CN203760425U - Etching machine - Google Patents
Etching machine Download PDFInfo
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- CN203760425U CN203760425U CN201420154267.1U CN201420154267U CN203760425U CN 203760425 U CN203760425 U CN 203760425U CN 201420154267 U CN201420154267 U CN 201420154267U CN 203760425 U CN203760425 U CN 203760425U
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- etching
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- 238000005530 etching Methods 0.000 title claims abstract description 126
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 description 15
- 230000002950 deficient Effects 0.000 description 13
- 239000007789 gas Substances 0.000 description 12
- 230000000694 effects Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 3
- 230000005684 electric field Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 241000931705 Cicada Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000036470 plasma concentration Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
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Abstract
The utility model discloses an etching machine comprising a bearing electrode plate, M pressure detection devices, an upper electrode plate and a processor. The bearing electrode plate is used for bearing an item to be etched and comprises M bearing regions, and the M is an integer larger than or equal to 2; the M pressure detection devices are respectively arranged on the M bearing regions and are used for measuring M pressure values of M portions of the item to be etched on the M bearing regions; the upper electrode plate comprises M electrode portions corresponding to the M bearing regions; the processor is connected to the M pressure detection devices and is used for controlling the etching speed of the M portions of the item to be etched according to the M pressure values.
Description
Technical field
The utility model relates to electronics manufacturing engineering field, relates in particular to a kind of etching machine.
Background technology
Current, along with informatization is flourish, as the terminal presentation facility of information issue, be widely used in the various aspects of work and life.
In the production technology of display device, need to carry out etching.Existing etching mode comprises dry etching, the thing that is etched is positioned on the battery lead plate in two battery lead plates in etching machine, in the time of described two battery lead plate energising, the plasma being ionized can be under the effect of electric field to the battery lead plate high-speed mobile of the thing that is etched described in carrying, so that the thing surface that is etched is bombarded, be etched described in the destruction film surface of thing, carries out etching to the described thing that is etched.
But there is following technical problem in above-mentioned prior art:
In the process of etching, find that part is etched thing in the time that mid portion occurred quarter, marginal portion some places also do not have etching abundant, thus the fraction defective of the thing that causes being etched is higher.
Utility model content
The application provides a kind of etching machine, improve in prior art and be etched thing in the time that mid portion occurred quarter, marginal portion some places also do not have etching abundant, the higher technical problem of fraction defective of thing causes being etched, reach the etching homogeneity of the thing that is etched described in raising, reduce the technique effect of the fraction defective of the thing that is etched.
The application provides a kind of etching machine, described etching machine comprises carrying pole plate, a M pressure-detecting device, electric pole plate and processor, described carrying pole plate is for carrying the thing that is etched, and described carrying pole plate comprises M bearing area, and described M is more than or equal to 2 integer; A described M pressure-detecting device is arranged at respectively on a described M bearing area, is carried on M force value of M part on a described M bearing area for detection of the described thing that is etched; Described electric pole plate comprises M the electrode part corresponding with a described M bearing area; Described processor is connected with a described M pressure-detecting device, for according to a described M force value, and the speed that is etched of M part of the thing that is etched described in control.
Preferably, in etching process, described etching machine also comprises the etching speed adjuster for adjusting etching speed, identical with the weight difference after etching before etching with M part of the thing that is etched described in making;
When a force value in a described M force value equals a preset value, etching speed adjuster described in described processor control, to stop the etching to part corresponding with the pressure-detecting device that detects this force value in the described thing that is etched;
When the variable quantity of the force value in a described M force value is greater than other force value in a described M force value, etching speed adjuster described in described processor control, to reduce the speed that is etched to part corresponding with the pressure-detecting device that detects this force value in the described thing that is etched;
When the variable quantity of the force value in a described M force value is less than other force value, etching speed adjuster described in described processor control, with the speed that is etched raising to part corresponding with the pressure-detecting device that detects this force value in the described thing that is etched.
Preferably, described etching speed adjuster is specially adjustment of gas concentration device;
When the variable quantity of the force value in a described M force value is greater than other force value, adjustment of gas concentration device described in described processor control, reduces with the concentration that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate;
When the variable quantity of the force value in a described M force value is less than other force value, adjustment of gas concentration device described in described processor control, raises with the concentration that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate.
