CN203617463U - Heat conducting device, plug and socket with the same, and combination thereof - Google Patents
Heat conducting device, plug and socket with the same, and combination thereof Download PDFInfo
- Publication number
- CN203617463U CN203617463U CN201320588154.8U CN201320588154U CN203617463U CN 203617463 U CN203617463 U CN 203617463U CN 201320588154 U CN201320588154 U CN 201320588154U CN 203617463 U CN203617463 U CN 203617463U
- Authority
- CN
- China
- Prior art keywords
- heat
- transfer device
- heat conduction
- plug
- bed course
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat conducting device, which includes a metal heat conduction layer having upper and lower sides; and two heat conduction cushion layers which are respectively arranged on the both sides of the metal heat conduction layer to form a three-layer structure, wherein one of the heat conduction cushion layers can be compressed in a stacking direction. The utility model also relates to a heat conducting device, which includes two metal heat conduction layers and a heat conduction cushion layer which is arranged between two metal heat conduction layers to form the three-layer structure, wherein the heat conduction cushion layer with elasticity can be compressed on the stacking direction. The utility model also provides a plug and a socket which are provided with the heat conducting device. According to the heat conducting device of the utility model, the heat conduction cushion layer can be in a compressed state after assembling the heat conducting device due to the fact that one heat conduction cushion layer can be compressed on the stacking direction, which can generate the pushing effect for the other metal heat conduction layers contacted with the heat conduction cushion layer, thereby reducing the thermal contact resistance between the heat conduction cushion layer and the other heat conduction layers as well as between the other metal heat conduction layers and an external heat transfer component.
Description
Technical field
The utility model relates to electric connector, relates in particular to a kind of electric connector with heat abstractor.
Background technology
Fig. 1 shows a kind of plug (transceiver, or optical module) of optical fiber connection area in prior art.In Fig. 1, Reference numeral 1 ' is plug casing, and Reference numeral 2 ' is circuit board, and Reference numeral 3 ' is chip, and the light signal of fiber optic conduction is converted to the signal of telecommunication by chip, and the signal of telecommunication flows to circuit board.As shown in Figure 1, between chip 3 ' top and external environment condition, without any solid matter, only have air, heat arrives external environment condition by air transmitted.But, the very narrow and small and sealing of the Spatial General 6 R between chip 3 ' and plug casing 1 ', be about about 1mm or below.Air in so narrow and small environment, effectively convection current and can only conducting heat by the conduction of air and chip.But air transmitted coefficient is extremely low, is about 0.02W/mK, cause the poor effect of dispelling the heat by air, cause the heating of chip cannot efficiently radiates heat, may affect the quality of signal transmission thereby can make optical fiber connector temperature raise.
The improvement of the heat sinking function to the plug in Fig. 1 has been shown in Fig. 2.In Fig. 2, between chip 3 ' top and plug casing 1 ', increase compressible heat conduction plastic material 4 ', make heat be transmitted to plug casing 1 ' by heat conduction plastic material 4 '.This heat conduction plastic material 4 ' fixes by chip 3 ' and the pressure of external environment condition.But heat conduction plastic material 4 ' is difficult to fix, can only fix in the vertical direction by chip 3 ' and the pressure of plug casing 1 ' merely, but cannot fixed horizontal plane direction, operator's assembling is also not easy.In addition, heat conduction plastic material conducts merely the heat of chip end face, and the heat that die bottom surface is transmitted on circuit board 2 ' is not taken away by heat conduction plastic material, and this part heat also can cause chip and circuit board temperature to raise.
