Background technology
Superhard material mainly refers to diamond and cubic boron nitride.Diamond is current known the hardest material in the world, and cubic boron nitride hardness is only second to diamond.The hardness of these two kinds of superhard materials, all far above the hardness of other material, comprises the hard tool materials such as grinding tool material corundum, silicon carbide and cutter material Wimet, rapid steel.Therefore, superhard material is suitable for the instrument for manufacturing other material of processing, especially, aspect processing rigid material, has unrivaled superiority, occupies irreplaceable critical role.Thereby superhard material is applied widely industrial.But diamond quantity rareness, expensive, can not meet the needs of Economic development far away, therefore, researchist utilizes high pressure synthetic technology to synthesize polycrystalline diamond (PCD), makes adamantine range of application expand to multiple fields such as exploration, Aeronautics and Astronautics, automobile, electronics, stone material.Along with the further expansion of applications of diamond, relative matrix material has caused investigator's broad interest, and polycrystalline diamond compacts (PDCs) is exactly one of them.
Polycrystalline diamond compacts (PDCs) is the block agglomerate being formed by many fine-particle diamonds and cemented carbide substrate associating sintering under High Temperature High Pressure, because the structure of polycrystalline diamond is wherein the fine-particle diamond sintered compact that orientation differs, though its hardness and wear resistance are lower than single-crystal diamond, but sintered compact shows as isotropy, therefore can as natural diamond, not split along single cleavage surface, often be mainly used in oil as machining tool, metallurgical, geological drill bit, hole enlarger etc., there is high strength, high rigidity, high-wearing feature, particularly there is high toughness, its drill speed and timeliness are the manyfold of natural diamond, and can also effectively keep aperture in drilling process.Can also be used to cut non-ferrous metal and alloy, Wimet and non-metallic material simultaneously, the hundreds of times that cutting speed is inserted tool, durability is Wimet thousands of times.
Polycrystalline diamond compacts (PDCs) of the prior art, due to the reason of preparation, having residual metal stays in the gap of diamond particles, greying or oxidation when these remaining metals can aggravate diamond compact use, cause glomerocryst layer to lose efficacy, and metallographic phase and the thermal expansivity of Wimet phase and the difference of Young's modulus, in use easily there is the phenomenon such as crackle, layering in polycrystalline diamond compacts (PDCs), affect polycrystalline diamond compacts (PDCs) abrasion and thermostability, thereby shorten its mission life-span.
Therefore, how to reduce the residual metals content in polycrystalline diamond compacts (PDCs), become problem demanding prompt solution in the industry.
Utility model content
In view of this; the technical problems to be solved in the utility model is to provide a kind of polycrystalline diamond compacts (PDCs) leaching device; the polycrystalline diamond compacts (PDCs) leaching device that the utility model provides can reduce the residual metals content in polycrystalline diamond compacts (PDCs), can also protect the hard alloy layer in polycrystalline diamond compacts (PDCs) simultaneously.
The utility model provides a kind of polycrystalline diamond compacts (PDCs) leaching device, comprising:
Pedestal, is provided with acid etching groove on described pedestal, described acid etching groove is used for holding strong acid;
Be arranged on the bench-type groove on described pedestal, described bench-type groove is used for placing polycrystalline diamond compacts (PDCs); The upper bottom surface of described bench-type groove is connected with described acid etching groove bottom surface;
The polycrystalline diamond layer segment of described polycrystalline diamond compacts (PDCs) is placed in described acid etching groove;
Size and the polycrystalline diamond compacts (PDCs) of the upper surface of described bench-type groove are of a size of shrink-fit.
Preferably, the thickness that is placed in the polycrystalline diamond layer of described acid etching groove described in is 30%~80% of polycrystalline diamond layer total thickness.
Preferably, the high angle of the bus of described bench-type groove and bench-type groove is 5~10 °.
Preferably, the bottom surface of described bench-type groove contacts with the bottom surface of polycrystalline diamond compacts (PDCs), the degree of depth of described bench-type groove is less than the thickness of described polycrystalline diamond compacts (PDCs), and the degree of depth of described bench-type groove is greater than the Wimet layer thickness of described polycrystalline diamond compacts (PDCs).
