CN203796138U - Sealing device for semiconductor device door - Google Patents
Sealing device for semiconductor device door Download PDFInfo
- Publication number
- CN203796138U CN203796138U CN201420090621.9U CN201420090621U CN203796138U CN 203796138 U CN203796138 U CN 203796138U CN 201420090621 U CN201420090621 U CN 201420090621U CN 203796138 U CN203796138 U CN 203796138U
- Authority
- CN
- China
- Prior art keywords
- door
- sealing device
- sealing
- plate
- weather strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000003825 pressing Methods 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000007789 gas Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000260 silastic Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Abstract
The utility model discloses a sealing device for a semiconductor device door. The sealing device comprises a door plate and a door frame. Grooves caving towards the inner surface of the door plate are formed in the lateral sides of the door plate. Sealing strips are arranged in the grooves and are flexible parts. The position, flush with each sealing strip, of the corresponding lateral side of the door frame is provided with a plate pressing strip. At least one protruding strip which protrudes towards the outer side wall is arranged on the outer side wall of each plate pressing strip, and the protruding strips are used in cooperation for pressing the sealing strips. By fixing the pressing plate strips to the door frame, then arranging the protruding strips on the plate pressing strips and tightly pressing and fixing the protruding strips to the sealing strips in the grooves in the periphery of the door under the certain pressing force when the door is closed, linear sealing between the door and the door frame is achieved, and the sealing device is good in sealing effect, simple in structure and low in cost.
Description
Technical field
The utility model relates to field of semiconductor devices, specifically, relates to a kind of sealing device of semiconductor equipment door.
Background technology
In semiconductor manufacturing equipment, because the manufacture of silicon chip has high external environment requirement, microenvironment is needed to higher cleanliness factor and low oxygen content, with the silicon wafer quality that ensures to produce, especially along with the update of integrated circuit fabrication process, also more and more higher to the requirement of the microenvironment in semiconductor manufacturing equipment, therefore, in equipment, microenvironment need to ensure its sealing, makes the oxygen content of microenvironment in equipment reach technological standards.
In prior art, seal degree in semiconductor manufacturing equipment between door and doorframe is lower, between door and doorframe, conventionally adopt traditional door sealing structure, a kind of hermetically-sealed construction is for being provided with gasket seal between door and doorframe, gasket seal is the outer tightening seal pad of defeating in junction, make itself to deform, allow pad fill up uneven coarse with microcosmic of macroscopic view on door and doorframe sealing surface, make the mutual flow forces of working media or external substance be less than the resistance of pad, thereby realize sealing, stop and leak; Adopt this gasket seal structure smooth because two large scale plane surfaces of doorframe and door are difficult to realize, the sealing mat in the middle of causing is difficult to compress, thereby does not reach high sealability requirement.
Another kind of hermetically-sealed construction is realized sealing for being provided with gas-flow closure circle between door and doorframe, by gas-flow closure circle is inflated, make hermatic door, between doorframe and sealing ring, compress seamlessly, ensure in microenvironment that gas is without leakage, sealing effectiveness is good, this kind of method need to provide a road gas to gas-flow closure circle, and the gas that passes into gas-flow closure circle has certain pressure, and the door-plate of hermatic door is produced to vertical stress, the stressed easy generation deformation of hermatic door, and the cost of gas-flow closure circle is high.
Therefore, the sealing performance of reinforcement semiconductor equipment door becomes those skilled in the art's problem demanding prompt solution.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of sealing device of semiconductor equipment door, strengthens the sealing of semiconductor equipment door.
In order to solve the problems of the technologies described above, the utility model provides a kind of sealing device of semiconductor equipment door, comprises door-plate and doorframe; The side of described door-plate is provided with to the groove of door-plate inner surface depression, in described groove, is provided with weather strip, and described weather strip is flexible piece; The side of described doorframe and the place of aliging with described weather strip are provided with pressing article, and the lateral wall of described pressing article is provided with the outstanding protuberant bar of at least one outside sidewall, and described protuberant bar is used for coordinating the described weather strip of compression.
Preferably, the horizontal cross sectional geometry of described protuberant bar is polygon, U-shaped, circular arc or the wherein combination of any one or multiple figure.
