CN203859137U - Device for cooling sintered solar silicon wafer - Google Patents
Device for cooling sintered solar silicon wafer Download PDFInfo
- Publication number
- CN203859137U CN203859137U CN201420261430.4U CN201420261430U CN203859137U CN 203859137 U CN203859137 U CN 203859137U CN 201420261430 U CN201420261430 U CN 201420261430U CN 203859137 U CN203859137 U CN 203859137U
- Authority
- CN
- China
- Prior art keywords
- shell
- housing
- cooling device
- speed governing
- solar silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 43
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 34
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 34
- 239000010703 silicon Substances 0.000 title claims abstract description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000005245 sintering Methods 0.000 claims description 21
- 235000012431 wafers Nutrition 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 3
- 238000004321 preservation Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 7
- 238000007664 blowing Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a cooling device which can cool a sintered solar silicon wafer and reduces the temperature of the sintered solar silicon wafer quickly and effectively till the temperature is within the optimal range of detection. The device comprises a housing, and the interior of the housing is hollow. The housing consists of a vertical segment, and a lateral segment which is bulged from the vertical segment and is communicated with the vertical segment from the top. The bottom of the housing is provided with a condensate outlet, and the lower part of the housing is provided with an air inlet. The housing is also provided with an exhaust port which is located on the bottom surface of the lateral segment of the housing. A flow-equalizing plate of the device covers the exhaust port, and a surface air cooler is laterally disposed in the vertical segment of the housing and located above the air inlet of the housing. A water inflow pipeline and a water return pipeline of the surface air cooler pass through the housing. A solenoid valve is disposed on the water inflow pipeline or the water return pipeline. A speed-regulating axial flow fan is disposed exactly above the surface air cooler. A temperature sensor is disposed at the top of the housing. A speed-regulating rotary knob and a temperature controller are disposed on an outer wall of the housing. The speed-regulating rotary knob is electrically connected with the speed-regulating axial flow fan. The temperature controller is electrically connected with the temperature sensor and the solenoid valve.
Description
Technical field
The utility model relates to a kind of cooling device after solar silicon wafers sintering in photovoltaic industry.
Background technology
Solar battery sheet main production raw material is silicon chip, makes semiconductor P-N joint on high-purity silicon chip, and typography section is printed on the metal pastes such as deployed silver, aluminium on silicon chip and forms grid line, carries out sintering, after sintering, will carry out performance test to silicon chip.Because the silicon temperature after sintering is higher, during test, the temperature of silicon chip need be reduced to 25 ± 2 ℃ of prescribed limits and just can carry out.
Existing method is the silicon chip after sintering to be placed on on conveyer belt, to carry out nature cooling or use axial flow blower to assist to enter after cooling simultaneously again and detect grading machine and test, as shown in Fig. 1,2.
The cooling time that traditional type of cooling needs is longer, and higher to surrounding enviroment temperature requirement, when surrounding enviroment temperature is subject to various factors to affect over a threshold value, can cause the silicon temperature that enters detection grading machine not in prescribed limit, cause testing result inaccurate, need do over again and heavily examine, operating efficiency is lower.
Utility model content
Goal of the invention of the present utility model is to provide a kind of silicon chip after sintering effectively can being cooled rapidly to the cooling device of its optimum detection temperature range, utilize cooling device of the present utility model, be conducive to improve the detection efficiency of silicon chip, and can reduce the impact of surrounding enviroment temperature on silicon chip detection efficiency.
