CN203703814U - Cooling device for COB (cache on board) craftwork lamp panel adopting LED bulb lamps - Google Patents
Cooling device for COB (cache on board) craftwork lamp panel adopting LED bulb lamps Download PDFInfo
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- CN203703814U CN203703814U CN201320600846.XU CN201320600846U CN203703814U CN 203703814 U CN203703814 U CN 203703814U CN 201320600846 U CN201320600846 U CN 201320600846U CN 203703814 U CN203703814 U CN 203703814U
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- lamp panel
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Abstract
The utility model relates to a cooling device for a COB (cache on board) craftwork lamp panel adopting LED bulb lamps. The cooling device at least comprises a lamp holder, a lamp panel power supply, an LED lamp panel, a spotlighting unit and a lamp panel base, wherein external threads connected with internal threads of the lamp holder are formed in the lamp panel base, the lamp penal base is connected with the lamp holder through the external threads and the internal threads; the lamp panel power supply is located in a cavity of the lamp holder below the lamp panel base and used for supplying constant drive current to the LED lamp panel; and the plane of the LED lamp panel is fixed in a plane cavity in the upper end of the lamp panel base, the LED lamp panel is electrically connected with an output end of the lamp panel power supply, and an input end of the lamp panel power supply is electrically connected with two alternating current connecting power supply electrodes of the lamp holder. The cooling device is characterized in that the lower end of the spotlighting unit is in seal connection with the LED lamp panel, and a LED wafer is bundled on the LED lamp panel; and a space gap is reserved between the upper end of the LED wafer and a fluorescent glue layer. By means of the spotlighting unit, the problems of insufficient LED lamp lighting ranges and angles are simply and effectively solved; and heat dissipation of the lamp panel in the use process is facilitated through space insulation of the upper part of the LED lamp panel and the spotlighting unit, and the service life of the lamp panel is greatly prolonged.
Description
Technical field
The utility model relates to the COB technique lamp plate heat sink of a kind of illuminating lamp take LED as light source, particularly ball lamp LED.
Background technology
LED is as a kind of novel lighting source, there are energy-saving and environmental protection, the life-span is long, colour rendering good, stable luminescence, luminous efficiency are high, without the feature of stroboscopic and bad dazzle, get more and more people's extensive concerning.Therefore, in the light fixture of present stage, be widely used.
Existing LED ball lamp comprises lamp holder, lamp plate power supply, LED lamp plate, spherical lamp housing and luminous board seat, LED lamp plate adopts powerful paster LED, in order to lower the temperature, LED lamp plate is fixed on the aluminum hull luminous board seat that thermal diffusivity is good, heat dissipation problem when although this technique can solve LED work, but really increased cost, cause a large amount of uses of non-ferrous alloy aluminium.Be unfavorable for environmental protection and energy saving.
For this reason, up-to-date scheme has and adopts COB solution integration LED light source, and it is integrated in multiple low power LED on circuit board through semiconductor binding technique, finally on blue-ray LED tube core, coats fluorescent glue.Circuit board adopts aluminium base or ceramic substrate.Finally aluminium base or ceramic substrate and aluminium or ceramics seat are fixedly being dispelled the heat.
We know with regard to aluminium base or ceramic substrate, it is all the good thermal conductor for heat radiation, but large-area fluorescent glue is by LED wafer light-emitting area weave in, form an area source, the thermal conductivity of fluorescent glue is very poor, is thermal insulator exactly, and this has just formed light source one side good heat dissipation, the structure of another side good heat insulation, has a strong impact on the heat radiation of LED.A LED ball lamp less than 3wCOB structure, light-emitting area temperature is more than 80 degree, and it makes the increasing that declines of LED light, and affects the LED lamp life-span, when the LED fluorescent tube core work of reason phase, should make its temperature below 60 degree.
It is in fluorescent glue coating procedure that COB solution integration LED light source also has a problem, and fluorescent material batching will be coated on the LED that helps to reserve in official hour technique in accordance with regulations, and the time has pass and can impact apply effect, as uniformity, colour temperature.
In the patent of having applied for, utility model people provides " a kind of LED ball modulated structure ", it comprises: lamp holder, lamp plate power supply, LED lamp plate, light focusing unit and luminous board seat, luminous board seat has the external screw thread being connected with lamp holder internal thread, and luminous board seat is connected by internal and external threads with lamp holder; Lamp plate power supply is positioned at the cavity of luminous board seat below lamp holder, for power supply constant current drive current being provided to LED lamp plate; LED lamp plate plane is fixed in the plane cavity of luminous board seat upper end, and LED lamp plate is electrically connected with lamp plate power output end, and lamp plate power input exchanges and is connected power electrode electrical connection with two, lamp holder; Light focusing unit lower end and LED lamp plate form and are tightly connected, and light focusing unit gathers in the mode of spot light and launches for the light that LED lamp plate is sent.