A kind of Socket casing (cage, or cage) 5 ' that optical fiber of the prior art connection area has been shown in Fig. 3, this Socket casing is because intermediate interlayer 6 ' has double-decker.In this Socket casing, hold light pipe.Intermediate interlayer in Fig. 3 has been shown in Fig. 4.As being as shown in circle in Fig. 3-4, on Socket casing and intermediate interlayer, be provided with a lot of louvres.But, the louvre here can not efficiently radiates heat.Because structural limitations causes the aperture of louvre less, this has caused air-flow larger by the resistance of louvre, if in cabinet environment, the wind speed that arrives Socket casing is generally less than 1m/s, belong to low wind speed, the air flow resistance of small-bore causes blowing to by louvre that the air-flow of intermediate interlayer upper and lower sides is considerably less and speed is low like this.So in Socket casing inside, substantially there is no forced convertion.The upper and lower surface of intermediate interlayer arranges louvre in fact and cannot reach the object of dispelling the heat by cross-ventilation.Because the space in Socket casing is very narrow and small and sealing, so air there is no effective free convection in this narrow space, and the external forced convection current that the louvre arranging in side is introduced more can be ignored.Therefore the heat that cannot take away plug or Socket casing surface by effective convection current, in air, can only dispel the heat by conducting, but being about the conductive coefficient of 0.02W/mK, air cause the heat taken away by conduction few.In double-deck Socket casing, because upper sheaf space end face and outside air have convection current, and between the bottom surface of lower layer space and circuit board, interval is about 0.25mm, fills up this gap by air, and this part air cannot pass through effective heat loss through convection.Therefore caused in general double-deck Socket casing, the temperature in lower floor exceeds upper strata approximately 5 degree.
Utility model content
In order to overcome or to alleviate at least one aspect in above-mentioned technical problem, the utility model is proposed.
The utility model provides a kind of heat-transfer device, can make this heat-transfer device more fully contact with heater element and keep lower thermal resistance, and makes electric connector heat radiation more efficient.
The utility model also provides a kind of pin connector with heat-transfer device, and this heat-transfer device and the heater element of electric connector inside are that chip more fully contacts and keeps lower thermal resistance, and make electric connector heat radiation more efficient.
The utility model also provides a kind of socket connector with heat-transfer device, this heat-transfer device can and the levels of this socket connector between transferring heat, and make electric connector lower floor better heat-radiation effect.
The utility model also provides a kind of plug and socket connector combination with heat-transfer device, in the middle of the double-decker of plug inside and socket, include respectively heat abstractor, and make effectively the heat of electric connector lower floor to be delivered to upper strata, and make the better heat-radiation effect of connector combination entirety.
According to an aspect of the present utility model, a kind of heat-transfer device has been proposed, comprising: a metal guide thermosphere, has upper and lower both sides; Two heat conduction bed courses, are arranged in the both sides of described metal guide thermosphere to form three stacked interposed structures, wherein: at least one in described heat conduction bed course has elasticity and can be compressed in stacked direction.
Favourable, the both sides up and down of described metal guide thermosphere are provided with the fit structure of arranging or engaging corresponding heat conduction bed course.Further, described fit structure is the groove that is formed on the both sides up and down of metal guide thermosphere, and heat conduction bed course is arranged in corresponding groove.
Optionally, described metal guide thermosphere is provided with location structure, and described location structure coordinates with the member that heat-transfer device is arranged on wherein.
Optionally, another in described heat conduction bed course is electric-insulation heat-conduction layer.
The utility model also relates to a kind of heat-transfer device, and it comprises: two metal guide thermospheres; A heat conduction bed course, described heat conduction bed course is arranged between described two metal guide thermospheres to form three stacked interposed structures, wherein: described heat conduction bed course has elasticity and can be compressed in stacked direction.
Favourable, the side contacting with described heat conduction bed course of at least one metal guide thermosphere is provided with the fit structure of arranging or engaging heat conduction bed course.Further, described fit structure is groove, and described heat conduction bed course is arranged in groove.
The utility model has also proposed a kind of plug, described plug comprises: plug casing, and described plug casing limits corresponding to the first direction of the length direction of plug casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction; A circuit board, is parallel to the plane layout being limited by first direction and second direction in described plug casing, and described circuit board has the first side and the second side that are parallel to described plane; And at least one plug heat-transfer device, each plug heat-transfer device is arranged between circuit board and a side of the plug casing relative with described circuit board on third direction, wherein: described plug heat-transfer device has a metal guide thermosphere, there are the both sides up and down along third direction; Two heat conduction bed courses, be arranged in the both sides up and down of described metal guide thermosphere to be formed on the three-decker being stacked on third direction, wherein: the heat conduction bed course contacting with described plug casing in described heat conduction bed course can be compressed on third direction, the heat conduction bed course contacting with described circuit board in described heat conduction bed course is electric-insulation heat-conduction layer.
