CN203794799U - Flow-line preparation device for base metal composite electrode of electronic ceramic element - Google Patents
Flow-line preparation device for base metal composite electrode of electronic ceramic element Download PDFInfo
- Publication number
- CN203794799U CN203794799U CN201420074094.2U CN201420074094U CN203794799U CN 203794799 U CN203794799 U CN 203794799U CN 201420074094 U CN201420074094 U CN 201420074094U CN 203794799 U CN203794799 U CN 203794799U
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- CN
- China
- Prior art keywords
- holes
- base metal
- adhesive tape
- chip
- electronic ceramics
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000000919 ceramic Substances 0.000 title claims abstract description 43
- 239000010953 base metal Substances 0.000 title claims abstract description 41
- 238000002360 preparation method Methods 0.000 title claims abstract description 23
- 239000002131 composite material Substances 0.000 title abstract 6
- 239000007921 spray Substances 0.000 claims abstract description 47
- 239000002390 adhesive tape Substances 0.000 claims abstract description 24
- 238000005507 spraying Methods 0.000 claims abstract description 12
- 239000007772 electrode material Substances 0.000 claims description 15
- 230000007306 turnover Effects 0.000 claims description 6
- 230000005540 biological transmission Effects 0.000 abstract 5
- 239000002184 metal Substances 0.000 abstract 2
- 238000007751 thermal spraying Methods 0.000 abstract 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 239000011135 tin Substances 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001128 Sn alloy Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
Landscapes
- Coating By Spraying Or Casting (AREA)
Abstract
The utility model provides a flow-line preparation device for a base metal composite electrode of an electronic ceramic element. The electronic ceramic element comprises an electronic ceramic chip and a base metal composite electrode; the flow-line preparation device is equipped with a thermal spraying device and further equipped with a chip transmission device and a transmission control device, wherein the transmission control device is used for controlling the chip transmission device to transmit electronic ceramic chips underneath a spray gun below the thermal spraying device. The chip transmission device comprises a conveyor belt with holes, a lower adhesive tape with holes and an upper adhesive tape with holes, wherein the conveyor belt with holes is adhered to the lower adhesive tape with holes; the electronic ceramic chips are loaded in the holes of the conveyor belt with holes; the upper adhesive tape with holes are pressed and covered on the conveyor belt with holes; and holes of the conveyor belt with holes, the lower adhesive tape with holes and the upper adhesive tape with holes are corresponding in position. The flow-line preparation device for the base metal composite electrode of the electronic ceramic element disclosed by the utility model forms a composite metal base electrode spraying structure of a continuous automatic flow-line, and improves spraying efficiency of the metal base composite electrode.
Description
Technical field
The utility model relates to the technical field of the base metal combined electrode of preparing electronic ceramics element, is specifically related to a kind of streamline preparation facilities of base metal combined electrode of electronic ceramics element.
Background technology
The applicant has applied for Chinese patent " a kind of preparation facilities of base metal combined electrode of electronic ceramics element " (application number is: 201320636558X) on October 15th, 2013, a kind of preparation facilities of base metal combined electrode of electronic ceramics element is disclosed, described preparation facilities comprises hot spray apparatus, electronic ceramics chip fixture apparatus, the spray gun of described hot spray apparatus can be adjusted to facing to described electronic ceramics chip fixture apparatus, be provided with upset control device, for controlling the upset of described electronic ceramics chip fixture apparatus, also comprise: mobile controller, move the position that is used for the spray gun of controlling described electronic ceramics chip fixture apparatus and described hot spray apparatus.
In the preparation facilities of the base metal combined electrode relating in above-mentioned patent, move the position disclosing by the spray gun of electronic ceramics chip fixture apparatus and described hot spray apparatus described in mobile controller control is set, thereby carry out the spraying process of base metal combined electrode.Because the spray area of electronic ceramics chip fixture apparatus is limited, once can only spray the electronic ceramics chip of lesser amt, spray efficiency is low.
