CN203813778U - TR radio frequency module - Google Patents
TR radio frequency module Download PDFInfo
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- CN203813778U CN203813778U CN201420241228.5U CN201420241228U CN203813778U CN 203813778 U CN203813778 U CN 203813778U CN 201420241228 U CN201420241228 U CN 201420241228U CN 203813778 U CN203813778 U CN 203813778U
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
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- 238000003199 nucleic acid amplification method Methods 0.000 description 5
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- 238000010168 coupling process Methods 0.000 description 2
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- 238000004377 microelectronic Methods 0.000 description 2
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- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 239000008358 core component Substances 0.000 description 1
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- 238000012216 screening Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model relates to the design technical field of the TR assembly of an active phased-array radar, and particularly relates to a TR radio frequency module. The TR radio frequency module comprises a box body used for the installation of circuit and function modules. An LTCC integrated circuit, a control sub-board, a waveguide-microstrip conversion structure, a radio frequency input interface and a radio frequency output interface are arranged in the box body. The control sub-board is connected with the LTCC integrated circuit through the gold wire bonding process. An LTCC substrate is adopted as a carrier for the LTCC integrated circuit. The LTCC substrate is integrated with a radio frequency chip set, a digital to analog conversion chip and a drive chip. The radio frequency input interface is connected with the radio frequency output interface successively through the waveguide-microstrip conversion structure, the drive chip and the radio frequency chip set. According to the technical scheme of the utility model, based on the foundation of an LTCC multilayer substrate, the TR radio frequency module integrates a chip and a multi-functional circuit as a whole, thus having the functions of amplitude control and phase control. Meanwhile, the TR radio frequency module is small in size, high in integration level and high in reliability, and also has the functions of amplitude control and phase control.
Description
Technical field
The utility model relates to the design field of TR assembly in Connectors for Active Phased Array Radar, particularly a kind of TR radio-frequency module.
Background technology
Since the thirties in 20th century, radar came out, Radar Technology has obtained high speed development in World War II, and after the nineties, Connectors for Active Phased Array Radar has become the developing main flow of radar.
In every Connectors for Active Phased Array Radar, comprise multiple T/R assemblies, it not only completes reception task but also complete launch mission and antenna beam electric scanning.Each T/R assembly is just equivalent to the tuner of an ordinary radar, has both included emission power amplifier, has again the functional circuits such as low noise amplifier, phase shifter and wave beam control circuit.Along with modern science and technology is more and more higher to the requirement of Connectors for Active Phased Array Radar, performance as the T/R assembly of one of Connectors for Active Phased Array Radar core component is also had higher requirement, TR assembly requires high, the high conformity of integrated level, volume little, lightweight, can adapt to different workbenches and environment.The high band TR assembly of domestic market is also fewer, the complex structure of existing product, and size is larger, and integrated level is lower, and TR radio-frequency channel lacks effective amplitude-phase modulation.
Utility model content
The purpose of this utility model is to overcome the above-mentioned deficiency of prior art, a kind of miniaturization, high integration is provided and has amplitude and the TR radio-frequency module of phase control function.
A kind of TR radio-frequency module, comprises the box body for mounting circuit and functional module, LTCC integrated circuit is installed in box body, controls daughter board, waveguide-microstrip transformation structure, rf input interface and output interface.Described control daughter board is welded and is communicated with by spun gold with LTCC integrated circuit; Described LTCC integrated circuit is taking ltcc substrate as carrier, on ltcc substrate, be integrated with radio frequency chip group, analog-digital chip, driving chip, described rf input interface is connected with radio frequency output interface successively after waveguide-microstrip transformation structure, driving chip, radio frequency chip group.
In above-mentioned TR radio-frequency module, described radio frequency chip group is made up of vector modulator chip and transmitting/receiving chip (T/R) cascade.
In above-mentioned TR radio-frequency module, described LTCC integrated circuit, control daughter board and waveguide-microstrip transformation structure are arranged on the front of box body; Rf input interface and output interface are arranged on the side of box body.Each electronic component compact in design is reasonable, and the volume of TR radio-frequency module is further dwindled.
In above-mentioned TR radio-frequency module, described rf input interface is rectangular waveguide mouth; Radio frequency output interface is the two male contacts of SMP, is connected with exterior antenna by the two male contacts of SMP.