Preferably, the ratio of the difference of the degree of depth of described bench-type groove and the thickness of described polycrystalline diamond compacts (PDCs) and the polycrystalline diamond layer thickness of described polycrystalline diamond compacts (PDCs) is (0.3~0.8): 1.
Preferably, described bench-type groove is circular platform type groove, and the upper surface diameter of described bench-type groove is less than bench-type groove lower surface diameter.
Preferably, the upper surface diameter of described bench-type groove is less than or equal to the diameter of polycrystalline diamond compacts (PDCs).
Preferably, the upper surface diameter of described bench-type groove is than the little 0.3~0.6mm of the diameter of polycrystalline diamond compacts (PDCs).
Preferably, described acid etching groove is cylinder shape cell body, and the bottom surface diameter of described acid etching groove is greater than the upper surface diameter of described bench-type groove.
The utility model provides a kind of polycrystalline diamond compacts (PDCs) leaching device, comprising: pedestal, on described pedestal, be provided with acid etching groove, and described acid etching groove is used for holding strong acid; Be arranged on the bench-type groove on described pedestal, described bench-type groove is used for placing polycrystalline diamond compacts (PDCs); The upper bottom surface of described bench-type groove is connected with described acid etching groove bottom surface; The polycrystalline diamond layer segment of described polycrystalline diamond compacts (PDCs) is placed in described acid etching groove.Compared with prior art; the leaching device that the utility model provides adopts bench-type groove and acid etching groove structure; thereby make polycrystalline diamond compacts (PDCs) in device; can reduce by acid etching the residual metals content of glomerocryst layer; utilize the design on special construction and the height of bench-type groove; while making polycrystalline diamond compacts (PDCs) be placed in circular platform type groove; in bench-type groove, form malleation air chamber; prevent that the strong acid in acid etching groove from entering in bench-type groove, thereby the hard alloy layer in protection polycrystalline diamond compacts (PDCs) is not by acid corrosion.
Embodiment
In order further to understand the utility model, below in conjunction with embodiment, the utility model preferred embodiment is described, but should be appreciated that these describe just as further illustrating feature and advantage of the present utility model, instead of restriction to the utility model claim.
The utility model provides a kind of polycrystalline diamond compacts (PDCs) leaching device, comprising:
Pedestal, is provided with acid etching groove on described pedestal, described acid etching groove is used for holding strong acid;
Be arranged on the bench-type groove on described pedestal, described bench-type groove is used for placing polycrystalline diamond compacts (PDCs); The upper bottom surface of described bench-type groove is connected with described acid etching groove bottom surface;
The polycrystalline diamond layer segment of described polycrystalline diamond compacts (PDCs) is placed in described acid etching groove;
Size and the polycrystalline diamond compacts (PDCs) of the upper surface of described bench-type groove are of a size of shrink-fit.
Referring to Fig. 1, cross-sectional view when the polycrystalline diamond compacts (PDCs) leaching device that Fig. 1 provides for the utility model embodiment is worked, wherein, 11 is acid etching groove, 12 is bench-type groove, and 13 put into the cavity forming after bench-type groove for polycrystalline diamond compacts (PDCs), 14 polycrystalline diamond layers that are polycrystalline diamond compacts (PDCs), 15 is the hard alloy layer of polycrystalline diamond compacts (PDCs), and 16 is pedestal.
The utility model is not particularly limited described polycrystalline diamond compacts (PDCs), with polycrystalline diamond compacts (PDCs) well known to those skilled in the art, preferably formed by polycrystalline diamond layer 14 and hard alloy layer 15, when polycrystalline diamond compacts (PDCs) is in Ore Leaching process, the top of polycrystalline diamond compacts (PDCs) is divided into polycrystalline diamond layer 14, and the bottom of polycrystalline diamond compacts (PDCs) is divided into hard alloy layer 15.
Polycrystalline diamond compacts (PDCs) leaching device described in the utility model comprises pedestal 16, and pedestal is the main part of polycrystalline diamond compacts (PDCs) leaching device, is provided with acid etching groove 11 and bench-type groove 12.