Utility model content
The utility model provides a kind of streamline preparation facilities of base metal combined electrode of electronic ceramics element, has solved the continuous automatic production line that forms compound base metal electrode spraying, improves the technical problem of the spray efficiency of base metal combined electrode.
In order to solve the problems of the technologies described above, technical solution adopted in the utility model is:
The utility model provides a kind of streamline preparation facilities of base metal combined electrode of electronic ceramics element, described electronic ceramics element comprises electronic ceramics chip and described base metal combined electrode, described streamline preparation facilities is provided with hot spray apparatus, it is characterized in that: be also provided with chip transfer apparatus and channel control unit, described channel control unit is sent to electronic ceramics chip under the spray gun of described hot spray apparatus for control chip transport unit.
Further, described hot spray apparatus is disposed with two groups of spray guns along chip delivery direction, and first group of spray gun is used for spraying the first base metal electrode materials, and second group of spray gun is used for spraying the second base metal electrode materials.
Further, described chip transfer apparatus comprises porous belt, lower adhesive tape with holes, adhesive tape with holes, described porous belt and lower adhesive tape sticking with holes, described electronic ceramics chip is loaded in the hole in porous belt, at adhesive tape with holes described in porous belt upper press cover, the position in the hole of described porous belt, lower adhesive tape with holes, adhesive tape with holes is corresponding.
Further, be also provided with turn-over control device, for controlling the turn-over of described chip transfer apparatus.
The utility model is by electronic ceramics chip is loaded on travelling belt, and by channel control unit control travelling belt, electronic ceramics chip is sent under the spray gun of hot spray apparatus, realizes the spraying of base metal electrode layer; And hot spray apparatus is disposed with two groups of spray guns along chip delivery direction, spray respectively the first base metal electrode materials and the second base metal electrode materials, thereby in chip transport process, complete and first spray the first base metal electrode layer, the operation of rear spray the second base metal electrode layer.Therefore, the streamline preparation facilities of the base metal combined electrode of electronic ceramics element of the present utility model has formed the compound base metal electrode spraying structure of continuous automatic production line, improves the spray efficiency of base metal combined electrode.
Brief description of the drawings
Fig. 1 is the structural representation of the streamline preparation facilities of the base metal combined electrode of the utility model electronic ceramics element.
Embodiment
Specifically illustrate embodiment of the present utility model below in conjunction with accompanying drawing, accompanying drawing is only for reference and use is described, does not form the restriction to the utility model scope of patent protection.
The embodiment of the base metal combined electrode of the electronic ceramics element that the utility model provides describes by following examples:
The structural representation of the streamline preparation facilities of the base metal combined electrode of a kind of electronic ceramics element that Fig. 1 provides for the utility model.Described electronic ceramics element comprises electronic ceramics chip 11 and described base metal combined electrode, described streamline preparation facilities is provided with hot spray apparatus 2, also be provided with chip transfer apparatus 1 and channel control unit 3, described channel control unit 3 is sent to electronic ceramics chip 11 for control chip transport unit 1 spray gun 21 times of described hot spray apparatus 2.
In the present embodiment, described hot spray apparatus 2 is disposed with 21, the first groups of spray guns 211 of two groups of spray guns for spraying the first base metal electrode materials along chip delivery direction, and second group of spray gun 212 is for spraying the second base metal electrode materials.
In the present embodiment, first group of spray gun 211 and second group of spray gun 212 are all only provided with a spray gun, and first group of spray gun 211 and second group of spray gun 212 can also arrange respectively branched spray gun.
In the present embodiment, described the first base metal electrode materials is aluminium, and described the second base metal electrode materials is copper, zinc, nickel or tin; According to the requirement of preparation technology's physical strength, described aluminium electrode materials can be fine aluminium, can be also that aluminium content accounts for more than 40% aluminium alloy; Copper electrode material can be fine copper, can be also that copper content accounts for more than 40% copper alloy; Zinc electrode material can be pure zinc, can be also that zinc content accounts for more than 40% zinc alloy; Nickel electrode material can be pure nickel, can be also that nickel content accounts for more than 40% nickelalloy; Tin electrode material can be pure tin, can be also that tin content accounts for more than 40% tin alloy.
