CN203927598U - Backlight module - Google Patents

Backlight module Download PDF

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Publication number
CN203927598U
CN203927598U CN201420302493.XU CN201420302493U CN203927598U CN 203927598 U CN203927598 U CN 203927598U CN 201420302493 U CN201420302493 U CN 201420302493U CN 203927598 U CN203927598 U CN 203927598U
Authority
CN
China
Prior art keywords
backboard
backlight
affixed
adhesive tape
iron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420302493.XU
Other languages
Chinese (zh)
Inventor
韩会卿
朱小华
赵松涛
李军旺
李琼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xian Chuan Photoelectric Co Ltd Of Shenzhen
Original Assignee
Xian Chuan Photoelectric Co Ltd Of Shenzhen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xian Chuan Photoelectric Co Ltd Of Shenzhen filed Critical Xian Chuan Photoelectric Co Ltd Of Shenzhen
Priority to CN201420302493.XU priority Critical patent/CN203927598U/en
Application granted granted Critical
Publication of CN203927598U publication Critical patent/CN203927598U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of backlight module, comprise: backboard, be located at the backlight in backboard, be located in backboard and the LGP that backlight arranges relatively, be located at the reflector plate between LGP and backboard, be located at the optical diaphragm group on LGP, and be affixed on the heat conductive insulating adhesive tape on backboard, described backboard comprises: plastic cement backboard and iron backboard, described heat conductive insulating adhesive tape is affixed on described iron backboard, described backlight comprises circuit board and is arranged on the several LED lamps on described circuit board, described circuit board is affixed on heat conductive insulating adhesive tape, so that this backlight is affixed on described iron backboard.The utility model adopts heat conductive insulating adhesive tape backlight to be affixed on to the iron back board part of backboard, not only backlight fixation, can also make the heat that LED lamp sends be passed to fast iron backboard by heat conductive insulating adhesive tape, go out by iron backboard Quick diffusing again, effectively reduce LED lamp heating temp, improve LED lamp brightness effect, and increase the service life.

