CN203800045U - 一种新型led灯及采用该led灯的恒流灯串 - Google Patents

一种新型led灯及采用该led灯的恒流灯串 Download PDF

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CN203800045U
CN203800045U CN201420124319.0U CN201420124319U CN203800045U CN 203800045 U CN203800045 U CN 203800045U CN 201420124319 U CN201420124319 U CN 201420124319U CN 203800045 U CN203800045 U CN 203800045U
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lamp
wiring board
led
zener diode
led lamp
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吴迪
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本实用新型公开了一种新型LED灯及采用该LED灯的恒流灯串,所述新型LED灯,包括灯珠和齐纳二极管,所述灯珠包括凸透镜、LED芯片、反射罩、PCB线路板、PVC胶、连接线、外壳和硅树脂灯罩,所述PCB线路板为双面线路板,PCB线路板的正面设置LED芯片,PCB线路板的背面设置齐纳二极管,且齐纳二极管与LED芯片并联。所述恒流灯串,包括串联在正负线路上的多个新型LED灯,所述正负线路上还串联一个开关管和一个恒流管。该新型LED灯通过在LED芯片上并联一个齐纳二极管进行稳压,显著提高了LED灯的稳定性,且当一个LED灯损坏时,与其串联的其他的LED灯不受影响。

Description

一种新型LED灯及采用该LED灯的恒流灯串
技术领域
本实用新型属于LED灯领域,具体是一种新型LED灯及采用该LED灯的恒流灯串。
背景技术
请参阅图1,为现有通用的一种的LED灯,该LED灯包括负极引脚21、反射帽22、LED芯片23、黄金导线接合部分24、圆形环氧树脂透镜25和正极引脚26。如果采用该LED灯做成灯串,当电压或者电流不稳时,容易造成黄金导线接合部分24损坏,从而造成LED灯永久损坏,进而造成LED灯灯串断路,影响整个灯串的工作。
实用新型内容
本实用新型的目的在于提供一种新型LED灯及采用该LED灯的恒流灯串,以解决上述背景技术中提出的问题。
为实现上述目的,本实用新型提供如下技术方案:
一种新型LED灯,包括灯珠和齐纳二极管,所述灯珠包括凸透镜、LED芯片、反射罩、PCB线路板、PVC胶、连接线、外壳和硅树脂灯罩,所述PCB线路板为双面线路板,PCB线路板的正面设置LED芯片,PCB线路板的背面设置齐纳二极管,且齐纳二极管与LED芯片并联,所述连接线焊接在PCB线路板的背面的正负极焊盘上,且连接线与外壳之间注塑PVC胶,注塑PVC胶凸出外壳,所述凸透镜设置在反射罩顶部,且凸透镜和反射罩及外壳顶部用硅树脂灯罩密封。
作为本实用新型进一步的方案:所述LED芯片设有三个,且串联连接。
作为本实用新型进一步的方案:所述PCB线路板为直径为8mm圆形双面线路板。
一种采用所述的新型LED灯的恒流灯串,包括串联在正负线路上的多个新型LED灯,所述正负线路上还串联一个开关管和一个恒流管。
与现有技术相比,本实用新型的有益效果是:该新型LED灯通过在LED芯片上并联一个齐纳二极管进行稳压,显著提高了LED灯的稳定性,且当一个LED灯损坏时,与其串联的其他的LED灯不受影响。
附图说明
图1为现有LED灯的结构示意图;
图2为新型LED灯的主视结构示意图;
图3为恒流LED灯串的结构示意图。
具体实施方式
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。
请参阅图2,一种新型LED灯,包括灯珠1和齐纳二极管2,所述灯珠1包括凸透镜11、LED芯片12、反射罩13、PCB线路板14、PVC胶15、连接线16、外壳17和硅树脂灯罩17,所述PCB线路板14为双面线路板,PCB线路板14的正面设置LED芯片12,PCB线路板14的背面设置齐纳二极管2,且齐纳二极管2与LED芯片12并联,所述连接线16焊接在PCB线路板14的背面的正负极焊盘上,且连接线16与外壳17之间注塑PVC胶15,注塑PVC胶15凸出外壳17,所述凸透镜11设置在反射罩13顶部,且凸透镜11和反射罩13及外壳17顶部用硅树脂灯罩17密封,以起到防水防尘的作用 。
作为本实用新型进一步的方案:所述LED芯片12设有三个,且串联连接。
作为本实用新型进一步的方案:所述PCB线路板14为直径为8mm圆形双面线路板。
请参阅图3,一种采用上述新型LED灯的恒流灯串,包括串联在正负线路5上的多个新型LED灯(采用红、黄灯珠时,20颗串联,采用蓝、绿、白灯珠时,14颗串联),所述正负线路5上还串联一个开关管3和一个恒流管4。
本实用新型的工作原理:所述齐纳二极管2的功率为5W;所述恒流管4为50mA恒流管;所述正负线路5的输入电压为DC48V;红、黄灯珠正常工作电压2.0V,20灯串联时分得电压40V;蓝、绿、白光正常工作电压3V,14灯串联时分得电压42V ,开关管3正常工作分得电压约0.9V ,恒流管4正常工作电压1.2V至15V之间,所以在外部恒压供电红、黄灯串:2×20+0.9+1.2=42.1V的电压下即可正常恒流50mA工作;蓝、绿、白光:3×14+0.9+1.2=44.1V电压下即可正常50mA工作。 
对于本领域技术人员而言,显然本实用新型不限于上述示范性实施例的细节,而且在不背离本实用新型的精神或基本特征的情况下,能够以其他的具体形式实现本实用新型。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本实用新型的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本实用新型内。不应将权利要求中的任何附图标记视为限制所涉及的权利要求。 
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。

