CN203738234U - IC card manufacturing equipment and IC card cutting device - Google Patents
IC card manufacturing equipment and IC card cutting device Download PDFInfo
- Publication number
- CN203738234U CN203738234U CN201420041681.1U CN201420041681U CN203738234U CN 203738234 U CN203738234 U CN 203738234U CN 201420041681 U CN201420041681 U CN 201420041681U CN 203738234 U CN203738234 U CN 203738234U
- Authority
- CN
- China
- Prior art keywords
- guide rail
- axis guide
- laser generator
- cutter sweep
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims description 19
- 238000012546 transfer Methods 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 description 4
- 238000004080 punching Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Abstract
The utility model relates to the technical field of IC card manufacturing, in particular to an IC card cutting device which comprises a machine frame. The machine frame is provided with a working platform for placing of a material plate. An XY moving platform is arranged above the machine frame. A laser generator which can be driven by the XY moving platform to move on a horizontal plane and can be used for cutting the material plate is arranged on the XY moving platform. The laser generator is placed above the working platform. The utility model further provides IC card manufacturing equipment which comprises a cutting working position. The IC card cutting device is arranged on the cutting working position. The laser generator is used for carrying out laser cutting on the material plate, the material plate or the laser generator are controlled to move through the XY moving platform, and various shapes of holes cut in the material plate can be formed, namely a locating hole and an IC chip hole can be formed in the same laser cutting working position. Due to the fact that the laser generator is high in cutting speed, the edge of the locating hole and the edge of the chip hole are smooth, and the phenomenon of burrs can be avoided.
Description
Technical field
The utility model relates to the technical field of manufacturing IC-card sheet, the particularly manufacturing equipment of IC-card sheet and cutter sweep thereof.
Background technology
In existing IC-card sheet production process, on flitch, punching is to adopt die punching, but mold production process is had relatively high expectations and structure is more complicated, increases production cost.In addition, every mould can only be gone out a kind of pass, and the locating hole of processing on flitch and IC chip hole need to adopt the respectively punchings of two molds, and is divided into two stations and carries out, can not process locating hole and IC chip hole at same station simultaneously, reduce production efficiency and machining accuracy.In addition, locating hole and IC chip hole need to be divided into two stations processes, and also causes production line long, and the location of the linking between two stations is comparatively complicated, consuming time longer.
Utility model content
Not enough for prior art, the utility model proposes manufacturing equipment and the cutter sweep thereof of IC-card sheet, be intended to solve in existing IC-card sheet production, owing to adopting die punching, locating hole and IC chip hole need to be divided into two stations and process and cause that cost is high, efficiency is low, precision is low and the problem of length consuming time.
The technical scheme the utility model proposes is:
The cutter sweep of IC-card sheet, comprise frame, described frame is provided with the workbench of putting flitch, described frame top is provided with XY motion platform, described XY motion platform is provided with and can is driven at horizontal plane and be moved and for cutting the laser generator of described flitch, described laser generator is placed in described workbench top by it.
Further, be included in detent mechanism that flitch is positioned before cutting and transfer the extremely transfer mechanism on described workbench of flitch behind described detent mechanism location.
Further, detent mechanism comprise be located at locating platform in frame, be located at the conveyer belt in same level in described locating platform and with described locating platform, by flitch inhale deliver to the material loading sucker of described conveyer belt and be located on described locating platform and be positioned at described conveyer belt direction of advance laterally, vertical location-plate, described located lateral plate and described vertical location-plate form right angle on described locating platform, at angle, described angle is greater than 0 ° and be less than 90 ° for described vertical location-plate and conveyer belt direction of advance shape.
Further, the angle ranging from 45 °.
Further, described transfer mechanism is for transferring sucker.
Further, described laser generator has light out part, and the light that described light out part sends is perpendicular to described workbench.
Further, described XY motion platform comprises Y-axis guide rail and X-axis guide rail, described X-axis guide rail is located on described Y-axis guide rail, described laser generator is located on described X-axis guide rail, described X-axis platform and described Y-axis platform are all parallel with described workbench, described Y-axis guide rail one end is provided with the Y-axis driver element that drives described X-axis guide rail to move on Y-axis guide rail, and described X-axis guide rail one end is provided with the X-axis driver element that drives described laser generator to move on described X-axis guide rail.
Further, comprise closed loop servo-control system, described XY motion platform is connected with described closed loop servo-control system.
According to above-mentioned technical scheme, the beneficial effect of the utility model cutter sweep: adopt laser generator to carry out laser cutting to flitch, and control mobile flitch or laser generator moves by XY motion platform, can make being shaped as of the hole of cutting on flitch multiple, that is to say, locating hole and IC chip hole all can complete at same laser cutting station, because laser generator cutting speed is fast, make the smooth of the edge of locating hole and IC chip hole, can not have the phenomenon of burr.
The utility model also provides the manufacturing equipment of IC-card sheet, comprises cutting work station, and described cutting work station is provided with the cutter sweep of above-mentioned IC-card sheet.