Favourable, the first side of described circuit board is furnished with the chip protruding along third direction; Described at least one plug heat-transfer device is or is included in the first heat-transfer device being arranged on third direction between the first side of circuit board and a side of the plug casing relative with this first side, the metal guide thermosphere of described the first heat-transfer device has first rectangle opening, the electric-insulation heat-conduction layer of described the first heat-transfer device has second rectangle opening, and described the first rectangle opening and described the second rectangle opening align on third direction; And described chip through described the first rectangle opening with described the second rectangle opening and with can the contacting by compressed heat conduction bed course of the first heat-transfer device.More specifically, the both sides along second direction of the inherent described circuit board of described plug casing have the first fin; The both sides along second direction of described circuit board have the circuit board notch coordinating with described the first fin, and described circuit board notch coordinates with described the first fin; The both sides along second direction of the metal guide thermosphere of the first heat-transfer device have the first heat-conducting layer notch, and described the first heat-conducting layer notch coordinates with described the first fin.Favourable, described the first fin has the rectangular cross section perpendicular to third direction, and described circuit board notch and described heat-conducting layer notch are rectangular notch.
Favourable, the size that the size of the first rectangle opening is slightly larger than chip thinks that chip small-sized stitch around reserves space, the undersized of the second rectangle opening in the size of chip to make electric-insulation heat-conduction layer cover exposed element on stitch around chip and circuit board after assembling.
Optionally, the both sides up and down of the metal guide thermosphere of the first heat-transfer device are provided with the groove of arranging or engaging corresponding heat conduction bed course.
Above-mentioned plug can be optical module, and described chip transfers the light signal of fiber optic conduction to the signal of telecommunication that flows to circuit board.
In above-mentioned plug, optional, described at least one heat-transfer device is or is included in the second heat-transfer device being arranged on third direction between the second side of described circuit board and a side of the plug casing relative with described the second side.
Further, described plug casing be provided with the side can compressed heat conduction bed course contacting the second heat-transfer device the second fin extending along second direction; The metal guide thermosphere of the second heat-transfer device is arranging that a described side that can compressed heat conduction bed course has the second heat-conducting layer notch extending along second direction, and described the second heat-conducting layer notch coordinates with described the second fin.Favourable, described the second heat-conducting layer notch has the rectangular cross section perpendicular to described second direction, and described the second fin has the rectangular cross section perpendicular to described second direction.
The utility model has proposed again a kind of socket, it comprises: a Socket casing, and described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction; An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction, wherein: between described two interlayer housings, clamping has socket heat-transfer device, and described socket heat-transfer device comprises two metal guide thermospheres; A heat conduction bed course, described heat conduction bed course is arranged between described two metal guide thermospheres to form three stacked interposed structures, wherein: described heat conduction bed course can be compressed in stacked direction, two metal guide thermospheres of socket heat-transfer device contact with two interlayer housings respectively.
Optionally, on each interlayer housing, be provided with rectangular aperture; A side of facing with interlayer housing of each metal guide thermosphere of socket heat-transfer device is provided with a boss; Described rectangular aperture only allows corresponding boss to protrude into arrange outside its interlayer housing.Favourable, described boss has two sides that extend parallel to each other perpendicular to second direction and along described first direction; In second direction, the distance between two sides that extend parallel to each other along first direction of described boss is less than the distance between two sides that extend parallel to each other along first direction of described metal guide thermosphere; Two sides that extend parallel to each other along first direction of described boss respectively with two side engagement that are parallel to first direction of rectangular aperture.Further, the both sides place that is parallel to second direction of described rectangular aperture is provided with the block piece extending in the space forming between two interlayer housings, and described block piece stops described metal guide thermosphere to move along first direction.
