CN203812863U - Tape crimping device used for electronic component taping machine - Google Patents
Tape crimping device used for electronic component taping machine Download PDFInfo
- Publication number
- CN203812863U CN203812863U CN201420220389.6U CN201420220389U CN203812863U CN 203812863 U CN203812863 U CN 203812863U CN 201420220389 U CN201420220389 U CN 201420220389U CN 203812863 U CN203812863 U CN 203812863U
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- CN
- China
- Prior art keywords
- pressure head
- material loading
- loading pressure
- transporting rail
- chip
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- Expired - Fee Related
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Abstract
The utility model relates to a tape crimping device used for an electronic component taping machine. The device comprises a rack, and the rack is provided with a drive motor. One end of the rack is provided with a chip feed port. The end of the chip feed port is provided with a transmission rail. The transmission rail is connected with a transmission mechanism. The transmission mechanism connects the drive motor and the transmission rail. The tail end of the transmission rail is provided with a carrier tape. A feeding device comprises a feeding pressure head disposed close to a side of the carrier tape. The front part of the feeding pressure head is in a columnar shape. The cross-sectional shape of the front part of the feeding pressure head is rectangle. Positioning and crimping of an electronic chip is performed by the transmission rail, the feeding pressure head, and the carrier tape with a cavity. The cross section of the front part of the feeding pressure head is improved to the rectangular shape from the existing circular shape, so operation is more reliable and stable through greatly improving contact area of the feeding pressure head and the cavity.
Description
Technical field
The utility model relates to a kind of electronic component braid field, particularly a kind of braid compression bonding apparatus for electronic component braider.
Background technology
In chip manufacture manufacturing equipment field, for the chip of sheet, conventionally chip need to be loaded in braid, again by the nozzle unit of braider constantly from repeatedly picking and placeing chip in braid, detect, turn to, location etc., and finally carry out braid.
In existing braid, be conventionally provided with the die cavity suitable with chip profile, in order can chip to be stably crimped in die cavity, sidepiece in braid is provided with for chip being pressed to the crimp head of die cavity, yet, the weak point of existing crimp head is: the profile of crimp head is cylindric, after die cavity extends in die cavity, less with the contact area of chip, when needs enlarge active surface, only have by increasing the mode of the diameter of crimp head, easy and braid is interfered mutually so again.
Utility model content
Goal of the invention of the present utility model is: the problem existing for prior art, provides a kind of braid compression bonding apparatus for electronic component braider that can more stably exert pressure to chip in the die cavity of braid.
To achieve these goals, the technical solution adopted in the utility model is:
A kind of braid compression bonding apparatus for electronic component braider, comprise frame, in described frame, be provided with drive motors, one end of described frame is provided with chip charging aperture, the end of described chip charging aperture is provided with transporting rail, described transporting rail is connected with transmission mechanism, and described transmission mechanism is connected drive motors with transporting rail; The end of described transporting rail is provided with carrier band, is provided with several die cavities on described carrier band, and described die cavity is arranged along the bearing of trend of carrier band, and the cross section of described die cavity is rectangular; In described frame, be provided with for chip being packed into the feeding device in die cavity, described feeding device comprises that the front portion of described material loading pressure head is column near the material loading pressure head of a side setting of carrier band, and the anterior shape of cross section of described material loading pressure head is rectangle.
Adopt such structure, by transporting rail and material loading pressure head and the carrier band that is provided with die cavity to electronic chip position, crimping, the mode of placing than the suction of available technology adopting nozzle unit, manipulator, efficiency is higher, in unit interval, can complete the operation of more chip, especially after being embodied in the front cross section of material loading pressure head being modified into rectangle by existing circle, can be by promoting greatly the contact area of material loading pressure head and die cavity, operation is more reliable, stable.
Preferably, between described material loading pressure head and frame, be provided with oscillating cylinder, the stiff end of described oscillating cylinder is fixedly connected with frame, and the piston rod of described oscillating cylinder is connected with material loading pressure head, and described oscillating cylinder drives material loading pressure head be inserted in the die cavity of carrier band or upwards extract.
Preferably, the end of described material loading pressure head is provided with transducer, and described transducer is connected with PLC controller.Adopt such structure, by transducer, the motion of material loading pressure head is counted, guarantee that chip is pressed into one by one by material loading pressure head.
Preferably, described transporting rail is obliquely installed along its bearing of trend, described transporting rail is greater than the height of transporting rail end at the height of the side near chip charging aperture, the left and right sides of described transporting rail arranges and is respectively provided with a side shield, and described transporting rail is provided with charging breach on the side shield of the side near chip charging aperture.Adopt such structure, electronic chip is taken advantage of a situation and is sent in the die cavity of carrier band, and operating efficiency is higher.
In sum, owing to having adopted technique scheme, the beneficial effects of the utility model are: by transporting rail and material loading pressure head, and the carrier band that is provided with die cavity positions electronic chip, crimping, than available technology adopting nozzle unit, aspirate, the mode that manipulator is placed, efficiency is higher, in unit interval, can complete the operation of more chip, especially after being embodied in the front cross section of material loading pressure head being modified into rectangle by existing circle, can be by promoting greatly the contact area of material loading pressure head and die cavity, operate more reliable, stable.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the schematic diagram of a kind of execution mode of material loading pressure head in the utility model;
Fig. 3 is the perspective view of material loading pressure head in the utility model;
Mark in figure: frame-1; Drive motors-2; Chip charging aperture-3; Transporting rail-4; Carrier band-5; Die cavity-6; Material loading pressure head-7a; Oscillating cylinder-7b.
Embodiment
Below in conjunction with accompanying drawing, the utility model is described in detail.
