CN203904492U - Anode plate used in treatment of heat-resistant layer of copper foil - Google Patents
Anode plate used in treatment of heat-resistant layer of copper foil Download PDFInfo
- Publication number
- CN203904492U CN203904492U CN201420302137.8U CN201420302137U CN203904492U CN 203904492 U CN203904492 U CN 203904492U CN 201420302137 U CN201420302137 U CN 201420302137U CN 203904492 U CN203904492 U CN 203904492U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- plate body
- refractory layer
- layer processing
- positive plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 39
- 239000011889 copper foil Substances 0.000 title claims abstract description 33
- 239000010936 titanium Substances 0.000 claims abstract description 19
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 19
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011248 coating agent Substances 0.000 claims abstract description 11
- 238000000576 coating method Methods 0.000 claims abstract description 11
- 229910052741 iridium Inorganic materials 0.000 claims abstract description 5
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims abstract description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims description 15
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 5
- 238000010422 painting Methods 0.000 claims description 4
- 241000276425 Xiphophorus maculatus Species 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000003064 anti-oxidating effect Effects 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 2
- 229910052715 tantalum Inorganic materials 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000007373 indentation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 239000002893 slag Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 229910000531 Co alloy Inorganic materials 0.000 description 1
- 208000003351 Melanosis Diseases 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- XYCQRIWVOKLIMW-UHFFFAOYSA-N [Co].[Ni].[Zn] Chemical compound [Co].[Ni].[Zn] XYCQRIWVOKLIMW-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003467 diminishing effect Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 150000003608 titanium Chemical class 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electrolytic Production Of Metals (AREA)
Abstract
The utility model relates to an anode plate used in treatment of a heat-resistant layer of copper foil. The anode plate used in treatment of the heat-resistant layer of the copper foil comprises a plate body taking a titanium plate as a base material and a coating composed of iridium and tantalum, wherein the flatness of the surface of the plate body is more than 99.5%; density of the coating is 30g/m<2>, the coating is uniformly coated on the surface of the plate body, and multiple through holes are formed at equal intervals on the same line 25mm away from one edge of the plate body. The anode plate used in treatment of the heat-resistant layer of the copper foil has the advantages that geometric dimension of an anode is constant, so that current distribution is optimized, the problem of uniform electroplating is solved, and the defect of poor antioxidation of the copper foil is overcome; no pollution is produced to an electroplating medium, burrs of the copper foil are reduced, and indentation is avoided; the anode is not frequently maintained and does not need to be cleaned and replenished by stopping a production line, the productivity is improved, and the labour cost is reduced.
Description
Technical field
The utility model relates to electrolytic copper foil field, relates in particular to the positive plate that a kind of Copper Foil refractory layer is processed use.
Background technology
Electrolytic copper foil production is divided into molten copper, raw paper tinsel manufacture, surface treatment, cuts four-stage, and surface treatment is divided into alligatoring, solidifies, melanism, refractory layer processings, anti-oxidation processing, painting coupling agent 6 procedures, refractory layer is processed the techniques such as general use is zinc-plated, zinc-nickel alloy, zinc-nickel-cobalt alloy, positive plate used is zine plate or admiro positive plate, zine plate or admiro positive plate are soluble anode, in use anode is along with dissolving, dissolution process easily produces anode slag, and size is diminishing slowly also.After the anode slag inflow electrolytic solution that dissolving produces, on easy attached Copper Foil, cause Copper Foil to occur the bad phenomenon such as burr, pressure resist, pin hole; Anode dimension diminishes and can cause the spacing between anode and negative electrode even at expansion, Copper Foil uneven coating progressively, easily makes Copper Foil baking rear anti-oxidation bad.Use soluble anode constantly to dissolve because of it, so need regular shutdown to change, cause the service efficiency of surface treating machine to be affected.
Utility model content
The technical problems to be solved in the utility model is to overcome the deficiency that above-mentioned prior art exists, and proposes a kind of positive plate, and it is insoluble positive plate, effectively prevents the generation of anode slag, improves the service efficiency of the surface treating machine of Copper Foil.