Description

Backlight module
Technical field
The utility model relates to lcd technology, relates in particular to a kind of backlight module of low temperature high brightness.
Background technology
Liquid crystal indicator (LCD, Liquid Crystal Display) has that fuselage is thin, power saving, the many merits such as radiationless, is widely used.Liquid crystal indicator major part on existing market is backlight liquid crystal indicator, and it comprises liquid crystal panel and backlight module (backlight module).The operation principle of liquid crystal panel is to place liquid crystal molecule in the middle of two parallel glass substrates, two have the tiny electric wire of many vertical and levels in the middle of sheet glass substrates, control liquid crystal molecule by whether switching on and change direction, the light refraction of backlight module is out produced to picture.Because liquid crystal panel itself is not luminous, the light source that need to provide by backlight module carrys out normal show image, and therefore, backlight module becomes one of key component of liquid crystal indicator.Backlight module is divided into two kinds of side entrance back module and down straight aphototropism mode set according to the difference of light source incoming position.Down straight aphototropism mode set is by for example CCFL of illuminating source (Cold Cathode Fluorescent Lamp, cathodouminescence fluorescent tube) or LED (Light Emitting Diode light emitting diode) be arranged on liquid crystal panel rear, directly forming surface light source offers liquid crystal panel.And side entrance back module is the back plate edges of backlight LED lamp bar (Light bar) being located to liquid crystal panel proceeds posterolateral, the light that LED lamp bar sends is from LGP (LGP, Light Guide Plate) incidence surface of a side enters LGP, after reflection and diffusion, penetrate from LGP exiting surface, via optical diaphragm group, offer liquid crystal panel with forming surface light source.
In side entrance back module, the material of existing backboard is plastic cement, thereby does not have high thermal conductivity and high-cooling property.LED lamp bar is affixed on this plastic cement backboard, and the heat of its luminous generation cannot see through this backboard Quick diffusing, causes LED lamp bar internal temperature higher, and LED is worked lastingly under hot environment, reduces its life-span, the service life of also reducing machine product simultaneously.State Patent Office discloses one section of patent documentation that application number is 201320518812.6, refer to Fig. 1, for addressing the above problem, this patent documentation discloses a kind of liquid crystal display module, this liquid crystal display module comprises chase 102 and wiring board under side-emitting LED 101, backlight module, side-emitting LED 101 is welded on after PCB surface, then presses close to fixing by being welded with chase 102 under the wiring board of side-emitting LED 101 and backlight module.In this scheme, be close together so that the heat that side-emitting LED 101 is sent distributes by chase being welded with chase 102 under the wiring board of side-emitting LED 101 and backlight module.But this liquid crystal display module, in follow-up carrying and using, can bump unavoidably, can generation crack between chase 102 under the wiring board that is welded with side-emitting LED 101 and backlight module, cause loose contact; Meanwhile, in use, element aging also can make to be welded with under the wiring board of side-emitting LED 101 and backlight module and produce crack between chase 102 this liquid crystal display module, causes loose contact.Two kinds of above-mentioned situations all can make the heat that side-emitting LED 101 sends cannot be passed to fast chase 102 under backlight module, affect the service life of side-emitting LED 101 and complete machine.
Therefore, there is defect in prior art, needs to improve.
Utility model content
The purpose of this utility model is to provide a kind of backlight module, effectively reduces LED lamp heating temp, improves LED lamp brightness effect, and increases the service life.
The technical solution of the utility model is as follows: the utility model provides a kind of backlight module, comprise: backboard, be located at the backlight in backboard, be located in backboard and the LGP that backlight arranges relatively, be located at the reflector plate between LGP and backboard, be located at the optical diaphragm group on LGP, and be affixed on the heat conductive insulating adhesive tape on described backboard and between backlight and backboard, described backboard comprises: plastic cement backboard and the iron backboard splicing with described plastic cement backboard one side, described heat conductive insulating adhesive tape is affixed on described iron backboard, described backlight comprises circuit board and is arranged on the several LED lamps on described circuit board, described circuit board is affixed on heat conductive insulating adhesive tape, so that this backlight is affixed on described iron backboard.
Described circuit board is flexible PCB.
Described LED lamp is paster LED lamp.
Adopt such scheme, backlight module of the present utility model, adopt heat conductive insulating adhesive tape backlight to be affixed on to the iron back board part of backboard, not only backlight fixation, can also make the heat that LED lamp sends be passed to fast iron backboard by heat conductive insulating adhesive tape, then go out by iron backboard Quick diffusing, effectively reduce LED lamp heating temp, improve LED lamp brightness effect, and increase the service life.
Brief description of the drawings
Fig. 1 is the structural representation of liquid crystal display module in prior art.
Fig. 2 is the structural representation of the utility model backlight module.
Fig. 3 is the profile of A-A in Fig. 2.
Fig. 4 is the enlarged drawing at B place in Fig. 3.
Detailed description of the invention
Below in conjunction with the drawings and specific embodiments, the utility model is elaborated.
Refer to Fig. 2 to Fig. 4, the utility model provides a kind of backlight module, comprising: backboard 10, be located at backlight 20 in backboard 10, be located in backboard 10 and the LGP 30 that backlight 20 arranges relatively, be located at reflector plate 40 between LGP 30 and backboard 10, be located at the optical diaphragm group 50 on LGP 30 and be affixed on the heat conductive insulating adhesive tape 60 on described backboard 10 and between backlight 20 and backboard 10.
Described backboard 10 comprises: plastic cement backboard 12 and the iron backboard 14 splicing with described plastic cement backboard 12 1 sides, and adopt plastic back plate 12 in reducing production costs, make the liquid crystal display of applying this backlight module meet the lightening demand for development in market.Described heat conductive insulating adhesive tape 60 is affixed on described iron backboard 14, described backlight 20 comprises circuit board 24 and is arranged on the several LED lamps 22 on described circuit board 24, described circuit board 24 is affixed on heat conductive insulating adhesive tape 60, so that this backlight 20 is affixed on described iron backboard 14, backlight 20 just can be firmly fixed on backboard 10 like this, prevent that liquid crystal display from occurring that in carrying or follow-up use backlight 20 and the position of backboard 10 change and occur crack, cause loose contact; Meanwhile, also make the heat that LED lamp 22 sends be passed to fast iron backboard 14 by heat conductive insulating adhesive tape 60, then go out by iron backboard 14 Quick diffusings, effectively reduce LED lamp 22 heating temps, improve LED lamp 22 brightness effects, and increase the service life.
In the present embodiment, described circuit board is flexible PCB, and described LED lamp is paster LED lamp.
In sum, the utility model provides a kind of backlight module, adopt heat conductive insulating adhesive tape backlight to be affixed on to the iron back board part of backboard, not only backlight fixation, can also make the heat that LED lamp sends be passed to fast iron backboard by heat conductive insulating adhesive tape, then go out by iron backboard Quick diffusing, effectively reduce LED lamp heating temp, improve LED lamp brightness effect, and increase the service life.
These are only preferred embodiment of the present utility model, be not limited to the utility model, all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.

Claims (3)

1. a backlight module, it is characterized in that, comprise: backboard, be located at the backlight in backboard, be located in backboard and the LGP that backlight arranges relatively, be located at the reflector plate between LGP and backboard, be located at the optical diaphragm group on LGP, and be affixed on the heat conductive insulating adhesive tape on described backboard and between backlight and backboard, described backboard comprises: plastic cement backboard and the iron backboard splicing with described plastic cement backboard one side, described heat conductive insulating adhesive tape is affixed on described iron backboard, described backlight comprises circuit board and is arranged on the several LED lamps on described circuit board, described circuit board is affixed on heat conductive insulating adhesive tape, so that this backlight is affixed on described iron backboard.
2. backlight module according to claim 1, is characterized in that, described circuit board is flexible PCB.
3. backlight module according to claim 1, is characterized in that, described LED lamp is paster LED lamp.
CN201420302493.XU 2014-06-09 2014-06-09 Backlight module Expired - Fee Related CN203927598U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420302493.XU CN203927598U (en) 2014-06-09 2014-06-09 Backlight module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420302493.XU CN203927598U (en) 2014-06-09 2014-06-09 Backlight module

Publications (1)

Publication Number Publication Date
CN203927598U true CN203927598U (en) 2014-11-05

Family

ID=51823406

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420302493.XU Expired - Fee Related CN203927598U (en) 2014-06-09 2014-06-09 Backlight module

Country Status (1)

Country Link
CN (1) CN203927598U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107390426A (en) * 2017-06-20 2017-11-24 合肥市惠科精密模具有限公司 A kind of TFT LCD display modules with noctilucence reflection backlight paper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107390426A (en) * 2017-06-20 2017-11-24 合肥市惠科精密模具有限公司 A kind of TFT LCD display modules with noctilucence reflection backlight paper

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20141105

Termination date: 20200609

CF01 Termination of patent right due to non-payment of annual fee