CN203738314U - Wave-soldering transmission structure - Google Patents

Wave-soldering transmission structure Download PDF

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Publication number
CN203738314U
CN203738314U CN201420093609.3U CN201420093609U CN203738314U CN 203738314 U CN203738314 U CN 203738314U CN 201420093609 U CN201420093609 U CN 201420093609U CN 203738314 U CN203738314 U CN 203738314U
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CN
China
Prior art keywords
outer plate
drive mechanism
roller
wave
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201420093609.3U
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Chinese (zh)
Inventor
罗文欣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Haobao Technology Co ltd
Original Assignee
HB AUTOMATION EQUIPMENT Co Ltd
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Priority to CN201420093609.3U priority Critical patent/CN203738314U/en
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Publication of CN203738314U publication Critical patent/CN203738314U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to the field of wave-soldering, in particular to a wave-soldering transmission structure. The structure comprises a pawl piece and an outer link plate, a pin shaft is arranged on the outer link plate, and the structure further comprises a plurality of roller chains. Each roller chain comprises at least two inner chain links connected with one another, fixing holes are formed in the inner chain links, and the pin shaft penetrates through the fixing holes and fixes the inner chain links to the outer chain plate. Due to a multi-row chain type transmission structure of a wave-soldering device, the bearing capability and stretch resistance loads of the transmission structure to the weight of a PCB are improved, the pawl piece of the transmission structure has the higher bending resistance strength, and the requirement of the heavy type plate packaging technology is met. Meanwhile, the transmission stability is greatly improved, the service life is greatly prolonged, the quality of the transmission structure is improved, and the work benefits of the packaging technology are improved.

