CN203734922U - Cover film offset detection system of flexible circuit board - Google Patents
Cover film offset detection system of flexible circuit board Download PDFInfo
- Publication number
- CN203734922U CN203734922U CN201420014398.XU CN201420014398U CN203734922U CN 203734922 U CN203734922 U CN 203734922U CN 201420014398 U CN201420014398 U CN 201420014398U CN 203734922 U CN203734922 U CN 203734922U
- Authority
- CN
- China
- Prior art keywords
- coverlay
- offset detection
- circuit board
- hole
- cover film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 title claims abstract description 49
- 239000013039 cover film Substances 0.000 title abstract 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 229920003266 Leaf® Polymers 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 9
- 238000004080 punching Methods 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a cover film offset detection system of a flexible circuit board, and belongs to the technical field of circuit board processing. The system comprises a circuit board and a cover film. The circuit board is provided with electrical elements. The cover film is provided with component holes corresponding to the electrical elements on the circuit board. The cover film needs two adjacent component holes which are punched by a pair of moulds, and outer sides of the component holes are provided with component hole offset detection labels. Copper foil of the circuit board is provided with a plurality of cover film offset detection labels. The cover film offset detection labels comprise four same fanshaped sections which are arranged at equal interval. The cover film is provided with four round holes concentric with the four fanshaped sections on the corresponding positions of the cover film offset detection labels on the circuit board copper foil. The system enables efficient detection of offset conditions of two adjacent component holes punched by two pairs of moulds and offset conditions of cover film adhesion. The system is convenient and rapid, and production efficiency is improved.
Description
Technical field
The utility model belongs to wiring board processing technique field, is specially a kind of coverlay offset detection system of flexible circuit board.
Background technology
Flexible circuit board is protection circuit and client's demand; need on conductor, make insulating cover; on cover layer, be processed with the element through hole corresponding with electronic component on wiring board; coverlay aligned position after processing is fitted in the circuit board; coverlay and base material are fitted tightly; form complete wiring board, but in the process of cover layer machine component through hole and laminating coverlay, have following problem:
1. when two part opening close together and while needing mould stamp, because of the restriction of mould self-condition, need to use the separately punching of two secondary moulds, and just have shift phenomenon when two secondary die operation.
2. need element through hole is corresponding one by one with electronic component in coverlay laminating process, coverlay also easily exists and pastes inclined to one side phenomenon.
Utility model content
The purpose of this utility model is the defect for prior art, provide a kind of can be for quickly and easily to needing the coverlay offset detection system of the flexible circuit board that the skew situation of skew situation between two adjacent elements through holes of two secondary die punchings and coverlay laminating detects on coverlay.
The technical scheme that realizes above-mentioned purpose is: the coverlay offset detection system of flexible circuit board, it is characterized in that: comprise wiring board and coverlay, on wiring board, be provided with electric component, on described coverlay, be provided with wiring board on the electric elements relative element through hole of answering, on coverlay, respectively need two adjacent element through hole outsides of a secondary die punching to be provided with element through hole offset detection label, the center hole that described element through hole offset detection label comprises and uniform ring are around four circular holes identical with center hole size of center hole surrounding, center hole is identical with the distance of four circular holes in ring week, and equal to need to allow between two adjacent element through holes of two secondary die punchings the tolerance of skew, the center hole of described offset detection label is gone out by the secondary mould in two secondary moulds, four circular holes of center hole surrounding are gone out by another the secondary mould in two secondary moulds.
On the Copper Foil of described wiring board, be provided with multiple coverlay offset detection labels, described coverlay offset detection label comprises the fan shape leaf of four identical equidistant layouts, and the interior ring limit of four fan shape leafs and outer annular edge are arranged on same circumference; The correspondence position of the coverlay offset detection label on described coverlay and copper foil of circuit board is provided with the circular hole with four fan shape leaf concentrics, the radius of the circular hole of the correspondence position setting of the coverlay offset detection label on coverlay and copper foil of circuit board is greater than the radius of the fan shape leaf of coverlay offset detection label, and the distance on the outer annular edge of four fan shape leafs of described coverlay offset detection label and coverlay between the outer side edges of corresponding circular hole equals the laminating misalignment tolerances of coverlay.
Described coverlay offset detection label is separately positioned on four corners of wiring board.
Need two adjacent element through hole skew situation judging principles of two secondary die punchings: by estimating the center hole of element through hole offset detection label and encircling between four all circular holes whether have intersection, if have, represent to exceed between element adjacent through-holes the deviation of permission.
Coverlay laminating skew situation judging principle: by range estimation, whether covered corresponding offset detection label completely on coverlay with the circular hole of the correspondence position setting of offset detection label, if do not have, coverlay laminating exceeds the deviation of permission.
The utility model has been realized the efficient detection of the skew situation of the skew situation that needs on coverlay between element through hole that two of two secondary die punchings are adjacent and coverlay laminating, convenient and swift, has improved production efficiency and economic benefit.
