CN203734628U - Digital amplifier chip with built-in DSP (digital signal processor) equalizer and 3D (three-dimensional) surround sound effect processor - Google Patents
Digital amplifier chip with built-in DSP (digital signal processor) equalizer and 3D (three-dimensional) surround sound effect processor Download PDFInfo
- Publication number
- CN203734628U CN203734628U CN201420118566.XU CN201420118566U CN203734628U CN 203734628 U CN203734628 U CN 203734628U CN 201420118566 U CN201420118566 U CN 201420118566U CN 203734628 U CN203734628 U CN 203734628U
- Authority
- CN
- China
- Prior art keywords
- module
- equalizer
- sound effect
- input
- built
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a digital amplifier chip with a built-in DSP (digital signal processor) equalizer and a 3D (three-dimensional) surround sound effect processor. The digital amplifier chip with the built-in DSP equalizer and the 3D surround sound effect processor comprises an audio signal interface, the equalizer, the 3D surround sound effect processor with a built-in DSP, a loudspeaker compensation module, an amplitude-limiting and volume control module, a 3D noise shaping and kaka sound removing module, a PWM (pulse-width modulation) controller, a pre-driver module, an EMI (electro magnetic interference) frequency spread module, an H-bridge drive module used for driving an external loudspeaker, an I2C controller, an LDO (low dropout regulator) module, a band gap reference voltage source, a sampling frequency detector and a phase-locked loop. According to the digital amplifier chip with the built-in DSP equalizer and the 3D surround sound effect processor, the problem of sound quality deterioration caused by the fact that repeated digital/analogue conversion is required to be performed when the conventional power amplifier receives an analogue audio signal is avoided; meanwhile, the processing of a sound effect in a digital audio input signal is not limited.
Description
Technical field
The utility model relates to a kind of digital amplifier chip, is specifically related to a kind of built-in DSP equalizer and the 3D digital amplifier chip around audio processing.
Background technology
21 century will be digitlization, informationalized epoch, and brand-new technical system will cause brand-new technical industry revolution.The SACD form of current up-to-date proposition emerges in an endless stream especially, from MPEG-1 to MPEG-2, from dolby digital (AC-3) to DTS etc.The digital power amplifier focus that all big enterprises pay close attention in the world especially.It is reported, the maximum audio-visual equipment manufacturer in the whole world prepares to release its digital power amplifier product recently, even very famous sound equipment manufacturer also will release digital power amplifier.This is mainly to acoustic pursuit because of digital times people.Therefore, the spring of digital power amplifier at hand, and, in the competition of this number of fields word power amplifier technology, have only constantly bring forth new ideas could maintenance technology leading position.Deepen continuously along with electronic system is digitized, increasing equipment adopts digital mode to carry out recording musical signal, especially in the processing of audio signal, intelligent television, high-grade flat-panel devices, smart mobile phone, the fields such as home theater and PC playback system, need low distortion, high efficiency digital power amplification system.Although current each integrated circuit producer has all released digital acoustic field processing, numeral Karaoke and dolby digital decoding integrated circuit.But because current power amplifier mostly can only receive simulated audio signal, so the interface of each integrated circuit is also simulated mostly, this just need to carry out mould/number, D/A switch repeatedly, can introduce thus quantizing noise, signal to noise ratio is restricted greatly, makes sound quality deterioration.In analog signal, carry out in addition audio processing and have significant limitation.
