CN203863756U - Automatic semiconductor trimming and forming equipment clamping mechanism - Google Patents
Automatic semiconductor trimming and forming equipment clamping mechanism Download PDFInfo
- Publication number
- CN203863756U CN203863756U CN201420091994.8U CN201420091994U CN203863756U CN 203863756 U CN203863756 U CN 203863756U CN 201420091994 U CN201420091994 U CN 201420091994U CN 203863756 U CN203863756 U CN 203863756U
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- Prior art keywords
- die
- plate
- locked mode
- clamping
- equipment
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- Expired - Fee Related
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Abstract
The utility model discloses an automatic semiconductor trimming and forming equipment clamping mechanism. The automatic semiconductor trimming and forming equipment clamping mechanism comprises clamping die plates, a punching movable plate and a die upper die plate, wherein the clamping die plates are arranged on two sides under the punching movable plate respectively and are fixed to the punching movable plate above the die upper die plate, and clamping air cylinders are installed on two sides above the punching movable plate respectively and drive the clamping die plates to lift through clamping pullers to clamp the die upper die plate. The automatic semiconductor trimming and forming equipment clamping mechanism can guarantee that a die will not deviate in the die trimming process when equipment operates normally, and is small in punching noise, high in production efficiency and capable of largely prolonging the service life of the die. The equipment is suitable for high-speed punching equipment and high in tolerance value of the allowed punching speed of the equipment. Meanwhile, the novel mechanism is good in clamping effect, convenient to operate, safe, reliable, and high in consistency of punched products.
Description
Technical field
The utility model relates to the automatic Trim Molding apparatus field of semiconductor, is specifically related to the automatic Trim Molding device lock of a kind of semiconductor mold mechanism.
Background technology
In the automatic Trim Molding equipment of semiconductor, upper/lower die all has clamping mechanism separately, can be partially not moving at normal mould in service with assurance equipment, guarantee that the product processing meets the requirements.When the fixing mould of traditional clamping mechanism is used; its center of effort's point is partial to wherein on one side with the movement of mould; cause mould bases easily to tilt or bending; when mold movement; meeting heavy wear mould bases, mould location is also inaccurate simultaneously, affects product quality; and the mould on mould bases is heavier, also larger on the impact of guide and product.During legacy equipment work, due to the movement of mould, when die-cut, noise is large; Die-cut homogeneity of product is out poor; Production efficiency is low; Life-span impact on mould is larger.Meanwhile legacy equipment allows the die-cut speed tolerance value of equipment low, is not suitable for high speed punch cutting equipment.
Utility model content
For the problems referred to above, the utility model aims to provide the automatic Trim Molding device lock of a kind of semiconductor mold mechanism.
For realizing this technical purpose; scheme of the present utility model is: the automatic Trim Molding device lock of a kind of semiconductor mold mechanism; comprise locked mode plate, die-cut portable plate, upper mould plate; described locked mode plate is separately positioned on both sides, die-cut portable plate below; locked mode plate is fixed on the die-cut portable plate of upper mould plate top; both sides, described die-cut portable plate top are separately installed with locked mode cylinder, and locked mode cylinder drives locked mode plate to promote by locked mode pull head, and upper mould plate is locked.
As preferably, both sides, described upper mould plate upper end are respectively arranged with locked groove.
As preferably, described locked mode plate is L-type structure, locked mode plate and the laminating of upper mould plate side, and locked mode plate engages with locked groove.
As preferably, the epimere notch of described locked groove is trapezium structure.
As preferably, the tail end of described locked mode plate is trapezium structure.
The beneficial effects of the utility model, when mould is cut muscle, energy assurance equipment can be partially not moving at normal mould in service, and die-cut noise is little, and production efficiency is high, can significantly improve the service life of mould; This equipment is applicable to high speed punch cutting equipment, and the tolerance value of the die-cut speed of permission equipment is high; Meanwhile, new mechanism locked mode is effective, easy to operate, safe and reliable, and die-cut homogeneity of product is out high.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the partial schematic diagram of locked mode plate of the present utility model.
The specific embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is described in further details.