In the present embodiment, pedestal material is the macromolecule resin material of resistance to strong acid, to ensure that leaching device is not corroded by strong acid.In other embodiments, pedestal can be selected other materials, corroding as preferred version by resistance to strong acid.
Polycrystalline diamond compacts (PDCs) leaching device described in the utility model comprises acid etching groove 11, and described acid etching groove is arranged on pedestal 16, and its effect is to hold strong acid, for leaching the residual metal of polycrystalline diamond compacts (PDCs) polycrystalline diamond layer.
In the present embodiment, acid etching groove 11 is cylindrical cell body.In other embodiments, acid etching groove can be other shapes, holds strong acid as preferred version to facilitate.
Polycrystalline diamond compacts (PDCs) leaching device described in the utility model comprises bench-type groove 12, described bench-type groove 12 is arranged on pedestal 16, described bench-type groove 12 is for placing polycrystalline diamond compacts (PDCs), described bench-type groove 12 upper surfaces are connected with described acid etching groove 11 bottom surfaces, its effect is to place and fixing polycrystalline diamond compacts (PDCs), and the pass of the size of the upper surface of described bench-type groove and the size of polycrystalline diamond compacts (PDCs) is shrink-fit.
In the present embodiment, polycrystalline diamond layer 14 parts of described polycrystalline diamond compacts (PDCs) are placed in described acid etching groove 11, part described in the utility model is placed in described acid etching groove 11 and refers to that polycrystalline diamond layer 14 is at the last acid etching groove 11 that is placed in of thickness direction, it is to ensure the process of polycrystalline diamond layer at Ore Leaching that a part is placed in 12 its effects of bench-type groove, and hard alloy layer 15 is not corroded by strong acid with bonding surface and the hard alloy layer of polycrystalline diamond layer; Described part is preferably 30%~80% of polycrystalline diamond layer thickness, and more preferably 40%~70% of polycrystalline diamond layer thickness.In other embodiments, polycrystalline diamond layer also can be placed in acid etching groove completely, not corrode hard alloy layer as preferred version.
In the present embodiment, the bottom surface of described bench-type groove contacts with the bottom surface of polycrystalline diamond compacts (PDCs), the degree of depth of described bench-type groove is less than the thickness of polycrystalline diamond compacts (PDCs), and the degree of depth of described bench-type groove is greater than the Wimet layer thickness of described polycrystalline diamond compacts (PDCs); The ratio of the polycrystalline diamond layer thickness of the difference of the degree of depth of described bench-type groove and the thickness of described polycrystalline diamond compacts (PDCs) and described polycrystalline diamond compacts (PDCs) is preferably (0.3~0.8): 1, and more preferably (0.4~0.7): 1.
In the utility model, the degree of depth of described bench-type groove is less than the thickness of described polycrystalline diamond compacts (PDCs), in polycrystalline diamond compacts (PDCs) is placed in bench-type groove time, the polycrystalline diamond layer 14 on polycrystalline diamond compacts (PDCs) top can with acid etching groove in strong acid have larger contact area, increase the leaching velocity of residual metal in polycrystalline diamond layer.Simultaneously; the difference of the degree of depth of described bench-type groove and polycrystalline diamond compacts (PDCs) thickness is less than the thickness of polycrystalline diamond layer 14; can prevent that polycrystalline diamond compacts (PDCs) is in Ore Leaching process; polycrystalline diamond layer 14 is corroded by the strong acid in acid etching groove with the composite surface of hard alloy layer 15, and then protection hard alloy layer 15.
In other embodiments, the degree of depth of bench-type groove can be identical with the thickness of polycrystalline diamond compacts (PDCs), so that the polycrystalline diamond layer of polycrystalline diamond compacts (PDCs) fully contacts as preferred version with the strong acid in acid etching groove.
