CN203850057U - Improved wire bundling device - Google Patents

Improved wire bundling device Download PDF

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Publication number
CN203850057U
CN203850057U CN201420217688.4U CN201420217688U CN203850057U CN 203850057 U CN203850057 U CN 203850057U CN 201420217688 U CN201420217688 U CN 201420217688U CN 203850057 U CN203850057 U CN 203850057U
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CN
China
Prior art keywords
boundling
bundling
holes
dish
bundle holes
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Expired - Fee Related
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CN201420217688.4U
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Chinese (zh)
Inventor
杨勇
欧敏
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Individual
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Individual
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Priority to CN201420217688.4U priority Critical patent/CN203850057U/en
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Publication of CN203850057U publication Critical patent/CN203850057U/en
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Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses an improved wire bundling device and belongs to the cable production equipment field. The improved wire bundling device is mainly used for improving bundling efficiency and bundling effect. The improved wire bundling device includes a first bundling disc with a first shaft hole formed at the center, and a second wire combining hole which is formed at a wire outgoing direction and is corresponding to the first shaft hole; two sides of the first bundling disc are fixed on connecting rods; the first bundling disc is provided with primary inner-layer bundling holes, primary middle-layer bundling holes and primary outer-layer bundling holes which are uniformly distributed on the circumference of a circle with R1 adopted as radius, the circumference of a circle with R2 adopted as radius and the circumference of a circle with R3 adopted as radius respectively; a second bundling disc is arranged between the first bundling disc and the second wire combining hole; two sides of the second bundling disc are also fixed on the connection rods; a first wire combining hole corresponding to and coaxial with the first shaft hole is formed at the center of the second bundling disc; the second bundling disc is provided with secondary middle-layer bundling holes corresponding to the primary middle-layer bundling holes, and secondary outer-layer bundling holes corresponding to the primary outer-layer bundling holes, wherein the secondary middle-layer bundling holes and the secondary outer-layer bundling holes are distributed on the circumference of a circle with R4 adopted as radius and the circumference of a circle with R5 adopted as radius respectively; and R1<R4<R2< R5<R3.

