CN2036391U - Semiconductor cup - Google Patents

Semiconductor cup Download PDF

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Publication number
CN2036391U
CN2036391U CN 88214975 CN88214975U CN2036391U CN 2036391 U CN2036391 U CN 2036391U CN 88214975 CN88214975 CN 88214975 CN 88214975 U CN88214975 U CN 88214975U CN 2036391 U CN2036391 U CN 2036391U
Authority
CN
China
Prior art keywords
cup
hot
cold
semiconductor
semiconductor cold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN 88214975
Other languages
Chinese (zh)
Inventor
刘弟垲
陈淑卿
孙建张
刘光林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN 88214975 priority Critical patent/CN2036391U/en
Publication of CN2036391U publication Critical patent/CN2036391U/en
Withdrawn legal-status Critical Current

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  • Table Devices Or Equipment (AREA)

Abstract

The utility model relates to a semiconductor cold and hot cup which can heat and refrigerate the water or other material with the function of heat insulation. The semiconductor cup is composed of a cup body, a cup cover, a handle, the heat insulation material, a semiconductor cold and hot pile electronic element, and a metal sheet for transferring the heat quantity. With the adoption of the direct-current power supply, the utility model is safe in use.

Description

Semiconductor cup
The utility model is the semiconductor cold-hot cup of the heating of a kind of energy, cooling water or other materials.
At present in the technique known, have heating function as electric cup, it comprises cup, bowl cover, resistance heating wire and handle.Heat insulation function is also arranged, and as thermos cup, it is have insulation material, but do not have the resistance heated part with the different of electric cup.Also have in addition and a kind ofly can heat and can be incubated, as the heat tracing cup, it is made up of cup, bowl cover, resistance heating wire, handle and insulation material.What prior art adopted in a word is AC power, when often going wrong, works the mischief to personal safety easily, and prior art can not solve the problem of refrigeration cold insulation besides.
The purpose of this utility model will provide a kind of improved semiconductor cold-hot cup exactly, but it has and not only can heat but also advantage that refrigeration can also be incubated.
The purpose of this utility model is achieved in that the semiconductor cold-hot cup comprises cup, bowl cover, insulation material, be characterized in the semiconductor cold-hot heap that can produce cold or heat that connects with dc source being housed, the sheet metal and the supply socket that are used to transmit energy that connects with the semiconductor cold-hot cup be housed in the bowl cover outside in the bowl cover inboard.For heat or the cold that better the semiconductor cold-hot heap is produced is delivered to cup interior water or other materials, can on the semiconductor cold-hot heap of bowl cover inboard, sheet metal be installed.
Effect of the present utility model: the semiconductor cold-hot cup adopts dc source owing to adopted technique scheme, use safe and reliable, and can be as required cold insulation after the water in the cup or other materials heating back insulation or the refrigeration, easy to use.
Provide embodiment of the present utility model by following accompanying drawing.
Fig. 1 is the general illustration of the utility model semiconductor cold-hot cup.
Referring to accompanying drawing, semiconductor cold-hot heap 1 is equipped with in bowl cover 3 inboards of semiconductor cold-hot cup, be equipped with and semiconductor cold-hot heap 1 sheet metal 2 that links and do radiation in the outside of bowl cover 3, in bowl cover 3 and the cup 5 insulation material 8 is housed, better for the energy transmission effect that makes semiconductor cold-hot heap 1, below the semiconductor cold-hot heap 1 of bowl cover 3 inboards, parallel sheet metal is housed also.Supply socket 7 is contained in the lateral surface of bowl cover 3, and handle 6 is housed on the outside of cup 5.The semiconductor cold-hot heap is known electronic device, semiconductor element by cavity type and electron type combines in pairs, after connecting direct current, end at this electronic device produces heat, the other end produces cold, can change the polarity of dc source by supply socket 7, after the change polarity, an end that then produced heat originally will produce cold, and the other end just produces heat; If an end that needs heat or cold is put into cup, an end of cold that does not need or heat is dispersed in the surrounding environment by sheet metal, has just reached the purpose of this utility model.

Claims (3)

1, a kind of semiconductor cold-hot cup, it comprises cup, bowl cover, insulation material, resistive heating device, it is characterized in that the semiconductor cold-hot heap that can produce cold or heat that connects with dc source being housed, the sheet metal and the supply socket that are used to transmit energy that connects with the semiconductor cold-hot heap is housed in the bowl cover outside in the bowl cover inboard.
2, semiconductor cold-hot cup according to claim 1 is characterized in that on the semiconductor cold-hot heap of bowl cover inboard the sheet metal that transmits energy being housed.
3, semiconductor cold-hot cup according to claim 1 and 2 is characterized in that being equipped with handle outside cup.
CN 88214975 1988-10-20 1988-10-20 Semiconductor cup Withdrawn CN2036391U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 88214975 CN2036391U (en) 1988-10-20 1988-10-20 Semiconductor cup

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 88214975 CN2036391U (en) 1988-10-20 1988-10-20 Semiconductor cup

Publications (1)

Publication Number Publication Date
CN2036391U true CN2036391U (en) 1989-04-26

Family

ID=4847842

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 88214975 Withdrawn CN2036391U (en) 1988-10-20 1988-10-20 Semiconductor cup

Country Status (1)

Country Link
CN (1) CN2036391U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101961207A (en) * 2010-09-01 2011-02-02 广东富信电子科技有限公司 Semiconductor cooling/heating device
CN102048458A (en) * 2010-09-10 2011-05-11 施军达 Heat insulating plate for heating and refrigerating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101961207A (en) * 2010-09-01 2011-02-02 广东富信电子科技有限公司 Semiconductor cooling/heating device
CN102048458A (en) * 2010-09-10 2011-05-11 施军达 Heat insulating plate for heating and refrigerating
CN102048458B (en) * 2010-09-10 2012-06-27 施军达 Heat insulating plate for heating and refrigerating

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C14 Grant of patent or utility model
GR01 Patent grant
C19 Lapse of patent right due to non-payment of the annual fee
CF01 Termination of patent right due to non-payment of annual fee