CN203720406U - Packaging structure of luminous power adjustable combiner - Google Patents

Packaging structure of luminous power adjustable combiner Download PDF

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Publication number
CN203720406U
CN203720406U CN201420018977.1U CN201420018977U CN203720406U CN 203720406 U CN203720406 U CN 203720406U CN 201420018977 U CN201420018977 U CN 201420018977U CN 203720406 U CN203720406 U CN 203720406U
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China
Prior art keywords
array
adjustable
luminous power
optical attenuator
optical
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Withdrawn - After Issue
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CN201420018977.1U
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Chinese (zh)
Inventor
闫超
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BROADEX TECHNOLOGIES Co Ltd
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BROADEX TECHNOLOGIES Co Ltd
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Abstract

The utility model relates to a packaging structure of a luminous power adjustable combiner. The packaging structure of the luminous power adjustable combiner comprises a packaging box composed of an upper cover and a lower bottom, wherein a control circuit board is fixed to the lower bottom, a silicon waveguide array variable optical attenuator and an array waveguide optical grating are fixed to the control circuit board, and a fiber channel of the silicon waveguide array variable optical attenuator and a fiber channel of the array waveguide optical grating are correspondingly connected through fibers. The silicon waveguide array variable optical attenuator based on the photoelectric absorption effect is adopted to manufacture the luminous power adjustable combiner, the reliability is good, the response speed is fast, the response time reaches the microsecond level, heating is not required, and power consumption is lower.