Preferably, described etching speed adjuster is specially thermoregulator;
When the variable quantity of the force value in a described M force value is greater than other force value, thermoregulator described in described processor control, reduces with the temperature that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate;
When the variable quantity of the force value in a described M force value is less than other force value, thermoregulator described in described processing controls, raises with the temperature that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate.
Preferably, described etching speed adjuster is specially voltage regulator;
When the variable quantity of the force value in a described M force value is greater than other force value, voltage regulator described in described processor control, reduce voltage between the described carrying pole plate corresponding with the pressure-detecting device that detects this force value and electric pole plate;
When the variable quantity of the force value in a described M force value is less than other force value, voltage regulator described in described processing controls, increase voltage between the described carrying pole plate corresponding with the pressure-detecting device that detects this force value and electric pole plate.
Preferably, described etching machine also comprises pressure regulator, and before the thing that is etched described in described etching machine etching, pressure regulator described in described processor control, to be adjusted into zero by M initial pressure value of a described M pressure-detecting device.
Preferably, described etching machine also comprises cleaning device, completing N in etching is etched after thing, when whether described processor is greater than the second preset value for judging difference between each the first force value of a described M force value and corresponding the second force value, cleaning device described in described processor control, described carrying pole plate is cleaned, wherein, described N is more than or equal to 1 integer, described the first force value is the force value before N the thing that is etched described in etching, and described the second force value is that etching completes described N the force value after the thing that is etched.
Preferably, on each bearing area of described carrying pole plate, convex with one or more arc convex for the thing that is etched described in supporting.
Preferably, described etching machine also comprises the fixed part for fixing described carrying pole plate.
Preferably, described fixed part is specially ceramic block, and described ceramic block is fixed on the periphery of described carrying pole plate.
The application's beneficial effect is as follows:
Above-mentioned etching machine is by being divided into M bearing area by described carrying pole plate, and pressure-detecting device is set in each bearing area detects to be etched and be carried on respectively on a described M bearing area M force value partly on thing, thereby in etching process, according to the speed that is etched of M part described in processor control described in this M force value, with the homogeneity of the etching of the thing that is etched described in improving, improve in prior art and be etched thing in the time that mid portion occurred quarter, marginal portion some places also do not have etching abundant, the higher technical problem of fraction defective of thing causes being etched, reach the etching homogeneity of the thing that is etched described in raising, reduce the technique effect of the fraction defective of the thing that is etched.
Brief description of the drawings
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, the accompanying drawing in the following describes is only embodiment more of the present utility model.
Fig. 1 is the structural representation of the application's the first preferred embodiments etching machine.
Embodiment
The embodiment of the present application is by providing a kind of etching machine, improve in prior art and be etched thing in the time that mid portion occurred quarter, marginal portion some places also do not have etching abundant, the higher technical problem of fraction defective of thing causes being etched, reach the etching homogeneity of the thing that is etched described in raising, reduce the technique effect of the fraction defective of the thing that is etched.
Technical scheme in the embodiment of the present application is for solving the problems of the technologies described above, and general thought is as follows:
A kind of etching machine, described etching machine comprises carrying pole plate, a M pressure-detecting device, electric pole plate and processor, and described carrying pole plate is for carrying the thing that is etched, and described carrying pole plate comprises M bearing area, and described M is more than or equal to 2 integer; A described M pressure-detecting device is arranged at respectively on a described M bearing area, is carried on M force value of M part on a described M bearing area for detection of the described thing that is etched; Described electric pole plate comprises M the electrode part corresponding with a described M bearing area; Described processor is connected with a described M pressure-detecting device, for according to a described M force value, and the speed that is etched of M part of the thing that is etched described in control.
Above-mentioned etching machine is by being divided into M bearing area by described carrying pole plate, and pressure-detecting device is set in each bearing area detects to be etched and be carried on respectively on a described M bearing area M force value partly on thing, thereby in etching process, according to the speed that is etched of M part described in processor control described in this M force value, with the homogeneity of the etching of the thing that is etched described in improving, improve in prior art and be etched thing in the time that mid portion occurred quarter, marginal portion some places also do not have etching abundant, the higher technical problem of fraction defective of thing causes being etched, reach the etching homogeneity of the thing that is etched described in raising, reduce the technique effect of the fraction defective of the thing that is etched.
In order better to understand technique scheme, below in conjunction with Figure of description and concrete execution mode, technique scheme is described in detail.
