CN203704754U

CN203704754U - Efficient air heat exchanger chip

Info

Publication number: CN203704754U
Application number: CN201420036332.0U
Authority: CN
Inventors: 何涛
Original assignee: ZHUHAI JIAYI ELECTRONIC TECHNOLOGY Co Ltd
Current assignee: ZHUHAI JIAYI ELECTRONIC TECHNOLOGY Co Ltd
Priority date: 2014-01-21
Filing date: 2014-01-21
Publication date: 2014-07-09
Anticipated expiration: 2024-01-21

Abstract

The utility model relates to an efficient air heat exchanger chip which comprises a plurality of stacked fin bodies, surfaces of the two sides of each fin body are both provided with protrusions, the protrusions and the fin bodies are punched and formed in an integrated mode, and the protrusions of every two adjacent fin bodies are tightly attached to each other and are connected. Thus, the distance between the fin bodies can be increased, the heat exchange air volume can be increased, heat exchange performance is strong, the heat exchange effect is good, the structure is simple, machining and production difficulty is low and the efficient air heat exchanger chip is easy to achieve.

Description

A kind of efficient air heat exchanger chip

Technical field

The utility model belongs to technical field of heat exchangers, relates in particular to a kind of efficient air heat exchanger chip.

Background technology

Various electronic devices and components have higher requirement to environment temperature, have again stricter dustproof requirement simultaneously; For this reason, electronic devices and components need to be arranged in airtight rack conventionally, make its inner air and outer air isolated, and make inner air and outer air in non-touching situation by heat exchanger, heat exchange is carried out on flow through the respectively two sides of heat exchanger metal heat-exchange sheet, thereby reduces the temperature in rack.

But the heat exchanger chip that existing heat exchanger adopts is in the market to be all laminated by multi-disc fin body, but because the spacing between each fin body is little, allow the heat exchange air quantity that passes through less, cause heat exchange efficiency extremely low.

Utility model content

For solving the above-mentioned problems in the prior art, the utility model provides a kind of spacing strengthening between fin body, strengthens heat exchange air quantity, and heat exchange property is strong, the efficient air heat exchanger chip that heat transfer effect is good.

For solving the problems of the technologies described above, the utility model adopts following technical scheme:

A kind of efficient air heat exchanger chip, includes the stacked fin body of multi-disc, and the both side surface of described fin body is equipped with convex closure, described convex closure and the moulding of fin body integrated punching, and the convex closure of adjacent two fin body is adjacent to connection.

Further, the both side surface of described fin body is equipped with multiple row convex closure group, and every row convex closure group is longitudinally formed by multiple convex closures, and the convex closure group interval of both side surface arranges.

Further, the convex closure that described fin body both side surface is provided with space on vertical and horizontal arranges.

Further, described convex closure is strip or circle.

Further, described fin body is provided with the waveform surface of integrated punching type, and described convex closure is positioned on waveform surface.

The beneficial effects of the utility model are:

The utility model, by technique scheme, can strengthen the spacing between fin body, strengthens heat exchange air quantity, and heat exchange property is strong, and heat transfer effect is good, and simple in structure, and processing difficulty is low, is easy to realize.

Accompanying drawing explanation

Fig. 1 is the structural representation of a kind of efficient air heat exchanger chip embodiment mono-described in the utility model;

Fig. 2 is the sectional structure schematic diagram along A-A in Fig. 1;

Fig. 3 is the structural representation of fin body in a kind of efficient air heat exchanger chip embodiment mono-described in the utility model;

Fig. 4 is the sectional structure schematic diagram along B-B in Fig. 3;

Fig. 5 is the structural representation of fin body in a kind of efficient air heat exchanger chip embodiment bis-described in the utility model;

Fig. 6 is the sectional structure schematic diagram along C-C in Fig. 5;

Fig. 7 is the structural representation of fin body in a kind of efficient air heat exchanger chip embodiment tri-described in the utility model;

Fig. 8 is the sectional structure schematic diagram along D-D in Fig. 7;

Fig. 9 is the structural representation of fin body in a kind of efficient air heat exchanger chip embodiment tetra-described in the utility model;

Figure 10 is the sectional structure schematic diagram along E-E in Fig. 9.