Description

A kind of encapsulating structure of luminous power adjustable combiner
Technical field
The utility model is related to the luminous power adjustable combiner in technical field of optical fiber, more particularly to a kind of encapsulating structure that luminous power adjustable combiner is made based on silicon waveguide type array adjustable optical attenuator.
Background technology
As fiber optic communication develops to high-speed, Large Copacity direction, erbium-doped fiber amplifier (Erbium-DopedFiber Amplifier, referred to as " EDFA ") it is combined as the technical way in this system with dense wave division multipurpose (DenseWavelengthDivisionMultiplexing, simple " DWDM ") technology.Luminous power adjustable combiner (referred to as " VMUX ") is the core devices in dwdm system, with wide market prospects, it can solve due to the power saltus step that the gain brought using fiber amplifier is brought when levelling and passage do not increase and decrease, by entering Mobile state adjustment to each channel optical power of system to reach equilibrium, so as to realize long range high speed error free transmission of the optical signal in dwdm system.
Luminous power adjustable combiner is main to be formed by two optical devices of array waveguide grating and array adjustable optical attenuator and control Circuit assembly.The array adjustable optical attenuator used in traditional luminous power adjustable combiner is formed using silica waveguiding structure or Polymer waveguide structure fabrications, its principle is the thermo-optic effect changed using the refractive index of waveguide material with temperature, by changing waveguide temperature, change the percent of pass of light in the waveguide(Attenuation).The adjustable optical attenuator that both make is required for heating and can be just operated, therefore power consumption is higher;In addition, the adjustable optical attenuator convergent response of silica waveguiding structure and Polymer structure fabrications is slow, generally Millisecond;Particularly, the long-term reliability of the adjustable optical attenuator of Polymer structure fabrications is poor, the need for the adjustable optical attenuator that obvious this technology mode is made does not adapt to luminous power adjustable combiner product Long-Term Properties, the quality and performance of whole product are difficult to be optimal, the potential risk that product is present can not be excluded, once product causes failure because reliability is bad, cause the influence of network problem big, used to client and issue handling after sale brings very big trouble.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of encapsulating structure of luminous power adjustable combiner, to improve product quality, optimization properties of product, ensures using reliably and with long-term for product.
The utility model solves the technical scheme that its technical problem used:There is provided to be fixed with control board, the control board on a kind of encapsulating structure of luminous power adjustable combiner, including the packaging cartridge being made up of upper lid and bottom, the bottom and be further fixed on silicon waveguide type array adjustable optical attenuator and array waveguide grating;The optical-fibre channel of the silicon waveguide type array adjustable optical attenuator is connected with the optical-fibre channel of array waveguide grating by the way that optical fiber is corresponding.
The silicon waveguide type array adjustable optical attenuator includes the array adjustable optical attenuator chip, input optical fibre array, output optical fibre array of silicon waveguide type;The input of the array adjustable optical attenuator chip is connected with the input optical fibre array, and output end is connected with the output optical fibre array;The input optical fibre array is connected with the optical-fibre channel of the array waveguide grating;The output optical fibre array is connected with the output optical fibre of luminous power adjustable combiner.
The structure of the input optical fibre array and output optical fibre array is V-groove structure, U-type groove structure, slab construction or capillary pipe structure.
The silicon waveguide type array adjustable optical attenuator is fixed in the control board by the supporting plate of intermediate projections.
The array waveguide grating is the array waveguide grating of individual packages;The array adjustable optical attenuator is the array adjustable optical attenuator of individual packages.
The port number of described silicon waveguide type array adjustable optical attenuator is M × N, wherein, 1≤M≤96,1≤N≤96;Described array waveguide grating is the array waveguide grating of multichannel, its port number is 16,32,40,48,80 or 96.
Beneficial effect
As a result of above-mentioned technical scheme, the utility model compared with prior art, has the following advantages that and good effect:The utility model makes luminous power adjustable combiner using the silicon waveguide type array adjustable optical attenuator based on photoelectric absorption effect, and fast response time can reach Microsecond grade;And it is low in energy consumption using silicon waveguide type array adjustable optical attenuator without heating;Luminous power adjustable combiner its good reliability in the utility model, whole technical process quality is easily controlled, suitable batch production, can ensure using reliably and with long-term for product.
Brief description of the drawings
Fig. 1 is luminous power adjustable combiner appearance schematic diagram of the present utility model;
Fig. 2 is silicon waveguide type array adjustable optical attenuator composition structural representation in the utility model;
Fig. 3 is silicon waveguide type array adjustable optical attenuator scheme of installation in the utility model;
Fig. 4 is luminous power adjustable combiner packaging cartridge bottom of the present utility model structural representation;
Fig. 5 is the connection diagram of silicon waveguide type array adjustable optical attenuator and array waveguide grating in luminous power adjustable combiner of the present utility model;
Fig. 6 is luminous power adjustable combiner overall package structural representation of the present utility model;
Fig. 7 is the curve map of silicon waveguide type array adjustable optical attenuator response time in the utility model.
Embodiment
With reference to specific embodiment, the utility model is expanded on further.It should be understood that these embodiments are merely to illustrate the utility model rather than limit scope of the present utility model.In addition, it is to be understood that after the content of the utility model instruction has been read, those skilled in the art can make various changes or modifications to the utility model, and these equivalent form of values equally fall within the application appended claims limited range.