In the present embodiment, bench-type groove 12 is circular platform type groove, to adapt to cross section as circular polycrystalline diamond compacts (PDCs).The high angle of the bus of described bench-type groove 12 and bench-type groove 12 is preferably 5~10 °, more preferably 6~9 °; After in polycrystalline diamond compacts (PDCs) is placed in circular platform type groove; cavity 13 places that surrounding forms inside bench-type groove become malleation air chamber; owing to there being malleation; can prevent that the acid solution in described acid etching groove from entering in bench-type groove, thereby the hard alloy layer of protection polycrystalline diamond compacts (PDCs) is not corroded.
In other embodiments, bench-type groove can be also prismoid shaped groove, to adapt as preferred version with the shape of polycrystalline diamond compacts (PDCs) cross section.
In the present embodiment, the upper surface diameter of described bench-type groove and the diameter of polycrystalline diamond compacts (PDCs) are shrink-fit, the upper bottom surface diameter of described circular platform type groove is less than the diameter of polycrystalline diamond compacts (PDCs), the difference of the upper bottom surface diameter of described circular platform type groove and the diameter of polycrystalline diamond compacts (PDCs) is preferably 0.3~0.6mm, more preferably 0.4~0.5mm.In the utility model; the diameter of the upper surface of described bench-type groove is less than the diameter of polycrystalline diamond compacts (PDCs); polycrystalline diamond compacts (PDCs) snaps in bench-type groove under the effect of external force; can make circumference and the polycrystalline diamond compacts (PDCs) of circular platform type groove upper bottom surface combine closely; thereby further prevent that the acid solution in described acid etching groove from entering in bench-type groove, the hard alloy layer of protection polycrystalline diamond compacts (PDCs) is not corroded.
In other embodiments, the upper bottom surface diameter of circular platform type groove can be identical with the diameter of polycrystalline diamond compacts (PDCs), so that the circumference of circular platform type groove upper bottom surface and polycrystalline diamond compacts (PDCs) are combined closely as preferred version as far as possible.
In the present embodiment, the diameter of acid etching groove is greater than the diameter of bench-type groove upper bottom surface, referring to Fig. 2, and the plan structure schematic diagram of the polycrystalline diamond compacts (PDCs) leaching device that Fig. 2 the utility model embodiment provides, wherein, 21 is acid etching groove, 22 is bench-type groove.The diameter of the utility model acid etching groove is greater than the upper bottom surface diameter of bench-type groove, in polycrystalline diamond compacts (PDCs) is placed in bench-type groove time, the polycrystalline diamond layer on polycrystalline diamond compacts (PDCs) top can with acid etching groove in strong acid have larger contact area, increase the leaching velocity of residual metal in polycrystalline diamond layer.
In other embodiments, the diameter of acid etching groove can be identical with the upper bottom surface diameter of bench-type groove, so that the polycrystalline diamond layer of polycrystalline diamond compacts (PDCs) fully contacts as preferred version with the strong acid in acid etching groove.
The utility model also provides a kind of leaching method of polycrystalline diamond compacts (PDCs), it is characterized in that, comprises the following steps:
Polycrystalline diamond compacts (PDCs) is pressed in the polycrystalline diamond compacts (PDCs) leaching device described in above-mentioned any one technical scheme, make the part of the polycrystalline diamond layer of polycrystalline diamond compacts (PDCs) be arranged in acid etching groove, then in acid etching groove, add strong acid to leach, obtain the polycrystalline diamond compacts (PDCs) after leaching.
The working process of the polycrystalline diamond compacts (PDCs) leaching device that the utility model provides is as follows:
Polycrystalline diamond compacts (PDCs) is pushed down in polycrystalline diamond compacts (PDCs) leaching device in the effect of external force, polycrystalline diamond compacts (PDCs) is higher than bench-type groove, a part that is polycrystalline diamond layer is arranged in acid etching groove, simultaneously, the upper surface diameter of bench-type groove and the diameter of polycrystalline diamond compacts (PDCs) are shrink-fit, make polycrystalline diamond compacts (PDCs) and bench-type groove upper surface reach the state of sealing.Then leach to injecting strong acid in acid etching groove, strong acid can not flow in bench-type groove, finally obtains the polycrystalline diamond compacts (PDCs) after leaching.