" a kind of LED ball modulated structure " adopted COB solution integration LED light source, has above-mentioned said problem.
Utility model content
The purpose of this utility model is to provide the COB technique lamp plate heat sink of a kind of ball lamp LED, to extend the service life of LED ball lamp, process simplification, reduces product cost.
The purpose of this utility model is to realize like this, the COB technique lamp plate heat sink of ball lamp LED, at least comprise: lamp holder, lamp plate power supply, LED lamp plate, light focusing unit and luminous board seat, luminous board seat has the external screw thread being connected with lamp holder internal thread, and luminous board seat is connected by internal and external threads with lamp holder; Lamp plate power supply is positioned at the cavity of luminous board seat below lamp holder, for constant current drive current being provided to LED lamp plate; LED lamp plate plane is fixed in the plane cavity of luminous board seat upper end, and LED lamp plate is electrically connected with lamp plate power output end, and lamp plate power input exchanges and is connected power electrode electrical connection with two, lamp holder; It is characterized in that: light focusing unit lower end and LED lamp plate form and be tightly connected, and have the LED wafer of binding on LED lamp plate; Gap has living space between LED wafer upper end and fluorescent adhesive layer, fluorescent adhesive layer converts white light to and is transmitted to space by the mode of reflection or direct projection by the light focusing unit top transparent body for blue-ray LED or ultraviolet leds being sent to light, the heat that blue-ray LED or ultraviolet leds produce is on the one hand by loose the removing of luminous board seat of bottom, be radiated on the other hand spatial joint clearance, then the heat that absorbs spatial joint clearance by light focusing unit and luminous board seat is in air space.
Described fluorescent adhesive layer applies in light focusing unit lower end, fluorescent adhesive layer converts white light to and is transmitted to space by the mode of reflection or direct projection by the light focusing unit top transparent body for blue-ray LED or ultraviolet leds being sent to light, the heat that blue-ray LED or ultraviolet leds produce is on the one hand by loose the removing of luminous board seat of bottom, be radiated on the other hand spatial joint clearance, then the heat that absorbs spatial joint clearance by light focusing unit and luminous board seat is in air space.
Described light focusing unit is made up of lamp spheroid and leaded light cone, leaded light cone imports to lamp spheroid for the area source that LED lamp plate is sent, lamp spheroid skin has fluorescent adhesive layer, blue-ray LED on LED lamp plate or ultraviolet leds send light and arrive lamp spheroid by leaded light cone, convert white light to be transmitted to space through lamp spheroid fluorescent adhesive layer.
Described light focusing unit is leaded light cone, leaded light cone imports fluorescent adhesive layer for the area source that LED lamp plate is sent, blue-ray LED on LED lamp plate or ultraviolet leds send light and arrive fluorescent adhesive layer by leaded light cone, convert white light to be transmitted to space through fluorescent adhesive layer.
There is one deck protection resin described blue-ray LED or ultraviolet leds upper end, and protection resin thickness is between 0.1-3mm.
The utility model has the advantages that: by light focusing unit, solved simply and effectively conventional LED light illumination range and the inadequate problem of angle; LED lamp plate top isolates with the space of light focusing unit, is convenient to lamp plate heat radiation in use, greatly extends the service life of lamp plate.
Below by accompanying drawing explanation and the specific embodiment, the utility model is further illustrated.
Accompanying drawing explanation
Fig. 1 the utility model embodiment 1 structural representation;
Fig. 2 is the total enlarged drawing of the office of Fig. 1;
Fig. 3 the utility model embodiment 2 structural representations;
Fig. 4 the utility model embodiment 3 structural representations.
In figure, 1, lamp holder, 2, lamp plate power supply, 3, LED lamp plate, 4, luminous board seat, 5, light focusing unit, 6, lampshade, 7, lamp spheroid, 8, leaded light cone; 9, fluorescent adhesive layer; 10, spatial joint clearance.
