CN203746108U - RFID electronic tag, and film packaging material and structure thereof - Google Patents
RFID electronic tag, and film packaging material and structure thereof Download PDFInfo
- Publication number
- CN203746108U CN203746108U CN201420046199.7U CN201420046199U CN203746108U CN 203746108 U CN203746108 U CN 203746108U CN 201420046199 U CN201420046199 U CN 201420046199U CN 203746108 U CN203746108 U CN 203746108U
- Authority
- CN
- China
- Prior art keywords
- film
- electronic tag
- rfid electronic
- label body
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000005022 packaging material Substances 0.000 title abstract 3
- 238000004806 packaging method and process Methods 0.000 claims abstract description 20
- 239000010408 film Substances 0.000 claims description 42
- 238000012856 packing Methods 0.000 claims description 15
- 239000000463 material Substances 0.000 claims description 10
- 239000010409 thin film Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000003292 glue Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 210000004276 hyalin Anatomy 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 206010013932 dyslexia Diseases 0.000 description 1
- RFHAOTPXVQNOHP-UHFFFAOYSA-N fluconazole Chemical compound C1=NC=NN1CC(C=1C(=CC(F)=CC=1)F)(O)CN1C=NC=N1 RFHAOTPXVQNOHP-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
Abstract
The utility model provides an RFID electronic tag, and a film packaging material and structure thereof. The RFID electronic tag comprises a tag body, a stay wire, a chip and a coil, wherein the coil is connected to the chip, the tag body is covered by the chip, an antenna and the coil, the two ends of the antenna are respectively provided with conductive contact surfaces, the two ends of the coil are bonded via conductive resin, and the stay wire is glued to the inner surface of the tag body at a position close to the two conductive contact surfaces. The film packaging material of the RFID electronic tag comprises a film and the electronic tags, wherein the multiple electronic tags are uniformly distributed on the film. The film packaging structure of the RFID electronic tag comprises a packaged product, a film wrapping the product and the electronic tag, wherein the electronic tag is placed between the packaged product and the film, and the stay wire surrounds the packaged product for one turn, then penetrates through one section of the film, and is used as a pull head. Connection between the antenna and the coil can be controlled by the stay wire, thereby ensuring that the electronic tag can be only used for once.
Description
Technical field
The utility model relates to false proof, the automatic identification field of hyaline membrane packaging group product, particularly a kind of RFID electronic tag and film packing material thereof, thin-film packaging structure.
Background technology
RFID (Radio Frequency Identification), radio-frequency (RF) identification, is commonly called as electronic tag.RFID technology is existing developing rapidly the beginning of this century, as last century end, once someone foretold: RFID will be one of ten large new technologies of 21st century, nowadays in logistics, storage, false proof, the application of producing and selling and just having RFID at developing " Internet of Things ".The hard label that mostly is the material making such as the soft label of papery adhesive sticker adhesive type and PVC, ABS, PPS that existing market exists, these labels are deposited problem both ways:
First be packaging Problems.This class label is all by artificial or plant equipment, to be assembled separately after packing of product moulding.For hyaline membrane packaging group product, the packaging process of these products is mostly pipelining, and hardware device is fixing, if add label, or purchase independent note label machine, or existing hardware equipment is transformed.The cost which kind of mode drops into all can be very large.
Next is problem life cycle of label.Most applications, after product is used, necessity that the label in the packing of product has not had, people still fall as garbage disposal.Yet electronic tag still exists in packing, if we still can scan with electronic label reader, easily cause Dyslexia.
In sum, need especially a kind of electronic tag that does not change existing equipment, can cease to be in force automatically again after product is used.The electronic tag of controlling validity by bracing wire can well address the above problem.
Utility model content
The purpose of this utility model is in order to address the above problem, and a kind of RFID electronic tag and film packing material thereof, thin-film packaging structure are provided.
The technical solution of the utility model is: a kind of RFID electronic tag, comprise label body, bracing wire, chip, be connected to the coil on chip, described chip, antenna, coil overlay in label body, the two ends of antenna arrange respectively conductive contact surfaces, the two ends of coil are bonded on coil by conducting resinl, and described bracing wire is adhesive in the inside surface of label body near the position of two conductive contact surfaces.
Described label body outside surface is covered with Quick Response Code overlayer.
A kind of film packing material that comprises RFID electronic tag, comprise film and several foregoing RFID electronic tags, described label body and bracing wire are bonded in by glue on the surface of film, and several described RFID electronic tags are evenly distributed on film.
Described label body outside surface is covered with Quick Response Code overlayer, and this Quick Response Code overlayer is between film and label body.
A kind of thin-film packaging structure that comprises RFID electronic tag, comprise packaged product, be coated on the film of product external surfaces, this packaging structure also includes foregoing RFID electronic tag, this electronic tag is between the outside surface of packaged product and the inside surface of film, and described bracing wire passes one section of film as pull head after one week around packaged product.
Described film is heat-sealing film.
Described label body outside surface is covered with Quick Response Code overlayer, and this Quick Response Code overlayer is between film and label body.
The beneficial effects of the utility model
This RFID electronic tag is by being connected between bracing wire control antenna and coil, thereby controls the validity of this RFID electronic tag, thereby guarantees that this electronic tag can only disposablely be used.
Use the film packing material that this RFID electronic tag is made when product is packed, RFID electronic tag to be placed on packaging structure, and the unsealing pull line using the bracing wire of this electronic tag as the packing of product is used, thereby when realizing product opening, the antenna of this RFID electronic tag is torn, and realizes the disposable use of RFID electronic tag.
This wrappage can utilize existing packaging facilities, do not need to arrange separately some labelled specialized equipments, reduce investment.