Embodiment of the present utility model is related to a kind of encapsulating structure of luminous power adjustable combiner, as shown in Figure 1, Figure 4 and Figure 5, including the packaging cartridge being made up of upper lid 4 and bottom 5, it is fixed with the bottom 5 in control board 3, the control board 3 and is further fixed on silicon waveguide type array adjustable optical attenuator 1 and array waveguide grating 2;The optical-fibre channel of the silicon waveguide type array adjustable optical attenuator 1 is connected with the optical-fibre channel of array waveguide grating 2 by the way that optical fiber is corresponding.
As shown in Fig. 2 the silicon waveguide type array adjustable optical attenuator 1 includes the array adjustable optical attenuator chip 6, input optical fibre array 7, output optical fibre array 8 of silicon waveguide type;The input of the array adjustable optical attenuator chip 6 is connected with the input optical fibre array 7, and output end is connected with the output optical fibre array 8;The input optical fibre array 7 is connected with the optical-fibre channel of the array waveguide grating 2;The output optical fibre array 8 is connected with the output optical fibre of luminous power adjustable combiner.Wherein, the structure of the input optical fibre array 7 and output optical fibre array 8 is V-groove structure, U-type groove structure, slab construction, capillary pipe structure or other structures.
As shown in figure 3, the array adjustable optical attenuator chip 6 of silicon waveguide type, input optical fibre array 7 and the type arched structure of output optical fibre array 8, pass through the supporting plate 9 of intermediate projections(Such as pcb board)Silicon waveguide type array adjustable optical attenuator 1 is arranged in control board 3.Wherein, the size of the intermediate raised portion of supporting plate 9 and array adjustable optical attenuator chip 6 is mutually matched.On the premise of radiating is ensured, silicon waveguide index and SiO are solved on the utility model also slave module rigging position2The encapsulation problem that the component arcuate configuration that optical fibre refractivity difference is caused is brought.
It is to be based on Mach-Zehnder using the adjustable attenuator of silica waveguiding structure(Mach-Zehnder)Principle of interference is made, it is necessary to change the refractive index of a wherein conductive arm by being heated after being powered up to chip, so as to change the phase and light path of the Shu Guang.Product power consumption is larger after heating.And the operation principle for the silicon waveguide type array adjustable optical attenuator that the utility model is used is the sink effect based on free carrier in solid sorbent light, therefore without heating.So that 15dB decays as an example, the power consumption of luminous power adjustable combiner of silicon waveguide type array adjustable optical attenuator is used for 120~150mW of every passage, and uses the power consumption of the luminous power adjustable combiner of the adjustable attenuator of silica waveguiding structure for 200~250mW.As can be seen here, compared to the luminous power adjustable combiner using silica waveguiding structure, the utility model need not be heated using silicon waveguide type array adjustable optical attenuator, and power consumption is lower.
Make to further illustrate the utility model with 1 × 40 luminous power adjustable combiner below.
Step one:Such as Fig. 2, by silicon waveguide type array adjustable optical attenuator chip 6(The silicon waveguide type array adjustable optical attenuator chip is 4x4 passages)With input optical fibre array 7(The input optical fibre array is 4 passages)And output optical fibre array 8(The output optical fibre array is 4 passages)It is packaged, produces silicon waveguide type array adjustable optical attenuator 1,10 array adjustable optical attenuators are produced in the same way as described above, individual packages can be carried out by every 2~3, and test out the optical property of its each optical-fibre channel.
Step 2:By array waveguide grating 2(The array waveguide grating is 40 passages)Individual packages are carried out, and test out the optical property of its each optical-fibre channel.
Step 3:Such as Fig. 4, array waveguide grating 2 and silicon waveguide type array adjustable optical attenuator 1 are fixed in control board 3, control board 3 is fixed on luminous power adjustable combiner packaging cartridge bottom 5, assembled according to designed module position, the array waveguide grating of 40 passages needs the silicon waveguide type array adjustable optical attenuator 1 of 10 4x4 passages matched.Wherein, silicon waveguide type array adjustable optical attenuator 1 is fixed in the control board by the supporting plate of intermediate projections.
Step 4:Such as Fig. 5, the optical fiber of the respective channel of array waveguide grating 2 and the optical fiber of the respective channel of silicon waveguide type array adjustable optical attenuator 1 are subjected to welding connection, and with pyrocondensation protection of pipe fusion point, the optical fiber connected is reasonably coiled in packaging cartridge.
Step 5:Input end fiber and output end optical fiber are individually fixed in input light end rubber cap and output light end rubber cap, and by the corresponding aperture of 5 sides of rubber cap installation packaging cartridge bottom.
Step 6:Such as Fig. 6, the Butt Assembling in the way of designing by encapsulation box cover 4 and bottom 5 completes the final assembling of luminous power adjustable combiner, forms structure as shown in Figure 1.
Step 7:As conventional method, the product that assembling is completed is tested successively, it is ensured that the whole performance of product, which is met, to be required.
In order that the silicon waveguide type array adjustable optical attenuator chip based on photoelectric absorption effect more optimal can be used for VMUX, chip utilization rate can be improved by Data Matching technique(It is specifically shown in the patent No.:201210077137.8).Can also be by using power consumption and cost very low central processing unit rather than TEC(Semiconductor cooler)To refresh the operating temperature of chip in real time and according to the change Correction and Control voltage/current of temperature, so as to ensure the highly stable of decay(Particular content is shown in and separately apply).
As shown in fig. 7, being tested under 27 degrees Celsius the silicon waveguide type array adjustable optical attenuator in the utility model, from undamped to the pad value of setting(0dB->-15dB)Best-case Response Time(90%->10%)Less than 1 microsecond, and the response time of the Mach Zehnder interference type adjustable optical attenuator of common silica waveguide is 1~10 millisecond.
It is seen that, the utility model makes luminous power adjustable combiner using the silicon waveguide type array adjustable optical attenuator based on photoelectric absorption effect, and fast response time can reach Microsecond grade, and using silicon waveguide type array adjustable optical attenuator without heating, power consumption is lower;Luminous power adjustable combiner its good reliability made using the utility model, suitable batch production can ensure using reliably and with long-term for product.

