CN203704628U - Mobile door of wafer washing dryer - Google Patents
Mobile door of wafer washing dryer Download PDFInfo
- Publication number
- CN203704628U CN203704628U CN201420060911.9U CN201420060911U CN203704628U CN 203704628 U CN203704628 U CN 203704628U CN 201420060911 U CN201420060911 U CN 201420060911U CN 203704628 U CN203704628 U CN 203704628U
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- China
- Prior art keywords
- moving door
- wafer cleaning
- cleaning drier
- layer structure
- mobile door
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Abstract
The utility model provides a mobile door of a wafer washing dryer. The mobile door of the wafer washing dryer comprises an external mobile door body and an internal mobile door body, wherein the external mobile door body is located at the top of a housing of the wafer washing dryer and can be opened in a sliding mode; the internal mobile door body is located at the top of a cavity of the wafer washing dryer and used for controlling the cavity to be opened and closed; the internal mobile door body is composed of an internal layer structure and an external layer structure. The internal mobile door body and the external mobile door body of the wafer washing dryer are made of hydrophilic materials, the surface of the internal mobile door body and the surface of the external mobile door body are particle spraying surfaces, the internal layer structure of the internal mobile door body of the wafer washing dryer is designed to be in an arc shape with a groove, the two ends of the internal layer structure of the internal mobile door body are provided with water inlets, the outer surface of the internal layer structure of the internal mobile door body is provided with protrusive areas along the two side edges, then water of the surface of the internal layer structure can flow into the water inlets via the groove and slide down to an internal container successfully, and the water is prevented from staying on the surface of the internal layer structure and falling to the surface of a wafer when the internal mobile door body is opened or closed.
Description
Technical field
The utility model relates to semiconductor manufacturing equipment field, particularly relates to a kind of moving door of wafer cleaning drier.
Background technology
In integrated circuit processing technology, it is a wherein important steps flow chart that wafer is cleaned, this is to drop on crystal column surface because have some residual or micronic dusts after chemically mechanical polishing, if this kind of grit defect (P/D, ParticleDefect) remove not in time, can have a strong impact on yield.This kind of grit defect can be removed by the mode of scrubbing, at present, the normally used mode of scrubbing has following 5 kinds: deionized water rinsing, hairbrush are scrubbed, water under high pressure is scrubbed, hairbrush is increased setting-out and scrubbed with chip double-side and scrub.
After chemically mechanical polishing, in prior art, use wafer cleaning drier (SRD, Spin Rinse Dryer) to carry out deionized water rinsing to wafer, wafer cleaning drier can make crystal column surface dry by rotating and being dried moist wafer.And in existing production process, after wafer cleaning drier Rotary drying, on crystal column surface 10, still have washmarking 11(as shown in Figure 1), can be seen by Fig. 1, there is together significantly washmarking 11 in crystal column surface.This is because wafer is in entering wafer cleaning drier, the water of crystal column surface can drop on the moving door of wafer cleaning drier, and the material of the moving door of existing wafer cleaning drier is non-hydrophilic material, and smooth surface, after dropping on this moving door, wafer will form at the moving door surface place of dropping water droplet, in the time that wafer dries taking-up, during due to the moving door of switch wafer cleaning drier, can produce vibrations, this water droplet dropping on moving door before will making again drops and produces washmarking on the surface of wafer, make wafer also could not reach dry requirement through chemically mechanical polishing and rotation and after being dried.The existence of crystal column surface washmarking defect herein, will affect the yield of product greatly.
Therefore, provide a kind of moving door of follow-on wafer cleaning spinner very necessary.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of moving door of wafer cleaning drier, for solving prior art because the material of the moving door of wafer cleaning drier is non-hydrophilic material, and smooth surface, and the wafer producing is in entering wafer cleaning drier, the water of crystal column surface can drop on the moving door of wafer cleaning drier and form water droplet on moving door surface, afterwards in the time that wafer dries taking-up, in the time of the moving door of switch wafer cleaning drier, produce vibrations, the water droplet dropping on moving door before making again drops and produces washmarking on the surface of wafer, and then affect the problem of product yield.