According to above-mentioned technical scheme, the beneficial effect of the manufacturing equipment of IC-card sheet of the present utility model: owing to adopting above-mentioned cutter sweep, locating hole and IC chip hole on flitch are completed in same cutting work station, avoided the production line of manufacture IC-card sheet long, increase floor space.
Accompanying drawing explanation
Fig. 1 is the top view of the cutter sweep that provides of the utility model embodiment;
Fig. 2 is the front view of the detent mechanism that provides of the utility model embodiment;
Fig. 3 is the schematic diagram of the Corrections Division in the detent mechanism that provides of the utility model embodiment.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
As shown in Figures 1 to 3, the preferred embodiment providing for the utility model.
As shown in Figure 1, the utility model embodiment proposes the cutter sweep of IC-card sheet, comprise frame 1, frame 1 is provided with workbench 11, flitch 100 is seated on workbench 11, frame 1 top is provided with XY motion platform 2, XY motion platform 2 moves above workbench 11, XY motion platform 2 is provided with and can is driven at horizontal plane and be moved and for cutting the laser generator 3 of flitch 100 by XY motion platform 2, laser generator 3 is placed in workbench 11 tops, and XY motion platform 2 drives laser generator 3 to move flitch 100 is cut above workbench 11.
Above workbench 11, laser generator 3 is under XY motion platform 2 drives, can above workbench 11, move, different according to the motion track of laser generator 3, laser generator 3 can cut out difform hole on flitch 100, for this reason, locating hole on flitch 100 and IC chip hole, adopt cutter sweep of the present utility model, can complete cutting at a station, improve production efficiency, and because having omitted the station that is transferred to processing IC chip hole from the station of processing locating hole, improved machining accuracy.The laser generator of this cutter sweep cutting speed when processing locating hole and IC chip hole is fast, makes the smooth of the edge of locating hole and IC chip hole, can not have the phenomenon of burr.
As shown in Figure 2, frame 1 is comprised of several connecting rods 12, and workbench 11 is located at the top of frame 1.
As shown in Figures 2 and 3, cutter sweep is also included in detent mechanism 13 that flitch 100 is positioned before cutting and transfers flitch 100 behind detent mechanism 13 location to the transfer mechanism (not marking in the drawings) on workbench 11.Before to flitch 100 cuttings, first through 13 pairs of flitch 100 of detent mechanism, position, improve the precision of cutting.
Detent mechanism 13 comprises the locating platform 135 be located in frame 1, be located in locating platform 135 and with the upper surface of locating platform 135 conveyer belt 131 in same level, flitch 100 is inhaled and is delivered to the material loading sucker 132 of conveyer belt 131 and be located on locating platform 135 and be positioned at the located lateral plate 133 of conveyer belt 131 directions of advance, vertical location-plate 134, located lateral plate 133 forms right angle with vertical location-plate 134 on locating platform 135, perpendicular location-plate 134 and conveyer belt 131 direction of advance shapes are a at angle, and angle a is greater than 0 ° and be less than 90 °.
By material loading sucker 132, draw flitch 100, and flitch 100 is placed on conveyer belt 131, under the drive of conveyer belt 131, flitch 100 moves along conveyer belt 131 directions of advance, flitch 100 moves a certain distance rear one side and first relies on the side of vertical location-plate 134, because the motive force of conveyer belt 131 and vertical location-plate 134 tilt in conveyer belt 131 directions of advance at horizontal plane, slowly slide again to the side of located lateral plate 133, and with lean on the side to located lateral plate 133, with it simultaneously, its opposite side leans on the side of located lateral plate 133, thereby realize to revise the position of flitch 100 self, then, by transfer mechanism, the flitch of having had good positioning 100 is transferred on workbench 11 again, wherein, transfer mechanism is mobile sucker.
In the present embodiment, angle a is preferably 45 °, can certainly be other angle, as 30 °, 60 °.
In the present embodiment, laser generator 3 has light out part (not marking in the drawings), and the light that light out part sends is perpendicular to workbench 11.The light that light out part sends is vertical with the flitch 100 on workbench 11, is convenient to like this by calculating XY motion platform 2 shift positions, thereby determines that laser generator 3 emits beam in the position of flitch 100 cuttings.
Certainly, the light that light out part sends also can favour workbench 11, like this when determining cutting position, also should add the distance of light that light out part sends and workbench 11 inclinations.
As shown in Figure 1, XY motion platform 2 comprises Y-axis guide rail 21 and X-axis guide rail 22, X-axis guide rail 22 is located on Y-axis guide rail 21, laser generator 3 is located on X-axis guide rail 22, X-axis platform 22 and Y-axis platform 21 are all parallel with workbench 11, Y-axis guide rail 21 one end are provided with the Y-axis driver element 211 that drives X-axis guide rail 22 to move on Y-axis guide rail 21, and X-axis guide rail 22 one end are provided with the X-axis driver element 221 that driving laser generator 3 moves on X-axis guide rail 22.
Under the driving of X-axis driver element 221, X-axis guide rail 22 drives laser generator 3 to move along X-axis, in like manner, under the driving of Y-axis driver element 211, Y-axis guide rail 21 drives X-axis guide rail 22 moving along y-axis shift, because laser generator 3 is located on X-axis guide rail 22, for this reason, under the driving of Y-axis driver element 211, Y-axis guide rail 21 drives laser generator 3 moving along y-axis shift.