Description

A kind of drive mechanism of wave-soldering
Technical field
The utility model relates to wave-soldering field, is specifically related to a kind of many rows chain-type drive mechanism of Wave soldering apparatus.
Background technology
At present, comparatively conventional electronic package packaging technology equipment, as wave-soldering, in its heavy-duty drive system, transport is mainly the meshing transferring power by sprocket teeth and chain link plate, sprocket wheel drives chain operation, wherein on chain, calvus is installed, thereby drives the printed circuit board (PCB) (PCB, PrintedCircuitBoard) on calvus to carry out welding procedure.General of wave-soldering adopts single strand chain to coordinate calvus to carry out soldered circuit board, and specifically as shown in Figure 1, Fig. 1 is the schematic diagram of the single drive mechanism of prior art, and the pcb board weight of bearing of this single-row chain complete machine is 0 to 25kg.
But along with advancing by leaps and bounds of pcb board welding procedure, welding procedure and operating efficiency thereof have been had to new requirement, for example some pcb board components and parts needs tool fixture as location, the weight of its whole plate will be extended to more than 3 times, thereby existing single-row chain complete machine is difficult to realize the welding job to above-mentioned pcb board.
Utility model content
The technical problems to be solved in the utility model is, for the above-mentioned defect of prior art, provides a kind of many rows chain-type drive mechanism of Wave soldering apparatus, realizes the stove welding job excessively of heavy plate.
The utility model solves the technical scheme that its technical problem adopts: the drive mechanism that a kind of wave-soldering is provided, comprise calvus and outer plate, on this outer plate, be provided with bearing pin, also comprise some roller chains, this roller chain comprises at least two interconnective inner links, on this inner link, be provided with fixing hole, described bearing pin is fixed on inner link on outer plate through this fixing hole.
Wherein, preferred version is: described inner link comprises two inner plates, is arranged at two sleeve and rollers between inner plate, and this sleeve passes roller and is connected with two inner plates, is matched in clearance between roller and sleeve.
Wherein, preferred version is: described inner link is two, and described outer plate comprises the first outer plate and the 3rd outer plate that are arranged at two inner link outer ends, is provided with the second outer plate between two inner links.
Wherein, preferred version is: described bearing pin comprises stiff end and free end, and this stiff end is riveted on the 3rd outer plate, and free end is connected with calvus with after the first outer plate through two inner links, the second outer plate.
Wherein, preferred version is: on described calvus, have pin-and-hole, described bearing pin passes this pin-and-hole and is connected with calvus by latch fitting.
Wherein, preferred version is: described latch fitting is shell fragment.
Wherein, preferred version is: described outer plate and inner plate are ' 8 ' font structure.
Wherein, preferred version is: described outer plate is some, and its quantity is corresponding with the quantity of roller chain, by this some outer plate, some roller chains is connected together.
Wherein, preferred version is: drive mechanism according to claim 1, is characterized in that: described some roller chains are transversely arranged, and two described inner links longitudinally arrange.
The beneficial effects of the utility model are, compared with prior art, the utility model is by many rows chain-type drive mechanism of a kind of Wave soldering apparatus of design, improve ability to bear and the stretch-proof load of drive mechanism to pcb board weight, the calvus of this drive mechanism has higher bending strength, meets the packaging technology demand of heavy plate; Increase substantially transmission stability and service life simultaneously, improve the quality of drive mechanism, improve the working efficiency of packaging technology.
Brief description of the drawings
Below in conjunction with drawings and Examples, the utility model is described in further detail, in accompanying drawing:
Fig. 1 is the schematic diagram of the single drive mechanism of prior art;
Fig. 2 is the schematic diagram of the utility model drive mechanism;
Fig. 3 is the fractionation schematic diagram of the utility model drive mechanism;
Fig. 4 is the combination schematic diagram of the utility model drive mechanism and guide rail.
Detailed description of the invention
Now by reference to the accompanying drawings, preferred embodiment of the present utility model is elaborated.
As shown in Figures 2 and 3, a kind of drive mechanism of wave-soldering is provided, comprise some roller chains 1, calvus 2, outer plate 3 and bearing pin 4, this bearing pin 4 is arranged on outer plate 3, this roller chain 1 comprises at least two interconnective inner links 11, on this inner link 11, be provided with fixing hole 114, described bearing pin 4 is fixed on inner link 11 on outer plate 3 through this fixing hole 114.
Further, described inner link 11 comprises roller 111, sleeve 112 and two inner plates 113, sleeve 112 and inner plate 113 are arranged between two inner plates 113, roller 111 is arranged in sleeve 112, this sleeve 112 passes roller 111 and is connected with two inner plates 113, and this roller 111 is matched in clearance with sleeve 112; On described calvus 2, have pin-and-hole 21, described bearing pin 4 passes this pin-and-hole 21 and is connected with calvus 2 by latch fitting 5, and the other end of calvus 2 is provided with to support and hooks pawl, and wherein latch fitting 5 is shell fragments.
A kind of preferred embodiment is further provided, inner link 11 is two, outer plate comprises the first outer plate 31 and the 3rd outer plate 33 that are arranged at two inner link outer ends, between two inner links, be provided with the second outer plate 32, bearing pin 4 comprises stiff end and free end, this stiff end is riveted on the 3rd outer plate 33, and free end is connected with calvus 2 after passing two inner links 11, the second outer plate 32 and the first outer plate 31, and wherein the second outer plate 32 is Multilayer Structures; With reference to figure 3, two fixing holes 114 of inner link 11 are connected with one end through hole of two outer plates 3 respectively simultaneously, ensure the stability of inner link 11, and some inner links 11 can be combined into roller chain 1.
Further, this outer plate 3 and inner plate 113 are ' 8 ' font structure; Outer plate 3 is some, and its quantity is corresponding with the quantity of roller chain 1, by this some outer plate 3, some roller chains 1 is connected together, and some roller 1 chains are transversely arranged, and two inner links 11 longitudinally arrange.
As shown in Figure 4, provide a kind of drive mechanism to contact with guide rail the preferred embodiment being connected.This drive mechanism is arranged on the guide rail 6 of packaging technology equipment, and its middle guide 6 is provided with secondary guide rail 61, and this roller 111 contacts with guide rail 6, and roller 111 is for forming rolling friction at transmission process and the secondary guide rail 61 of described guide rail 6; Wherein two cover drive mechanisms are located at the left and right sides, and it is relative that the support of both calvus 2 hooks pawl, and pcb board 7, in the time of encapsulation work, is placed on two supports and hooks between pawl.Wherein, secondary guide rail 61 is round bars.
Further, when calvus 2 is placed pcb board 7, support hook pawl because of weight issue can be to the inside roller chain 1 direction tilt, thereby drive roller chain 1 to tilt at guide rail 6 places, therefore the utility model adopts duplex chain 1 structure, and set up secondary guide rail 61 with the inclination contact both sides place of roller chain 1 in guide rail 6, anti-click banking stop 2 over-tiltings, thereby can effectively solve the load-carrying problem of calvus 2, increase the weight of transport, improve operating efficiency; And secondary guide rail 61 contacts with the roller 111 of roller chain 1, roller 111 and sleeve 112 matched in clearance, therefore roller chain 1 reduces with the relative friction of guide rail 6; And in the time that calvus 2 carries pcb board 7, the pressure that rolling friction produces bearing pin 4 is less, thereby can effectively reduce calvus 2 jitter problems, increase transportation system's stability, improve operating efficiency.
In the utility model, this packaging technology equipment is Wave soldering apparatus.
As described above, be only the utility model most preferred embodiment, and not for limiting scope of the present utility model, all equivalences of doing according to the utility model claim change or modify, and are all the utility model and contain.

