CN203697277U - Novel guide wheel used for silicon wafer cutting - Google Patents

Novel guide wheel used for silicon wafer cutting Download PDF

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Publication number
CN203697277U
CN203697277U CN201320888689.7U CN201320888689U CN203697277U CN 203697277 U CN203697277 U CN 203697277U CN 201320888689 U CN201320888689 U CN 201320888689U CN 203697277 U CN203697277 U CN 203697277U
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CN
China
Prior art keywords
guide wheel
gathering sill
silicon chip
main body
guide
Prior art date
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Withdrawn - After Issue
Application number
CN201320888689.7U
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Chinese (zh)
Inventor
聂金根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ZHENJIANG GANGNAN ELECTRIC CO Ltd
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ZHENJIANG GANGNAN ELECTRIC CO Ltd
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Priority to CN201320888689.7U priority Critical patent/CN203697277U/en
Application granted granted Critical
Publication of CN203697277U publication Critical patent/CN203697277U/en
Anticipated expiration legal-status Critical
Withdrawn - After Issue legal-status Critical Current

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Abstract

The utility model relates to a novel guide wheel used for silicon wafer cutting. The guide wheel comprises a guide wheel body, wherein a circle of guide slots are formed in the circumferential direction of the guide wheel body; the guide slots comprise a first guide slot and a second guide slot, wherein the first guide slot is in a round structure, the second guide slot is in a semicircular structure, and the first guide slot and the second guide slot are an integer; the guide wheel body is in a split structure and is divided into an upper guide wheel and a lower guide wheel, the inner wall of the lower guide wheel contacted with the upper guide wheel is provided with a plurality of slots, the inner wall of the upper guide wheel contacted with the lower guide wheel is provided with a plurality of self-locking bulges, and the upper guide wheel and the lower guide wheel are mutually locked by the matching of the shapes the slots and the self-locking bulges. The guide wheel can be matched up with a special silicon wafer sawing wire, so that the guide wheel is flexible to mount, simple to operate, and high in stability.