For solving the problems of the technologies described above, the utility model adopts following technical scheme:
A Copper Foil refractory layer processing positive plate, it comprises: one take the plate body that titanium plate is base material, and the surperficial planeness of plate body is higher than 99.5%; The coating that one iridium and tantalum form, the painting amount of described coating is 30g/m
2, be evenly applied to the surface of plate body; Wherein, the close wherein same straight line in 25mm place, edge of plate body is provided with a plurality of evenly spaced through holes.
More specifically, the distance between described through hole is 100mm.
Wherein, also comprise a bus belt being electrically connected to described plate body, described bus belt comprises a strip transverse slat, described strip transverse slat is provided with the open holes corresponding with through hole on described plate body, and each vertically extends a junction by described strip transverse slat both ends, described connection section is provided with wire joining.
Wherein, between described bus belt and described plate body, by titanium screw, be connected and fixed, and make bus belt and plate body electric connection by titanium screw.
Wherein, described bus belt is the platy structure that an inside is titanium layer for red copper appearance.
Wherein, described wire joining is three through holes.
Wherein, the length of the strip transverse slat of described bus belt is 693mm.
Wherein, described plate body thickness is 4.4mm.
Wherein, the length of described plate body is 302.5mm.
Wherein, the width of described plate body and bus belt junction lap is 31.25mm.
Compared with prior art, the utlity model has following beneficial effect, the geometrical dimension of the utility model anode remains unchanged, thereby distribution of current is optimized, and solves the even problem of coating, reduces the bad problem of the anti-oxygen of Copper Foil.To electroplating medium, pollution be can not produce, Copper Foil burr, load mould etc. reduced bad.Anode is safeguarded few, does not need to stop that production line cleans and supplementary anode, boosts productivity, and reduces cost of labor.
Accompanying drawing explanation
Fig. 1 is that the utility model Copper Foil refractory layer is processed the board body part separation structure figure with positive plate;
Fig. 2 is that the utility model Copper Foil refractory layer is processed the bus belt structural representation with positive plate;
Fig. 3 is that the utility model Copper Foil refractory layer is processed with positive plate and bus belt mounting structure schematic diagram.
Embodiment
The exemplary embodiment that embodies the utility model feature & benefits will describe in detail in the following description.Be understood that the utility model can have various variations on different embodiments, it neither departs from scope of the present utility model, and explanation wherein and to be shown in be when the use that explain in essence, but not in order to limit the utility model.
Consult accompanying drawing 1 to accompanying drawing 3, this kind of Copper Foil refractory layer processing positive plate, it comprises: one take the plate body 1 that titanium plate is base material, and the surperficial planeness of plate body 1 is higher than 99.5%; The coating that one iridium and tantalum form (also not shown in figure), the painting amount of described coating is 30g/m
2, be evenly applied to the surface of plate body 1; Wherein, the close wherein same straight line in 25mm place, edge of plate body 1 is provided with a plurality of evenly spaced through holes 11.
More specifically, the distance D between described through hole is 100mm.
Wherein, also comprise a bus belt 2 being electrically connected to plate body 1, bus belt 2 comprises a strip transverse slat 21, strip transverse slat 21 is provided with the open holes 211 corresponding with through hole 11 on plate body 1, and each vertically extends a junction 22 by strip transverse slat 21 both ends, connection section 22 is provided with wire joining 23.
Further, between above-mentioned bus belt 2 and plate body 1, by titanium screw 3, be connected and fixed, and make bus belt 2 and plate body 1 electric connection by titanium screw 3.
Concrete, bus belt 2 is the platy structure that an inside is titanium layer for red copper appearance.
Consult accompanying drawing 1 and accompanying drawing 2 and accompanying drawing 3, it is more than 99.5% titanium plate with surface without burr, no marking, smooth purity that this positive plate adopts, on titanium plate top, far from 25mm place, top, bore the aperture (seeing accompanying drawing 1) that row's spacing is 100mm, then apply one deck 30g/m on this titanium plate
2precious metal iridium and tantalum, and at high temperature carry out sintering, take out the cooling refractory layer treatment process that can be used for the surface treatment stage and use as positive plate.This positive plate in use needs to carry out coupling with the bus belt 2 shown in accompanying drawing 2, and bus belt 2 materials are titanium bag red copper, and appearance is titanium layer, and the welding of outside weld seam and internal copper is essential good, and possesses resistance to strong acid, highly basic ability.Bus belt 2 bottoms are drilled with a row and positive plate hole with equally spaced open holes 211, to be connected with positive plate; Two of bus belt 2 is also drilled with 3 and is electrically connected to hole, for being connected with wire.Through hole 11 during use on positive plate is corresponding with the open holes 211 of bus belt 2, and pass hole with titanium screw, positive plate plate body 1 and bus belt 2 is fixing, and bus belt 2 two are fixed connection with the wire that is connected rectifier cabinet, can be used for Copper Foil refractory layer and process after connection energising.