The utility model is not particularly limited the material of polycrystalline diamond compacts (PDCs) leaching device, with the material of resistance to strong acid well known to those skilled in the art, preferably adopts the macromolecule resin of resistance to strong acid; The utility model is not particularly limited polycrystalline diamond compacts (PDCs), with polycrystalline diamond compacts (PDCs) well known to those skilled in the art, preferably adopt diameter 19.05mm, height 13.20mm, polycrystalline diamond layer thickness is the polycrystalline diamond compacts (PDCs) (EP-H1913 type, Henan Jingrui Superhard Material Co., Ltd.) of 1.80mm; Strong acid described in the utility model is well known to those skilled in the art for leaching the mineral acid of residual metal, is preferably one or more in nitric acid, hydrochloric acid, perchloric acid; The utility model is not particularly limited the amount of described injection strong acid, is preferably (5~20) ml/g; The utility model was not particularly limited the time of leaching, and was preferably 24~108 hours.
The utility model repeats to leach 50 polycrystalline diamond compacts (PDCs)s according to above-mentioned steps, use XRF(X-ray fluorescence spectra) detect, experimental result shows, residual metals content before leaching in polycrystalline diamond layer is 8%, after leaching, residual metals content in the polycrystalline diamond layer leaching in district is 0.07%, use ultramicroscopic observation hard alloy layer and polycrystalline diamond layer interface simultaneously, there is not demixing phenomenon in the hard alloy layer of polycrystalline diamond compacts (PDCs), shows that hard alloy layer is not subject to sour corrosion.
The utility model provides a kind of polycrystalline diamond compacts (PDCs) leaching device and leaching method, by putting into strong acid to acid etching groove, leach the residual metal in polycrystalline diamond layer, the utility model adopts the special design of bench-type groove and acid etching groove structure and bench-type groove upper bottom surface in the position of placing polycrystalline diamond compacts (PDCs) simultaneously, make polycrystalline diamond compacts (PDCs) in acid corrosion process, hard alloy layer in protection polycrystalline diamond and Wimet composite surface and polycrystalline diamond compacts (PDCs) is not corroded by strong acid, thereby extend the work-ing life of polycrystalline diamond compacts (PDCs).
Embodiment 1
Choosing diameter is 19.05mm, the polycrystalline diamond compacts (PDCs) (EP-H1913 type, Henan Jingrui Superhard Material Co., Ltd.) that polycrystalline diamond layer thickness is 1.80mm, and the content that records residual metal in polycrystalline diamond compacts (PDCs) glomerocryst layer by XRF is 7.8%.Above-mentioned polycrystalline diamond compacts (PDCs) is pressed in the polycrystalline diamond compacts (PDCs) leaching device of being made by the macromolecule resin material of resistance to strong acid, the bench-type groove upper bottom surface diameter of leaching device is 18.6mm, the angle that bus and platform are high is 5 °, polycrystalline diamond compacts (PDCs) is higher than bench-type groove 1.0mm, i.e. the thickness of polycrystalline diamond layer in the acid etching groove of leaching device.
Leach to injecting 15ml mixing acid in acid etching groove, mixing acid is that volume ratio is hydrochloric acid and the nitric acid of 3:1.After 24 hours, obtain the polycrystalline diamond compacts (PDCs) after leaching.
Polycrystalline diamond compacts (PDCs) after above-mentioned leaching is observed, and there is not acid corrosion phenomenon in its hard alloy layer.
Polycrystalline diamond compacts (PDCs) after above-mentioned leaching is carried out to electron-microscope scanning, and as shown in Figure 3, Fig. 3 is the scanning electron microscope diagram of the polycrystalline diamond compacts (PDCs) after the utility model embodiment 1 leaches to result.As seen from Figure 3, region more than white line is for leaching district, and wherein white is residual gold symbolic animal of the birth year, and black is diamond phase.
The explanation of above embodiment is just for helping to understand method of the present utility model and core concept thereof.Should be understood that; for those skilled in the art; do not departing under the prerequisite of the utility model principle, can also carry out some improvement and modification to the utility model, these improvement and modification also fall in the protection domain of the utility model claim.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the utility model.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from spirit or scope of the present utility model, realize in other embodiments.Therefore, the utility model will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.