In above-mentioned TR radio-frequency module, on described control daughter board, be also provided with spi bus interface, external signal can enter control daughter board through spi bus interface.
In above-mentioned TR radio-frequency module, welded with LTCC integrated circuit and be connected by spun gold owing to controlling daughter board, control daughter board and can realize signal transmission with analog-digital chip, described analog-digital chip is again by inner cabling and vector modulator chip interconnects.In the time that LTCC integrated circuit is controlled, external signal passes through to control the output voltage of analog-digital chip, and then vector modulator chip is carried out to amplitude and phase control.
In above-mentioned TR radio-frequency module, described LTCC integrated circuit adopts sandwich construction, and transmitting/receiving chip (T/R) and vector modulator chip in radio frequency chip group are placed in same cavity.
In above-mentioned TR radio-frequency module, described TR radio-frequency module comprises the LTCC integrated circuit of two 4 passages.
In above-mentioned TR radio-frequency module, on described control daughter board, comprise power supply modulator circuit and logic control circuit, and control accordingly power interface and control logic interface, described control power interface is connected with LTCC integrated circuit by spun gold welding manner with control logic interface.
In above-mentioned TR radio-frequency module, also comprise the protective structures such as cover plate, screening cover.
In above-mentioned TR radio-frequency module, LTCC integrated circuit is taking ltcc substrate as carrier, by machine integrated radio frequency chip group, analog-digital chip, feeding network and corresponding control circuit, realized amplification, transmitting-receiving conversion and the amplitude-phase control of microwave signal, and it is integrated to have reached the height of circuit.Can realize signal transmission with analog-digital chip owing to controlling daughter board, analog-digital chip is realized interconnection by inner cabling and each vector modulator chip again, by controlling the output voltage of analog-digital chip, and then control vector modulator chip, complete the adjustment to each channel amplitude and phase place in module, control daughter board and provide power supply and Transmit enable to each channel chip.Described waveguide-microstrip structure is the coupling to microstrip structure for waveguide, and the coupling that realizes signal inputs or outputs.Described feeding network has been used for the feed of 8 passage constant amplitude homophases or the signal of 8 passages is synthetic.
LTCC(low-temperature co-fired ceramic substrate) sandwich construction that integrated circuit adopts, according to each selected device and mutual electrical relation thereof, select suitable LTCC material and the medium number of plies, rationally determine the function of each layer and slurry accordingly.Wherein, in LTCC integrated circuit, radiofrequency signal feed line and radio frequency chip group exist together in one deck, and adopt strip lines configuration; The lower floor in them isolating by large-area stratum of chip power supply line and Vector Modulation chip controls line.In order to prevent the impact of electromagnetic interference in strip line feeding network, in this design, adopt metallization via hole to shield.The sandwich construction adopting by LTCC integrated circuit has solved the syndeton of circuit complexity in the past, electronic component, in different dielectric layers, has improved the integrated level of circuit, has dwindled module size, reduce the phase mutual interference of electronic devices and components, module performance index is improved.
compared with prior art, the beneficial effects of the utility model:the utility model is simple in structure, and electronic component compact in design is reasonable, and the volume of TR radio-frequency module can further be dwindled.LTCC integrated circuit is on the basis of the micro-belt substrate of LTCC multilayer, be integrated with chip and multifunctional circuit, interconnect by microelectronics again, can realize reliably amplification, Transmit enable and the amplitude-phase control of microwave signal, and it is integrated to have reached the height of control circuit.Radio-frequency channel adopts vector modulator chip to adjust signal amplitude and phase place.
Brief description of the drawings
Fig. 1 is that circuit of the present utility model connects block diagram.
Fig. 2 is internal structure schematic diagram of the present utility model.
Mark in figure: 1-box body, 2-LTCC integrated circuit, 21-LTCC substrate, 22-radio frequency chip group, 23-analog-digital chip, 24-drives chip, 221-transmitting/receiving chip, 222-Vector Modulation chip, 3-controls daughter board, 4-waveguide-microstrip transformation structure, 5-rectangular waveguide mouth, the two male contacts of 6-SMP, 7-SPI bus interface.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is further described.
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Embodiment 1
As shown in Figure 1, the TR radio-frequency module of the present embodiment, comprise the box body 1 for mounting circuit and functional module, the front of described box body 1 is provided with the LTCC integrated circuit 2 of two 4 passages, control daughter board 3 and waveguide-microstrip transformation structure 4, the side of box body 1 is provided with rectangular waveguide mouth 5, the two male contacts 6 of SMP, and described control daughter board 3 is welded and is communicated with by spun gold with LTCC integrated circuit 2; Described LTCC integrated circuit 2 is taking ltcc substrate 21 as carrier, on ltcc substrate 21, be integrated with radio frequency chip group 22, analog-digital chip 23, drive chip 24, radio frequency chip group 22 is formed by Vector Modulation chip 222 and transmitting/receiving chip 221 serial connections, described rectangular waveguide mouth 5 is connected with the two male contacts 6 of SMP successively after waveguide-microstrip transformation structure 4, driving chip 24, radio frequency chip group 22, and the two male contacts 6 of SMP are connected with exterior antenna again.
In above-mentioned TR radio-frequency module, described LTCC integrated circuit 2 adopts sandwich construction, and transmitting/receiving chip (T/R) 221 and vector modulator chip 222 in radio frequency chip group 22 are placed in same cavity.On described control daughter board 3, be provided with spi bus interface 7, power supply modulator circuit and logic control circuit, and control accordingly power interface and control logic interface, module chips power supply and width phase control signal provide by controlling daughter board 3; Can realize signal transmission with analog-digital chip 23 owing to controlling daughter board 3, analog-digital chip 23 is realized interconnection by inner cabling and vector modulator chip 222 again, by controlling the output voltage of analog-digital chip 23, and then control vector modulator chip 222, complete amplitude to each passage in module and the adjustment of phase place, control daughter board also for providing power supply and Transmit enable to each channel chip.
The transmitting-receiving operation principle of described TR radio-frequency module is:
In the time of emission state, transmit by rectangular waveguide mouth 5 signal feed-in, in waveguide-microstrip transformation structure 4, transfer strip line transmission to by the transition of microstrip line-strip line, the radio-frequency channel that parallel feed-in is made up of transmitting/receiving chip 221 and Vector Modulation chip 222 after prime drives chip 24 to amplify, adjusted amplitude and the phase place of each road signal by vector modulator chip 222 according to beam position, then amplify and be fed into the two male contacts 6 of SMP through transmitting/receiving chip 221, the two male contacts 6 of SMP are connected signal are launched with exterior antenna.
In the time of accepting state, radiofrequency signal enters transmitting/receiving chip 221 by the two male contacts 6 of SMP, low noise amplifier in transmitting/receiving chip 221 carries out signal amplification, after amplification, adjusted amplitude and the phase place of signal by vector modulator chip 222 according to higher level's control command, after chopped-off head power is synthetic, become a road signal, after driving chip 24 to amplify, finally export from rectangular waveguide mouth 5 by the transition of microstrip line-strip line.
Electricity supply and control operation principle is:
External power source enters and controls daughter board 3 through spi bus interface 7, is controlling on daughter board 3 through voltage modulated.Weld and be communicated with by spun gold with LTCC integrated circuit 2 owing to controlling daughter board 3 in TR radio-frequency module, external power source is inputted LTCC integrated circuit 2 by controlling daughter board 3, then is transferred on each chip and powers through the mode of the inside of LTCC integrated circuit 2 cabling and gold wire bonding.
External control signal enters and controls daughter board 3 through spi bus interface 7, is welded and is communicated with LTCC integrated circuit 2 owing to controlling daughter board 3 by spun gold, and analog-digital chip 23 interconnects by inner cabling and each vector modulator chip 222 again.In the time that LTCC integrated circuit 2 is controlled, external signal passes through to control the output voltage of analog-digital chip 23, and then Vector Modulation chip 222 is carried out to amplitude, phase control.
