CN203826348U - Wafer temperature control device - Google Patents
Wafer temperature control device Download PDFInfo
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- CN203826348U CN203826348U CN201420237945.0U CN201420237945U CN203826348U CN 203826348 U CN203826348 U CN 203826348U CN 201420237945 U CN201420237945 U CN 201420237945U CN 203826348 U CN203826348 U CN 203826348U
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- wafer
- temperature
- supervising device
- temperature sensor
- wafer temperature
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Abstract
The utility model discloses a wafer temperature control device, at least comprising a temperature sensor, a clamp device positioned on the outside of the temperature sensor and a step controller which is connected to the clamp device and is used for controlling the temperature sensor. The wafer temperature control device can flexibly and dynamically monitor the temperature distribution of the whole wafer to be detected on real time by moving one temperature controller, can return the monitor result back to the system for regulating temperature control in the meantime and greatly increasing the uniformity of the temperature in the wafer, and can improve the yield of the wafer.
Description
Technical field
The utility model relates to a kind of semiconductor detector, particularly relates to a kind of wafer temperature supervising device.
Background technology
Temperature be the most common in semiconductor production be also very important physical index, therefore significant to the temperature detection in semiconductor production process.Temperature sensor (temperature sensor) refers to the transducer that can experience temperature and convert usable output signal to.Temperature sensor is the core of temperature measuring instrument, various in style, by metering system, can be divided into contact and contactless two large classes, according to sensor material and electron component characteristic, is divided into thermal resistance and thermocouple two classes.Conventional temperature sensor is fibre optic temperature sensor at present, compares with conventional temperature sensor, and fibre optic temperature sensor has the advantages such as operating frequency is wide, dynamic range is large, anti-electromagnetic interference capability is strong.Fibre optic temperature sensor utilizes the spectrum of part material absorbing to vary with temperature and the principle that changes, analyzes the spectra real time temperature of Optical Fiber Transmission.Fibre optic temperature sensor adopts macromolecule temperature sensing material a kind of and that optical fibre refractivity matches to be coated in two outside of fiber that are welded together, making luminous energy input this reflecting surface by an optical fiber goes out another root optical fiber and exports, due to this Novel temperature-sensitive material temperature influence, refractive index changes, and therefore luminous power and the temperature of output are functional relation.Its physical essence is to utilize the characteristic parameter of the light wave transmitting in optical fiber, as amplitude, phase place, polarization state, wavelength and pattern etc., and environmental factor to external world, as temperature, pressure, radiation etc. have sensitivity characteristic, belong to contactless temperature-measuring.
The principle that detects wafer temperature in prior art is as follows, 1～7 stationary monitoring point is set in the bottom of wafer to be measured, as shown in Figures 1 and 2, in the present embodiment, stationary monitoring point is set as 6, be arranged in successively on the radial direction of wafer 1 to be measured, 6 temperature sensors 2 are arranged at respectively to the stationary monitoring point place setting, described 6 temperature sensor 2 other ends are connected in receiver, receiver collects 6 data, then by peripheral equipment control wafer 1 to be measured, around its center of circle, rotate, while receiver image data, wafer 1 to be measured completes the rotation of a week, receiver completes the collection of data.Being illustrated in figure 3 one group of data that receiver receives, is the schematic diagram of the line scan that distributes on temperature diameter line, is shown as a Temperature Distribution on diameter wafer d line to be measured in figure, and this temperature value generally characterizes by resistance R.Due to temperature sensor 2 monitorings are 6 fixing points, so the data that receive on radial direction are the set of independent data one by one, the image obtaining from the temperature control system based on RS485 bus is the contour map with obvious differentiation in different regions, is illustrated in figure 4 the schematic diagram of the full sheet contour of temperature distribution contour map.The back segment of preparing at semiconductor is distinguished in the CP test of non-defective unit, also can obtain affecting the ring grain figure of yield.This monitoring result is larger tests for various chip test systems, and obviously tool is incomprehensive as the result of whole wafer temperature monitoring to using Monitoring Data that the sampling of 6 monitoring points draws, there is very large error, the Temperature Distribution situation that can not reflect strictly according to the facts wafer 1 to be measured, the monitoring result of this contour map or ring grain figure is very indiscernible for the data handling system with certain range ability simultaneously, and in actual application process, error is large, operability is not good.
Therefore, the distribution situation of temperature on reflection wafer 1 to be measured comprehensively, strictly according to the facts how, and the temperature data monitoring is fed back to temperature control system, do further adjustment to realize uniformity in high wafer temperature sheet, improving wafer yield is one of those skilled in the art's problem demanding prompt solution.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of wafer temperature supervising device, for solving the problems such as prior art temperature detection error is large, operability is poor.
For achieving the above object and other relevant objects, the utility model provides a kind of wafer temperature supervising device, described wafer temperature supervising device at least comprises: temperature sensor, is fixed on the clamping device in described temperature sensor outside and the step-by-step controller moving for controlling described temperature sensor that is connected in described clamping device.
Preferably, described temperature sensor comprises the fibre-optical probe close to wafer to be measured bottom, is sheathed on the protective casing on described fibre-optical probe top, is connected in the connecting line of described protective casing lower end.