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figure 1 to Figure 3, a kind of braid compression bonding apparatus for electronic component braider of the present embodiment, comprise frame 1, in frame 1, be provided with drive motors 2, one end of frame 1 is provided with chip charging aperture 33, the end of chip charging aperture 3 is provided with transporting rail 4, and transporting rail 4 is connected with transmission mechanism, and transmission mechanism is connected drive motors 2 with transporting rail 4, the end of transporting rail 4 is provided with carrier band 5, is provided with several die cavities 6 on carrier band 5, and die cavity 6 is arranged along the bearing of trend of carrier band 5, and the cross section of die cavity 6 is rectangular, in frame 1, be provided with for chip being packed into the feeding device in die cavity 6, feeding device comprises the material loading pressure head 7a near a side setting of carrier band 5, the front portion of material loading pressure head 7a is column, the anterior shape of cross section of material loading pressure head 7a is rectangle, wherein, between material loading pressure head 7a and frame 1, be provided with oscillating cylinder 7b, the stiff end of oscillating cylinder 7b is fixedly connected with frame 1, the piston rod of oscillating cylinder 7b is connected with material loading pressure head 7a, oscillating cylinder 7b drives material loading pressure head 7a to be inserted in the die cavity 6 of carrier band 5, or upwards extract, the end of material loading pressure head 7a is provided with transducer, transducer is connected with PLC controller, by transducer, the motion of material loading pressure head 7a is counted, guarantee that chip is pressed into one by one by material loading pressure head 7a, transporting rail 4 is obliquely installed along its bearing of trend, transporting rail 4 is greater than the height of transporting rail 4 ends at the height of the side near chip charging aperture 3, the left and right sides of transporting rail 4 arranges and is respectively provided with a side shield, transporting rail 4 is provided with charging breach on the side shield of the side near chip charging aperture 3, electronic chip is taken advantage of a situation and is sent in the die cavity 6 of carrier band 5, operating efficiency is higher.
As a kind of execution mode, the concrete structure of the material loading pressure head 7a of the present embodiment as shown in Figure 3, in the present embodiment, material loading pressure head 7a also sets up at the end of existing cylindrical structural the front end that one section of shape of cross section is rectangle and forms material loading pressure head 7a, also can directly material loading pressure head 7a integral body be manufactured to the square-column-shaped structure that cross section is rectangle, as preferably, as shown in Figure 2, material loading pressure head 7a in the present embodiment passes through connecting plate, the mode being threaded is connected with the oscillating cylinder 7b in frame 1, connecting plate and oscillating cylinder 7b are threaded connection, such structure can adapt to different carrier band 5, the spacing of oscillating cylinder 7b, and there is dismounting, change beneficial effect easily.
The present embodiment by transporting rail 4 and material loading pressure head 7a and 5 pairs of electronic chips of carrier band of being provided with die cavity 6 position, crimping, the mode of placing than the suction of available technology adopting nozzle unit, manipulator, efficiency is higher, in unit interval, can complete the operation of more chip, especially after being embodied in the front cross section of material loading pressure head 7a being modified into rectangle by existing circle, can be by promoting greatly the contact area of material loading pressure head 7a and die cavity 6, operation is more reliable, stable.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection range of the present utility model.
Claims (4)
1. the braid compression bonding apparatus for electronic component braider, it is characterized in that: comprise frame, in described frame, be provided with drive motors, one end of described frame is provided with chip charging aperture, the end of described chip charging aperture is provided with transporting rail, described transporting rail is connected with transmission mechanism, and described transmission mechanism is connected drive motors with transporting rail; The end of described transporting rail is provided with carrier band, is provided with several die cavities on described carrier band, and described die cavity is arranged along the bearing of trend of carrier band, and the cross section of described die cavity is rectangular; In described frame, be provided with for chip being packed into the feeding device in die cavity, described feeding device comprises that the front portion of described material loading pressure head is column near the material loading pressure head of a side setting of carrier band, and the anterior shape of cross section of described material loading pressure head is rectangle.
2. the braid compression bonding apparatus for electronic component braider according to claim 1, it is characterized in that: between described material loading pressure head and frame, be provided with oscillating cylinder, the stiff end of described oscillating cylinder is fixedly connected with frame, the piston rod of described oscillating cylinder is connected with material loading pressure head, and described oscillating cylinder drives material loading pressure head be inserted in the die cavity of carrier band or upwards extract.
3. the braid compression bonding apparatus for electronic component braider according to claim 2, is characterized in that: the end of described material loading pressure head is provided with transducer, and described transducer is connected with PLC controller.
4. the braid compression bonding apparatus for electronic component braider according to claim 2, it is characterized in that: described transporting rail is obliquely installed along its bearing of trend, described transporting rail is greater than the height of transporting rail end at the height of the side near chip charging aperture, the left and right sides of described transporting rail arranges and is respectively provided with a side shield, and described transporting rail is provided with charging breach on the side shield of the side near chip charging aperture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220389.6U CN203812863U (en) | 2014-04-30 | 2014-04-30 | Tape crimping device used for electronic component taping machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220389.6U CN203812863U (en) | 2014-04-30 | 2014-04-30 | Tape crimping device used for electronic component taping machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203812863U true CN203812863U (en) | 2014-09-03 |
Family
ID=51451582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420220389.6U Expired - Fee Related CN203812863U (en) | 2014-04-30 | 2014-04-30 | Tape crimping device used for electronic component taping machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203812863U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298591A (en) * | 2016-08-15 | 2017-01-04 | 太仓高创电气技术有限公司 | A kind of movable rack unit for producing flat bridge |
-
2014
- 2014-04-30 CN CN201420220389.6U patent/CN203812863U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106298591A (en) * | 2016-08-15 | 2017-01-04 | 太仓高创电气技术有限公司 | A kind of movable rack unit for producing flat bridge |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140903 Termination date: 20160430 |