Specific embodiment is as shown in Figure 1 the automatic Trim Molding device lock of a kind of semiconductor mold mechanism; comprise locked mode plate 2, die-cut portable plate 1, upper mould plate 3; described locked mode plate 2 is separately positioned on die-cut portable plate 1 both sides, below; locked mode plate 2 is fixed on the die-cut portable plate 1 of upper mould plate 3 tops; described die-cut portable plate 1 both sides, top are separately installed with locked mode cylinder 4; locked mode cylinder 4 drives locked mode plate 2 to promote by locked mode pull head 5, and locked mode plate 2 is locked in die-cut portable plate 1 below by upper mould plate 3.During use, mould can deflection wherein move on one side because of stressed, cause upper mould plate easily to tilt or bending, when mold movement, meeting heavy wear upper mould plate, upper mould plate location is also inaccurate simultaneously, affects product quality, and the mould on upper mould plate is heavier, also larger on the impact of guide and product.Install after locked mode cylinder, locked mode cylinder can closely couple together upper mould plate and die-cut portable plate, and when die-cut portable plate cuts, upper mould plate can keep original position not move.Due to the fixation of upper mould plate, this equipment is applicable to high speed punch cutting equipment, and the tolerance value of the die-cut speed of permission equipment is high; Meanwhile, new mechanism locked mode is effective, easy to operate, and die-cut homogeneity of product is out high.
For mould being stablized and pinned, described upper mould plate 3 both sides, upper end are respectively arranged with locked groove 6.Described locked mode plate 2 is L-type structure, locked mode plate 2 and the 3 side laminatings of upper mould plate, and locked mode plate 2 engages with locked groove 6.Rotation lock die drawing head, proceeds to locked mode plate in locked groove, starts locked mode cylinder, makes locked mode plate increase and firmly engages with locked groove upside, and upper mould plate is closely connected with die-cut portable plate.
In order to guarantee that locked mode plate is well engaged with locked groove, the epimere notch of described locked groove 6 is trapezium structure.The tail end of described locked mode plate 2 is trapezium structure.The easy abrasion deformation of rectangular configuration edge part can damage attaching parts simultaneously, and two trapezium structures are not easy to wear, also not fragile attaching parts.
The above; it is only preferred embodiment of the present utility model; not in order to limit the utility model, any trickle modification that every foundation technical spirit of the present utility model is done above embodiment, be equal to and replace and improve, within all should being included in the protection domain of technical solutions of the utility model.
Claims (5)
1. the automatic Trim Molding device lock of a semiconductor mold mechanism; comprise locked mode plate, die-cut portable plate, upper mould plate; described locked mode plate is separately positioned on both sides, die-cut portable plate below; locked mode plate is fixed on the die-cut portable plate of upper mould plate top; it is characterized in that: both sides, described die-cut portable plate top are separately installed with locked mode cylinder; locked mode cylinder drives locked mode plate to promote by locked mode pull head, and upper mould plate is locked.
2. the automatic Trim Molding device lock of a kind of semiconductor according to claim 1 mold mechanism, is characterized in that: both sides, described upper mould plate upper end are respectively arranged with locked groove.
3. the automatic Trim Molding device lock of a kind of semiconductor according to claim 2 mold mechanism, is characterized in that: described locked mode plate is L-type structure, locked mode plate and the laminating of upper mould plate side, and locked mode plate engages with locked groove.
4. the automatic Trim Molding device lock of a kind of semiconductor according to claim 2 mold mechanism, is characterized in that: the epimere notch of described locked groove is trapezium structure.
5. the automatic Trim Molding device lock of a kind of semiconductor according to claim 3 mold mechanism, is characterized in that: the tail end of described locked mode plate is trapezium structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420091994.8U CN203863756U (en) | 2014-02-28 | 2014-02-28 | Automatic semiconductor trimming and forming equipment clamping mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420091994.8U CN203863756U (en) | 2014-02-28 | 2014-02-28 | Automatic semiconductor trimming and forming equipment clamping mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203863756U true CN203863756U (en) | 2014-10-08 |
Family
ID=51644741
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420091994.8U Expired - Fee Related CN203863756U (en) | 2014-02-28 | 2014-02-28 | Automatic semiconductor trimming and forming equipment clamping mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203863756U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107160550A (en) * | 2017-07-14 | 2017-09-15 | 江苏汤辰机械装备制造股份有限公司 | A kind of easy-disassembling-assembling centrifugal mold |
| CN110421075A (en) * | 2019-09-03 | 2019-11-08 | 安徽擎天伟嘉装备制造有限公司 | A kind of quick clamping mechanism of bicker |
-
2014
- 2014-02-28 CN CN201420091994.8U patent/CN203863756U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107160550A (en) * | 2017-07-14 | 2017-09-15 | 江苏汤辰机械装备制造股份有限公司 | A kind of easy-disassembling-assembling centrifugal mold |
| CN110421075A (en) * | 2019-09-03 | 2019-11-08 | 安徽擎天伟嘉装备制造有限公司 | A kind of quick clamping mechanism of bicker |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141008 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |