CN203811941U - Micro-display chip with optical sensitization function - Google Patents

Micro-display chip with optical sensitization function Download PDF

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Publication number
CN203811941U
CN203811941U CN201420202640.6U CN201420202640U CN203811941U CN 203811941 U CN203811941 U CN 203811941U CN 201420202640 U CN201420202640 U CN 201420202640U CN 203811941 U CN203811941 U CN 203811941U
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China
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chip
micro
cmos
display chip
optics
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Expired - Fee Related
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CN201420202640.6U
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Chinese (zh)
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夏军
黄嵩人
石荣
何军
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SUZHOU XINMENG HUIXIAN ELECTRONIC TECHNOLOGY CO., LTD.
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WUXI XINMENG TECHNOLOGY Co Ltd
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Abstract

The utility model discloses a micro-display chip with an optical sensitization function. The micro-display chip comprises a semiconductor chip body, a transparent substrate and a liquid crystal layer arranged between the semiconductor chip and the transparent substrate, wherein a driving circuit is prepared on the semiconductor chip. A loading voltage is arranged on the top layer of the semiconductor chip so that pixel electrodes with dynamic image display can be achieved. CMOS sensitization units which are provided with independent line and row driving circuits to complete dynamic video image shooting are prepared between the pixel electrodes. CMOS optical sensors are prepared on the micro-display chip so that shooting and displaying can share the same optical path system, it is ensured that the shot real scene and a micro-display image are highly fused, and meanwhile dynamic images of the human eyes can be easily shot in real time.