Claims (9)

1. the drive mechanism of a wave-soldering, comprise calvus and outer plate, on this outer plate, be provided with bearing pin, it is characterized in that: also comprise some roller chains, this roller chain comprises at least two interconnective inner links, on this inner link, be provided with fixing hole, described bearing pin is fixed on inner link on outer plate through this fixing hole.
2. drive mechanism according to claim 1, it is characterized in that: described inner link comprises two inner plates, is arranged at two sleeve and rollers between inner plate, this sleeve passes roller and is connected with two inner plates, is matched in clearance between roller and sleeve.
3. drive mechanism according to claim 2, is characterized in that: described inner link is two, and described outer plate comprises the first outer plate and the 3rd outer plate that are arranged at two inner link outer ends, is provided with the second outer plate between two inner links.
4. drive mechanism according to claim 3, is characterized in that: described bearing pin comprises stiff end and free end, and this stiff end is riveted on the 3rd outer plate, and free end is connected with calvus with after the first outer plate through two inner links, the second outer plate.
5. drive mechanism according to claim 4, is characterized in that: on described calvus, have pin-and-hole, described bearing pin passes this pin-and-hole and is connected with calvus by latch fitting.
6. drive mechanism according to claim 5, is characterized in that: described latch fitting is shell fragment.
7. according to the drive mechanism described in any one in claim 2 to 5, it is characterized in that: described outer plate and inner plate are ' 8 ' font structure.
8. drive mechanism according to claim 7, is characterized in that: described outer plate is some, and its quantity is corresponding with the quantity of roller chain, by this some outer plate, some roller chains is connected together.
9. drive mechanism according to claim 1, is characterized in that: described some roller chains are transversely arranged, and two described inner links longitudinally arrange.
CN201420093609.3U 2014-03-03 2014-03-03 Wave-soldering transmission structure Expired - Lifetime CN203738314U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420093609.3U CN203738314U (en) 2014-03-03 2014-03-03 Wave-soldering transmission structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420093609.3U CN203738314U (en) 2014-03-03 2014-03-03 Wave-soldering transmission structure

Publications (1)

Publication Number Publication Date
CN203738314U true CN203738314U (en) 2014-07-30

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104806697A (en) * 2015-03-27 2015-07-29 杭州万隆链传动科技股份有限公司 Graphite-embedded sleeve roller chain and manufacturing method
CN109533791A (en) * 2018-12-10 2019-03-29 嘉善县奔达链条厂 A kind of carrier chain is pulled over mechanism
CN109533803A (en) * 2018-11-08 2019-03-29 深圳市浩宝技术有限公司 A kind of pcb board transport device
CN113830493A (en) * 2021-11-03 2021-12-24 江苏丰东热技术有限公司 Heat treating stove transmission chain
CN117020485A (en) * 2023-08-04 2023-11-10 北京石油化工学院 8-shaped expansion corrugated pipe mobile welding robot and design method thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104806697A (en) * 2015-03-27 2015-07-29 杭州万隆链传动科技股份有限公司 Graphite-embedded sleeve roller chain and manufacturing method
CN104806697B (en) * 2015-03-27 2017-01-11 杭州萧山万隆机械有限公司 Graphite-embedded sleeve roller chain and manufacturing method
CN109533803A (en) * 2018-11-08 2019-03-29 深圳市浩宝技术有限公司 A kind of pcb board transport device
CN109533791A (en) * 2018-12-10 2019-03-29 嘉善县奔达链条厂 A kind of carrier chain is pulled over mechanism
CN113830493A (en) * 2021-11-03 2021-12-24 江苏丰东热技术有限公司 Heat treating stove transmission chain
CN117020485A (en) * 2023-08-04 2023-11-10 北京石油化工学院 8-shaped expansion corrugated pipe mobile welding robot and design method thereof

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20220616

Address after: 518000 office building 201, No. 1, Tianyang Sixth Road, Dongfang community, Songgang street, Bao'an District, Shenzhen, Guangdong Province

Patentee after: SHENZHEN HAOBAO TECHNOLOGY Co.,Ltd.

Address before: 518000 Haobao Industrial Park, No. 43, Shajing xinerhongxiang Industrial Zone, Bao'an District, Shenzhen, Guangdong Province

Patentee before: HB AUTOMATION EQUIPMENT Co.,Ltd.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20140730

CX01 Expiry of patent term