Preferably, the protuberant bar on the lateral wall of described pressing article is multiple, and is evenly distributed on the lateral wall of described pressing article.
Preferably, described groove is 1～5mm to the depth dimensions of door-plate inner surface depression.
Preferably, the external surface of described weather strip applies seal coating.
Preferably, described pressing article and described protuberant bar are structure as a whole.
Preferably, the material of described pressing article is stainless steel.
Preferably, the material of described weather strip is silicon rubber.
The utility model is by being fixed on pressing article on doorframe, and then protuberant bar is set on pressing article, in the time that door is closed, under the effect of certain thrust, make protuberant bar be pressed abd fixed on the weather strip in a surrounding groove, and then realize the linear sealing between door and doorframe, sealing effectiveness is good, simple in structure, cost is low.
Brief description of the drawings
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, to the accompanying drawing of required use in embodiment be briefly described below, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the structural representation of the sealing device of the utility model semiconductor equipment door;
Fig. 2 is the horizontal cross of the sealing device of the utility model semiconductor equipment door;
Fig. 3 is the partial enlarged drawing of the sealing device of semiconductor equipment door in Fig. 2.
Number in the figure is described as follows:
100, door-plate; 200, pressing article; 201, protuberant bar; 300, weather strip; 400, doorframe; 500, groove.
Detailed description of the invention
Below will coordinate graphic and embodiment to describe embodiment of the present utility model in detail, and by this utility model implementation procedure how application technology means solve technical problem and reach technology effect can be fully understood and be implemented according to this.
Embodiment mono-
As shown in Figure 1 to Figure 3, the utility model provides a kind of sealing device of semiconductor equipment door, comprises door-plate 100 and doorframe 400, and the side of described door-plate 100 is provided with to the groove 500 of door-plate inner surface depression; In described groove 500, be provided with weather strip 300, described weather strip 300 is flexible piece; The side of described doorframe 400 and the place of aliging with described weather strip 300 are provided with pressing article 200, and the lateral wall of described pressing article 200 is provided with the outstanding protuberant bar of at least one outside sidewall 201, and described protuberant bar 201 compresses described weather strip 300 for coordinating.
The utility model is by being fixed on pressing article 200 on doorframe 400, and then protuberant bar 210 is set on pressing article 200, in the time that door is closed, under the effect of certain thrust, make protuberant bar 210 be pressed abd fixed on the weather strip 300 in door-plate 100 grooves 500, press seal bar 300 so realize door-plate 100 and doorframe 400 between linear sealing, increase sealing effectiveness.
In the present embodiment, the width dimensions of the width dimensions of described groove 500 and weather strip 300 adapts, and the height dimension of described weather strip 300 is greater than the depth dimensions of described groove.
Wherein, the horizontal cross sectional geometry of described protuberant bar 210 is polygon, U-shaped, circular arc or the wherein combination of any one or multiple figure, the polygonal triangle, rectangle, trapezoidal etc. of being shaped as.As shown in Figure 3, shown in pressing article 200 structures be wedge shape, i.e. rectangle and trapezoidal combination, the structure of this pressing article 200 is press seal bar 300 better.
Described pressing article 200 adopts stainless steel material, and doorframe 400 adopts aluminum alloy materials, by viscose glue, pressing article 200 is closely pasted and fixed on doorframe 400, and pressing article 200 and the doorframe 400 seamless sealings in junction, without gas permeation.
Described weather strip 300 adopts sealed material, closely sticks in the groove 500 of surrounding of door-plate 100, and when Dang Menguan closes, under the effect of external force, pressing article 200 and protuberant bar 210 compress has certain flexible weather strip 300, realizes linear sealing.Described pressing article 200 and protuberant bar 210 are structure as a whole, and the material of described weather strip 300 is silicon rubber.
Embodiment bis-
On the basis of embodiment mono-, the protuberant bar 210 on the lateral wall of described pressing article 200 is multiple, and is evenly distributed on the lateral wall of described pressing article 200.As shown in Figure 3, described door-plate 100 is provided with to the rectangular recess 500 of door-plate 100 inner surface depressions, and described groove 500 is 1～5mm to the depth dimensions of door-plate 100 inner surface depressions, and preferred, the degree of depth of groove 500 is 2mm.