Description

The micro display chip with optics sensitization function
Technical field
The utility model relates to a kind of display device, especially relates to a kind of micro-display device simultaneously with camera function.
Background technology
Micro-multiple technologies that show, comprising: liquid crystal on silicon, silica-based OLED, the devices such as DLP and MEMS.Liquid crystal on silicon (LCoS) technology is relatively ripe, below the preferred structure of described the utility model will take LCoS as example describes, shown in Fig. 1, be the top level structure schematic diagram of traditional LC oS micro display chip.Traditional micro display chip has two kinds of common structures, i.e. monochromatic display chip (left side structure in Fig. 1) and colored display chip (the right structure in Fig. 1).The corresponding foursquare electrode (being a kind of conventional include monochrome pixels electrode shape as shown in the left side in Fig. 1) of each display pixel of monochromatic display chip, the mode of time-division that adopts monochromatic display chip realizes colored demonstration, because red, green, blue three looks share same pixel cell, be therefore conducive to the miniaturization of pixel cell size.
Each pixel of colored display chip is comprised of (if the right in Fig. 1 is a kind of color sub-pixel structure of typical delta structure three sub-pixels of red, green, blue, in figure, rectangle represents respectively the electrode zone of sub-pixel, and the word in rectangle frame represents the color of sub-pixel).In figure, the dotted line in the upper left corner represents that a pixel cell is comprised of adjacent red, green, blue three sub-pixels.
Shown in Fig. 2, be sectional structure chart (list of references 1:David Armitage, Ian Underwood, the Shin-Tson Wu of traditional LC oS micro display chip, " Introduction to Microdisplays ", John Wiley & Sons, Ltd, 2006).In figure, micro display chip is comprised of three-decker, is topmost transparent electrically-conductive backing plate 12, normally with the glass substrate of ITO conductive layer; Centre is liquid crystal layer 13, and common liquid crystal mode of operation has TN pattern and VA pattern; Orlop is semi-conductor silicon chip 11, is provided with show electrode 14 on semi-conductor silicon chip.Major function comprises the Drive of row and column of pixel cell, with dynamic refresh of pixel electrode voltage etc., in figure, simplifying the electrode structure only drawn top layer (is the fundamental diagram of traditional LC oS pixel cell shown in Fig. 6, each pixel cell comprises that a triode connects respectively column electrode, row electrode and pixel electrode, between the pixel electrode of semi-conductor silicon chip and the ITO conductive layer of upper substrate, on-load voltage can cause liquid crystal to change orientation, thereby realize the modulation to incident light), for colored display chip, above electrode, also can prepare one deck colour filter, corresponding red respectively, green, blue three look color filters.
In Fig. 2, undermost silicon-based semiconductor integrated circuit adopts traditional semiconductor technology preparation conventionally, therefore except realizing the Drive of row and column function of micro-display device, and all right integrated various large scale integrated circuit functions, such as SRAM, analog to digital conversion etc.
The small image that wearable intelligent glasses adopts micro display chip and waveguide imaging arrangement that micro display chip is shown directly projects in people's eyes, makes human eye on virtual screen, see enlarged image forwardly.The intelligent glasses (Google glass) of Google of take is example, and it has adopted liquid crystal on silicon (LCoS) micro display chip to show image.
Intelligent glasses, as wearable device, has video capture function simultaneously, can take in real time the live view that intelligent glasses wearer is watched.This shoot function is compared with traditional mobile phone shoot function, not only has higher use portable, simultaneously due to human eye watch visual field height consistent, for novel augmented reality application provides good platform.
Yet in current intelligent glasses product, wearable intelligent glasses product generally adopts independently micro display chip and shooting chip, completes respectively the demonstration of virtual image and the shooting of reality scene.Separated demonstration and camera system exist and show the inconsistent of image and shot object, thereby have reduced in augmented reality application the height syncretizing effect of the dummy object of demonstration and real-world object.Therefore in augmented reality display application, need between photographic images and display image content, carry out locus rectification, increase the difficulty of design and the production of product.
Summary of the invention
The purpose of this utility model is to provide a kind of micro display chip with optics sensitization function, this micro-display device is prepared CMOS optical sensor on micro display chip, make to take and show and share same light path system, thereby guarantee that the reality scene of shooting and the height of micro-demonstration image merge, and are also beneficial to the dynamic image of real-time shooting human eye simultaneously.
The purpose of this utility model is achieved through the following technical solutions:
A kind of micro display chip with optics sensitization function, comprise the semi-conductor chip, the transparency carrier that are prepared with driving circuit, be arranged on the liquid crystal layer between semi-conductor chip and transparency carrier, top layer at semi-conductor chip is provided with the pixel electrode that on-load voltage is realized dynamic image demonstration, it is characterized in that: between pixel electrode, be prepared with the CMOS photosensitive unit with independent rows column drive circuit.
In the utility model, above pixel electrode, there are liquid crystal layer, on-load voltage can change the liquid crystal modulation angle reverse to incident polarisation of light.Or pixel electrode is OLED structure above, and on-load voltage can be realized the luminescence display of pixel cell.CMOS photosensitive unit can complete the shooting of dynamic video image.
The preferred pixel electrode of the utility model can be LCoS display unit.CMOS photosensitive unit is positioned at LCoS display unit, or CMOS photosensitive unit is between LCoS display unit gap.CMOS photosensitive unit can be corresponding one by one with LCoS display unit, or CMOS photosensitive unit and LCoS display unit inconsistent in space distribution.
At pixel electrode and CMOS photosensitive unit top, there is color filter.CMOS photosensitive unit can adopt the color filter of identical wavelength with LCoS display unit, realize the shooting of coloured image.CMOS photosensitive unit can adopt the color filter of different wave length with LCoS display unit, realize infrared shooting.
