CN203950689U - Metallization film capacitor - Google Patents
Metallization film capacitor Download PDFInfo
- Publication number
- CN203950689U CN203950689U CN201420308056.9U CN201420308056U CN203950689U CN 203950689 U CN203950689 U CN 203950689U CN 201420308056 U CN201420308056 U CN 201420308056U CN 203950689 U CN203950689 U CN 203950689U
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- China
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- connecting portion
- installation portion
- bending part
- width
- film capacitor
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- Expired - Fee Related
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Abstract
Metallization film capacitor comprises metalized film, two gilding layers, shell and two conducting strips; After this metallizing film winding or stack, be contained in this shell, two gilding layers are located at two ends of this metalized film; Each conducting strip comprises integrated connecting portion, bending part and installation portion; This connecting portion is the rectangular flat of strip, this bending part body in the form of sheets; This installation portion is a rectangular flat, and the width of this installation portion is greater than the width of this connecting portion; This bending part is connected between this connecting portion and this installation portion, and this connecting portion and this installation portion all vertically extend, and between this bending part and this connecting portion, become dullness, between this bending part and this installation portion, become obtuse angle; The upper end of the connecting portion of each conducting strip is located on a corresponding gilding layer.Printed circuit board (PCB) can be welded or be plugged in to above-mentioned utility model securely, and conducting strip is stressed large, can support better capacitor.
Description
Technical field
The utility model relates to a kind of metallization film capacitor.
Background technology
As shown in Figure 1, existing capacitor comprises metalized film, be located at the gilding layer at metalized film two ends and connect respectively two tin-coated steel lead-in wires 140 of gilding layer, this lead-in wire 140 is the millimetre-sized cylindrical shape wire of diameter, by capacitor welding when the printed circuit board (PCB), because the cross-sectional area of lead-in wire 140 is very little, and the body of capacitor is relatively large, when lead-in wire 140 is welded in to printed circuit board (PCB), contact area between lead-in wire 140 and printed circuit board (PCB) is very little, it is not firm to cause installing, be collided or use for a long time after oxidized and be easy to come off, cause loose contact.
Utility model content
For the deficiencies in the prior art, the purpose of this utility model is intended to provide a kind of metallization film capacitor that can firmly be installed on printed circuit board (PCB).
For achieving the above object, the utility model adopts following technical scheme:
A kind of metallization film capacitor, it comprises metalized film, two gilding layers, shell and two conducting strips; After this metallizing film winding or stack, be contained in this shell, two gilding layers are located at respectively two ends of this metalized film; Each conducting strip comprises integrated connecting portion, bending part and installation portion; This connecting portion is the rectangular flat of strip, this bending part body in the form of sheets; This installation portion is a rectangular flat, and the width of this installation portion is greater than the width of this connecting portion; This bending part is connected between this connecting portion and this installation portion, and this connecting portion and this installation portion all vertically extend, and between this bending part and this connecting portion, become dullness, between this bending part and this installation portion, become obtuse angle; The upper end of the connecting portion of each conducting strip is located on a corresponding gilding layer.
Further, the end of the installation portion of each conducting strip extends a fixed part downwards, and the width of this fixed part is less than this installation portion and is greater than this connecting portion; On this fixed part, offer a fixed via.
Further, this fixed via is made up of a manhole and a strip through hole that is communicated with this manhole.
Further, between this fixed part and this installation portion, the width of junction dwindles the width that transits to this fixed part gradually.
Further, the width of this bending part dwindles from top to bottom gradually, to form isosceles triangle flat board.
Further, this conducting strip is zinc-plated copper sheet.
Further, this gilding layer is made up of tin, zinc, antimony, copper and Zinc-tin alloy.
Further, this metalized film is poly-the third metalized film.
The beneficial effects of the utility model are at least:
Conducting strip of the present utility model comprises connecting portion, bending part and installation portion, due to the rectangular flat board of this connecting portion, it has expanded the contact area with gilding layer, and it is more firmly firm to install, the strip of connecting portion can increase its ductility, thereby can rationally adjust angle according to the different installation sites at printed circuit board (PCB).This bending part makes this installation portion and this connecting portion certain distance that staggers, can make up the less defect of width of metalized film, make the firm printed circuit board (PCB) that is installed on suitably of capacitor, without carry out artificial bending lead-in wire as prior art, thereby avoid damaging gilding layer and conducting strip, in addition, when this kind of structure can make capacitor be installed on printed circuit board (PCB) and between circuit board, keep certain interval, also play position-limiting action, had optimization radiating effect.In addition, the width of this bending part dwindles from top to bottom gradually, makes the stressed transition gradually between connecting portion and installation portion, is not easy to fracture, and increases the useful life of capacitor.The width of this installation portion is greater than the width of this connecting portion, can increase the contact area between this conducting strip and printed circuit board (PCB), makes this capacitor can weld securely or be plugged in printed circuit board (PCB), and increases the stressed of conducting strip, supports better capacitor.
Brief description of the drawings
Fig. 1 is the schematic diagram of prior art metallization film capacitor.
Fig. 2 is the part section structural representation of the preferred embodiments of the utility model metallization film capacitor.
Fig. 3 is the structural representation of another view of the metallization film capacitor of Fig. 2.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the utility model is described further:
Refer to Fig. 2 and Fig. 3, the utility model relates to a kind of metallization film capacitor, and its preferred embodiments comprises metalized film 10, two gilding layers 20, shell 30 and two conducting strips 40.
This metalized film 10 is contained in after reeling or superposeing in this shell 30, and two gilding layers 20 are located at respectively two ends of this metalized film 10.