For achieving the above object and other relevant objects, the utility model provides a kind of moving door of wafer cleaning drier, and the moving door of described wafer cleaning drier at least comprises:
Be positioned at wafer cleaning drier cover top portion, can sliding opening outside moving door;
Be positioned at wafer cleaning drier cavity top, for controlling the inside moving door of cavity switch; Described inner moving door is made up of inside and outside double-layer structure, and wherein inner moving door layer structure is fixed on the inwall of cavity one side, and inner moving door endothecium structure can horizontally slip; The surfaces externally and internally of described inner moving door endothecium structure is all longitudinally distributed with groove equably.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the two ends of described inner moving door endothecium structure are provided with water inlet.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the outer surface of described inner moving door endothecium structure is provided with the protrusion district along its both sides of the edge.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the material of the inside and outside double-layer structure of described inner moving door is water wetted material.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the material of the inside and outside double-layer structure of described inner moving door is hydrophilic quartz.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the surface of the inside and outside double-layer structure of described inner moving door is particle-blasted finish.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the shape of the inside and outside double-layer structure of described inner moving door is arc.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the surface of described outside moving door is particle-blasted finish.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the material of described outside moving door is water wetted material.
As a kind of preferred version of the moving door of wafer cleaning drier of the present utility model, the material of described outside moving door is hydrophilic quartz.
As mentioned above, the moving door of wafer cleaning drier of the present utility model, there is following beneficial effect: the material of the inside and outside moving door of wafer cleaning drier is all used to water wetted material, this water wetted material can allow deionized water at material surface drawout, instead of resting on the place's of dropping formation water droplet, this has just reduced water in the time that this does switch motion and has dropped to the possible of crystal column surface; Particle-blasted finish is all arranged to in the surface of the inside and outside moving door of wafer cleaning drier, and can greatly increase is the hydrophily of water-wetted surface; The endothecium structure of the inner moving door of wafer cleaning drier is designed to the arc of with groove, be provided with water inlet at the two ends of inner moving door endothecium structure simultaneously, can allow the water on endothecium structure surface flow to water inlet by groove, be slipped to smoothly in internal container, avoid water to rest on endothecium structure surface, in the time that inner moving door does switch motion, caused water to drop at crystal column surface; The outer surface of inner moving door endothecium structure is provided with to the protrusion district along its both sides of the edge, avoided water flow through endothecium structure outer surface edge and drop on the surface of wafer.
Brief description of the drawings
Fig. 1 is shown as crystal column surface of the prior art and has washmarking defect schematic diagram.
Fig. 2 a is shown as the top view of the outside moving door of wafer cleaning drier of the present utility model while closing.
Fig. 2 b is shown as that the outside moving door of wafer cleaning drier of the present utility model is opened, the top view of inner moving door while closing.
Fig. 2 c is shown as the schematic diagram of the inner moving door endothecium structure of wafer cleaning drier of the present utility model.
Element numbers explanation
Detailed description of the invention
By particular specific embodiment, embodiment of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this description.
Refer to Fig. 2 a to 2c.Notice, appended graphic the illustrated structure of this description, ratio, size etc., all contents in order to coordinate description to disclose only, understand and read for person skilled in the art scholar, not in order to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this description, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, changing under technology contents, when being also considered as the enforceable category of the utility model without essence.
Refer to Fig. 2 a to 2c, the utility model provides a kind of moving door of wafer cleaning drier, and the moving door of described wafer cleaning drier at least comprises: be positioned at wafer cleaning drier shell 21 tops, can sliding opening outside moving door 22; Be positioned at wafer cleaning drier cavity top, for controlling the inside moving door (23) of cavity switch; Described inner moving door 23 is made up of inside and outside double-layer structure, and wherein inner moving door layer structure 231 is fixed on the inwall of cavity one side, and inner moving door endothecium structure 232 can horizontally slip; The surfaces externally and internally of described inner moving door endothecium structure 232 is all longitudinally distributed with groove 232a equably.