As shown in Figure 1, be the structural representation of the application's the first preferred embodiments etching machine 100.Described etching machine 100 comprises housing 10, electric pole plate 20, carrying pole plate 30, a M pressure-detecting device 40, processor 50.
In described housing 10, offer the accommodation space 11 of a sealing, described electric pole plate 20, carrying pole plate 30 and M pressure-detecting device 40 are arranged in described accommodation space 11.In described accommodation space 11, have certain density gas as inert gas, in the time of needs etching, described gas can be ionized to plasma.
In described electric pole plate 20 and described carrying pole plate 30, one of them is positive plate, and one is minus plate.In the time of etching, described electric pole plate 20 and described carrying pole plate 30 can be passed into voltage, to form an electric field between described electric pole plate 20 and described carrying pole plate 30, the described plasma being ionized can be to described carrying pole plate 30 high-speed mobile under the effect of electric field, so that the thing surface that is etched is bombarded, the film surface of the thing that is etched described in destruction.
Described carrying pole plate 30 is for carrying the thing 200 that is etched, and described carrying pole plate 30 comprises M bearing area 31, and described M is more than or equal to 2 integer.That is to say, described carrying pole plate 30 is divided into two bearing areas 31 to I haven't seen you for ages, and certainly, the number of described bearing area 31 can be any number such as two, three, four, five, six, and concrete number can arrange as required.In addition, the size in 31Ge region, described bearing area can be identical, also can be different.
In embodiment, in order to reduce the contact area of be etched thing 200 and described carrying pole plate 30, and the space of refrigerating gas is provided, on each bearing area 31 of described carrying pole plate 30, convexes with one or more arc convex 32 for the thing 200 that is etched described in supporting.Described etching machine 100 also comprises the fixed part 33 for fixing described carrying pole plate 30.Particularly, described fixed part 33 is ceramic block, and described ceramic block is fixed on the periphery of described carrying pole plate 30.
A described M pressure-detecting device 40 is arranged at respectively on a described M bearing area 31, is carried on M force value of M part on a described M bearing area 31 for detection of the described thing 200 that is etched.Each pressure-detecting device 40 in a described M pressure-detecting device 40 can be a pressure sensor, also can comprise multiple pressure sensors.In the time that described each pressure-detecting device 40 is a pressure sensor, described force value equals this force value that pressure sensor detects; In the time that described each pressure-detecting device 40 comprises multiple pressure sensor, described force value equals the value sum of the plurality of pressure sensor.
Described processor 50 is connected with a described M pressure-detecting device 40, for according to a described M force value, and the speed that is etched of M part of the thing 200 that is etched described in control.
Equal to describe for example for 3 o'clock with described M.Equal at 3 o'clock at described M, first pressure-detecting device 40 in a described M pressure-detecting device 40 is for detection of the force value of the Part I of the thing 200 that is etched described on first bearing area 31, second pressure-detecting device 40 in a described M pressure-detecting device 40 be for detection of the force value of the Part II of the thing 200 that is etched described on second bearing area 31, and the 3rd pressure-detecting device 40 in a described M pressure-detecting device 40 is for detection of the force value of the Part III of the thing 200 that is etched described on the 3rd bearing area 31.Described processor 50 can be controlled respectively Part I, the Part II of the thing 200 that is etched, the speed that is etched of Part III according to first, second, third force value.
Above-mentioned etching machine 100 is by being divided into M bearing area by described carrying pole plate, and pressure-detecting device 40 is set in each bearing area detects be carried on respectively on the thing 200 that is etched on a described M bearing area M force value partly, thereby in etching process, control the speed that is etched of described M part according to processor 50 described in this M force value, with the homogeneity of the etching of the thing 200 that is etched described in improving, improve in prior art and be etched thing in the time that mid portion occurred quarter, marginal portion some places also do not have etching abundant, the higher technical problem of fraction defective of thing causes being etched, reach the etching homogeneity of the thing that is etched described in raising, reduce the technique effect of the fraction defective of the thing that is etched.
Particularly, described etching machine 100 also comprises the etching speed adjuster for adjusting etching speed, when a force value in described M force value equals a preset value, described processor 50 is controlled described etching speed adjuster, to stop the etching to part corresponding with the pressure-detecting device 40 that detects this force value in the described thing 200 that is etched.Continue to equal to describe as example for 3 o'clock taking the described M of aforementioned part, while supposing that first force value in described three force value is less than a preset pressure value, control the described Part I that is etched thing 200 is stopped to etching, accordingly, in the time that second force value is less than a preset pressure value, control the described Part II that is etched thing 200 is stopped to etching, in the time that the 3rd force value is less than a preset pressure value, controls the described Part III that is etched thing 200 is stopped to etching.