Whole TR radio-frequency module is divided into two-stage High Density Integration: chip-scale and circuit level, and module adopts special chip to realize transmission-receiving function and the width phase control function of circuit; Adopt multilayer co-firing ceramic substrate to realize the integrated of chip, feeding network and control circuit; Complete the control to radio frequency signal amplitude, phase place by spi bus interface input control signal, module performance index is improved.The present embodiment is simple in structure, and electronic component compact in design is reasonable, and the volume of TR radio-frequency module can further be dwindled; LTCC integrated circuit, on LTCC multilager base plate, is integrated with chip and multifunctional circuit, then interconnects by microelectronics, can realize reliably amplification, Transmit enable and the width phase control of microwave signal, and it is integrated to have reached the height of control circuit.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (8)
1. a TR radio-frequency module, comprise the box body for mounting circuit and functional module, it is characterized in that: LTCC integrated circuit is installed in box body, controls daughter board, waveguide-microstrip transformation structure, rf input interface and output interface, described control daughter board is welded and is communicated with by spun gold with LTCC integrated circuit; Described LTCC integrated circuit is taking ltcc substrate as carrier, on ltcc substrate, be integrated with radio frequency chip group, analog-digital chip, driving chip, described rf input interface is connected with radio frequency output interface successively after waveguide-microstrip transformation structure, driving chip, radio frequency chip group.
2. TR radio-frequency module according to claim 1, is characterized in that: described radio frequency chip group is made up of vector modulator (Vector Modulator) and transmitting/receiving chip (T/R) cascade.
3. TR radio-frequency module according to claim 1, is characterized in that: described LTCC integrated circuit, control daughter board and waveguide-microstrip transformation structure are arranged on the front of box body; Rf input interface and output interface are arranged on the side of box body.
4. TR radio-frequency module according to claim 1, is characterized in that: described rf input interface is rectangular waveguide mouth; Radio frequency output interface is the two male contacts of SMP.
5. TR radio-frequency module according to claim 1, is characterized in that: on described control daughter board, be also provided with spi bus interface.
6. TR radio-frequency module according to claim 2, is characterized in that: described LTCC integrated circuit forms different cavitys by sandwich construction, and transmitting/receiving chip (T/R) and vector modulator chip are placed in same cavity.
7. TR radio-frequency module according to claim 1, is characterized in that: described TR radio-frequency module comprises the LTCC integrated circuit of two 4 passages.
8. TR radio-frequency module according to claim 1, is characterized in that: on described control daughter board, comprise power supply modulator circuit and logic control circuit, and control accordingly power interface and control logic interface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241228.5U CN203813778U (en) | 2014-05-13 | 2014-05-13 | TR radio frequency module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420241228.5U CN203813778U (en) | 2014-05-13 | 2014-05-13 | TR radio frequency module |
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| Publication Number | Publication Date |
|---|---|
| CN203813778U true CN203813778U (en) | 2014-09-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420241228.5U Expired - Lifetime CN203813778U (en) | 2014-05-13 | 2014-05-13 | TR radio frequency module |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104052517A (en) * | 2014-05-13 | 2014-09-17 | 成都雷电微力科技有限公司 | Tr radio frequency module |
| CN112671428A (en) * | 2021-03-16 | 2021-04-16 | 成都华兴大地科技有限公司 | Multichannel radio frequency signal receiving and transmitting amplitude-phase control device |
| CN113193326A (en) * | 2021-07-05 | 2021-07-30 | 成都锐芯盛通电子科技有限公司 | W-band multi-channel airtight packaging phased array SIP module |
-
2014
- 2014-05-13 CN CN201420241228.5U patent/CN203813778U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104052517A (en) * | 2014-05-13 | 2014-09-17 | 成都雷电微力科技有限公司 | Tr radio frequency module |
| CN112671428A (en) * | 2021-03-16 | 2021-04-16 | 成都华兴大地科技有限公司 | Multichannel radio frequency signal receiving and transmitting amplitude-phase control device |
| CN113193326A (en) * | 2021-07-05 | 2021-07-30 | 成都锐芯盛通电子科技有限公司 | W-band multi-channel airtight packaging phased array SIP module |
| CN113193326B (en) * | 2021-07-05 | 2021-09-17 | 成都锐芯盛通电子科技有限公司 | W-band multi-channel airtight packaging phased array SIP module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 610041 Shiyang Industrial Park, No.288, Yixin Avenue, hi tech Zone, Chengdu, Sichuan Province Patentee after: Chengdu lightning Micro Power Technology Co.,Ltd. Address before: 610041 Shiyang Industrial Park, hi tech Zone, Chengdu, Sichuan Patentee before: RML TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140903 |
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| CX01 | Expiry of patent term |