The specific embodiment
Embodiment 1
As shown in Figure 1, the COB technique lamp plate heat sink of ball lamp LED, at least comprise: lamp holder 1, lamp plate power supply 2, LED lamp plate 3, light focusing unit 5 and luminous board seat 4, luminous board seat 4 has the external screw thread being connected with lamp holder 1 internal thread, and luminous board seat 4 is connected by internal and external threads with lamp holder 1; Lamp plate power supply 2 is positioned at the cavity of luminous board seat 4 below lamp holders 1, for constant current drive current being provided to LED lamp plate 3; LED lamp plate 3 planes are fixed in luminous board seat 4 upper end plane cavitys, and LED lamp plate 3 is electrically connected with lamp plate power supply 2 outputs, and lamp plate power supply 2 inputs exchange and are connected power electrode electrical connection with 1 two, lamp holder; Light focusing unit 5 lower ends and LED lamp plate 3 form and are tightly connected, the LED wafer that LED lamp plate 3 Shang You nations are fixed.
As shown in Figure 2, there is the fluorescent adhesive layer 9 of coating light focusing unit 5 lower ends, fluorescent adhesive layer 9 converts white light to and is transmitted to space by the mode of reflection or direct projection by the light focusing unit 5 top transparent bodies for blue-ray LED or ultraviolet leds being sent to light, fluorescent adhesive layer 9 has a spatial joint clearance 10 with blue-ray LED or ultraviolet leds top, the heat that blue-ray LED or ultraviolet leds produce is on the one hand by loose the removing of luminous board seat 4 of bottom, be radiated on the other hand spatial joint clearance 10, then the heat that absorbs spatial joint clearance 10 by light focusing unit 5 and luminous board seat 4 is in air space.
Equally compared with prior art, light focusing unit 5 is made up of lamp spheroid 7 and leaded light cone 8, leaded light cone 8 converts white light for the area source that LED lamp plate 3 is sent to by fluorescent adhesive layer 9, then imports to lamp spheroid 7, by lamp spheroid 7 to surrounding projection illumination light source.
Embodiment 2
As shown in Figure 3, the COB technique lamp plate heat sink of ball lamp LED, at least comprise: lamp holder 1, lamp plate power supply 2, LED lamp plate 3, light focusing unit 5 and luminous board seat 4, luminous board seat 4 has the external screw thread being connected with lamp holder 1 internal thread, and luminous board seat 4 is connected by internal and external threads with lamp holder 1; Lamp plate power supply 2 is positioned at the cavity of luminous board seat 4 below lamp holders 1, for constant current drive current being provided to LED lamp plate 3; LED lamp plate 3 planes are fixed in luminous board seat 4 upper end plane cavitys, and LED lamp plate 3 is electrically connected with lamp plate power supply 2 outputs, and lamp plate power supply 2 inputs exchange and are connected power electrode electrical connection with 1 two, lamp holder; Light focusing unit 5 lower ends and LED lamp plate 3 forms and is tightly connected, the LED wafer that LED lamp plate 3 Shang You nations are fixed, LED wafer and the light focusing unit 5 lower surfaces gap 10 that has living space.The fixed LED wafer of nation is blue-ray LED or ultraviolet leds.
Light focusing unit 5 is made up of lamp spheroid 7 and leaded light cone 8, leaded light cone 8 imports to lamp spheroid 7 for the area source that LED lamp plate 3 is sent, lamp spheroid 7 skins have fluorescent adhesive layer 9, blue-ray LED on LED lamp plate 3 or ultraviolet leds send light and arrive lamp spheroid 7 by leaded light cone 8, convert white light to be transmitted to space through lamp spheroid 7 fluorescent adhesive layers 9.
The heat that blue-ray LED or ultraviolet leds produce by loose the removing of luminous board seat 4 of bottom, be radiated on the other hand spatial joint clearance 10, then the heat that absorbs spatial joint clearance 10 by light focusing unit 5 and luminous board seat 4 is in air space on the one hand.
Embodiment 3
As shown in Figure 4, as different from Example 2, light focusing unit 5 is leaded light cones 8, leaded light cone 8 imports fluorescent adhesive layer 9 for the area source that LED lamp plate 3 is sent, blue-ray LED on LED lamp plate 3 or ultraviolet leds send light and arrive fluorescent adhesive layer 9 by leaded light cone 8, convert white light to be transmitted to space through fluorescent adhesive layer 9.
The heat that blue-ray LED or ultraviolet leds produce by loose the removing of luminous board seat 4 of bottom, be radiated on the other hand spatial joint clearance 10, then the heat that absorbs spatial joint clearance 10 by light focusing unit 5 and luminous board seat 4 is in air space on the one hand.
In the utility model, there is one deck protection resin blue-ray LED or ultraviolet leds upper end, and protection resin thickness is between 0.1-3mm.Protection resin is for the protection of blue-ray LED or the ultraviolet leds of binding.
The parts that the present embodiment does not describe in detail and structure belong to well-known components and common structure or the conventional means of the industry, here not narration one by one.