Description

A kind of novel guide wheel for silicon chip cutting
Technical field
The utility model relates to a kind of guide wheel, and particularly a kind of guide wheel for silicon chip cutting belongs to the technical field of silicon wafer cutting equipment.
Background technology
Along with social development, the maturation of photovoltaic industry, the use of silicon chip is more and more.Because silicon chip belongs to hard material, its cutting technique occupies very important position in processing technology.Silicon chip cutting many by line of cut supply the mortar with abrasive material, realize the cutting of silicon chip by the abrasive wear principle between abrasive material, line of cut and silicon crystal, line of cut carries out displacement by guide wheel.
My company has designed " a kind of silicon chip cutting steel wire " at present, comprise two steel wire bodies, wherein, described two steel wire bodies are the integral structure that is superimposed with each other into the figure of eight, for coordinate this cutting steel wire to use, just just need to there is special silicon chip cutting guide wheel to realize.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of novel guide wheel for silicon chip cutting for above drawback, can coordinate above-mentioned special silicon chip cutting steel wire to use, and flexible for installation, simple to operate, stability is high.
For solving the problems of the technologies described above, the technical solution of the utility model is:
A kind of novel guide wheel for silicon chip cutting, comprise guide wheel main body, wherein, described guide wheel main body is circumferentially with a circle gathering sill, described gathering sill comprises the first gathering sill and the second gathering sill, described the first gathering sill is circular configuration, its diameter is 0.55-0.95mm, described the second gathering sill is semicircular structure, its diameter is 0.55-0.95mm, described the first gathering sill and the second gathering sill are as a whole, described guide wheel main body is split-type structural, described guide wheel main body is divided into upper guide wheel and bottom guide wheel, the central angle of described top guide wheel is 120-180 °, the central angle of described bottom guide wheel is 180-240 °, the inwall that described bottom guide wheel contacts with top guide wheel is provided with some grooves, the inwall that described top guide wheel contacts with bottom guide wheel is provided with some self-locking projections, mutually lock by the form fit between described groove and described self-locking projection, on guide wheel two side, described bottom, be connected with two lockplates by hinge is rotating respectively, angle between described lockplate is identical with the angle of the central angle of described bottom guide wheel, between described lockplate and described top guide wheel outer wall, can be fixed by screw.
Above-mentioned a kind of novel guide wheel for silicon chip cutting, wherein, the described guide wheel for silicon chip cutting also comprises two fixing lassos, the cross sectional shape of described fixing lasso is U-shaped, be linked in described guide wheel main body, described fixing lasso is formed by two semicircle collar combinations, and between described two semicircle lassos, one end is by the rotating connection of hinge, and the other end is fixed by buckle.
Above-mentioned a kind of novel guide wheel for silicon chip cutting, wherein, the junction of described the first gathering sill and the second gathering sill is arc-shaped structure.
The beneficial effects of the utility model are:
When use, silicon chip cutting steel wire is penetrated from one end of top guide wheel gathering sill, after the other end passes, penetrate again in the gathering sill of bottom guide wheel, pass from suitable position, by top guide wheel and bottom guide wheel closing, mutually lock by the form fit between the groove of top guide wheel and the self-locking projection of bottom guide wheel, again the lockplate on the guide wheel of bottom is turn on the outer wall of top guide wheel, be fixed with screw, finally fixed cover snare is combined on guide wheel, fixed by snap.
The utility model can well coordinate the special silicon chip cutting steel wire of my company to use, lock more firm, steel wire can slippage from gathering sill, more safe and reliable, the utility model is simple in structure, easy to operate, fixing and locking effect is the more than 3 times of original guide wheel, and be also applicable to common cutting steel wire simultaneously, highly versatile, meanwhile, the junction of the first gathering sill and the second gathering sill is arc-shaped structure, can prevent that the steel wire being placed in one is scratched, increase service life, save cost.
Brief description of the drawings
Fig. 1 is cutaway view of the present utility model
Fig. 2 is exploded view of the present utility model
Fig. 3 is constitutional diagram of the present utility model
Fig. 4 is the structure chart of the fixing lasso 12 of the utility model
Detailed description of the invention
Below the utility model is further described.
A kind of novel guide wheel for silicon chip cutting as shown in the figure, comprise guide wheel main body 1, wherein, described guide wheel main body 1 is circumferentially with a circle gathering sill 2, described gathering sill 2 comprises the first gathering sill 3 and the second gathering sill 4, the junction 14 of described the first gathering sill 3 and the second gathering sill 4 is arc-shaped structure, described the first gathering sill 3 is circular configuration, its diameter d 1 is 0.55-0.95mm, described the second gathering sill 4 is semicircular structure, its diameter d 2 is 0.55-0.95mm, described the first gathering sill 3 and the second gathering sill 4 are as a whole, described guide wheel main body 1 is split-type structural, described guide wheel main body 1 is divided into top guide wheel 5 and bottom guide wheel 6, central angle a=120-180 ° of described top guide wheel 5, central angle b=180-240 ° of described bottom guide wheel 6, the inwall that described bottom guide wheel 6 contacts with top guide wheel 5 is provided with some grooves 7, the inwall that described top guide wheel 5 contacts with bottom guide wheel 6 is provided with some self-locking projections 8, mutually lock by the form fit between described groove 7 and described self-locking projection 8, on guide wheel 6 two sides, described bottom, be connected with two lockplates 10 by hinge 9 is rotating respectively, angle c between described lockplate 10 is identical with the angle b of the central angle of described bottom guide wheel, between described lockplate 10 and described top guide wheel outer wall, can be fixed by screw 11, the described guide wheel for silicon chip cutting also comprises two fixing lassos 12, the cross sectional shape of described fixing lasso 12 is U-shaped, be linked in described guide wheel main body 1, described fixing lasso 12 is combined by two semicircle lassos 13, between described two semicircle lassos, one end is by the rotating connection of hinge 15, the other end is fixed by buckle 14.
When use, silicon chip cutting steel wire is penetrated from one end of top guide wheel gathering sill, after the other end passes, penetrate again in the gathering sill of bottom guide wheel, pass from suitable position, by top guide wheel and bottom guide wheel closing, mutually lock by the form fit between the groove of top guide wheel and the self-locking projection of bottom guide wheel, again the lockplate on the guide wheel of bottom is turn on the outer wall of top guide wheel, be fixed with screw, finally fixed cover snare is combined on guide wheel, fixed by snap.
The utility model can well coordinate the special silicon chip cutting steel wire of my company to use, lock more firm, steel wire can slippage from gathering sill, more safe and reliable, the utility model is simple in structure, easy to operate, fixing and locking effect is the more than 3 times of original guide wheel, and be also applicable to common cutting steel wire simultaneously, highly versatile, meanwhile, the junction of the first gathering sill and the second gathering sill is arc-shaped structure, can prevent that the steel wire being placed in one is scratched, increase service life, save cost.
Here description of the present utility model and application is illustrative; not want scope of the present utility model to limit in the above-described embodiments; therefore, the utility model is not subject to the restriction of the present embodiment, and the technical scheme that any employing equivalence replacement obtains is all in the scope of the utility model protection.