More preferably, described fibre-optical probe comprises the optical fiber of signal transmission and is coated on the fluorescence coating of fiber end face.
More preferably, the material of described protective casing is glass.
Preferably, described temperature sensor is connected in receiver.
Preferably, described wafer temperature supervising device is done straight line and is come and gone translation.
More preferably, the distance of the round translation of described straight line is brilliant radius of a circle to be measured.
As mentioned above, wafer temperature supervising device of the present utility model, has following beneficial effect:
Wafer temperature supervising device of the present utility model by a mobile temperature sensor realize in real time, the Temperature Distribution of flexible, the whole wafer to be measured of dynamic monitoring, monitoring result is fed back to system simultaneously, being used for adjusting temperature controls, temperature homogeneity in wafer is improved greatly, improve the yield of wafer simultaneously.
Accompanying drawing explanation
Fig. 1 is shown as monitoring temperature principle schematic top plan view of the prior art.
Fig. 2 is shown as monitoring temperature principle schematic side view of the prior art.
Fig. 3 is shown as the schematic diagram of the line scan that distributes on temperature diameter line in prior art.
Fig. 4 is shown as the schematic diagram of the full sheet contour of temperature distribution contour map in prior art.
Fig. 5 is shown as wafer temperature supervising device schematic diagram of the present utility model.
Fig. 6 is shown as the operation principle schematic diagram of wafer temperature supervising device of the present utility model.
Element numbers explanation
1 wafer to be measured
2 temperature sensors
3 wafer temperature supervising devices
31 temperature sensors
311 fibre-optical probes
312 protective casings
313 connecting lines
32 clamping devices
33 step-by-step controllers
34 receivers
4 wafers to be measured
V
1wafer rotary speed
V
2the point-to-point speed of wafer temperature supervising device
T wafer temperature
D brilliant diameter of a circle to be measured
R brilliant radius of a circle to be measured
Embodiment
By specific instantiation, execution mode of the present utility model is described below, those skilled in the art can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.The utility model can also be implemented or be applied by other different embodiment, and the every details in this specification also can be based on different viewpoints and application, carries out various modifications or change not deviating under spirit of the present utility model.
Refer to Fig. 5 and Fig. 6.It should be noted that, the diagram providing in the present embodiment only illustrates basic conception of the present utility model in a schematic way, satisfy and only show with assembly relevant in the utility model in graphic but not component count, shape and size drafting while implementing according to reality, during its actual enforcement, kenel, quantity and the ratio of each assembly can be a kind of random change, and its assembly layout kenel also may be more complicated.
As shown in Figures 5 and 6, the utility model provides a kind of wafer temperature supervising device, and described wafer temperature supervising device at least comprises:
Temperature sensor 31, clamping device 32 and step-by-step controller 33.
Described temperature sensor 31 is connected in receiver 34.Described temperature sensor 31 can be that in prior art, any one meets the temperature sensor that monitoring requires, and in the present embodiment, is preferably optical-fiber fluorescent probe, and described temperature sensor 31 comprises the fibre-optical probe 311 close to wafer to be measured 4 bottoms; Be sheathed on the protective casing 312 on described fibre-optical probe top; Be connected in the connecting line 313 of described protective casing 312 lower ends.
Described fibre-optical probe 311 comprises the optical fiber of signal transmission and is coated on the fluorescence coating of fiber end face, it utilizes the irradiative characteristic of material of fluorescence, detect the temperature of light-emitting zone, fluorescent material is conventionally when being subject to ultraviolet ray or ultrared stimulation, just there will be luminous situation, optical parameter and the temperature of launching have positive connection, therefore can carry out probe temperature by fluorescence intensity.The light signal of the reflection monitor temperature that described temperature sensor 31 reception fluorescent materials send, and by optic path to receiver 34, via control system, the light signal collecting is converted to the signal of telecommunication and carries out signal processing again, obtain monitoring result intuitively, monitoring result is fed back, adjusted to obtain desirable monitoring result simultaneously.
The protective casing 312 that is sheathed on described fibre-optical probe 311 tops, the material of described protective casing 312 can be any one in the materials such as glass, silica gel, polytetrafluoroethylene, in the present embodiment, the material of described protective casing 312 is glass.
Be connected in the connecting line 313 of described protective casing 312 lower ends, described connecting line 313 is for carrying out outer protection to signal transmission line.
The outside of described temperature sensor 31 is fixed with clamping device 32,, described clamping device 32 is also connected with the step-by-step controller 33 moving for controlling described temperature sensor 31.As shown in Figure 5, described clamping device 32 is fixed on the outside of described connecting line 313, and described step-by-step controller 33 is controlled described clamping device 32 and driven described connecting line 313, described protective casing 312 and described fibre-optical probe 311 to move together.
Described wafer temperature supervising device 3 is done straight line and is come and gone translation, and it is in the radius region of wafer 4 to be measured that described straight line comes and goes range of translation, and described straight line comes and goes the speed V of translation
2be not more than 10cm/s, in the present embodiment, the point-to-point speed of described wafer temperature supervising device 3 is set as 5cm/s.