The specific embodiment

In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.

Embodiment mono-:

As shown in Figure 1 to Figure 4, a kind of efficient air heat exchanger chip described in the utility model embodiment mono-, include the stacked fin body of multi-disc 1, the both side surface of described fin body 1 is equipped with convex closure 2, described convex closure 2 and fin body 1 integrated punching moulding, concrete structure can be: the both side surface of described fin body 1 is equipped with multiple row convex closure group, every row convex closure group is longitudinally formed by multiple convex closures 2, described convex closure 2 is strip, and the convex closure group interval of both side surface arranges.The convex closure 2 of adjacent two fin body 1 of described efficient air heat exchanger chip is adjacent to connection.

Like this, efficient air heat exchanger chip described in the utility model can strengthen the spacing between fin body 1, strengthens heat exchange air quantity, and heat exchange property is strong, and heat transfer effect is good, and simple in structure, and processing difficulty is low, is easy to realize.

As the utility model one preferred version, described fin body 1 is provided with the waveform surface 3 of integrated punching type, and described convex closure 2 is positioned on waveform surface 3.Can effectively increase like this heat exchange area, further improve heat exchange property, heat transfer effect is better.

Embodiment bis-:

As shwon in Figures 5 and 6, a kind of efficient air heat exchanger chip described in the utility model embodiment bis-, its structure and embodiment mono-are basic identical, include the stacked fin body of multi-disc 1, the both side surface of described fin body 1 is equipped with convex closure 2, described convex closure 2 and fin body 1 integrated punching moulding, and the convex closure 2 of adjacent two fin body 1 is adjacent to connection, and the convex closure 2 that described fin body 1 both side surface is provided with space on vertical and horizontal arranges.Its difference is only: described convex closure 2 is for circular.

Embodiment tri-:

As shown in Figures 7 and 8, a kind of efficient air heat exchanger chip described in the utility model embodiment tri-, its structure and embodiment mono-are basic identical, include the stacked fin body of multi-disc 1, the both side surface of described fin body 1 is equipped with convex closure 2, described convex closure 2 is strip, and with fin body 1 integrated punching moulding, and the convex closure 2 of adjacent two fin body 1 is adjacent to connection.Its difference is only: the convex closure 2 that described fin body 1 both side surface is provided with space on vertical and horizontal arranges.

Embodiment tetra-:

As shown in Fig. 9 and Figure 10, a kind of efficient air heat exchanger chip described in the utility model embodiment tetra-, its structure and embodiment tri-are basic identical, include the stacked fin body of multi-disc 1, the both side surface of described fin body 1 is equipped with convex closure 2, described convex closure 2 and fin body 1 integrated punching moulding, and the convex closure 2 of adjacent two fin body 1 is adjacent to connection, and the convex closure 2 that described fin body 1 both side surface is provided with space on vertical and horizontal arranges.Its difference is only: described convex closure 2 is for circular.

The above is preferred embodiment of the present utility model; it should be pointed out that for those skilled in the art, do not departing under the prerequisite of the utility model principle; can also make some improvements and modifications, these improvements and modifications are also considered as protection domain of the present utility model.

Claims

1. an efficient air heat exchanger chip, include the stacked fin body of multi-disc (1), it is characterized in that: the both side surface of described fin body (1) is equipped with convex closure (2), described convex closure (2) and fin body (1) integrated punching moulding, and the convex closure (2) of adjacent two fin body (1) is adjacent to connection.

2. efficient air heat exchanger chip according to claim 1, it is characterized in that: the both side surface of described fin body (1) is equipped with multiple row convex closure group, every row convex closure group is longitudinally formed by multiple convex closures (2), and the convex closure group interval of both side surface arranges.

3. efficient air heat exchanger chip according to claim 1, is characterized in that: the convex closure (2) that described fin body (1) both side surface is provided with space on vertical and horizontal arranges.

4. according to the efficient air heat exchanger chip described in claim 1 or 2 or 3, it is characterized in that: described convex closure (2) is strip or circle.

5. according to the efficient air heat exchanger chip described in claim 1 or 2 or 3, it is characterized in that: described fin body (1) is provided with the waveform surface (3) of integrated punching type, and described convex closure (2) is positioned on waveform surface (3).