Fig. 2 a is the top view of the outside moving door of described wafer cleaning drier while closing, and described outside moving door 22 is positioned at the top of wafer drier shell 21, can realize by slip the switch at wafer cleaning drier top.The material of outside moving door 22 is water wetted material, and preferably, the material of the present embodiment peripheral moving door 22 is hydrophilic quartz.By the materials'use water wetted material of the outside moving door of wafer cleaning drier, this water wetted material can allow deionized water at material surface drawout, instead of rest on the place of dropping and form water droplet, this has just reduced in the time that this does switch motion water and has dropped to the risk of crystal column surface.
Concrete, the surface of described outside moving door 22 is particle-blasted finish, particle spray coating is carried out in the surface of outside moving door 22 and be prepared into particle-blasted finish, can increase the surface area of outside moving door 22, and then increase has been the hydrophily of water-wetted surface.
Fig. 2 b is that the outside moving door of described wafer cleaning drier is opened, the top view of inner moving door while closing, and described inner moving door 23 is positioned at wafer cleaning drier cavity top, just can see inner moving door 23 after only opening outside moving door 22.Inner moving door 23 is made up of inside and outside double-layer structure, and wherein inner moving door layer structure 231 is fixed on the inwall of cavity one side, and inner moving door endothecium structure 232 can horizontally slip; The material of the inside and outside double-layer structure of described inner moving door is water wetted material, and preferably, in the present embodiment, the material of the inside and outside double-layer structure of inner moving door is hydrophilic quartz.By the materials'use water wetted material of the inside moving door of wafer cleaning drier, this water wetted material can allow deionized water at material surface drawout, instead of rest on the place of dropping and form water droplet, this has just reduced in the time that this does switch motion water and has dropped to the risk of crystal column surface.
The surface of described inner moving door 23 layer structures 231 and endothecium structure 232 is particle-blasted finish, particle spray coating is carried out in the surface of inner moving door 23 layer structures 231 and endothecium structure 232 and be prepared into particle-blasted finish, can increase the surface area of inner moving door 23 layer structures 231 and endothecium structure 232, and then increase is the hydrophily of water-wetted surface.
The width of described inner moving door layer structure 231 should be less than or equal to 1/2 of cavity hatch width, and preferably, in the present embodiment, the width of inner moving door layer structure 231 equals 1/2 of cavity hatch width.The width of described inner moving door endothecium structure 232 should be more than or equal to 1/2 of cavity hatch width, and preferably, in the present embodiment, the width of inner moving door endothecium structure 232 equals 1/2 of cavity hatch width.
Because the layer structure 231 of inner moving door is fixed on the inwall of cavity one side, so in fact the switch of cavity is that the slip of the endothecium structure 232 by inner moving door is controlled.In the time that the endothecium structure 232 of inner moving door slides into the bottom of layer structure 231 of inner moving door, cavity is opened; In the time that the endothecium structure 232 of inner moving door pulls out completely from the bottom of the layer structure 231 of inner moving door, cavity is closed.In the time that the endothecium structure 232 of inner moving door pulls out completely from the bottom of the layer structure 231 of inner moving door, in order to realize closing completely of cavity, the width sum of described inner moving door ectonexine structure should be more than or equal to the width of cavity hatch, preferably, in the present embodiment, the width sum of described inner moving door ectonexine structure equals the width of cavity hatch.
As shown in Fig. 2 b and 2c, being shaped as of described inner moving door ectonexine structure is arc, the surfaces externally and internally of inner moving door endothecium structure 232 is all longitudinally distributed with groove 232a equably along arcuate directions, and is provided with water inlet 232c at the two ends of inner moving door endothecium structure 232.Inner wafer cleaning drier moving door endothecium structure 232 is designed to the arc of with groove 232a, can increase endothecium structure 232 surface areas, be provided with water inlet 232c at the two ends of inner moving door endothecium structure 232 simultaneously, can allow the water on endothecium structure 232 surfaces flow to water inlet 232c by groove 232a, be slipped to smoothly in internal container, avoid water to rest on endothecium structure 232 surfaces, in the time that inner moving door does switch motion, caused water to drop at crystal column surface.
