CN203921302U - 一种粉剂真空包装机的进料装置 - Google Patents
一种粉剂真空包装机的进料装置 Download PDFInfo
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- CN203921302U CN203921302U CN201420237826.5U CN201420237826U CN203921302U CN 203921302 U CN203921302 U CN 203921302U CN 201420237826 U CN201420237826 U CN 201420237826U CN 203921302 U CN203921302 U CN 203921302U
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- top board
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- mounting plate
- bottom plate
- feed arrangement
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Application Number | Priority Date | Filing Date | Title |
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CN201420237826.5U CN203921302U (zh) | 2014-05-09 | 2014-05-09 | 一种粉剂真空包装机的进料装置 |
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CN201420237826.5U CN203921302U (zh) | 2014-05-09 | 2014-05-09 | 一种粉剂真空包装机的进料装置 |
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CN203921302U true CN203921302U (zh) | 2014-11-05 |
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CN201420237826.5U Expired - Fee Related CN203921302U (zh) | 2014-05-09 | 2014-05-09 | 一种粉剂真空包装机的进料装置 |
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CN (1) | CN203921302U (zh) |
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2014
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Feeding device of powder vacuum packaging machine Effective date of registration: 20150724 Granted publication date: 20141105 Pledgee: Bengbu financing guarantee Group Co., Ltd. Pledgor: Bengbu Wanke Silicon Material Technology Co., Ltd. Registration number: 2015990000595 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20160901 Granted publication date: 20141105 Pledgee: Bengbu financing guarantee Group Co., Ltd. Pledgor: Bengbu Wanke Silicon Material Technology Co., Ltd. Registration number: 2015990000595 |
|
PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Feeding device of powder vacuum packaging machine Effective date of registration: 20160901 Granted publication date: 20141105 Pledgee: Bengbu financing guarantee Group Co., Ltd. Pledgor: Bengbu Wanke Silicon Material Technology Co., Ltd. Registration number: 2016990000758 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20171013 Granted publication date: 20141105 Pledgee: Bengbu financing guarantee Group Co., Ltd. Pledgor: Bengbu Wanke Silicon Material Technology Co., Ltd. Registration number: 2016990000758 |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141105 Termination date: 20180509 |