Utility model content
The utility model provides built-in DSP equalizer and the 3D digital amplifier chip around audio processing, has solved existing power amplifier and mostly can only receive the problem of simulated audio signal.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopts is:
Built-in DSP equalizer and 3D be around the digital amplifier chip of audio processing, comprise audio signal interface, equalizer, 3D around sound effect processor, loudspeaker compensating module, amplitude limit and volume control module, 3D noise shaped and Ka Ka sound remove module, PWM controller, prime driver module, EMI exhibition frequency module, in order to drive H bridge driver module, I2C controller, LDO module, band-gap voltage reference, sample frequency detector and the phase-locked loop of outside loudspeaker, described sample frequency detector and equalizer all receive numerical value audio input signal by audio signal interface, described sample frequency detector output end is connected with the input of phase-locked loop, the output of described equalizer is connected around the input of sound effect processor with 3D, described 3D is connected with the input of loudspeaker compensating module around the output of sound effect processor, described loudspeaker compensating module output is connected with the input of amplitude limit and volume control module, the output of described amplitude limit and volume control module is connected with the input that 3D noise shaped and Ka Ka sound are removed module, described 3D noise shaped is connected with the input of PWM controller with the output that Ka Ka sound is removed module, described PWM controller output end is connected with the input of prime driver module, the output of described prime driver module is connected with the PWM input of H bridge driver module, the spread spectrum signal input of described H bridge driver module is connected with EMI exhibition frequency module, it is described chip power supply that described band-gap voltage reference connects LDO module, and described I2C controller receives I2C serial data data, controls described chip.
Described H bridge driver module is also connected with overheat protector module, overcurrent protection module, overvoltage protective module and under-voltage protection module.
The 3D that described 3D is built-in DSP around sound effect processor is around sound effect processor.
The beneficial effects of the utility model are: the utility model directly receives digital audio input signal by audio signal interface, remove module around sound effect processor, loudspeaker compensating module, amplitude limit and volume control module, 3D noise shaped and Ka Ka sound audio is processed by equalizer, 3D, convert audio signal to pwm signal by PWM controller, by the radio-frequency component filtering of pwm signal, be reduced into the audio signal output of simulation by prime driver module, EMI exhibition frequency module and H bridge driver module; Avoid traditional power amplifier to receive simulated audio signal, need to carry out D/A switch repeatedly, made sound quality deterioration; In digital audio input signal, process audio and do not have limitation simultaneously.
Brief description of the drawings
Fig. 1 is structured flowchart of the present utility model.
Embodiment
Below in conjunction with Figure of description, the utility model is described in further detail.Following examples are only for the technical solution of the utility model is more clearly described, and can not limit protection range of the present utility model with this.
As shown in Figure 1, built-in DSP equalizer and 3D be around the digital amplifier chip of audio processing, the 3D that comprises audio signal interface, equalizer, built-in DSP around sound effect processor, loudspeaker compensating module, amplitude limit and volume control module, 3D noise shaped and Ka Ka sound remove module, PWM controller, prime driver module, EMI exhibition frequency module, in order to drive H bridge driver module, I2C controller, LDO module, band-gap voltage reference, sample frequency detector and the phase-locked loop of outside loudspeaker.
Sample frequency detector and equalizer all receive digital audio input signal by audio signal interface, described sample frequency detector output end is connected with the input of phase-locked loop, the output of described equalizer is connected around the input of sound effect processor with 3D, described 3D is connected with the input of loudspeaker compensating module around the output of sound effect processor, described loudspeaker compensating module output is connected with the input of amplitude limit and volume control module, the output of described amplitude limit and volume control module is connected with the input that 3D noise shaped and Ka Ka sound are removed module, described 3D noise shaped is connected with the input of PWM controller with the output that Ka Ka sound is removed module, described PWM controller output end is connected with the input of prime driver module, the output of described prime driver module is connected with the PWM input of H bridge driver module, the spread spectrum signal input of described H bridge driver module is connected with EMI exhibition frequency module.It is described chip power supply that described band-gap voltage reference connects LDO module, and described I2C controller receives I2C serial data data, controls described chip.
The function of above-mentioned parts is as follows:
Audio signal interface: this interface can directly be inputted the digital audio input signal of 24 I2 s, the direct access of the digital audio input signal of 24 I2 s has reduced the noise causing in signals transmission greatly.
Sample frequency detector: for detection of the sample frequency of digital audio input signal of input I2s, when detecting that, after the sample frequency of signal, chip internal can be adjusted to suitable clock signal.
Phase-locked loop: detect after correct sample frequency at sample frequency detector, phase-locked loop produces corresponding over-sampling frequency signal with this frequency signal, and phase-locked loop can produce the frequency of 256 times or 512 times pwm signals.