More specifically, the length of the strip transverse slat of described bus belt is 693mm.
More specifically, described plate body thickness is 4.4mm.
More specifically, the length of described plate body is 302.5mm.
More specifically, the width of described plate body and bus belt junction lap is 31.25mm.
It should be noted that; these are only better possible embodiments of the present utility model; and unrestricted protection domain of the present utility model, the equivalent structure that all utilization the utility model specification sheetss and accompanying drawing content have been done changes, and is all included in protection domain of the present utility model.
Claims (10)
1. a Copper Foil refractory layer processing positive plate, is characterized in that, comprising: one take the plate body that titanium plate is base material, and the surperficial planeness of described plate body is higher than 99.5%; The coating that one iridium and tantalum form, the painting amount of described coating is 30g/m
2, be evenly applied to the surface of described plate body; Wherein, the close wherein same straight line in 25mm place, edge of described plate body is provided with a plurality of evenly spaced through holes.
2. Copper Foil refractory layer processing positive plate as claimed in claim 1, is characterized in that, the distance between described through hole is 100mm.
3. Copper Foil refractory layer processing positive plate as claimed in claim 1, it is characterized in that, also comprise a bus belt being electrically connected to described plate body, described bus belt comprises a strip transverse slat, described strip transverse slat is provided with the open holes corresponding with through hole on described plate body, and each vertically extends a junction by described strip transverse slat both ends, described connection section is provided with wire joining.
4. Copper Foil refractory layer processing positive plate as claimed in claim 3, is characterized in that, is connected and fixed, and makes bus belt and plate body electric connection by titanium screw between described bus belt and described plate body by titanium screw.
5. Copper Foil refractory layer processing positive plate as claimed in claim 3, is characterized in that, described bus belt is the platy structure that an inside is titanium layer for red copper appearance.
6. Copper Foil refractory layer processing positive plate as claimed in claim 3, is characterized in that, described wire joining is three through holes.
7. Copper Foil refractory layer processing positive plate as claimed in claim 3, is characterized in that, the length of the strip transverse slat of described bus belt is 693mm.
8. Copper Foil refractory layer processing positive plate as claimed in claim 1, is characterized in that, described plate body thickness is 4.4mm.
9. Copper Foil refractory layer processing positive plate as claimed in claim 1, is characterized in that, the length of described plate body is 302.5mm.
10. Copper Foil refractory layer processing positive plate as claimed in claim 3, is characterized in that, the width of described plate body and bus belt junction lap is 31.25mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420302137.8U CN203904492U (en) | 2014-06-06 | 2014-06-06 | Anode plate used in treatment of heat-resistant layer of copper foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420302137.8U CN203904492U (en) | 2014-06-06 | 2014-06-06 | Anode plate used in treatment of heat-resistant layer of copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203904492U true CN203904492U (en) | 2014-10-29 |
Family
ID=51778783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420302137.8U Expired - Lifetime CN203904492U (en) | 2014-06-06 | 2014-06-06 | Anode plate used in treatment of heat-resistant layer of copper foil |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203904492U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108660488A (en) * | 2018-05-29 | 2018-10-16 | 江阴安诺电极有限公司 | The preparation method of electrolytic copper foil anode plate |
| CN109989075A (en) * | 2019-05-10 | 2019-07-09 | 建滔（连州）铜箔有限公司 | A kind of back coating technique producing electrolytic copper foil titanium anode plate |
-
2014
- 2014-06-06 CN CN201420302137.8U patent/CN203904492U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108660488A (en) * | 2018-05-29 | 2018-10-16 | 江阴安诺电极有限公司 | The preparation method of electrolytic copper foil anode plate |
| CN109989075A (en) * | 2019-05-10 | 2019-07-09 | 建滔（连州）铜箔有限公司 | A kind of back coating technique producing electrolytic copper foil titanium anode plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141029 |