Favourable, the cross section that is parallel to first direction of described boss is isosceles trapezoid cross section.
The utility model has also proposed a kind of socket, it comprises: a Socket casing, and described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction; An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction, wherein: between described two interlayer housings, clamping has socket heat-transfer device, described socket heat-transfer device comprises a metal guide thermosphere, has upper and lower both sides; Two heat conduction bed courses, be arranged in the both sides of described metal guide thermosphere to form three stacked interposed structures, wherein: at least one in described heat conduction bed course can be compressed in stacked direction, two heat conduction bed courses of socket heat-transfer device contact with two interlayer housings respectively.
Optionally, each interlayer housing is provided with elasticity boss structure, described elasticity boss structure have one be parallel to planar portions that plane that first direction and second direction limit extends and by this planar portions resiliency supported to the elastic joint part on interlayer housing, described planar portions protrudes into outside corresponding interlayer housing; Two heat conduction bed courses of socket heat-transfer device respectively with the planar portions plane contact of two described elasticity boss structures.Favourable, described elasticity boss structure comprises two inclined-planes that are parallel to second direction extension, described two inclined-planes are connected to the both sides that are parallel to described second direction of described planar portions respectively the interlayer housing at place.
The utility model also relates to a kind of heat-transfer device, comprising: a metal guide thermosphere; A heat conduction bed course, is arranged in a side of described metal guide thermosphere, wherein: described heat conduction bed course has elasticity and can be compressed in stacked direction.Optionally, a side of described metal guide thermosphere is provided with the fit structure of arranging or engaging corresponding heat conduction bed course.Further, described fit structure is the groove that is formed on a side of metal guide thermosphere, and described heat conduction bed course is arranged in corresponding groove.Optionally, the scope of described thickness w that can compressed heat conduction bed course is: b/(a%) <w<b/ (0.8a%), wherein a% be can compressed heat conduction bed course limit compression ratio, b is the described decrement that can compressed heat conduction bed course need to provide.The utility model also relates to a kind of socket, comprise: a Socket casing, described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction; An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, in order to hold respectively two plugs, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction, wherein: between described two interlayer housings, be provided with heat-transfer device, described heat-transfer device respectively with two interlayer housing physical contacts, the heat producing when conducting described two plugs work.Optionally, described heat-transfer device is a metal derby.Optionally, described heat-transfer device is the heat-transfer device described in this section.
The utility model relates to a kind of socket and plug-assembly, and it comprises: socket, the first plug and the second plug.Socket comprises: a Socket casing, and described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction; An and intermediate interlayer, described intermediate interlayer is arranged in described Socket casing at described third direction, described Socket casing is divided into two plug spatial accommodations, and described intermediate interlayer comprises and is spaced apart from each other and is parallel to two interlayer housings that the plane that limited by first direction and second direction is extended.The first plug is placed in a plug spatial accommodation, and the second plug is placed in another plug spatial accommodation.Between two interlayer housings of described intermediate interlayer, clamping has a socket heat-transfer device, and a heat producing in the first plug and the second plug is delivered to another the plug casing in the first plug and the second plug by described socket heat-transfer device.
Favourable, described the first plug and described the second plug are above-mentioned plug.
Favourable, described socket is above-mentioned socket.
In the utility model, the scope of thickness w that can compressed heat conduction bed course is: b/(a%) <w<b/ (0.8a%), wherein a% be can compressed heat conduction bed course limit compression ratio, b is the described decrement that can compressed heat conduction bed course need to provide.
Utilize heat-transfer device of the present utility model, because a heat conduction bed course can be compressed in stacked direction, after heat-transfer device completes assembling, this heat conduction bed course can be in compressive state, this can produce pushing effect to other heat-conducting layers that are in contact with it, thereby reduces the contact heat resistance between heat conduction bed course and other heat-conducting layers and between other heat-conducting layers and external heat transfer parts.In the time that this heat-transfer device is clamped between circuit board and plug casing, the effective heat transfer path between can providing from circuit board to plug casing.And in the time that heat-transfer device is arranged in the intermediate interlayer of Socket casing, can be for providing effective heat transfer path to eliminate or effectively to reduce the temperature difference between both sides up and down of intermediate interlayer between the plug casing of the both sides up and down at intermediate interlayer.