Each conducting strip 40 comprises integrated connecting portion 41, bending part 42 and installation portion 43.The rectangular flat that this connecting portion 41 is strip, the width of this bending part 42 dwindles from top to bottom gradually, and it forms isosceles triangle flat board, and this installation portion 43 is a rectangular flat, and the width of this installation portion 43 is greater than the width of this connecting portion 41.This bending part 42 is connected between this connecting portion 41 and this installation portion 43, and this connecting portion 41 and this installation portion 43 all vertically extend, and between this bending part 42 and this connecting portion 41, become dullness, between this bending part 42 and this installation portion 43, become obtuse angle.The upper end of the connecting portion 41 of each conducting strip 40 is located on a corresponding gilding layer 20.
So, due to the rectangular flat board of this connecting portion 41, it has expanded the contact area with gilding layer 20, and installation is more firmly firm, and the strip of connecting portion 41 can increase its ductility, thereby can rationally adjust angle according to the different installation sites at printed circuit board (PCB).This bending part 42 makes this installation portion 43 and this connecting portion 41 certain distance that staggers, can make up the less defect of width of metalized film 10, make the firm printed circuit board (PCB) that is installed on suitably of capacitor, without carry out artificial bending lead-in wire as prior art, thereby avoid damaging gilding layer 20 and conducting strip, in addition, when this kind of structure can make capacitor be installed on printed circuit board (PCB) and between circuit board, keep certain interval, also play position-limiting action, had optimization radiating effect.In addition, the width of this bending part 42 dwindles from top to bottom gradually, makes the stressed transition gradually between connecting portion 41 and installation portion 43, is not easy to fracture, and increases the useful life of capacitor.The width of this installation portion 43 is greater than the width of this connecting portion 41, can increase the contact area between this conducting strip 40 and printed circuit board (PCB), make this capacitor can weld securely or be plugged in printed circuit board (PCB), and increase the stressed of conducting strip 40, support better capacitor.
Preferably, the end of the installation portion 43 of each conducting strip 40 extends a fixed part 44 downwards, the width of this fixed part 44 is less than this installation portion 43 and is greater than this connecting portion 41, between this fixed part 44 and this installation portion 43, the width of junction dwindles the width that transits to this fixed part 44 gradually, so, can make the stressed transition gradually between fixed part 44 and this installation portion 43, be not easy to fracture.On this fixed part 44, offer a fixed via 45, this capacitor can be fixed on printed circuit board (PCB) through this fixed via 45 by screw or bolt, so, can make the more firm printed circuit board (PCB) that is firmly fixed on of capacitor.This fixed via 45 is made up of a manhole 451 and a strip through hole 452 that is communicated with this manhole 451, so, is conducive to the setting height(from bottom) of regulating capacitor, the convenient capacitor of installing.
Preferably, this conducting strip 40 is zinc-plated copper sheet, is conducive to improve the electric conductivity of conducting strip 40, and welding effect is good, optimizes the electrical property of electric capacity, in order to extending electric capacity useful life.
This gilding layer 20 is made up of tin, zinc, antimony, copper and Zinc-tin alloy, is conducive to reduce electric capacity ESR.
This metalized film 10 is poly-the third metalized film.
For a person skilled in the art, can be according to technical scheme described above and design, make other various corresponding changes and distortion, and these all changes and distortion all should belong to the protection range of the utility model claim within.
Claims (8)
1. a metallization film capacitor, is characterized in that: it comprises metalized film, two gilding layers, shell and two conducting strips; After this metallizing film winding or stack, be contained in this shell, two gilding layers are located at respectively two ends of this metalized film; Each conducting strip comprises integrated connecting portion, bending part and installation portion; This connecting portion is the rectangular flat of strip, this bending part body in the form of sheets; This installation portion is a rectangular flat, and the width of this installation portion is greater than the width of this connecting portion; This bending part is connected between this connecting portion and this installation portion, and this connecting portion and this installation portion all vertically extend, and between this bending part and this connecting portion, become dullness, between this bending part and this installation portion, become obtuse angle; The upper end of the connecting portion of each conducting strip is located on a corresponding gilding layer.
2. metallization film capacitor as claimed in claim 1, is characterized in that: the end of the installation portion of each conducting strip extends a fixed part downwards, and the width of this fixed part is less than this installation portion and is greater than this connecting portion; On this fixed part, offer a fixed via.
3. metallization film capacitor as claimed in claim 2, is characterized in that: this fixed via is made up of a manhole and a strip through hole that is communicated with this manhole.
4. metallization film capacitor as claimed in claim 2, is characterized in that: between this fixed part and this installation portion, the width of junction dwindles the width that transits to this fixed part gradually.
5. metallization film capacitor as claimed in claim 1, is characterized in that: the width of this bending part dwindles from top to bottom gradually, to form isosceles triangle flat board.
6. metallization film capacitor as claimed in claim 1 or 2, is characterized in that: this conducting strip is zinc-plated copper sheet.
7. metallization film capacitor as claimed in claim 1, is characterized in that: this gilding layer is made up of tin, zinc, antimony, copper and Zinc-tin alloy.
8. metallization film capacitor as claimed in claim 1, is characterized in that: this metalized film is poly-the third metalized film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420308056.9U CN203950689U (en) | 2014-06-10 | 2014-06-10 | Metallization film capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420308056.9U CN203950689U (en) | 2014-06-10 | 2014-06-10 | Metallization film capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203950689U true CN203950689U (en) | 2014-11-19 |
Family
ID=51892711
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420308056.9U Expired - Fee Related CN203950689U (en) | 2014-06-10 | 2014-06-10 | Metallization film capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203950689U (en) |
-
2014
- 2014-06-10 CN CN201420308056.9U patent/CN203950689U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141119 Termination date: 20190610 |