Description

A kind of improved line set bundle device
Technical field
The utility model belongs to cable production equipment field, relates to a kind of boundling equipment of cable conductor, is the beaming device that one is more suitable for the cable cores such as copper aluminium (aluminium) twisted wire specifically.
Background technology
In cable conductor boundling process, wire boundling is the important procedure that ensures cable boundling quality.In prior art, for the collecting compacting stage of single or multiple lift wire, be all generally the wire strand boundling processed that first completes internal layer, then on the bunched cable having completed, complete successively the boundling of outer layer conductor.Chinese patent CN201570319U document (Granted publication day is on September 1st, 2010) discloses a kind of " the strand device processed of steel reinforced aluminium conductor ", boundling process in the document mainly completes by rotating disk and wire parallel module, can find out by the accompanying drawing in the document, on the first rotating disk radius circumference identical with the 5th rotating disk, 12 holes are all set, second and third and four rotating disks are also provided with 12 and cross wire carrier, therefore for the strand system of steel reinforced aluminium conductor, this equipment is the strand system that can complete inner core and 12 wires.When but this equipment is used for boundling, wire per pass has been merely able to the boundling of a layer conductor, therefore its boundling efficiency is on the low side, if 6 holes and 12 holes are set on a rotating disk for simple raising boundling efficiency, then directly complete the boundling of two layer conductors by wire parallel module simultaneously, this boundling method two layer conductors before by wire parallel module are to merge boundling, make that boundling is not compact, boundling effect is poor.
Utility model content
For above shortcomings in prior art, the utility model provides a kind of line set bundle device that not only can improve boundling efficiency but also can improve boundling effect.
For realizing above-mentioned technical purpose, the technical solution adopted in the utility model is as follows:
A kind of improved line set bundle device, comprise the second doubling hole corresponding with the first axis hole that center is provided with the first boundling dish of the first axis hole and arranges on outlet direction, the first boundling dish both sides are fixed on connecting rod, described the first boundling dish is with R1, R2 and R3 are respectively equipped with equally distributed elementary internal layer bundle holes on the circumference of radius, elementary middle level bundle holes and elementary outer bundle holes, wherein R1<R2<R3, between the first boundling dish and the second doubling hole, also has the second boundling dish, these the second boundling dish both sides are fixed on connecting rod equally, center is provided with the coaxial first doubling hole corresponding with the first axis hole, described the second boundling dish is being respectively equipped with the secondary middle level bundle holes corresponding with elementary middle level bundle holes taking R4 and R5 on the circumference of radius, and the secondary outer bundle holes corresponding with elementary outer bundle holes, wherein R4 and R5 meet R1< R4<R2< R5<R3.
Adopt the utility model of technique scheme, by adding a second boundling dish between the first boundling dish in end of incoming cables and the second doubling hole of leading-out terminal, enter the first doubling hole by the inner core of the first axis hole like this, enter into equally the first doubling hole of the second boundling dish by the wire of elementary internal layer bundle holes, enter into the secondary middle level bundle holes of the second boundling dish by the wire of elementary middle level bundle holes, enter into the secondary outer bundle holes of the second boundling dish by the wire of elementary outer bundle holes, finally the inner core by the second boundling dish and wire all enter into the second doubling hole and carry out final boundling.Because the wire by elementary internal layer bundle holes first completes boundling for the first time with inner core between the first boundling dish and the second boundling dish, wire by elementary middle level bundle holes and elementary outer bundle holes completes final boundling again with by the wire in the first doubling hole, therefore this method completes the needs process that repeatedly boundling completes by twice parallel boundling, improve boundling efficiency, and second boundling dish as a new transition fulcrum, multi-layer conductor leads is from the first boundling dish to the second boundling dish, all inwardly converge and make wire boundling compacter to the second doubling hole again, improve technique effect.
Furthermore, elementary internal layer bundle holes, elementary middle level bundle holes and elementary outer bundle holes are respectively equipped with 6,12 and 18 bundle holes, and secondary middle level bundle holes and secondary outer bundle holes are respectively equipped with 12 and 18 bundle holes.Such restriction is just applicable to twisted wire standard, and when work, the wire in 6 holes and inner core carry out final boundling with the wire in 12 holes and 18 holes after boundling for the first time again.
The utility model compared to existing technology, owing to increasing a new boundling dish, and supplements and improves corresponding bundle holes, makes this beaming device can complete boundling process twice simultaneously, has also ensured boundling effect simultaneously.
Brief description of the drawings
Fig. 1 is plan structure schematic diagram of the present utility model;
Fig. 2 is the first boundling dish and the second boundling dish Structure Comparison figure.
Embodiment
In order to make those skilled in the art understand better the utility model, below in conjunction with drawings and Examples, technical solutions of the utility model are further illustrated.
As shown in Figure 1-2, a kind of improved line set bundle device, comprise the second doubling hole 3 corresponding with the first axis hole 11 that center is provided with the first boundling dish 1 of the first axis hole 11 and arranges on outlet direction, the first boundling dish 1 both sides are fixed on connecting rod 4, described the first boundling dish 1 is with R1, R2 and R3 are respectively equipped with equally distributed elementary internal layer bundle holes 12 on the circumference of radius, elementary middle level bundle holes 13 and elementary outer bundle holes 14, wherein R1<R2<R3, elementary internal layer bundle holes 12 has 6 bundle holes, elementary middle level bundle holes 13 has 12 bundle holes, elementary outer bundle holes 14 has 18 bundle holes.
Between the first boundling dish 1 and the second doubling hole 3, also has the second boundling dish 2, these the second boundling dish 2 both sides are fixed on connecting rod 4 equally, center is provided with and the first corresponding the first coaxial doubling hole 21 of axis hole 11, described the second boundling dish 2 is being respectively equipped with the secondary middle level bundle holes 22 corresponding with elementary middle level bundle holes 13 taking R4 and R5 on the circumference of radius, and the secondary outer bundle holes 23 corresponding with elementary outer bundle holes 14, be that secondary middle level bundle holes 22 is provided with 12 bundle holes, secondary outer bundle holes 23 is established 18 bundle holes, wherein R4 and R5 meet R1<R4<R2< R5<R3.
The operation principle of this line set bundle device under brief description: first in end of incoming cables, inner core by the first axis hole 11, the first doubling hole 21, finally arrives the second doubling hole 3 successively; 6 inner conductors enter into the first doubling hole 21 by after elementary internal layer bundle holes 12 and inner core boundling; 22,18 outer layer conductors of secondary middle level bundle holes that 12 middle layer conductors enter into the second boundling dish 2 by elementary middle level bundle holes 13 enter into the secondary outer bundle holes 23 of the second boundling dish 2 by the wire of elementary outer bundle holes 14; Finally the inner core by the second boundling dish 2 and wire all enter into the second doubling hole 3 and carry out final boundling.
Because 6 wires by elementary internal layer bundle holes 12 first complete boundling for the first time with inner core between the first boundling dish 1 and the second boundling dish 2, complete boundling for the second time with the wire (comprising inner core) by the first doubling hole 21 again by 12 wires of elementary middle level bundle holes 13 and 18 wires of elementary outer bundle holes 14, therefore this process that need to complete several times boundling completes by twice parallel boundling, improve boundling efficiency, and second boundling dish 2 as a new transition fulcrum, multi-layer conductor leads is from the first boundling dish 1 to second boundling dish 2, all inwardly converge gradually and make wire boundling compacter to the second doubling hole 3 again.
It should be noted that, the first doubling hole 21 is furnished with the second doubling hole 3 the boundling circle mould conforming to the stranded external diameter of Bundling conducting wire, make inner core and 6 smooth roundings of inner conductor after the first doubling hole 21 boundlings tight, without jumping a burst throwing silk phenomenon, inner core after the second doubling hole 3 boundlings, 6 inner conductors, 12 middle layer conductors and 18 same smooth roundings of outer layer conductor are tight, without jumping a burst throwing silk phenomenon, this device equally can be for the wire boundling that there is no inner core simultaneously, now the first axis hole 11 does not just have inner core to pass through, can also be only to the two-layer wire boundling of internal layer and middle level.
The utility model is owing to increasing by a second new boundling dish 2, thus make interior, in, the outer three layer conductors boundling that can walk abreast twice, improved boundling efficiency, simultaneously, when wire boundling, all inwardly converged boundling, this makes boundling compacter, has improved boundling effect.
The improved line set bundle device of one above the utility model being provided is described in detail.The explanation of specific embodiment is just for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection range of the utility model claim.