Accompanying drawing explanation
Above and other object of the present utility model and advantage will become from the embodiment of following preferred embodiment clear presenting more in the time learning by reference to the accompanying drawings, wherein:
Fig. 1 is a kind of plug of SFF series connector of the prior art;
The improved schematic diagram of the heat sinking function to the plug in Fig. 1 has been shown in Fig. 2;
Fig. 3 is a kind of Socket casing of SFF series connector of the prior art;
Fig. 4 is the schematic diagram of the intermediate interlayer in the Socket casing of Fig. 3;
Fig. 5 is according to the schematic perspective view of the heat-transfer device of an exemplary embodiment of the present utility model;
Fig. 6 is the decomposition view of the heat-transfer device in Fig. 5;
Fig. 7 is according to the schematic perspective view of the heat-transfer device of another embodiment of the present utility model;
Fig. 8 is the schematic perspective view at another visual angle of the heat-transfer device in Fig. 7;
Fig. 9 is the decomposing schematic representation of the heat-transfer device in Fig. 7;
Figure 10 is according to the schematic perspective view of the heat-transfer device of another embodiment of the present utility model;
Figure 11 is the decomposing schematic representation of the heat-transfer device in Figure 10;
Figure 12 is according to the schematic perspective view of the heat-transfer device of another embodiment of the present utility model;
Figure 13 is the decomposing schematic representation of the heat-transfer device in Figure 12;
Figure 14 is according to the schematic perspective view of the plug of an exemplary embodiment of the present utility model, and wherein a part of parts of plug are removed to illustrate circuit board and chip;
Figure 15 is the partial sectional view of the plug in Figure 14, and wherein the heat-transfer device in Fig. 5 has been arranged between plug casing and circuit board;
Figure 16 is the partial enlarged view in Figure 15;
Figure 17 is the partly cut-away's view according to the plug of another exemplary embodiment of the present utility model, so that the structure of the Socket casing below circuit board to be shown;
Figure 18 is the partial sectional view of the plug in Figure 17, and wherein the heat-transfer device in Fig. 8 has been arranged between plug casing and circuit board;
Figure 19 is according to the schematic perspective view of the intermediate interlayer in the Socket casing of an exemplary embodiment of the present utility model;
Figure 20 is the schematic perspective view of having arranged the heat-transfer device in Figure 12 in the intermediate interlayer in Figure 19;
Figure 21 is according to the cutaway view of the assembly of the plug and socket of an exemplary embodiment of the present utility model, wherein, and socket has comprised installation in Figure 20 intermediate interlayer of heat-transfer device;
Figure 22 is according to the schematic perspective view of the intermediate interlayer in the Socket casing of another exemplary embodiment of the present utility model;
Figure 23 is partly cut-away's schematic diagram of having arranged the heat-transfer device in Figure 10 in the intermediate interlayer in Figure 22;
Figure 24 is according to the cutaway view of the assembly of the plug and socket of another exemplary embodiment of the present utility model, wherein, and socket has comprised installation in Figure 23 intermediate interlayer of heat-transfer device;
Figure 25 is according to the cutaway view of the assembly of the plug and socket of another exemplary embodiment of the present utility model, wherein, socket has comprised installation in Figure 20 intermediate interlayer of heat-transfer device, two plugs include the heat-transfer device in heat-transfer device and the Fig. 7 in Fig. 5;
Figure 26 is according to the cutaway view of the assembly of the plug and socket of another exemplary embodiment of the present utility model, wherein, socket has comprised installation in Figure 23 intermediate interlayer of heat-transfer device, two plugs include the heat-transfer device in heat-transfer device and the Fig. 7 in Fig. 5;
Figure 27 is according to the schematic diagram of the heat-transfer device of an exemplary embodiment of the present utility model.