The outer surface of described inner moving door endothecium structure 232 can also be provided with the protrusion district 232b along its both sides of the edge.In order to ensure that inner moving door endothecium structure 232 can slide into layer structure 231 bottoms, the height of described protrusion district 232b is less than or equal to the gap between inner moving door ectonexine structure.The outer surface of inner moving door endothecium structure 232 is provided with to the protrusion district 232b along its both sides of the edge, avoided water flow through endothecium structure 232 outer surface edge and drop on the surface of wafer.
In sum, the utility model provides a kind of moving door of wafer cleaning drier, the material of the inside and outside moving door of wafer cleaning drier is all used to water wetted material, this water wetted material can allow deionized water at material surface drawout, instead of resting on the place's of dropping formation water droplet, this has just reduced water in the time that this does switch motion and has dropped to the possible of crystal column surface; Particle-blasted finish is all arranged to in the surface of the inside and outside moving door of wafer cleaning drier, and can greatly increase is the hydrophily of water-wetted surface; The endothecium structure of the inner moving door of wafer cleaning drier is designed to the arc of with groove, be provided with water inlet at the two ends of inner moving door endothecium structure simultaneously, can allow the water on endothecium structure surface flow to water inlet by groove, be slipped to smoothly in internal container, avoid water to rest on endothecium structure surface, in the time that inner moving door does switch motion, caused water to drop at crystal column surface; The outer surface of inner moving door endothecium structure is provided with to the protrusion district along its both sides of the edge, avoided water flow through endothecium structure outer surface edge and drop on the surface of wafer.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (10)
1. a moving door for wafer cleaning drier, is characterized in that, the moving door of described wafer cleaning drier comprises:
Be positioned at wafer cleaning drier cover top portion, can sliding opening outside moving door;
Be positioned at wafer cleaning drier cavity top, for controlling the inside moving door of cavity switch; Described inner moving door is made up of inside and outside double-layer structure, and wherein inner moving door layer structure is fixed on the inwall of cavity one side, and inner moving door endothecium structure can horizontally slip; The surfaces externally and internally of described inner moving door endothecium structure is all longitudinally distributed with groove equably.
2. the moving door of wafer cleaning drier according to claim 1, is characterized in that: the two ends of described inner moving door endothecium structure are provided with water inlet.
3. the moving door of wafer cleaning drier according to claim 1, is characterized in that: the outer surface of described inner moving door endothecium structure is provided with the protrusion district along its both sides of the edge.
4. the moving door of wafer cleaning drier according to claim 1, is characterized in that: the material of the inside and outside double-layer structure of described inner moving door is water wetted material.
5. the moving door of wafer cleaning drier according to claim 4, is characterized in that: the material of the inside and outside double-layer structure of described inner moving door is hydrophilic quartz.
6. the moving door of wafer cleaning drier according to claim 1, is characterized in that: the surface of the inside and outside double-layer structure of described inner moving door is particle-blasted finish.
7. the moving door of wafer cleaning drier according to claim 1, is characterized in that: the shape of the inside and outside double-layer structure of described inner moving door is arc.
8. the moving door of wafer cleaning drier according to claim 1, is characterized in that: the surface of described outside moving door is particle-blasted finish.
9. the moving door of wafer cleaning drier according to claim 1, is characterized in that: the material of described outside moving door is water wetted material.
10. the moving door of wafer cleaning drier according to claim 9, is characterized in that: the material of described outside moving door is hydrophilic quartz.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420060911.9U CN203704628U (en) | 2014-02-10 | 2014-02-10 | Mobile door of wafer washing dryer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420060911.9U CN203704628U (en) | 2014-02-10 | 2014-02-10 | Mobile door of wafer washing dryer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203704628U true CN203704628U (en) | 2014-07-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420060911.9U Expired - Fee Related CN203704628U (en) | 2014-02-10 | 2014-02-10 | Mobile door of wafer washing dryer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203704628U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109196632A (en) * | 2016-06-16 | 2019-01-11 | 应用材料公司 | Wafer processor door interface |
-
2014
- 2014-02-10 CN CN201420060911.9U patent/CN203704628U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109196632A (en) * | 2016-06-16 | 2019-01-11 | 应用材料公司 | Wafer processor door interface |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20190210 |
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| CF01 | Termination of patent right due to non-payment of annual fee |