Claims (6)

1. a kind of encapsulating structure of luminous power adjustable combiner, including by upper lid(4)And bottom(5)The packaging cartridge of composition, the bottom(5)On be fixed with control board(3), it is characterised in that the control board(3)On be further fixed on silicon waveguide type array adjustable optical attenuator(1)And array waveguide grating(2);The silicon waveguide type array adjustable optical attenuator(1)Optical-fibre channel and array waveguide grating(2)Optical-fibre channel pass through optical fiber correspondence connect.
2. the encapsulating structure of luminous power adjustable combiner according to claim 1, it is characterised in that the silicon waveguide type array adjustable optical attenuator(1)Array adjustable optical attenuator chip including silicon waveguide type(6), input optical fibre array(7), output optical fibre array(8);The array adjustable optical attenuator chip(6)Input and the input optical fibre array(7)It is connected, output end and the output optical fibre array(8)It is connected;The input optical fibre array(7)With the array waveguide grating(2)Optical-fibre channel be connected;The output optical fibre array(8)It is connected with the output optical fibre of luminous power adjustable combiner.
3. the encapsulating structure of luminous power adjustable combiner according to claim 2, it is characterised in that the input optical fibre array(7)With output optical fibre array(8)Structure be V-groove structure, U-type groove structure, slab construction or capillary pipe structure.
4. the encapsulating structure of luminous power adjustable combiner according to claim 2, it is characterised in that the silicon waveguide type array adjustable optical attenuator(1)Pass through the supporting plate of intermediate projections(9)It is fixed on the control board(3)On.
5. the encapsulating structure of luminous power adjustable combiner according to claim 1, it is characterised in that the array waveguide grating(2)For the array waveguide grating of individual packages;The array adjustable optical attenuator(1)For the array adjustable optical attenuator of individual packages.
6. the encapsulating structure of luminous power adjustable combiner according to claim 1, it is characterised in that described silicon waveguide type array adjustable optical attenuator(1)Port number be M × N, wherein, 1≤M≤96,1≤N≤96;Described array waveguide grating(2)For the array waveguide grating of multichannel, its port number is 16,32,40,48,80 or 96.
CN201420018977.1U 2014-01-13 2014-01-13 Packaging structure of luminous power adjustable combiner Withdrawn - After Issue CN203720406U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420018977.1U CN203720406U (en) 2014-01-13 2014-01-13 Packaging structure of luminous power adjustable combiner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420018977.1U CN203720406U (en) 2014-01-13 2014-01-13 Packaging structure of luminous power adjustable combiner

Publications (1)

Publication Number Publication Date
CN203720406U true CN203720406U (en) 2014-07-16

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Application Number Title Priority Date Filing Date
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103760641A (en) * 2014-01-13 2014-04-30 博创科技股份有限公司 Package structure of variable optical attenuator multiplexer and manufacturing method of package structure
CN105676350A (en) * 2016-03-03 2016-06-15 博创科技股份有限公司 Packaging structure of arrayed waveguide grating module and preparation method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103760641A (en) * 2014-01-13 2014-04-30 博创科技股份有限公司 Package structure of variable optical attenuator multiplexer and manufacturing method of package structure
CN103760641B (en) * 2014-01-13 2015-11-18 博创科技股份有限公司 Encapsulating structure of a kind of luminous power adjustable combiner and preparation method thereof
CN105676350A (en) * 2016-03-03 2016-06-15 博创科技股份有限公司 Packaging structure of arrayed waveguide grating module and preparation method

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AV01 Patent right actively abandoned

Granted publication date: 20140716

Effective date of abandoning: 20151118

C25 Abandonment of patent right or utility model to avoid double patenting