Claims (4)

1.一种新型LED灯,包括灯珠(1)和齐纳二极管(2),所述灯珠(1)包括凸透镜(11)、LED芯片(12)、反射罩(13)、PCB线路板(14)、PVC胶(15)、连接线(16)、外壳(17)和硅树脂灯罩(17),其特征在于,所述PCB线路板(14)为双面线路板,PCB线路板(14)的正面设置LED芯片(12),PCB线路板(14)的背面设置齐纳二极管(2),且齐纳二极管(2)与LED芯片(12)并联,所述连接线(16)焊接在PCB线路板(14)的背面的正负极焊盘上,且连接线(16)与外壳(17)之间注塑PVC胶(15),注塑PVC胶(15)凸出外壳(17),所述凸透镜(11)设置在反射罩(13)顶部,且凸透镜(11)和反射罩(13)及外壳(17)顶部用硅树脂灯罩(17)密封。
2.根据权利要求1所述的新型LED灯,其特征在于,所述LED芯片(12)设有三个,且串联连接。
3.根据权利要求1所述的新型LED灯,其特征在于,所述PCB线路板(14)为直径为8mm圆形双面线路板。
4.一种采用如权利要求1-3之一所述的新型LED灯的恒流灯串,其特征在于,包括串联在正负线路(5)上的多个新型LED灯,所述正负线路(5)上还串联一个开关管(3)和一个恒流管(4)。
CN201420124319.0U 2014-03-19 2014-03-19 一种新型led灯及采用该led灯的恒流灯串 Expired - Fee Related CN203800045U (zh)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105003844A (zh) * 2015-06-20 2015-10-28 李忠训 基于12v直流电的一体式单点可剪led注塑模组及其成型工艺
CN105590931A (zh) * 2016-01-27 2016-05-18 长兴科迪光电股份有限公司 一种带有齐纳管的食人鱼led
CN110379804A (zh) * 2019-06-10 2019-10-25 天台天宇光电股份有限公司 一种内置防击穿保护的双通led灯

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105003844A (zh) * 2015-06-20 2015-10-28 李忠训 基于12v直流电的一体式单点可剪led注塑模组及其成型工艺
CN105590931A (zh) * 2016-01-27 2016-05-18 长兴科迪光电股份有限公司 一种带有齐纳管的食人鱼led
CN110379804A (zh) * 2019-06-10 2019-10-25 天台天宇光电股份有限公司 一种内置防击穿保护的双通led灯

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