shaft of described motor (10), the second drive rod (13) being fixedly connected with described swinging axle (11) and be connected described the first drive rod (12) and the intermediate bar (14) of described the second drive rod (13), two ends of described intermediate bar (14) are hinged with one end of described the first drive rod (12) and described the second drive rod (13) respectively.
9. wafer cleaning machine according to claim 8, is characterized in that: in described cleaning case (8), be separated into work nest (15) and rack for cleaning rinse bath (16), described swing span (9) is positioned at described work nest (15).
10. wafer cleaning machine according to claim 7, is characterized in that: wafer cleaning frame be provided with two groups on described swing span (9) described in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420292913.0U CN204011364U (en) | 2014-06-04 | 2014-06-04 | Wafer cleaning frame and cleaning machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420292913.0U CN204011364U (en) | 2014-06-04 | 2014-06-04 | Wafer cleaning frame and cleaning machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204011364U true CN204011364U (en) | 2014-12-10 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420292913.0U Expired - Fee Related CN204011364U (en) | 2014-06-04 | 2014-06-04 | Wafer cleaning frame and cleaning machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204011364U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706144A (en) * | 2017-09-14 | 2018-02-16 | 德淮半导体有限公司 | Wafer cleaning fixing device and cleaning equipment |
| CN107900022A (en) * | 2017-11-27 | 2018-04-13 | 珠海东锦石英科技有限公司 | Quartz wafer ground and cleaned machine and its ground and cleaned technique |
| CN113967648A (en) * | 2020-07-23 | 2022-01-25 | 富准精密模具(嘉善)有限公司 | Cleaning device |
-
2014
- 2014-06-04 CN CN201420292913.0U patent/CN204011364U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107706144A (en) * | 2017-09-14 | 2018-02-16 | 德淮半导体有限公司 | Wafer cleaning fixing device and cleaning equipment |
| CN107900022A (en) * | 2017-11-27 | 2018-04-13 | 珠海东锦石英科技有限公司 | Quartz wafer ground and cleaned machine and its ground and cleaned technique |
| CN113967648A (en) * | 2020-07-23 | 2022-01-25 | 富准精密模具(嘉善)有限公司 | Cleaning device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20180604 |