Particularly, M of thing 200 part that be etched described in is identical with the weight difference after etching before etching.Specifically can divide M part according to the weight being etched into, or M part identical greatly, the figure of etching is identical.In etching process, when the variable quantity of the force value in a described M force value is greater than other force value in a described M force value, described processor 50 is controlled described etching speed adjuster, to reduce the speed that is etched to part corresponding with the pressure-detecting device 40 that detects this force value in the described thing 200 that is etched; When the variable quantity of the force value in a described M force value is less than other force value, described processor 50 is controlled described etching speed adjuster, with the speed that is etched raising to part corresponding with the pressure-detecting device 40 that detects this force value in the described thing 200 that is etched.
Continue to equal to describe as example for 3 o'clock taking the described M of aforementioned part, when the variable quantity of supposing first force value in described three force value is greater than the variable quantity of the second force value and the 3rd force value, reduce the speed that is etched of the Part I to the described thing 200 that is etched, if when the variable quantity of the first force value is less than the variable quantity of the second force value and the 3rd force value, the speed that is etched of the Part I to the described thing 200 that is etched that raises; In like manner, in the time that the variable quantity of described the second force value is greater than the variable quantity of described the first force value and the 3rd force value, the speed that is etched of Part II of thing 200 is etched described in reducing, if when the variable quantity of the second force value is less than the variable quantity of described the first force value and the 3rd force value,, the speed that is etched of the Part II of rising to the described thing 200 that is etched; In the time that the variable quantity of described the 3rd force value is greater than the variable quantity of described the first force value and described the second force value, the speed that is etched of Part III of thing 200 is etched described in reducing, if when the variable quantity of the 3rd force value is less than the variable quantity of described the first force value and described the second force value, the speed that is etched of the Part III of the thing 200 that is etched described in raising.
Particularly, described etching speed adjuster can be one or more in following three kinds, below be etched described in the changing speed that is etched of thing 200 of mode:
The first: described etching speed adjuster is specially adjustment of gas concentration device 51, described processor 50 is connected with an adjustment of gas concentration device 51.As: the variable quantity of the first force value from as described in the variable quantity of the second force value and the 3rd force value when different, described processor 50 is according to adjustment of gas concentration device 51 described in described the first force value control, to change the gas concentration in the space between described Part I and electric pole plate 20, thereby change the plasma concentration between described Part I and electric pole plate 20, the plasma number that changes bombardment Part I in the unit interval, reaches the speed that is etched that changes Part I.
Particularly, when the variable quantity of the force value in a described M force value is greater than other force value, described processor 50 is controlled described adjustment of gas concentration device 51, reduces with the concentration that makes region corresponding with the pressure-detecting device 40 that detects this force value between described carrying pole plate 30 and described electric pole plate 20;
When the variable quantity of the force value in a described M force value is less than other force value, described processor 50 is controlled described adjustment of gas concentration device 51, raises with the concentration that makes region corresponding with the pressure-detecting device 40 that detects this force value between described carrying pole plate 30 and described electric pole plate 10.
The second: described etching speed adjuster is specially thermoregulator 52, described processor 50 is connected with a thermoregulator 52.As: the variable quantity of the first force value from as described in the variable quantity of the second force value and the 3rd force value when different, described processor 50 is according to thermoregulator 52 described in described the first force value control, to change the temperature on described Part I surface, thereby change the isoionic speed of service, the plasma number that changes bombardment Part I in the unit interval, reaches the speed that is etched that changes Part I.
Particularly, when the variable quantity of the force value in a described M force value is greater than other force value, described processor 50 is controlled described thermoregulator 52, reduces with the temperature that makes region corresponding with the pressure-detecting device 40 that detects this force value between described carrying pole plate 30 and described electric pole plate 20;
When the variable quantity of the force value in a described M force value is less than other force value, described processor 50 is controlled described thermoregulator 52, raises with the temperature that makes region corresponding with the pressure-detecting device 40 that detects this force value between described carrying pole plate 30 and described electric pole plate 20.