The operation principle of above-mentioned wafer temperature supervising device 3 is as follows:
As shown in Figure 6, described wafer temperature supervising device 3 is installed on the below of wafer 4 to be measured, in the present embodiment, by the start position setting of described wafer temperature supervising device 3 in the vertical lower of the right side of wafer 4 to be measured round edge, enabling signal treatment system, supervising device and the power set that rotate for controlling described wafer to be measured 4, now wafer temperature supervisory control system starts wafer temperature T to monitor.Described wafer to be measured 4 around the center of circle with speed V
1slow circumvolve, the center of circle direction translation of described wafer temperature supervising device 3 along the radius r of described wafer 4 to be measured to described wafer 4 to be measured, the Shi Yuan road, below, the center of circle that moves to described wafer to be measured 4 is returned, and its movement locus is that the straight line within the scope of wafer 4 radius r to be measured comes and goes translation.For the accuracy of monitoring result, the point-to-point speed V of described wafer temperature supervising device 3
2be not more than 10cm/s, in the present embodiment, point-to-point speed V
2be set as 5cm/s.Each point temperature information in translation process on wafer transfers to described receiver 34 by described temperature sensor 31, by described receiver 34, carries out data processing.
Cooperation due to the rotation of described wafer 4 to be measured and the translational motion of described wafer temperature supervising device 3, the monitoring range of described wafer temperature supervising device 3 covers whole described wafer 4 to be measured, monitoring result is continually varying value, rather than a plurality of independent datas, can be in real time, the Temperature Distribution situation flexibly, described in dynamic reflection on wafer 4 to be measured.Further, whistle control system, according to the feedback of the monitoring result of Real-time Collection, is adjusted heater, improves the Temperature Distribution situation of described wafer to be measured 4, greatly improves the interior uniformity of sheet of described wafer to be measured 4.
In sum, the utility model provides a kind of wafer temperature supervising device 3, described wafer temperature supervising device 3 at least comprises: temperature sensor, is fixed on the clamping device in described temperature sensor outside and the step-by-step controller moving for controlling described temperature sensor that is connected in described clamping device.Wafer temperature supervising device of the present utility model comes and goes translational motion by doing straight line within the scope of being controlled at of step-by-step controller wafer radius to be measured, and coordinates the rotation of wafer to be measured, realizes real-time, flexible, the dynamic temperature monitoring of whole wafer scope to be measured; Coordinate control system to adjust firing equipment simultaneously the temperature of wafer to be measured is controlled, realize the interior temperature homogeneity of higher wafer greatly to improve wafer yield.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (7)
1. a wafer temperature supervising device, it is characterized in that, described wafer temperature supervising device at least comprises: temperature sensor, is fixed on the clamping device in described temperature sensor outside and the step-by-step controller moving for controlling described temperature sensor that is connected in described clamping device.
2. wafer temperature supervising device according to claim 1; it is characterized in that: described temperature sensor comprises the fibre-optical probe close to wafer to be measured bottom; be sheathed on the protective casing on described fibre-optical probe top, be connected in the connecting line of described protective casing lower end.
3. wafer temperature supervising device according to claim 2, is characterized in that: described fibre-optical probe comprises the optical fiber of signal transmission and is coated on the fluorescence coating of fiber end face.
4. wafer temperature supervising device according to claim 2, is characterized in that: the material of described protective casing is glass.
5. wafer temperature supervising device according to claim 1, is characterized in that: described temperature sensor is connected in receiver.
6. wafer temperature supervising device according to claim 1, is characterized in that: described wafer temperature supervising device is done straight line and come and gone translation.
7. wafer temperature supervising device according to claim 6, is characterized in that: the distance that described straight line comes and goes translation is brilliant radius of a circle to be measured.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420237945.0U CN203826348U (en) | 2014-05-09 | 2014-05-09 | Wafer temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420237945.0U CN203826348U (en) | 2014-05-09 | 2014-05-09 | Wafer temperature control device |
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| Publication Number | Publication Date |
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| CN203826348U true CN203826348U (en) | 2014-09-10 |
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| CN201420237945.0U Active CN203826348U (en) | 2014-05-09 | 2014-05-09 | Wafer temperature control device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105483619A (en) * | 2016-01-26 | 2016-04-13 | 京东方科技集团股份有限公司 | Moving target coating device and method |
| CN112987897A (en) * | 2019-12-17 | 2021-06-18 | 张峻浩 | Method and device for monitoring outlet air temperature of server power module |
-
2014
- 2014-05-09 CN CN201420237945.0U patent/CN203826348U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105483619A (en) * | 2016-01-26 | 2016-04-13 | 京东方科技集团股份有限公司 | Moving target coating device and method |
| CN105483619B (en) * | 2016-01-26 | 2018-01-02 | 京东方科技集团股份有限公司 | Running target coating apparatus and film plating process |
| CN112987897A (en) * | 2019-12-17 | 2021-06-18 | 张峻浩 | Method and device for monitoring outlet air temperature of server power module |
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