The utility model is achieved through the following technical solutions its goal of the invention: the cooling device after a kind of solar silicon wafers sintering, it is characterized in that, described cooling device comprises shell, enclosure hollow, shell is by vertical section and protrude from described vertical section and form with the traversing section that described vertical section is communicated with from top;
The bottom of described shell is provided with condensation-water drain, bottom is provided with air inlet, on described shell, be also provided with exhaust outlet, described exhaust outlet is positioned on the bottom surface of described shell traversing section, it is positioned at for transmitting the top of the driving-belt of the silicon chip after sintering, so that cooling device blows to cold wind the silicon chip of its below, make silicon chip be cooled to rapidly optimum detection temperature range;
Described cooling device also comprises surface cooler, speed governing axial flow blower, temperature sensor, thermostat, speed governing knob, electromagnetically operated valve and homogenizing plate, homogenizing plate covers on described exhaust outlet, described surface cooler is horizontally installed on the vertical section inside of described shell, be positioned at the above air inlet top of shell, the inlet pipeline of surface cooler and water return pipeline pass described shell, described electromagnetically operated valve is arranged on described inlet pipeline or water return pipeline, described speed governing axial flow blower be arranged on described surface cooler directly over, for by extraneous air in shell described in described air inlet suction and blow to the top of described shell, described temperature sensor is arranged on the top of described shell, described speed governing knob and thermostat are arranged on the outer wall of described shell, speed governing knob is electrically connected to described speed governing axial flow blower, thermostat is electrically connected to described temperature sensor and described electromagnetically operated valve, the temperature signal that thermostat detects according to described temperature sensor passes in and out the cooling water inflow of described surface cooler by described solenoid control, make cooling device of the present utility model can realize the control of temperature and the speed of the cooling air that it is blown out simultaneously.
As to a kind of improvement of the present utility model, described cooling device can also comprise inferior high efficiency filter, described inferior high efficiency filter be horizontally set on described speed governing axial flow blower directly over.
Described enclosure is parallel to shell bottom surface and is provided with a water accumulating disc, makes outer casing bottom form double-layer drainage structure, and described condensation-water drain is communicated with the discharge structure of lower floor, between two-layer discharge structure, by drain elbow, is communicated with, and drain elbow middle part has U-shaped bending.Speed governing axial flow blower, when operation, can make enclosure form negative pressure, and the design of the utility model discharge structure, is conducive to make the condensed water of enclosure to be discharged smoothly.
The upper berth, bottom surface of described enclosure is lined with one layer of heat preservation layer, to prevent that the condensed water in extraneous air from collecting in the bottom of housing exterior.
Described air inlet place is provided with shutter, and the blade lean of described shutter upwards, so that air enters enclosure from above, prevents the dust suction enclosure of Near Ground.
With respect to prior art, the utlity model has following beneficial effect: 1) cooling device of the present utility model can be realized the cool preliminary treatment of required cold air of silicon chip, the utility model arranges surface cooler and for controlling the temperature sensor of the cooling water inflow of meter inlet-outlet cooler, thermostat and electromagnetically operated valve, speed governing axial flow blower is also set, not only wind speed is controlled but also temperature is adjustable to make the cooling air that blows out from cooling device of the present utility model, cooling device of the present utility model also arranges homogenizing plate at exhaust outlet place, make cooling air blow to uniformly the silicon chip after the sintering transmitting its below, can effectively the silicon chip after sintering be cooled rapidly to its optimum detection temperature range, and it is little affected by surrounding enviroment temperature,
2) cooling air blowing out through cooling device of the present utility model filters through inferior high efficiency filter, can prevent that the impurity such as airborne dust from impacting the conversion efficiency of silicon chip.
Accompanying drawing explanation
Fig. 1 is that in prior art, the silicon chip after sintering is placed on schematic diagram when naturally cooling on conveyer belt;
Fig. 2 is that in prior art, the silicon chip after sintering is used axial flow blower to assist schematic diagram when cooling;
Fig. 3 is the structural representation of the cooling device after the utility model solar silicon wafers sintering.