Described weather strip 300 adopts silastic material, and silastic material is foam structure, for the sealing of enhanced leaktightness bar 300, applies seal coating at the external surface of weather strip 300.
In order to strengthen the sealing between door-plate 100 and doorframe 400, the four side of described doorframe 400 all fixedly mounts the pressing article 200 aliging with described weather strip 300.
Above-mentioned explanation illustrates and has described some preferred embodiments of the present utility model, but as previously mentioned, be to be understood that the utility model is not limited to disclosed form herein, should not regard the eliminating to other embodiment as, and can be used for various other combinations, amendment and environment, and can, in utility model contemplated scope described herein, change by technology or the knowledge of above-mentioned instruction or association area.And the change that those skilled in the art carry out and variation do not depart from spirit and scope of the present utility model, all should be in the protection domain of the utility model claims.
Claims (8)
1. a sealing device for semiconductor equipment door, comprises door-plate and doorframe; It is characterized in that,
The side of described door-plate is provided with to the groove of door-plate inner surface depression, in described groove, is provided with weather strip, and described weather strip is flexible piece;
The side of described doorframe and the place of aliging with described weather strip are provided with pressing article, and the lateral wall of described pressing article is provided with the outstanding protuberant bar of at least one outside sidewall, and described protuberant bar is used for coordinating the described weather strip of compression.
2. the sealing device of semiconductor equipment door according to claim 1, is characterized in that, the horizontal cross sectional geometry of described protuberant bar is polygon, U-shaped, circular arc or the wherein combination of any one or multiple figure.
3. the sealing device of semiconductor equipment door according to claim 1, is characterized in that, the protuberant bar on the lateral wall of described pressing article is multiple, and is evenly distributed on the lateral wall of described pressing article.
4. the sealing device of semiconductor equipment door according to claim 1, is characterized in that, described groove is 1～5mm to the depth dimensions of door-plate inner surface depression.
5. the sealing device of semiconductor equipment door according to claim 1, is characterized in that, the external surface of described weather strip applies seal coating.
6. according to the sealing device of the arbitrary described semiconductor equipment door of claim 1～5, it is characterized in that, described pressing article and described protuberant bar are structure as a whole.
7. according to the sealing device of the arbitrary described semiconductor equipment door of claim 1～5, it is characterized in that, the material of described pressing article is stainless steel.
8. according to the sealing device of the arbitrary described semiconductor equipment door of claim 1～5, it is characterized in that, the material of described weather strip is silicon rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420090621.9U CN203796138U (en) | 2014-02-28 | 2014-02-28 | Sealing device for semiconductor device door |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420090621.9U CN203796138U (en) | 2014-02-28 | 2014-02-28 | Sealing device for semiconductor device door |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203796138U true CN203796138U (en) | 2014-08-27 |
Family
ID=51378359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420090621.9U Expired - Lifetime CN203796138U (en) | 2014-02-28 | 2014-02-28 | Sealing device for semiconductor device door |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203796138U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103806817A (en) * | 2014-02-28 | 2014-05-21 | 北京七星华创电子股份有限公司 | Sealing device of semiconductor equipment door |
-
2014
- 2014-02-28 CN CN201420090621.9U patent/CN203796138U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103806817A (en) * | 2014-02-28 | 2014-05-21 | 北京七星华创电子股份有限公司 | Sealing device of semiconductor equipment door |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee after: North China Science and technology group Limited by Share Ltd. Address before: 100016 Jiuxianqiao East Road, Beijing, No. 1, No. Patentee before: BEIJING SEVENSTAR ELECTRONIC Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170907 Address after: 101312 Beijing city Shunyi District Zhu Yuan three Street No. 6 (Tianzhu Free Trade Zone) Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO.,LTD. Address before: 100015 No. 1 East Jiuxianqiao Road, Beijing, Chaoyang District Patentee before: North China Science and technology group Limited by Share Ltd. |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140827 |
|
| CX01 | Expiry of patent term |