Claims (3)

1. the novel guide wheel for silicon chip cutting, comprise guide wheel main body, it is characterized by, described guide wheel main body is circumferentially with a circle gathering sill, described gathering sill comprises the first gathering sill and the second gathering sill, described the first gathering sill is circular configuration, its diameter is 0.55-0.95mm, described the second gathering sill is semicircular structure, its diameter is 0.55-0.95mm, described the first gathering sill and the second gathering sill are as a whole, described guide wheel main body is split-type structural, described guide wheel main body is divided into upper guide wheel and bottom guide wheel, the central angle of described top guide wheel is 120-180 °, the central angle of described bottom guide wheel is 180-240 °, the inwall that described bottom guide wheel contacts with top guide wheel is provided with some grooves, the inwall that described top guide wheel contacts with bottom guide wheel is provided with some self-locking projections, mutually lock by the form fit between described groove and described self-locking projection, on guide wheel two side, described bottom, be connected with two lockplates by hinge is rotating respectively, angle between described lockplate is identical with the angle of the central angle of described bottom guide wheel, between described lockplate and described top guide wheel outer wall, can be fixed by screw.
2. a kind of novel guide wheel for silicon chip cutting as claimed in claim 1, it is characterized by, the described guide wheel for silicon chip cutting also comprises two fixing lassos, the cross sectional shape of described fixing lasso is U-shaped, be linked in described guide wheel main body, described fixing lasso is formed by two semicircle collar combinations, and between described two semicircle lassos, one end is by the rotating connection of hinge, and the other end is fixed by buckle.
3. a kind of novel guide wheel for silicon chip cutting as claimed in claim 1, is characterized by, and the junction of described the first gathering sill and the second gathering sill is arc-shaped structure.
CN201320888689.7U 2013-12-31 2013-12-31 Novel guide wheel used for silicon wafer cutting Withdrawn - After Issue CN203697277U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320888689.7U CN203697277U (en) 2013-12-31 2013-12-31 Novel guide wheel used for silicon wafer cutting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320888689.7U CN203697277U (en) 2013-12-31 2013-12-31 Novel guide wheel used for silicon wafer cutting

Publications (1)

Publication Number Publication Date
CN203697277U true CN203697277U (en) 2014-07-09

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CN201320888689.7U Withdrawn - After Issue CN203697277U (en) 2013-12-31 2013-12-31 Novel guide wheel used for silicon wafer cutting

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103722628A (en) * 2013-12-31 2014-04-16 镇江市港南电子有限公司 Novel guiding wheel for silicon wafer cutting
CN107672072A (en) * 2017-10-31 2018-02-09 扬中市惠丰包装有限公司 The reverse wheel of outage can be reduced
WO2018171339A1 (en) * 2017-03-20 2018-09-27 厦门致力金刚石科技股份有限公司 Stone cutting chain saw drive guide wheel with grooved washer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103722628A (en) * 2013-12-31 2014-04-16 镇江市港南电子有限公司 Novel guiding wheel for silicon wafer cutting
WO2018171339A1 (en) * 2017-03-20 2018-09-27 厦门致力金刚石科技股份有限公司 Stone cutting chain saw drive guide wheel with grooved washer
CN107672072A (en) * 2017-10-31 2018-02-09 扬中市惠丰包装有限公司 The reverse wheel of outage can be reduced

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GR01 Patent grant
AV01 Patent right actively abandoned

Granted publication date: 20140709

Effective date of abandoning: 20150715

RGAV Abandon patent right to avoid regrant