Embodiment
As shown in Figure 1, the cooling device after solar silicon wafers sintering of the present utility model comprises shell 1, shell 1 inner hollow, and shell 1 is comprised of vertical section and the traversing section that protrudes from vertical section and be communicated with vertical section from top, makes shell 1 integral body be " 7 " font.The bottom of shell 1 is provided with condensation-water drain 8, bottom is provided with air inlet 12, air inlet 12 places are provided with shutter, and the blade lean of shutter upwards, to make air enter shell 1 inside from above, prevent dust suction shell 1 inside of Near Ground, on shell 1, be also provided with exhaust outlet, exhaust outlet is positioned on the bottom surface of shell 1 traversing section, homogenizing plate 15 covers on exhaust outlet, so that the cooling air blowing out from cooling device can blow on the silicon chip 18 after the sintering that thereunder conveyer belt transmits uniformly.Shell 1 inside is parallel to shell bottom surface and is provided with a water accumulating disc 11, make outer casing bottom form double-layer drainage structure, the condensation-water drain 8 of outer casing bottom is communicated with the discharge structure of lower floor, between two-layer discharge structure, by drain elbow 9, is communicated with, and drain elbow 9 middle parts have U-shaped bending.Shell 1 inside is provided with speed governing axial flow blower 13(and will talks about below), for in the air inlet suction shell from shell 11 by extraneous air and blow to the top of shell 1, and speed governing axial flow blower 13 is when operation, can make the inner negative pressure that forms of shell 1, the design of double-layer drainage structure, is conducive to make the condensed water of shell 1 inside to discharge smoothly shell 1.On the bottom surface of shell 1 inside, going back place mat has one layer of heat preservation layer 10, for preventing that the condensed water of extraneous air from collecting in the bottom of housing exterior.
Cooling device also comprises surface cooler 4, speed governing axial flow blower 13, temperature sensor 2, thermostat 17, speed governing knob 16, electromagnetically operated valve 5 and homogenizing plate 12 and inferior high efficiency filter 14, surface cooler 4 is horizontally installed on the vertical section inside of shell 1, be positioned at the enterprising gas port of shell 1 12 tops, inlet pipeline 7 and the water return pipeline 6 of surface cooler 4 pass shell 1, electromagnetically operated valve 5 is arranged on water return pipeline 6, speed governing axial flow blower 13 be arranged on surface cooler 4 directly over, speed governing axial flow blower 13 is by outside air suction shell 1 inside, enter air in shell 1 and the cooling water in surface cooler 4 and carry out exchange heat, air is cooled to lower the temperature and becomes cold air, inferior high efficiency filter 14 be horizontally set on described speed governing axial flow blower directly over, to filter blowing to the cooling air at shell 1 top, inferior high efficiency filter 14 is frame inferior high efficiency filter 14, edge is fixed in shell 1 by filter pressing plate 3, temperature sensor 2 is arranged on the top of shell 1, speed governing knob 16 and thermostat 17 are arranged on the outer wall of shell 1, speed governing knob 16 is electrically connected to speed governing axial flow blower 13, to control the speed of the cooling air that cooling device of the present utility model blows out, thermostat 17 is electrically connected to temperature sensor 2 and electromagnetically operated valve 5, the temperature signal that thermostat 17 detects according to temperature sensor 2 is controlled the cooling water inflow of meter inlet-outlet cooler 4 by electromagnetically operated valve 5, to control the temperature of the cooling air that cooling device of the present utility model blows out.
Claims (5)
1. the cooling device after solar silicon wafers sintering, comprises shell, it is characterized in that, described enclosure hollow, and shell is by vertical section and protrude from described vertical section and form with the traversing section that described vertical section is communicated with from top;
The bottom of described shell is provided with condensation-water drain, and bottom is provided with air inlet, is also provided with exhaust outlet on described shell, and described exhaust outlet is positioned on the bottom surface of described shell traversing section;
Described cooling device also comprises surface cooler, speed governing axial flow blower, temperature sensor, thermostat, speed governing knob, electromagnetically operated valve and homogenizing plate, homogenizing plate covers on described exhaust outlet, described surface cooler is horizontally installed on the vertical section inside of described shell, be positioned at the above air inlet top of shell, the inlet pipeline of surface cooler and water return pipeline pass described shell, described electromagnetically operated valve is arranged on described inlet pipeline or water return pipeline, described speed governing axial flow blower be arranged on described surface cooler directly over, for by extraneous air in shell described in described air inlet suction and blow to the top of described shell, described temperature sensor is arranged on the top of described shell, described speed governing knob and thermostat are arranged on the outer wall of described shell, speed governing knob is electrically connected to described speed governing axial flow blower, thermostat is electrically connected to described temperature sensor and described electromagnetically operated valve, the temperature signal that thermostat detects according to described temperature sensor passes in and out the cooling water inflow of described surface cooler by described solenoid control.