The beneficial effects of the utility model are: the utility model is prepared CMOS optical sensor on micro display chip, owing to showing and shooting is positioned on same chip, make to take and show and share same light path system, thereby guarantee that the reality scene of shooting and the height of micro-demonstration image merge, and are also beneficial to the dynamic image of real-time shooting human eye simultaneously.
The technology on micro display chip by the preparation of CMOS photosensitive unit that the utility model proposes is equally applicable to silica-based OLED, the micro display chips such as DLP and MEMS.
Accompanying drawing explanation
Fig. 1-1st, the top level structure schematic diagram of monochromatic display chip in traditional LC oS micro display chip.
Fig. 1-2 is the top level structure schematic diagram of colored display chip in traditional micro display chip.
Fig. 2 is the cross-sectional view of traditional micro display chip.
It shown in Fig. 3, is the preferred micro display chip cross-sectional view of the utility model.
It shown in Fig. 4, is the preferred monochromatic micro display chip top level structure schematic diagram of the utility model.
It shown in Fig. 5, is the preferred colored micro display chip top level structure schematic diagram of the utility model.
Fig. 6 is the fundamental diagram of traditional LC oS pixel cell.
Fig. 7 is the fundamental diagram of traditional cmos photosensitive unit.
Embodiment
A kind of micro display chip with optics sensitization function, see Fig. 3, this micro-display device comprises semi-conductor chip 1, the transparency carrier 2 that is prepared with driving circuit, be arranged on the liquid crystal layer 3 between semi-conductor chip and transparency carrier, at the top layer of semi-conductor chip, be provided with on-load voltage and realize the pixel electrode 4 that dynamic image shows, between pixel electrode, be prepared with and there is independently Drive of row and column circuit and complete the CMOS photosensitive unit 5 that dynamic video image is taken.Above pixel electrode, there are liquid crystal layer, on-load voltage can change the liquid crystal modulation angle reverse to incident polarisation of light.Or pixel electrode is OLED structure above, and on-load voltage can be realized the luminous of pixel cell.
The preferred pixel electrode of the utility model is LCoS display unit.CMOS photosensitive unit is positioned at LCoS display unit, or CMOS photosensitive unit is between LCoS display unit gap.CMOS photosensitive unit can be corresponding one by one with LCoS display unit, or CMOS photosensitive unit and LCoS display unit inconsistent in space distribution.
At pixel electrode and CMOS photosensitive unit top, there is color filter.CMOS photosensitive unit can adopt the color filter of identical wavelength with LCoS display unit, realize the shooting of coloured image.CMOS photosensitive unit can adopt the color filter of different wave length with LCoS display unit, for example, adopt infrared color filter to realize infrared shooting.
The utility model is prepared CMOS photosensitive circuit on semi-conductor silicon chip simultaneously, CMOS photosensitive array is integrated on the same semi-conductor silicon chip of LCoS micro display chip, realizes image and show and shoot function on same chip.
It shown in Fig. 3, is the preferred monochromatic micro display chip sectional structure chart of the utility model, be with the maximum differential of traditional LC oS micro display chip, (traditional structure of cmos sensor is with reference to list of references 2: Wang Qingyou between adjacent display pixel cells, to have inserted a CMOS photosensitive unit, " image sensor application technology ", Electronic Industry Press, 2013); It shown in Fig. 7, is the fundamental diagram of traditional logarithmic response type CMOS-APS photosensitive unit, this photosensitive unit has very high dynamic range, its pixel cell structure is comprised of photodiode D0, load pipe M0, source follower M1 and row gate tube M2, load tube grid is a constant bias voltage (if not necessarily supply voltage), this pixel cell output signal becomes logarithmic relationship with incident optical signal, and its work characteristics is that light is converted into signal voltage continuously.CMOS photosensitive unit array and LCoS array of display cells, and the control of Drive of row and column circuit separately, be positioned on same semi-conductor silicon chip, but independent separately.Traditional CMOS photosensitive unit top comprises a lenticule, be used for making convergence of rays at photosensitive unit, in preferred version of the present utility model, owing to need to guaranteeing that cmos cell and LCoS unit have consistent smooth upper surface to meet the requirement of liquid crystal aligning layer effects on surface flatness, will save traditional microlens structure in preferred version of the present utility model.In space distribution, because the size of cmos cell is much smaller than LCoS unit, cmos cell can be embedded in LCoS display unit, in figure, black region represents cmos cell as shown in Figure 3.Fig. 4 is the semi-conductor chip top level structure schematic diagram of the utility model preferred structure, and the place, the lower right corner that cmos cell is positioned at each LCoS display unit, now can realize monochrome image and take; When LCoS display unit top layer increases color filter (top level structure as shown in the right in Fig. 1), cmos cell can be positioned at LCoS display unit color filter shared with it, now can realize coloured image shoot function.
Due to cmos cell and LCoS unit separate, and without corresponding one by one, except the preferred technical scheme of the utility model, can also between LCoS display unit, embed cmos cell, or adopt the more CMOS array of low resolution, each cmos cell is dispersed between the gap of a plurality of LCoS, and researcher in this field can design various array modes as required.
It shown in Fig. 5, is the preferred colored micro display chip top level structure structural drawing of the utility model.In figure, CMOS photosensitive unit is positioned at the gap of red, green, blue three color pixel unit, the region that in figure, letter " C " indicates.The schematic diagram that has just drawn " C " areal distribution in figure, this area researchist can design various difformities and arrangement mode according to the actual requirements.The advantage of this structure is that CMOS top layer can adopt the color filter from red, green, blue three looks different, and for example can adopt transmission region is infrared color filter, thereby realizes infrared image shoot function.This infrared shooting function can be applied to eye tracking location, and the real-time shooting of reality scene under low-light (level) environment.