Accompanying drawing explanation
Fig. 1 is the structural representation of RFID electronic tag;
Fig. 2 is the structural representation that comprises the film packing material of RFID electronic tag;
Fig. 3 is the hierarchical structure schematic diagram that comprises the thin-film packaging structure of RFID electronic tag;
Fig. 4 is the schematic diagram comprising after the packing of thin-film packaging structure of RFID electronic tag;
In figure, 1. label body, 2. bracing wire, 3. film, 4. packaged product, 5. pull head, wherein 1-1. antenna, 1-2. conductive contact surfaces, 1-3. coil, 1-4. chip.
Embodiment
Embodiment mono-: referring to Fig. 1, a kind of RFID electronic tag in figure, comprise label body, bracing wire, chip, be connected to the coil on chip, described chip, antenna, coil overlay in label body, the two ends of antenna arrange respectively conductive contact surfaces, the two ends of coil are bonded on coil by conducting resinl, and described bracing wire is adhesive in the inside surface of label body near the position of two conductive contact surfaces.
The feature of this RFID electronic tag is that its antenna ends is provided with two conductive contact surfaces, is connected to form antenna with wire between two conductive contact surfaces.By pulling bracing wire to make wire, from two surface of contact, any one departs from, and antenna just disconnects naturally, and label had just lost efficacy.
Label body outside surface in embodiment mono-can also be covered with Quick Response Code overlayer.Thereby form new embodiment, Quick Response Code overlayer can be written into more information.
Embodiment bis-: referring to Fig. 2, a kind of film packing material that comprises RFID electronic tag in figure, comprise the RFID electronic tag described in film and several embodiment mono-, described label body and bracing wire are bonded in by glue on the surface of film, and several described RFID electronic tags are evenly distributed on film.
In actual production, can set according to the horizontal level of the size of product packing box and bracing wire width, length, the label sticking position of every a slice covering film.For large-size pipeline packaging machine, also sealer directly can be made to the rolled body (being similar to adhesive tape) of specified width, which width, in certain length printing, bar line is as reference position (using while adjusting deviation).
Label body outside surface in embodiment bis-can also be covered with Quick Response Code overlayer, and this Quick Response Code overlayer is between film and label body.Thereby form new embodiment, Quick Response Code overlayer can be written into more information.
Embodiment tri-: referring to Fig. 3, a kind of thin-film packaging structure that comprises RFID electronic tag in figure, comprise packaged product, be coated on the film of product external surfaces, this packaging structure also includes the RFID electronic tag described in embodiment mono-, this electronic tag is between the outside surface of packaged product and the inside surface of film, and described bracing wire passes one section of film as pull head after one week around packaged product.Described film is heat-sealing film.
Can see that bracing wire is positioned at inner side and directly contacts with the outside surface of packaged product, label, between bracing wire and wrapping film, is done maximum advantage to be when pulling bracing wire by pull head like this, more easily disconnects the antenna in label, makes label inefficacy.
Label body outside surface in embodiment tri-can also be covered with Quick Response Code overlayer, and this Quick Response Code overlayer is between film and label body.Thereby form new embodiment, Quick Response Code overlayer can be written into more information.
Claims (7)
1. a RFID electronic tag, comprise label body, bracing wire, chip, be connected to the coil on chip, it is characterized in that: described chip, antenna, coil overlay in label body, the two ends of antenna arrange respectively conductive contact surfaces, the two ends of coil are bonded on coil by conducting resinl, and described bracing wire is adhesive in the inside surface of label body near the position of two conductive contact surfaces.
2. RFID electronic tag according to claim 1, is characterized in that: described label body outside surface is covered with Quick Response Code overlayer.
3. a film packing material that comprises RFID electronic tag, comprise film and several RFID electronic tags claimed in claim 1, it is characterized in that: described label body and bracing wire are bonded in by glue on the surface of film, several described RFID electronic tags are evenly distributed on film.
4. the film packing material that comprises RFID electronic tag according to claim 3, is characterized in that: described label body outside surface is covered with Quick Response Code overlayer, and this Quick Response Code overlayer is between film and label body.
5. a thin-film packaging structure that comprises RFID electronic tag, comprise packaged product, be coated on the film of product external surfaces, it is characterized in that: this packaging structure also includes RFID electronic tag claimed in claim 1, this electronic tag is between the outside surface of packaged product and the inside surface of film, and described bracing wire passes one section of film as pull head after one week around packaged product.
6. the thin-film packaging structure that comprises RFID electronic tag according to claim 5, is characterized in that: described film is heat-sealing film.
7. the thin-film packaging structure that comprises RFID electronic tag according to claim 5, is characterized in that: described label body outside surface is covered with Quick Response Code overlayer, and this Quick Response Code overlayer is between film and label body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420046199.7U CN203746108U (en) | 2014-01-24 | 2014-01-24 | RFID electronic tag, and film packaging material and structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420046199.7U CN203746108U (en) | 2014-01-24 | 2014-01-24 | RFID electronic tag, and film packaging material and structure thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203746108U true CN203746108U (en) | 2014-07-30 |
Family
ID=51345882
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420046199.7U Expired - Lifetime CN203746108U (en) | 2014-01-24 | 2014-01-24 | RFID electronic tag, and film packaging material and structure thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203746108U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109502159A (en) * | 2018-12-10 | 2019-03-22 | 福建省德鑫泉物联网科技有限公司 | A kind of tea-bag based on RFID electronic label |
-
2014
- 2014-01-24 CN CN201420046199.7U patent/CN203746108U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109502159A (en) * | 2018-12-10 | 2019-03-22 | 福建省德鑫泉物联网科技有限公司 | A kind of tea-bag based on RFID electronic label |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140730 |