The third: described etching speed adjuster is specially voltage regulator 53, and in order to change the voltage between electric pole plate 20 and carrying pole plate 30, described voltage regulator 53 is connected with described processor 50.As: the variable quantity of the first force value from as described in the variable quantity of the second force value and the 3rd force value when different, described processor 50 is according to described the first force value control voltage regulator 53, change the voltage between the first bearing area 31 and the electric pole plate 20 that carries described Part I, thereby change the isoionic speed of service, the plasma number that changes bombardment Part I in the unit interval, reaches the speed that is etched that changes Part I.
When the variable quantity of the force value in a described M force value is greater than other force value, described processor 50 is controlled described voltage regulator 53, so that voltage between the described carrying pole plate 30 corresponding with the pressure-detecting device 40 that detects this force value and electric pole plate 20 is reduced;
When the variable quantity of the force value in a described M force value is less than other force value, described processor 50 is controlled described voltage regulator 53, so that voltage between the described carrying pole plate 30 corresponding with the pressure-detecting device 40 that detects this force value and electric pole plate 20 is increased.
Particularly, described etching machine 100 also comprises pressure regulator 60, before the thing 200 that is etched described in described etching machine 100 etchings, described processor 50 is controlled described pressure regulator 60, so that M initial pressure value of a described M pressure-detecting device 40 is adjusted into zero, again will described in the thing 200 that is etched be placed on and between described carrying pole plate 30, carry out etching, now, the force value that a described M pressure-detecting device 40 shows be etched M of thing 200 part apply with a described M bearing area on force value.M the initial pressure value by M pressure-detecting device 40 is set to zero, thereby be etched after thing 200 described in carrying, be convenient to observe the pressure changing of a described M checkout gear 40, so that the speed of being etched of described M part is adjusted according to pressure variety.
Particularly, described etching machine 100 also comprises cleaning device 70, before the described thing 200 that is etched is carried on described carrying pole plate 30, record described M the first force value, completing N in etching is etched after thing, before described carrying pole plate 30 does not carry the new thing 200 that is etched, record described M the second force value, when whether the difference in a described M force value between first force value and corresponding the second force value is greater than the second preset value, described processor 20 is controlled described cleaning device 70, described carrying pole plate 30 is cleaned wherein, described N is more than or equal to 1 integer.Described the second preset value can arrange as required, is etched the etching quality of thing 200 as prerequisite not affect etching.In the present embodiment, in the time that described the first force value is 0, directly judge whether described the second force value is greater than described the second preset value, if be greater than, send the clean information of prompting, if be not more than, continue etching.
Above-mentioned etching machine 100 is by being divided into M bearing area by described carrying pole plate, and pressure-detecting device 40 is set in each bearing area detects be carried on respectively on the thing 200 that is etched on a described M bearing area M force value partly, thereby in etching process, control the speed that is etched of described M part according to processor 50 described in this M force value, with the homogeneity of the etching of the thing 200 that is etched described in improving, improve in prior art and be etched thing in the time that mid portion occurred quarter, marginal portion some places also do not have etching abundant, the higher technical problem of fraction defective of thing causes being etched, reach the etching homogeneity of the thing that is etched described in raising, reduce the technique effect of the fraction defective of the thing that is etched.
Although described preferred embodiment of the present utility model, once those skilled in the art obtain the basic creative concept of cicada, can make other change and amendment to these embodiment.So claims are intended to be interpreted as comprising preferred embodiment and fall into all changes and the amendment of the utility model scope.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if these amendments of the present utility model and within modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (10)
1. an etching machine, is characterized in that, described etching machine comprises:
Carrying pole plate, for carrying the thing that is etched, described carrying pole plate comprises M bearing area, described M is more than or equal to 2 integer;
M pressure-detecting device, is arranged at respectively on a described M bearing area, is carried on M force value of M part on a described M bearing area for detection of the described thing that is etched;
Electric pole plate, comprises M the electrode part corresponding with a described M bearing area;
Processor, is connected with a described M pressure-detecting device, for according to a described M force value, and the speed that is etched of M part of the thing that is etched described in control.
2. etching machine as claimed in claim 1, is characterized in that, described etching machine also comprises the etching speed adjuster for adjusting etching speed, identical with the weight difference after etching before etching with M part of the thing that is etched described in making;
When a force value in a described M force value equals a preset value, etching speed adjuster described in described processor control, stops the etching to part corresponding with the pressure-detecting device that detects this force value in the described thing that is etched;
When the variable quantity of the force value in a described M force value is greater than other force value in a described M force value, etching speed adjuster described in described processor control, with the speed that is etched of part corresponding with the pressure-detecting device that detects this force value in the thing that is etched described in reducing;
When the variable quantity of the force value in a described M force value is less than other force value, etching speed adjuster described in described processor control, with the speed that is etched of part corresponding with the pressure-detecting device that detects this force value in the thing that is etched described in raising.