3D is around sound effect processor: the in the situation that of the loudspeaker close together of left and right, the sound of L channel can pass to auris dextra, and right channel sound can pass to left ear, and the 3D of built-in DSP is around processing the effect that can produce virtual three-dimensional sound.
Loudspeaker compensating module: be used for eliminating the frequency that caused by sound chamber and the distortion of individual features, due to the restriction in overall loudspeaker space, loudspeaker are usually designed to ultra-thin, and the compensation of the frequency to loudspeaker and phase place is just particularly important like this.
Amplitude limit and volume control module: amplitude limiting processing is mainly the peak-peak for limiting output signal in this module; thereby limit the maximum power of whole output; and then protection loudspeaker are not damaged; in this module, adopt automatic gain control and then further improve tonequality simultaneously, volume adjusting adopts soft start volume control and then smooth adjustment volume.
3D noise shaped and Ka Ka sound are removed module: adopt 5 rank noise shaped circuit, the noise within the scope of low frequency and audio bandwidth is shaped to high-frequency region, thereby the noise within the scope of audio bandwidth is reduced.At power initiation, while closing, the design all adopts card card sound to remove design, thus the audio visual effect obtaining while making startup and shutdown.
PWM controller: the audio signal that 3D noise shaped and Ka Ka sound are removed module output is converted into pwm signal in PWM controller module.
Prime driver module: pwm signal enters prime and drives processing, controls comprising dead band, increases in advance driving force etc.
EMI opens up frequency module: exhibition frequency module is for reducing EMI, produces chattering frequency to reduce the energy of PWM centre frequency by prime driver module.
H bridge driver module: output stage drives and is used for driving outside loudspeaker.Each passage is made up of four FET devices.For to not having individual passage to protect, described H bridge driver module is also connected with overheat protector module, overcurrent protection module, overvoltage protective module and under-voltage protection module.
LDO module receives the high voltage of band-gap voltage reference, exports the required low-voltage of whole chip.
I2C controller: control module is used for, receiving after I2c control signal, carrying out the control of whole chip.Its support unit and long numeric data read-write operation are controlled data internal state counter, support normal speed (100KZ) and the operation of (400KZ) at a high speed, the control data of I2c are programmed at the various counting device chip internal after I2C control module.
Above-mentioned built-in DSP equalizer and 3D directly receive digital audio input signal around the digital amplifier chip of audio processing by audio signal interface, remove module around sound effect processor, loudspeaker compensating module, amplitude limit and volume control module, 3D noise shaped and Ka Ka sound audio is processed by equalizer, 3D, convert audio signal to pwm signal by PWM controller, by the radio-frequency component filtering of pwm signal, be reduced into the audio signal output of simulation by prime driver module, EMI exhibition frequency module and H bridge driver module; Avoid traditional power amplifier to receive simulated audio signal, need to carry out D/A switch repeatedly, made sound quality deterioration; In digital audio input signal, process audio and do not have limitation simultaneously.
More than show and described general principle of the present utility model, principal character and advantage.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that in above-described embodiment and specification, describes just illustrates principle of the present utility model; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (3)
1. built-in DSP equalizer and 3D, around the digital amplifier chip of audio processing, is characterized in that: comprise audio signal interface, equalizer, 3D around sound effect processor, loudspeaker compensating module, amplitude limit and volume control module, 3D noise shaped and Ka Ka sound remove module, PWM controller, prime driver module, EMI exhibition frequency module, in order to drive H bridge driver module, I2C controller, LDO module, band-gap voltage reference, sample frequency detector and the phase-locked loop of outside loudspeaker;
Described sample frequency detector and equalizer all receive digital audio input signal by audio signal interface, described sample frequency detector output end is connected with the input of phase-locked loop, the output of described equalizer is connected around the input of sound effect processor with 3D, described 3D is connected with the input of loudspeaker compensating module around the output of sound effect processor, described loudspeaker compensating module output is connected with the input of amplitude limit and volume control module, the output of described amplitude limit and volume control module is connected with the input that 3D noise shaped and Ka Ka sound are removed module, described 3D noise shaped is connected with the input of PWM controller with the output that Ka Ka sound is removed module, described PWM controller output end is connected with the input of prime driver module, the output of described prime driver module is connected with the PWM input of H bridge driver module, the spread spectrum signal input of described H bridge driver module is connected with EMI exhibition frequency module,
It is described chip power supply that described band-gap voltage reference connects LDO module, and described I2C controller receives I2C serial data data, controls described chip.