In the present embodiment, described chip transfer apparatus 1 comprises porous belt 12, lower adhesive tape 13 with holes, adhesive tape with holes 14, described porous belt 12 is pasted with lower adhesive tape 13 with holes, described electronic ceramics chip 11 is loaded in the hole in porous belt 12, at adhesive tape 14 with holes described in porous belt 12 upper press covers, the position in the hole of described porous belt 12, lower adhesive tape 13 with holes, adhesive tape with holes 14 is corresponding.In the present embodiment, described porous belt 12 is paper tape.
In the present embodiment, be also provided with turn-over control device 4, for controlling the turn-over of described chip transfer apparatus.
Above disclosed is only preferred embodiment of the present utility model, can not limit rights protection scope of the present utility model with this, and the equivalent variations of therefore doing according to the utility model claim, still belongs to the scope that the utility model is contained.
Claims (4)
1. the streamline preparation facilities of the base metal combined electrode of an electronic ceramics element, described electronic ceramics element comprises electronic ceramics chip and described base metal combined electrode, described streamline preparation facilities is provided with hot spray apparatus, it is characterized in that: be also provided with chip transfer apparatus and channel control unit, described channel control unit is sent to electronic ceramics chip under the spray gun of described hot spray apparatus for control chip transport unit.
2. the streamline preparation facilities of the base metal combined electrode of electronic ceramics element according to claim 1, it is characterized in that: described hot spray apparatus is disposed with two groups of spray guns along chip delivery direction, first group of spray gun is used for spraying the first base metal electrode materials, and second group of spray gun is used for spraying the second base metal electrode materials.
3. the streamline preparation facilities of the base metal combined electrode of electronic ceramics element according to claim 1, it is characterized in that: described chip transfer apparatus comprises porous belt, lower adhesive tape with holes, adhesive tape with holes, described porous belt and lower adhesive tape sticking with holes, described electronic ceramics chip is loaded in the hole in porous belt, at adhesive tape with holes described in porous belt upper press cover, the position in the hole of described porous belt, lower adhesive tape with holes, adhesive tape with holes is corresponding.
4. according to the streamline preparation facilities of the base metal combined electrode of the electronic ceramics element described in claim 1,2 or 3, it is characterized in that: be also provided with turn-over control device, for controlling the turn-over of described chip transfer apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420074094.2U CN203794799U (en) | 2014-02-20 | 2014-02-20 | Flow-line preparation device for base metal composite electrode of electronic ceramic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420074094.2U CN203794799U (en) | 2014-02-20 | 2014-02-20 | Flow-line preparation device for base metal composite electrode of electronic ceramic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203794799U true CN203794799U (en) | 2014-08-27 |
Family
ID=51377032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420074094.2U Expired - Lifetime CN203794799U (en) | 2014-02-20 | 2014-02-20 | Flow-line preparation device for base metal composite electrode of electronic ceramic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203794799U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104299738A (en) * | 2014-09-18 | 2015-01-21 | 兴勤（常州）电子有限公司 | Novel electrode electronic component and preparation method thereof |
| CN105836435A (en) * | 2016-06-01 | 2016-08-10 | 海宁永力电子陶瓷有限公司 | PTC thermistor ceramic aluminum spraying carrier plate turnover device and aluminum spraying equipment |
-
2014
- 2014-02-20 CN CN201420074094.2U patent/CN203794799U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104299738A (en) * | 2014-09-18 | 2015-01-21 | 兴勤（常州）电子有限公司 | Novel electrode electronic component and preparation method thereof |
| CN104299738B (en) * | 2014-09-18 | 2017-10-10 | 兴勤（常州）电子有限公司 | A kind of electrodic electron component and preparation method thereof |
| CN105836435A (en) * | 2016-06-01 | 2016-08-10 | 海宁永力电子陶瓷有限公司 | PTC thermistor ceramic aluminum spraying carrier plate turnover device and aluminum spraying equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140827 |
|
| CX01 | Expiry of patent term |