Brief description of the drawings
Fig. 1 is the structural representation of wiring board;
Fig. 2 is the structural representation of coverlay;
Fig. 3 is the detection schematic diagram of coverlay offset detection label.
Embodiment
As Fig. 1, 2, shown in 3, the utility model comprises wiring board 1 and coverlay 2, on wiring board 1, be provided with electric component 3, on described coverlay 2, be provided with the element through hole 4 corresponding with electric component 3 on wiring board 1, on coverlay 2, need the outside of two element through holes 4 that two secondary moulds punch to be respectively provided with element through hole offset detection label 5, the center hole 6 that described element through hole offset detection label 5 comprises and uniform ring are around four circular holes 7 identical with center hole 6 sizes of center hole 6 surroundings, center hole 6 is identical with the spacing of four circular holes 7 in ring week, and between two adjacent element through holes 4 that equal to need two secondary moulds to punch respectively, allow the tolerance of skew, the center hole 6 of described offset detection label 5 is gone out by a secondary mould wherein, four circular holes 7 of center hole 6 surroundings are gone out by another secondary mould.
Four corners of the Copper Foil of wiring board 1 are respectively arranged with a coverlay offset detection label 8, described coverlay offset detection label 8 comprises the fan shape leaf 9 of four identical equidistant layouts, and the interior ring limit of four fan shape leafs 9 and outer annular edge are arranged on same circumference; The correspondence position of the coverlay offset detection label 8 on described coverlay 2 and copper foil of circuit board is provided with the circular hole 10 with four fan shape leaf concentrics, the radius of the circular hole 10 of the correspondence position setting of the coverlay offset detection label 8 on the Copper Foil of coverlay 2 and wiring board 1 is greater than the radius of the fan shape leaf 9 of coverlay offset detection label 8, and the distance on the outer annular edge of four fan shape leafs 9 of described coverlay offset detection label 8 and coverlay 2 between the outer side edges of corresponding circular hole 10 equals the laminating misalignment tolerances of coverlay 2.
Claims (3)
1. the coverlay offset detection system of flexible circuit board, it is characterized in that: comprise wiring board and coverlay, on wiring board, be provided with electric component, on described coverlay, be provided with wiring board on the electric elements relative element through hole of answering, on coverlay, respectively need two adjacent element through hole outsides of a secondary die punching to be provided with element through hole offset detection label, the center hole that described element through hole offset detection label comprises and uniform ring are around four circular holes identical with center hole size of center hole surrounding, center hole is identical with the spacing of four circular holes in ring week, and between two adjacent element through holes that equal each needs one secondary die punching, allow the tolerance of skew, the center hole of described offset detection label is gone out by the secondary mould in two secondary moulds, four circular holes of center hole surrounding are gone out by another the secondary mould in two secondary moulds.
2. the coverlay offset detection system of flexible circuit board according to claim 1, it is characterized in that: on the Copper Foil of described wiring board, be provided with multiple coverlay offset detection labels, described coverlay offset detection label comprises the fan shape leaf of four identical equidistant layouts, and the interior ring limit of four fan shape leafs and outer annular edge are arranged on same circumference; The correspondence position of the coverlay offset detection label on described coverlay and copper foil of circuit board is provided with the circular hole with four fan shape leaf concentrics, the radius of the circular hole of the correspondence position setting of the coverlay offset detection label on coverlay and copper foil of circuit board is greater than the radius of the fan shape leaf of coverlay offset detection label, and the distance on the outer annular edge of four fan shape leafs of described coverlay offset detection label and coverlay between the outer side edges of corresponding circular hole equals the laminating misalignment tolerances of coverlay.
3. the coverlay offset detection system of flexible circuit board according to claim 2, is characterized in that: described coverlay offset detection label is separately positioned on four corners of wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420014398.XU CN203734922U (en) | 2014-01-10 | 2014-01-10 | Cover film offset detection system of flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420014398.XU CN203734922U (en) | 2014-01-10 | 2014-01-10 | Cover film offset detection system of flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203734922U true CN203734922U (en) | 2014-07-23 |
Family
ID=51204958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420014398.XU Expired - Lifetime CN203734922U (en) | 2014-01-10 | 2014-01-10 | Cover film offset detection system of flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203734922U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604554A (en) * | 2016-12-29 | 2017-04-26 | 深圳市鑫达辉软性电路科技有限公司 | Flexible circuit board covering film deviation detection method |
| CN106941761A (en) * | 2017-04-20 | 2017-07-11 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible PCB |
-
2014
- 2014-01-10 CN CN201420014398.XU patent/CN203734922U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106604554A (en) * | 2016-12-29 | 2017-04-26 | 深圳市鑫达辉软性电路科技有限公司 | Flexible circuit board covering film deviation detection method |
| CN106941761A (en) * | 2017-04-20 | 2017-07-11 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible PCB |
| CN106941761B (en) * | 2017-04-20 | 2019-11-19 | 苏州市华扬电子股份有限公司 | A kind of target practice hole orifice ring of flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140723 |
|
| CX01 | Expiry of patent term |