CN203706096U - Heat dissipation module applied to microcomputer - Google Patents

Heat dissipation module applied to microcomputer Download PDF

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Publication number
CN203706096U
CN203706096U CN201320802545.5U CN201320802545U CN203706096U CN 203706096 U CN203706096 U CN 203706096U CN 201320802545 U CN201320802545 U CN 201320802545U CN 203706096 U CN203706096 U CN 203706096U
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CN
China
Prior art keywords
copper sheet
heat
weld zone
parallelogram
transfer pipe
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320802545.5U
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Chinese (zh)
Inventor
项彬
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Chongqing Qiaocheng Technology Development Co Ltd
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Chongqing Qiaocheng Technology Development Co Ltd
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Filing date
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Application filed by Chongqing Qiaocheng Technology Development Co Ltd filed Critical Chongqing Qiaocheng Technology Development Co Ltd
Priority to CN201320802545.5U priority Critical patent/CN203706096U/en
Application granted granted Critical
Publication of CN203706096U publication Critical patent/CN203706096U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a heat dissipation module applied to a microcomputer. The heat dissipation module comprises a radiating copper sheet, a heat transfer tube, a radiating fin group, a fan and a copper sheet mounting bracket, wherein the copper sheet mounting bracket is a square plate formed by stamping a hot-dip galvanizing steel plate; each of the four corners of the square plate outwards extends to form a mounting platform; a downwards-sunken square copper sheet welding area is arranged in the middle of the front surface of the square plate; a parallelogram-shaped groove is formed in the copper sheet welding area; two corners on the long diagonal line in the parallelogram-shaped groove are overlapped with two corners of the copper sheet welding area; edgefolds facing the back surface are arranged on the two side edges of the parallelogram-shaped groove respectively, and the extension directions of the edgefolds are consistent with that of the parallelogram-shaped groove; two rectangular heat transfer tube welding areas opposite to the two ends of the parallelogram-shaped groove respectively are arranged on the back surface of the square plate; two mounting holes in the same side of the parallelogram-shaped groove are connected through a downwards-sunken reinforcing rib. The heat dissipation module has the characteristics of simple structure, reliable strength, convenience for mounting, small size, compactness and the like.