3. etching machine as claimed in claim 2, is characterized in that, described etching speed adjuster is specially adjustment of gas concentration device;
When the variable quantity of the force value in a described M force value is greater than other force value, adjustment of gas concentration device described in described processor control, reduces with the concentration that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate;
When the variable quantity of the force value in a described M force value is less than other force value, adjustment of gas concentration device described in described processor control, raises with the concentration that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate.
4. etching machine as claimed in claim 2, is characterized in that, described etching speed adjuster is specially thermoregulator;
When the variable quantity of the force value in a described M force value is greater than other force value, thermoregulator described in described processor control, reduces with the temperature that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate;
When the variable quantity of the force value in a described M force value is less than other force value, thermoregulator described in described processor control, raises with the temperature that makes region corresponding with the pressure-detecting device that detects this force value between described carrying pole plate and described electric pole plate.
5. etching machine as claimed in claim 2, is characterized in that, described etching speed adjuster is specially voltage regulator;
When the variable quantity of the force value in a described M force value is greater than other force value, voltage regulator described in described processor control, reduce voltage between the described carrying pole plate corresponding with the pressure-detecting device that detects this force value and electric pole plate;
When the variable quantity of the force value in a described M force value is less than other force value, voltage regulator described in described processor control, increase voltage between the described carrying pole plate corresponding with the pressure-detecting device that detects this force value and electric pole plate.
6. the etching machine as described in arbitrary claim in claim 1-5, it is characterized in that, described etching machine also comprises pressure regulator, before the thing that is etched described in described etching machine etching, pressure regulator described in described processor control, to be adjusted into zero by M initial pressure value of a described M pressure-detecting device.
7. the etching machine as described in arbitrary claim in claim 1-5, it is characterized in that, described etching machine also comprises cleaning device, completing N in etching is etched after thing, when difference in a described M force value between first force value and corresponding the second force value is greater than the second preset value, cleaning device described in described processor control, described carrying pole plate is cleaned, wherein, described N is more than or equal to 1 integer, described the first force value is the force value before N the thing that is etched described in etching, described the second force value is that etching completes described N the force value after the thing that is etched.
8. the etching machine as described in arbitrary claim in claim 1-5, is characterized in that, convexes with one or more arc convex for the thing that is etched described in supporting on each bearing area of described carrying pole plate.
9. the etching machine as described in arbitrary claim in claim 1-5, is characterized in that, described etching machine also comprises the fixed part for fixing described carrying pole plate.
10. etching machine as claimed in claim 9, is characterized in that, described fixed part is specially ceramic block, and described ceramic block is fixed on the periphery of described carrying pole plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420154267.1U CN203760425U (en) | 2014-04-01 | 2014-04-01 | Etching machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420154267.1U CN203760425U (en) | 2014-04-01 | 2014-04-01 | Etching machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203760425U true CN203760425U (en) | 2014-08-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420154267.1U Expired - Lifetime CN203760425U (en) | 2014-04-01 | 2014-04-01 | Etching machine |
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| Country | Link |
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| CN (1) | CN203760425U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995994A (en) * | 2016-12-29 | 2018-05-04 | 深圳市柔宇科技有限公司 | Dry ecthing equipment |
| CN108364845A (en) * | 2018-03-20 | 2018-08-03 | 武汉华星光电技术有限公司 | A kind of dry etching equipment |
-
2014
- 2014-04-01 CN CN201420154267.1U patent/CN203760425U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107995994A (en) * | 2016-12-29 | 2018-05-04 | 深圳市柔宇科技有限公司 | Dry ecthing equipment |
| WO2018119959A1 (en) * | 2016-12-29 | 2018-07-05 | 深圳市柔宇科技有限公司 | Dry etching apparatus |
| CN108364845A (en) * | 2018-03-20 | 2018-08-03 | 武汉华星光电技术有限公司 | A kind of dry etching equipment |
| WO2019179327A1 (en) * | 2018-03-20 | 2019-09-26 | 武汉华星光电技术有限公司 | Dry etching apparatus |
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