2. the cooling device after solar silicon wafers sintering according to claim 1, is characterized in that, described cooling device also comprises inferior high efficiency filter, described inferior high efficiency filter be horizontally set on described speed governing axial flow blower directly over.
3. the cooling device after solar silicon wafers sintering according to claim 2, it is characterized in that, described enclosure is parallel to shell bottom surface and is provided with a water accumulating disc, make outer casing bottom form double-layer drainage structure, described condensation-water drain is communicated with the discharge structure of lower floor, between two-layer discharge structure, by drain elbow, be communicated with, drain elbow middle part has U-shaped bending.
4. the cooling device after solar silicon wafers sintering according to claim 3, is characterized in that, the upper berth, bottom surface of described enclosure is lined with one layer of heat preservation layer.
5. according to the cooling device after the solar silicon wafers sintering described in claim 2 or 4, it is characterized in that, described air inlet place is provided with shutter, and the blade lean of described shutter upwards.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420261430.4U CN203859137U (en) | 2014-05-21 | 2014-05-21 | Device for cooling sintered solar silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420261430.4U CN203859137U (en) | 2014-05-21 | 2014-05-21 | Device for cooling sintered solar silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203859137U true CN203859137U (en) | 2014-10-01 |
Family
ID=51608978
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420261430.4U Expired - Lifetime CN203859137U (en) | 2014-05-21 | 2014-05-21 | Device for cooling sintered solar silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203859137U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072797A (en) * | 2015-08-31 | 2015-11-18 | 中广核达胜加速器技术有限公司 | Electronic accelerator internal cooling device |
| CN112746330A (en) * | 2020-12-29 | 2021-05-04 | 有研半导体材料有限公司 | Cooling device and method for heat treatment process of eliminating oxygen donor of silicon wafer |
-
2014
- 2014-05-21 CN CN201420261430.4U patent/CN203859137U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105072797A (en) * | 2015-08-31 | 2015-11-18 | 中广核达胜加速器技术有限公司 | Electronic accelerator internal cooling device |
| CN112746330A (en) * | 2020-12-29 | 2021-05-04 | 有研半导体材料有限公司 | Cooling device and method for heat treatment process of eliminating oxygen donor of silicon wafer |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106482573B (en) | A kind of blower fan of cooling tower Optimal Control System and method | |
| CN206282217U (en) | Computer cabinet with cooling dedusting function | |
| CN209471386U (en) | A kind of automated computer thermostat | |
| CN209230114U (en) | A kind of glass processing cooling device | |
| CN203859137U (en) | Device for cooling sintered solar silicon wafer | |
| CN106123277A (en) | Automatically the device of moisture in air is collected | |
| CN207926426U (en) | A kind of Novel cabinet type frequency converter | |
| CN101858638A (en) | Condensed water temperature control device of window type air conditioner | |
| CN212910523U (en) | Electric automation control's heat dissipation formula regulator cubicle | |
| CN101608819B (en) | Energy-saving central air conditioner | |
| CN208269689U (en) | A kind of square counter flow cooling tower | |
| CN208518921U (en) | One kind controlling cooling water system based on frequency-variable controller | |
| CN110714883A (en) | IP23 wind driven generator adopting direct cooling heat dissipation device | |
| CN206190337U (en) | Little quick -witted condenser and host computer condenser combination formula condensing system based on arrange side by side | |
| CN206269575U (en) | A kind of heat sink of ceramic sintering process goods of furniture for display rather than for use | |
| CN206741336U (en) | A kind of greenhouse cooling device | |
| CN206056331U (en) | A kind of casting cooling water filtration tank | |
| CN206042637U (en) | Dc -to -ac converter heat abstractor of dustproof function in area | |
| CN212806623U (en) | Energy-saving cooling tower | |
| CN211425941U (en) | High-temperature water vapor sampling device | |
| CN212179413U (en) | Energy-saving drying-machine | |
| CN204739684U (en) | Capacitor chamber positive pressure aeration cooling of transformer substation structure | |
| CN209658718U (en) | Graphene heat dissipation type refrigerated dehumidification device | |
| CN201575540U (en) | Central air-conditioning capable of realizing energy saving | |
| CN213395648U (en) | Factory building air cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20141001 |