Claims (9)

1. a micro display chip with optics sensitization function, comprise the semi-conductor chip (1), the transparency carrier (2) that are prepared with driving circuit, be arranged on the liquid crystal layer (3) between semi-conductor chip (1) and transparency carrier (2), top layer at semi-conductor chip (1) is provided with the pixel electrode (4) that on-load voltage is realized dynamic image demonstration, it is characterized in that: between pixel electrode (2), be prepared with the CMOS photosensitive unit (5) with independent rows column drive circuit.
2. the micro display chip with optics sensitization function according to claim 1, is characterized in that: described pixel electrode (4) is LCoS display unit.
3. the micro display chip with optics sensitization function according to claim 2, is characterized in that: CMOS photosensitive unit (5) is positioned at LCoS display unit.
4. the micro display chip with optics sensitization function according to claim 2, is characterized in that: CMOS photosensitive unit (5) is between LCoS display unit gap.
5. the micro display chip with optics sensitization function according to claim 2, is characterized in that: CMOS photosensitive unit (5) is corresponding one by one with LCoS display unit.
6. the micro display chip with optics sensitization function according to claim 2, is characterized in that: CMOS photosensitive unit (5) is inconsistent in space distribution with LCoS display unit.
7. the micro display chip with optics sensitization function according to claim 1, is characterized in that: at pixel electrode (4) and CMOS photosensitive unit (5) top, have color filter.
8. the micro display chip with optics sensitization function according to claim 7, is characterized in that: CMOS photosensitive unit (5) and LCoS display unit adopt the color filter of identical wavelength.
9. the micro display chip with optics sensitization function according to claim 7, is characterized in that: CMOS photosensitive unit (5) and LCoS display unit adopt the color filter of different wave length.
CN201420202640.6U 2014-04-23 2014-04-23 Micro-display chip with optical sensitization function Expired - Fee Related CN203811941U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103901653A (en) * 2014-04-23 2014-07-02 无锡芯盟科技有限公司 Micro-display device with optical camera shooting function
CN114136209A (en) * 2021-11-24 2022-03-04 京东方科技集团股份有限公司 Eyeball position positioning circuit, method, substrate and virtual reality wearable device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103901653A (en) * 2014-04-23 2014-07-02 无锡芯盟科技有限公司 Micro-display device with optical camera shooting function
CN114136209A (en) * 2021-11-24 2022-03-04 京东方科技集团股份有限公司 Eyeball position positioning circuit, method, substrate and virtual reality wearable device
CN114136209B (en) * 2021-11-24 2023-11-24 京东方科技集团股份有限公司 Eyeball position positioning circuit, eyeball position positioning method, substrate and virtual reality wearable device

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Effective date of registration: 20160718

Address after: 215000 No. 209 Chuk Yuen Road, Suzhou hi tech Development Zone, Jiangsu, Suzhou

Patentee after: SUZHOU XINMENG HUIXIAN ELECTRONIC TECHNOLOGY CO., LTD.

Address before: 214000, room thirteen, floor 1, 530 building, Binhu District, Wuxi, Jiangsu, 1310

Patentee before: WUXI XINMENG TECHNOLOGY CO., LTD.

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CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140903

Termination date: 20170423