2. built-in DSP equalizer according to claim 1 and 3D, around the digital amplifier chip of audio processing, is characterized in that: described H bridge driver module is also connected with overheat protector module, overcurrent protection module, overvoltage protective module and under-voltage protection module.
3. built-in DSP equalizer according to claim 1 and 3D, around the digital amplifier chip of audio processing, is characterized in that: the 3D that described 3D is built-in DSP around sound effect processor is around sound effect processor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420118566.XU CN203734628U (en) | 2014-03-17 | 2014-03-17 | Digital amplifier chip with built-in DSP (digital signal processor) equalizer and 3D (three-dimensional) surround sound effect processor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420118566.XU CN203734628U (en) | 2014-03-17 | 2014-03-17 | Digital amplifier chip with built-in DSP (digital signal processor) equalizer and 3D (three-dimensional) surround sound effect processor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203734628U true CN203734628U (en) | 2014-07-23 |
Family
ID=51204669
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420118566.XU Expired - Fee Related CN203734628U (en) | 2014-03-17 | 2014-03-17 | Digital amplifier chip with built-in DSP (digital signal processor) equalizer and 3D (three-dimensional) surround sound effect processor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203734628U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948116A (en) * | 2017-10-31 | 2018-04-20 | 北京理工大学 | Power amplifier device based on polarization modulation |
-
2014
- 2014-03-17 CN CN201420118566.XU patent/CN203734628U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107948116A (en) * | 2017-10-31 | 2018-04-20 | 北京理工大学 | Power amplifier device based on polarization modulation |
| CN107948116B (en) * | 2017-10-31 | 2020-02-11 | 北京理工大学 | Power amplifying device based on polar modulation |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104937844B (en) | Optimize loudness and dynamic range between different playback apparatus | |
| CN102724462A (en) | Volume adjusting method and device | |
| TW200610402A (en) | System and method for high-quality variable speed playback of audio-visual media | |
| CN201590835U (en) | High-fidelity sound reproduction system | |
| WO2015127832A1 (en) | Mobile terminal for realizing high-fidelity music playback | |
| EP1494504A3 (en) | Audio data processing device, audio data processing method, program for the same, and recording medium for the program recorded therein | |
| CN203734628U (en) | Digital amplifier chip with built-in DSP (digital signal processor) equalizer and 3D (three-dimensional) surround sound effect processor | |
| CN106941643B (en) | A kind of multi-functional intelligent sound control method of set | |
| CN102404517A (en) | Television device and sound accompanying and debugging method thereof | |
| CN101789258B (en) | Vehicle-mounted DVD (Digital Video Disk) navigation and video-audio device adopting purely digital audio processing | |
| WO2008129853A1 (en) | Audio band extension device | |
| CN206313981U (en) | A kind of wireless network audio high-fidelity streaming media playing machine | |
| CN202353798U (en) | Audio processor of digital cinema | |
| CN201937549U (en) | Audio power amplification system and audio equipment | |
| CN201601598U (en) | Protector of power supply and speaker | |
| CN207780781U (en) | Device and electronic equipment applied to translator | |
| CN204068875U (en) | based on the multi-channel digital audio amplifier of FPGA | |
| CN204314675U (en) | A kind of one-in-and-two-out DSP audio process | |
| CN203563181U (en) | Mobile terminal having KTS sound effect | |
| CN202496002U (en) | Audio signal outputting and processing circuit and television | |
| CN203761573U (en) | Electronic acoustic splitter | |
| CN204090111U (en) | The pneumatic type height figure sound system of modular DSP digital technology adjustment | |
| TWI256623B (en) | Equalizer for high density optical disc reproducing apparatus and equalizing method therefor | |
| CN201622847U (en) | Vehicle-mounted DVD navigation video and audio device adopting all-digital audio processing | |
| CN202285418U (en) | Digital telephone set top box |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20170317 |