Claims (2)

1. an improved line set bundle device, comprise the second doubling hole corresponding with the first axis hole that center is provided with the first boundling dish of the first axis hole and arranges on outlet direction, the first boundling dish both sides are fixed on connecting rod, described the first boundling dish is with R1, R2 and R3 are respectively equipped with equally distributed elementary internal layer bundle holes on the circumference of radius, elementary middle level bundle holes and elementary outer bundle holes, wherein R1<R2<R3, it is characterized in that, between the first boundling dish and the second doubling hole, also has the second boundling dish, these the second boundling dish both sides are fixed on connecting rod equally, center is provided with the coaxial first doubling hole corresponding with the first axis hole, described the second boundling dish is being respectively equipped with the secondary middle level bundle holes corresponding with elementary middle level bundle holes taking R4 and R5 on the circumference of radius, and the secondary outer bundle holes corresponding with elementary outer bundle holes, wherein R4 and R5 meet R1< R4<R2< R5<R3.
2. the improved line set bundle device of one according to claim 1, it is characterized in that, elementary internal layer bundle holes, elementary middle level bundle holes and elementary outer bundle holes are respectively equipped with 6,12 and 18 bundle holes, and secondary middle level bundle holes and secondary outer bundle holes are respectively equipped with 12 and 18 bundle holes.
CN201420217688.4U 2014-04-30 2014-04-30 Improved wire bundling device Expired - Fee Related CN203850057U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420217688.4U CN203850057U (en) 2014-04-30 2014-04-30 Improved wire bundling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420217688.4U CN203850057U (en) 2014-04-30 2014-04-30 Improved wire bundling device

Publications (1)

Publication Number Publication Date
CN203850057U true CN203850057U (en) 2014-09-24

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CN201420217688.4U Expired - Fee Related CN203850057U (en) 2014-04-30 2014-04-30 Improved wire bundling device

Country Status (1)

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CN (1) CN203850057U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112346183A (en) * 2020-10-21 2021-02-09 中策联合科技有限公司 Secondary doubling device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112346183A (en) * 2020-10-21 2021-02-09 中策联合科技有限公司 Secondary doubling device
CN112346183B (en) * 2020-10-21 2023-09-12 中策联合科技有限公司 Secondary doubling device

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140924

Termination date: 20150430

EXPY Termination of patent right or utility model