Claims (5)
1. the COB technique lamp plate heat sink of ball lamp LED, at least comprises: lamp holder, lamp plate power supply, LED lamp plate, light focusing unit and luminous board seat, and luminous board seat has the external screw thread being connected with lamp holder internal thread, and luminous board seat is connected by internal and external threads with lamp holder; Lamp plate power supply is positioned at the cavity of luminous board seat below lamp holder, for constant current drive current being provided to LED lamp plate; LED lamp plate plane is fixed in the plane cavity of luminous board seat upper end, and LED lamp plate is electrically connected with lamp plate power output end, and lamp plate power input exchanges and is connected power electrode electrical connection with two, lamp holder; It is characterized in that: light focusing unit lower end and LED lamp plate form and be tightly connected, and have the LED wafer of binding on LED lamp plate; Gap has living space between LED wafer upper end and fluorescent adhesive layer, fluorescent adhesive layer converts white light to and is transmitted to space by the mode of reflection or direct projection by the light focusing unit top transparent body for blue-ray LED or ultraviolet leds being sent to light, the heat that blue-ray LED or ultraviolet leds produce is on the one hand by loose the removing of luminous board seat of bottom, be radiated on the other hand spatial joint clearance, then the heat that absorbs spatial joint clearance by light focusing unit and luminous board seat is in air space.
2. the COB technique lamp plate heat sink of ball lamp LED according to claim 1, it is characterized in that: described fluorescent adhesive layer applies in light focusing unit lower end, fluorescent adhesive layer converts white light to and is transmitted to space by the mode of reflection or direct projection by the light focusing unit top transparent body for blue-ray LED or ultraviolet leds being sent to light, the heat that blue-ray LED or ultraviolet leds produce is on the one hand by loose the removing of luminous board seat of bottom, be radiated on the other hand spatial joint clearance, then the heat that absorbs spatial joint clearance by light focusing unit and luminous board seat is in air space.
3. the COB technique lamp plate heat sink of ball lamp LED according to claim 1, it is characterized in that: described light focusing unit is made up of lamp spheroid and leaded light cone, leaded light cone imports to lamp spheroid for the area source that LED lamp plate is sent, lamp spheroid skin has fluorescent adhesive layer, blue-ray LED on LED lamp plate or ultraviolet leds send light and arrive lamp spheroid by leaded light cone, convert white light to be transmitted to space through lamp spheroid fluorescent adhesive layer.
4. the COB technique lamp plate heat sink of ball lamp LED according to claim 1, it is characterized in that: described light focusing unit is leaded light cone, leaded light cone imports fluorescent adhesive layer for the area source that LED lamp plate is sent, blue-ray LED on LED lamp plate or ultraviolet leds send light and arrive fluorescent adhesive layer by leaded light cone, convert white light to be transmitted to space through fluorescent adhesive layer.
5. the COB technique lamp plate heat sink of ball lamp LED according to claim 2, is characterized in that: there is one deck protection resin described blue-ray LED or ultraviolet leds upper end, and protection resin thickness is between 0.1-3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320600846.XU CN203703814U (en) | 2013-09-27 | 2013-09-27 | Cooling device for COB (cache on board) craftwork lamp panel adopting LED bulb lamps |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320600846.XU CN203703814U (en) | 2013-09-27 | 2013-09-27 | Cooling device for COB (cache on board) craftwork lamp panel adopting LED bulb lamps |
Related Child Applications (4)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320610303.6U Division CN203605146U (en) | 2013-09-27 | 2013-09-27 | Light converging device for ball lamp LED |
| CN201320610407.7U Division CN203703644U (en) | 2013-09-27 | 2013-09-27 | LED ball lamp |
| CN201320610875.4U Division CN203571631U (en) | 2013-09-27 | 2013-09-27 | Light guide cone for ball lamp LED |
| CN201320610302.1U Division CN203605151U (en) | 2013-09-27 | 2013-09-27 | White light LED ball light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203703814U true CN203703814U (en) | 2014-07-09 |
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ID=51054252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320600846.XU Expired - Fee Related CN203703814U (en) | 2013-09-27 | 2013-09-27 | Cooling device for COB (cache on board) craftwork lamp panel adopting LED bulb lamps |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203703814U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104515105A (en) * | 2013-09-27 | 2015-04-15 | 西安信唯信息科技有限公司 | COB craft lamp board cooling method of ball lamp LED |
-
2013
- 2013-09-27 CN CN201320600846.XU patent/CN203703814U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104515105A (en) * | 2013-09-27 | 2015-04-15 | 西安信唯信息科技有限公司 | COB craft lamp board cooling method of ball lamp LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140709 Termination date: 20140927 |
|
| EXPY | Termination of patent right or utility model |