CN203631597U - Surface-mounted energy-saving light emitting diode - Google Patents
Surface-mounted energy-saving light emitting diode Download PDFInfo
- Publication number
- CN203631597U CN203631597U CN201320756104.6U CN201320756104U CN203631597U CN 203631597 U CN203631597 U CN 203631597U CN 201320756104 U CN201320756104 U CN 201320756104U CN 203631597 U CN203631597 U CN 203631597U
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- chip
- substrate
- emitting diode
- light emitting
- anode region
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Abstract
The utility model discloses a surface-mounted energy-saving light emitting diode, which comprises a bracket, a substrate and a chip, and is characterized in that the bracket is internally provided with an insulating tape, the insulating tape divides the bracket into a cathode region and an anode region, the substrate is arranged in the anode region, the chip is arranged in the substrate, a positive electrode and a negative electrode of the chip are respectively welded with a gold wire, the gold wire connected with the positive electrode of the chip is led out from the back surface of the anode region on the outer side of the substrate, the gold wire connected with the negative electrode of the chip is led out from the back surface of the cathode region, and the outer side of the chip is painted with external sealing glue. Through the structural design, the surface-mounted energy-saving light emitting diode has the advantages of simple manufacturing, good heat dissipation effect and stable application performance, and is a qualified light emitting diode product.
Description
Technical field
The utility model relates to light-emitting diode art, especially a kind of SMD energy saving luminous diode.
Background technology
Light-emitting diode because the life-span is long, light efficiency is high, the advantage such as radiationless and low-power consumption is widely used in lighting field.Light-emitting diode can be divided into direct insertion and SMD (SMD), and wherein SMD have the advantages such as volume is little, angle of scattering is large, uniformity of luminance is good and become the development trend of illuminating product with respect to direct insertion.In prior art; the patent of Granted publication CN203013794U provides a kind of paster LED, comprises LED wafer, silica gel and substrate; on substrate, be provided with LED wafer; LED wafer both positive and negative polarity pin is electrically connected with substrate by gold thread respectively, at least comprises that two are located at heat sink on substrate, and each is heat sink is the conductive structure contacting with described LED wafer positive/negative pin; this product thermal diffusivity is good; but structure is more complicated, is unfavorable for scale making, thereby has limited its industrial applications effect.
Summary of the invention
For the deficiencies in the prior art, the utility model provide a kind of easy to make, thermal diffusivity good and the SMD energy saving luminous diode of stable performance.
The technical solution of the utility model is: a kind of SMD energy saving luminous diode, comprise support, substrate and chip, described support is rectangle, in support, be provided with insulating tape, support is divided into cathodic region and anode region by insulating tape, in anode region, be provided with substrate, chip is installed in substrate, the positive and negative electrode of chip is all welded with gold thread, the gold thread that connects chip positive pole is drawn from the back side, anode region in substrate outside, the gold thread that connects chip negative pole is drawn from the back side, cathodic region, and chip outside is coated with external sealant, and external sealant is epoxy resin or transparent silica gel.
The beneficial effects of the utility model are: simple in structure, easy to make, production cost is low, can obtain good radiating effect by the structural design of support and the materials'use of external sealant simultaneously, make properties of product more stable, be conducive to realize good industrial applications.
Accompanying drawing explanation
Fig. 1 is the vertical view of SMD energy saving luminous diode described in the utility model.
Fig. 2 is the upward view of SMD energy saving luminous diode described in the utility model.
Fig. 3 is the sectional view of SMD energy saving luminous diode described in the utility model.
In figure, 1-support, 2-chip, 3-gold thread, 4-external sealant, 5-cathodic region, 6-anode region, 11-substrate, 12-insulating tape.
Embodiment
Below in conjunction with accompanying drawing, embodiment of the present utility model is described further:
As Figure 1-3, a kind of SMD energy saving luminous diode, comprise support (1), substrate (11) and chip (2), support (1) is rectangle, in support (1), be provided with insulating tape (12), support (1) is divided into cathodic region (5) and anode region (6) by insulating tape (12), in anode region (6), be provided with the substrate (11) being made of copper, chip (2) is installed in substrate (11), chip (2) just, negative pole is all welded with gold thread (3), connecting the anodal gold thread (3) of chip (2) draws from the back side, anode region (6) in substrate (11) outside, the gold thread (3) that connects chip (2) negative pole is drawn at (5) back side from cathodic region, chip (2) outside is coated with external sealant (4), external sealant (4) is transparent silica gel.The utility model designs by said structure, not only easy to make, and good heat dissipation effect, and serviceability is stable, is a kind of light-emitting diode product of high-quality.
That in above-described embodiment and specification, describes just illustrates principle of the present utility model and most preferred embodiment; do not departing under the prerequisite of the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.
Claims (3)
1. a SMD energy saving luminous diode, comprise support, substrate and chip, it is characterized in that: in described support, be provided with insulating tape, support is divided into cathodic region and anode region by insulating tape, is provided with substrate in anode region, and chip is installed in substrate, the positive and negative electrode of chip is all welded with gold thread, the gold thread that connects chip positive pole is drawn from the back side, anode region in substrate outside, and the gold thread that connects chip negative pole is drawn from the back side, cathodic region, and chip outside is coated with external sealant.
2. SMD energy saving luminous diode according to claim 1, is characterized in that: described support is rectangle.
3. SMD energy saving luminous diode according to claim 1, is characterized in that: described external sealant is epoxy resin or transparent silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320756104.6U CN203631597U (en) | 2013-11-27 | 2013-11-27 | Surface-mounted energy-saving light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320756104.6U CN203631597U (en) | 2013-11-27 | 2013-11-27 | Surface-mounted energy-saving light emitting diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203631597U true CN203631597U (en) | 2014-06-04 |
Family
ID=50818046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320756104.6U Expired - Fee Related CN203631597U (en) | 2013-11-27 | 2013-11-27 | Surface-mounted energy-saving light emitting diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203631597U (en) |
-
2013
- 2013-11-27 CN CN201320756104.6U patent/CN203631597U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140604 Termination date: 20181127 |