Description

Be applicable to the heat radiation module of microcomputer
Technical field
The utility model relates to computer components technical field, is specifically related to a kind of for the heat radiation module on computer.
Background technology
Heat radiation module is requisite parts on notebook computer, is made up of radiating copper sheet, heat-transfer pipe, radiating fin group, fan and several parts of copper sheet mounting bracket.Radiating copper sheet is the core component in heat radiation module, and radiating copper sheet is arranged on CPU below, by heat-transfer pipe, the heat of CPU is derived, dispel the heat by radiating fin again, also be provided with fan in heat radiation in module, fan is cool ambient air and radiating fin heat exchange, thereby realizes the cooling of CPU.
Radiating copper sheet is fixed by welding in the front of copper sheet mounting bracket, heat-transfer pipe is fixed by welding in the back side of copper sheet mounting bracket, existing radiating copper sheet mounting bracket ubiquity complex structure, the problem such as size is bigger than normal, bulk strength is inadequate, installation is inconvenient.
Utility model content
The purpose of this utility model is to provide that a kind of simple in structure, intensity is reliable, compact, the easy computer heat radiation module of welding.
For this reason, the technical scheme that the utility model adopts is: a kind of heat radiation module that is applicable to microcomputer, comprise radiating copper sheet (I), heat-transfer pipe (II), radiating fin group (III), fan (IV) and copper sheet mounting bracket (V), key is: the square plate that described copper sheet mounting bracket (V) is stamped to form for hot-dip galvanized steel sheet, four angles of described square plate stretch out respectively and form mounting platform (1), and the relative square plate of mounting platform (1) is to lower recess, on each mounting platform (1), be provided with a mounting hole (1a), the middle part in described square plate front is provided with the square copper sheet weld zone (2) to lower recess, in copper sheet weld zone (2), have parallelogram groove (3), two angles in described parallelogram groove (3) on long-diagonal overlap with wherein two angles of copper sheet weld zone (2), on the dual-side of parallelogram groove (3), be respectively arranged with consistent with parallelogram groove (3) bearing of trend and towards the flange (4) at the back side, be provided with the just heat-transfer pipe weld zone (5) of the rectangle to parallelogram groove (3) two ends of two difference at the back side of described square plate, described copper sheet weld zone (2), in heat-transfer pipe weld zone (5), be respectively provided with some the line balls that are parallel to each other, and copper sheet weld zone (2) are consistent with the line ball direction in heat-transfer pipe weld zone (5), two mounting holes (1a) that are positioned at parallelogram groove (3) the same side are connected by the reinforcement (6) to lower recess, and reinforcement (6), mounting platform (1) and copper sheet weld zone (2) are in the same plane, described radiating copper sheet (I) is welded in copper sheet weld zone (2), one end of described heat-transfer pipe (II) is welded on the back side of copper sheet mounting bracket (V) by two heat-transfer pipe weld zones (5), and be positioned between two flange (4), the other end of heat-transfer pipe (II) is connected with radiating fin group (III), fan (IV).
Be preferably, the length of described flange (4) is less than the length of parallelogram groove (3), and flange (4) is positioned at the middle part of place parallelogram groove (3) side.Flange is mainly spacing to being arranged on the heat-transfer pipe at the copper sheet mounting bracket back side, and heat-transfer pipe is just between two flange, and flange does not need the oversize spacing effect that just can reach, when design, the length of parallelogram groove is less than the length of flange, is mainly convenient for punching press, avoids interfering.
The beneficial effects of the utility model:
(1) by four mounting holes being separately positioned on the mounting platform at four angles of copper sheet mounting bracket, and the relative copper sheet mounting bracket of mounting platform is to lower recess, in conjunction with reinforcing rib structure, the bulk strength of copper sheet mounting bracket and the laminating degree of copper sheet mounting bracket and CPU are jointly improved;
(2) radiating copper sheet is welded on copper sheet mounting bracket front, and is positioned at copper sheet weld zone; Heat-transfer pipe is welded on the back side of copper sheet mounting bracket by two heat-transfer pipe weld zones, and spacing to heat-transfer pipe in conjunction with two flange, be arranged in copper sheet weld zone, line ball in heat pipe weld zone, mainly play the effect that helps weldering, guaranteed convenience and the reliability of welding; Simultaneously consistent with the line ball direction in heat-transfer pipe weld zone in copper sheet weld zone, facilitate line ball processing;
(3) whole copper sheet mounting bracket adopts hot-dip galvanized steel sheet to be stamped to form, and entirety is square, and is installed to CPU above by four mounting holes, simple in structure, quick and easy for installation; Meanwhile, hot-dip galvanized steel sheet has antirust and helps weldering effect;
(4) in parallelogram groove, two angles on long-diagonal overlap with wherein two angles of copper sheet weld zone, the two ends up and down of parallelogram groove and two limits up and down of copper sheet weld zone are overlapped, maximally utilise copper sheet weld zone and arrange parallelogram groove, make more compact of copper sheet mounting bracket one-piece construction.
In sum, the utlity model has simple in structure, the feature such as intensity is reliable, easy for installation, compact.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Fig. 2 is the front elevation of copper sheet mounting bracket in Fig. 1.
Fig. 3 is the rear view of Fig. 2.
Fig. 4 is the stereographic map of Fig. 2.
Embodiment
Below in conjunction with drawings and Examples, the utility model is described in further detail:
A kind of heat radiation module that is applicable to microcomputer as shown in Figure 1, is made up of radiating copper sheet I, heat-transfer pipe II, radiating fin group III, fan IV and copper sheet mounting bracket V five parts.Radiating copper sheet I is fixed by welding in the front of copper sheet mounting bracket V, heat-transfer pipe II is fixed by welding in the back side of copper sheet mounting bracket V, radiating copper sheet I is the core component of heat radiation module, it is not shown that radiating copper sheet I is arranged on CPU() below, by heat-transfer pipe II, the heat of CPU is derived, again by radiating fin group III heat radiation, fan IV is cool ambient air and the heat exchange of radiating fin group III, thereby realizes the cooling of CPU.The above is consistent with traditional structure, does not repeat them here.
Difference is: Fig. 2---Figure 4 shows that copper sheet mounting bracket V, the square plate being stamped to form for hot-dip galvanized steel sheet (MAT'L mark is SGCC).Four angles of square plate stretch out respectively and form mounting platform 1, and the relative square plate of mounting platform 1 is to lower recess, is provided with a mounting hole 1a on each mounting platform 1, and welded plate is installed on CPU by four mounting hole 1a.Square plate is divided into front and back, and the side that radiating copper sheet I is installed is positive, and opposite side is the back side.The middle part in square plate front is provided with the square copper sheet weld zone 2 to lower recess, and the shape of copper sheet weld zone 2 is consistent with the shape of radiating copper sheet I, and radiating copper sheet I is just placed in copper sheet weld zone 2.In copper sheet weld zone 2, have parallelogram groove 3, copper sheet weld zone 2 is divided into two parts by parallelogram groove 3, and heat-transfer pipe II is just placed in parallelogram groove 3.Parallelogram groove 3 is divided into long-diagonal and short diagonal, and two angles in parallelogram groove 3 on long-diagonal overlap with wherein two angles of copper sheet weld zone 2.The two ends up and down of parallelogram groove 3 overlap with two limits up and down of copper sheet weld zone 2, are respectively arranged with unanimously with parallelogram groove 3 bearing of trends and towards the flange 4 at the back side on the dual-side of parallelogram groove 3, and flange 4 is spacing to heat-transfer pipe II.
Be provided with the just heat-transfer pipe weld zone 5 of the rectangle to parallelogram groove 3 two ends of two difference at the back side of square plate, copper sheet weld zone 2, heat-transfer pipe weld zone 5 is interior is respectively provided with some the line balls that are parallel to each other, and copper sheet weld zone 2 is consistent with the line ball direction in heat-transfer pipe weld zone 5.Two mounting hole 1a that are positioned at parallelogram groove 3 the same sides are connected by the reinforcement 6 to lower recess, and reinforcement 6, mounting platform 1 and copper sheet weld zone 2 are in the same plane, are convenient to design stamping die.
Radiating copper sheet I is welded in copper sheet weld zone 2, and one end of heat-transfer pipe II is welded on the back side of copper sheet mounting bracket V by two heat-transfer pipe weld zones 5, and between two flange 4, the other end of heat-transfer pipe II is connected with radiating fin group III, fan IV.Radiating copper sheet I is welded on the front of copper sheet mounting bracket V, and heat-transfer pipe II is welded on the back side of copper sheet mounting bracket V, heat-transfer pipe II be positioned at radiating copper sheet I under, and by two flange 4 spacing.The two ends that reinforcement 6 is avoided parallelogram groove 3 arrange, and interfere avoiding with heat-transfer pipe II.
Preferably, the length of flange 4 is less than the length of parallelogram groove 3, and flange 4 is positioned at the middle part of place parallelogram groove 3 sides.