In the present embodiment, X-axis driver element 221 and Y-axis driver element 211 are all servomotor.
In the present embodiment, XY motion platform 2 is connected with closed loop servo-control system (not marking in the drawings).Cutter sweep adopts closed loop servo-control system, controls XY motion platform 2, makes the adjusting location of laser generator 3 more convenient.
The utility model embodiment also provides the manufacturing equipment of IC-card sheet, comprises cutting work station, and cutting work station is provided with the cutter sweep of above-mentioned IC-card sheet.
The manufacturing equipment of this IC-card sheet, owing to adopting above-mentioned cutter sweep, completes locating hole and IC chip hole on flitch in same cutting work station, has avoided the production line of manufacture IC-card sheet long, increases floor space.
These are only preferred embodiment of the present utility model, not in order to limit the utility model, all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.
Claims (9)
- The cutter sweep of 1.IC card, comprise frame, described frame is provided with the workbench of putting flitch, it is characterized in that, described frame top is provided with XY motion platform, described XY motion platform is provided with and can is driven at horizontal plane and be moved and for cutting the laser generator of described flitch, described laser generator is placed in described workbench top by it.
- 2. the cutter sweep of IC-card sheet as claimed in claim 1, is characterized in that, is included in detent mechanism that flitch is positioned before cutting and transfers the extremely transfer mechanism on described workbench of flitch behind described detent mechanism location.
- 3. the cutter sweep of IC-card sheet as claimed in claim 2, it is characterized in that, detent mechanism comprises the locating platform of being located in frame, be located in described locating platform and with the conveyer belt of described locating platform in same level, flitch is inhaled and delivered to the material loading sucker of described conveyer belt and be located on described locating platform and be positioned at the horizontal of described conveyer belt direction of advance, vertical location-plate, described located lateral plate and described vertical location-plate form right angle on described locating platform, described vertical location-plate and conveyer belt direction of advance shape are at angle, described angle is greater than 0 ° and be less than 90 °.
- 4. the cutter sweep of IC-card sheet as claimed in claim 3, is characterized in that, the angle ranging from 45 °.
- 5. the cutter sweep of IC-card sheet as claimed in claim 2, is characterized in that, described transfer mechanism is for transferring sucker.
- 6. the cutter sweep of IC-card sheet as claimed in claim 1, is characterized in that, described laser generator has light out part, and the light that described light out part sends is perpendicular to described workbench.
- 7. the cutter sweep of IC-card sheet as claimed in claim 1, it is characterized in that, described XY motion platform comprises Y-axis guide rail and X-axis guide rail, described X-axis guide rail is located on described Y-axis guide rail, described laser generator is located on described X-axis guide rail, described X-axis platform and described Y-axis platform are all parallel with described workbench, described Y-axis guide rail one end is provided with the Y-axis driver element that drives described X-axis guide rail to move on Y-axis guide rail, and described X-axis guide rail one end is provided with the X-axis driver element that drives described laser generator to move on described X-axis guide rail.
- 8. the cutter sweep of the IC-card sheet as described in as arbitrary in claim 1～7, is characterized in that, comprise closed loop servo-control system, described XY motion platform is connected with described closed loop servo-control system.
- The manufacturing equipment of 9.IC card, is characterized in that, comprises cutting work station, and described cutting work station is provided with the cutter sweep of the IC-card sheet as described in as arbitrary in claim 1～8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420041681.1U CN203738234U (en) | 2014-01-22 | 2014-01-22 | IC card manufacturing equipment and IC card cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420041681.1U CN203738234U (en) | 2014-01-22 | 2014-01-22 | IC card manufacturing equipment and IC card cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203738234U true CN203738234U (en) | 2014-07-30 |
Family
ID=51338097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420041681.1U Expired - Lifetime CN203738234U (en) | 2014-01-22 | 2014-01-22 | IC card manufacturing equipment and IC card cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203738234U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103753027A (en) * | 2014-01-22 | 2014-04-30 | 深圳西龙同辉技术股份有限公司 | IC card manufacturing equipment and IC card cutting device |
| CN107919230A (en) * | 2017-12-13 | 2018-04-17 | 广州明森科技股份有限公司 | A kind of contactless smart card automatic coiling device |
-
2014
- 2014-01-22 CN CN201420041681.1U patent/CN203738234U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103753027A (en) * | 2014-01-22 | 2014-04-30 | 深圳西龙同辉技术股份有限公司 | IC card manufacturing equipment and IC card cutting device |
| CN103753027B (en) * | 2014-01-22 | 2015-09-16 | 深圳西龙同辉技术股份有限公司 | The manufacturing equipment of IC-card sheet and cutter sweep thereof |
| CN107919230A (en) * | 2017-12-13 | 2018-04-17 | 广州明森科技股份有限公司 | A kind of contactless smart card automatic coiling device |
| CN107919230B (en) * | 2017-12-13 | 2023-10-31 | 广州明森科技股份有限公司 | Automatic winding device of non-contact intelligent card |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140730 |