Claims (2)

1. one kind is applicable to the heat radiation module of microcomputer, comprise radiating copper sheet (I), heat-transfer pipe (II), radiating fin group (III), fan (IV) and copper sheet mounting bracket (V), it is characterized in that: the square plate that described copper sheet mounting bracket (V) is stamped to form for hot-dip galvanized steel sheet, four angles of described square plate stretch out respectively and form mounting platform (1), and the relative square plate of mounting platform (1) is to lower recess, on each mounting platform (1), be provided with a mounting hole (1a), the middle part in described square plate front is provided with the square copper sheet weld zone (2) to lower recess, in copper sheet weld zone (2), have parallelogram groove (3), two angles in described parallelogram groove (3) on long-diagonal overlap with wherein two angles of copper sheet weld zone (2), on the dual-side of parallelogram groove (3), be respectively arranged with consistent with parallelogram groove (3) bearing of trend and towards the flange (4) at the back side, be provided with the just heat-transfer pipe weld zone (5) of the rectangle to parallelogram groove (3) two ends of two difference at the back side of described square plate, described copper sheet weld zone (2), in heat-transfer pipe weld zone (5), be respectively provided with some the line balls that are parallel to each other, and copper sheet weld zone (2) are consistent with the line ball direction in heat-transfer pipe weld zone (5), two mounting holes (1a) that are positioned at parallelogram groove (3) the same side are connected by the reinforcement (6) to lower recess, and reinforcement (6), mounting platform (1) and copper sheet weld zone (2) are in the same plane, described radiating copper sheet (I) is welded in copper sheet weld zone (2), one end of described heat-transfer pipe (II) is welded on the back side of copper sheet mounting bracket (V) by two heat-transfer pipe weld zones (5), and be positioned between two flange (4), the other end of heat-transfer pipe (II) is connected with radiating fin group (III), fan (IV).
2. according to the heat radiation module that is applicable to microcomputer claimed in claim 1, it is characterized in that: the length of described flange (4) is less than the length of parallelogram groove (3), and flange (4) is positioned at the middle part of place parallelogram groove (3) side.
CN201320802545.5U 2013-12-08 2013-12-08 Heat dissipation module applied to microcomputer Expired - Fee Related CN203706096U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320802545.5U CN203706096U (en) 2013-12-08 2013-12-08 Heat dissipation module applied to microcomputer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320802545.5U CN203706096U (en) 2013-12-08 2013-12-08 Heat dissipation module applied to microcomputer

Publications (1)

Publication Number Publication Date
CN203706096U true CN203706096U (en) 2014-07-09

Family

ID=51056502

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320802545.5U Expired - Fee Related CN203706096U (en) 2013-12-08 2013-12-08 Heat dissipation module applied to microcomputer

Country Status (1)

Country Link
CN (1) CN203706096U (en)

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Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140709

Termination date: 20141208

EXPY Termination of patent right or utility model