Embodiment
Although fully describe the utility model with reference to the accompanying drawing that contains preferred embodiment of the present utility model, but before describing, this should be appreciated that those of ordinary skill in the art can revise utility model described herein, obtains technique effect of the present utility model simultaneously.Therefore, must understand above description to those of ordinary skill in the art and Yan Weiyi discloses widely, and its content does not lie in the described exemplary embodiment of restriction the utility model.
First with reference to accompanying drawing 5-11, heat-transfer device is described.As shown in Fig. 5-6, heat-transfer device 10 comprises: a metal guide thermosphere 11, has upper and lower both sides; Two heat conduction bed courses 12,13, be arranged in the both sides of described metal guide thermosphere to form three stacked interposed structures, wherein: having elasticity can be compressed in stacked direction at least one (being for example heat conduction bed course 12) in described heat conduction bed course 12,13 in Fig. 6.
For fixing heat conduction bed course 12,13, the both sides up and down of described metal guide thermosphere 11 are provided with the fit structure of arranging or engaging corresponding heat conduction bed course, this fit structure is the groove 11a that is formed on the both sides up and down of metal guide thermosphere, and heat conduction bed course 12,13 is arranged in corresponding groove.Fit structure also can be for stoping heat conduction bed course along the upper side plane of metal guide thermosphere or other structures of downside plane translation, for example can several restriction protrusion be set at the edge of metal guide thermosphere 11, this restriction protrusion has played the effect that forms the wall of groove 11a in Fig. 6.
As shown in Figure 6, the both sides of described metal guide thermosphere 11 are provided with location structure 11b, and described location structure 11b for example, coordinates with the member (plug casing of mentioning below) that heat-transfer device 10 is arranged on wherein.
In the time that heat-transfer device 10 need to dispel the heat object electric insulation with quilt, favourable, another (in Fig. 6, being for example heat conduction bed course 13) in heat conduction bed course 12,13 is electric-insulation heat-conduction layer.It should be noted that in the utility model, is also can be compressed as the heat conduction bed course of electric-insulation heat-conduction layer itself.
Metal guide thermosphere 11 can be copper layer, and heat conduction bed course 12 for example can be made up of heat-conducting plastic material, and heat conduction bed course 13 can be made up of insulating and heat-conducting plastics material.
As Figure 7-9, heat-transfer device 20 comprises: a metal guide thermosphere 21, has upper and lower both sides; Two heat conduction bed courses 22,23, are arranged in the both sides of described metal guide thermosphere to form three stacked interposed structures, wherein: at least one (in Fig. 9, being for example heat conduction bed course 22) in described heat conduction bed course 22,23 can be compressed in stacked direction.
For fixing heat conduction bed course 22,23, the both sides up and down of described metal guide thermosphere 21 are provided with the fit structure of arranging or engaging corresponding heat conduction bed course, this fit structure is the groove 21a that is formed on the both sides up and down of metal guide thermosphere, and heat conduction bed course 22,23 is arranged in corresponding groove.Fit structure also can be for stoping heat conduction bed course along the upper side plane of metal guide thermosphere or other structures of downside plane translation, for example can several restriction protrusion be set at the edge of metal guide thermosphere 21, this restriction protrusion has played the effect that forms the wall of groove 21a in Fig. 9.
As shown in Figure 9, the downside of described metal guide thermosphere 21 is provided with location structure 21b, and described location structure 21b for example, coordinates with the member (plug casing of mentioning below) that heat-transfer device 20 is arranged on wherein.As shown in Figure 9, the location structure 21b of metal guide thermosphere 21 can be arranged on the notch of the downside of metal guide thermosphere 21.
In the time that heat-transfer device 20 need to dispel the heat object electric insulation with quilt, favourable, another (in Fig. 9, being for example heat conduction bed course 23) in heat conduction bed course 22,23 is electric-insulation heat-conduction layer.
As shown in Figure 10-11, heat-transfer device 30 comprises: a metal guide thermosphere 31, has upper and lower both sides; Two heat conduction bed courses 32,33, are arranged in the both sides of described metal guide thermosphere to form three stacked interposed structures, wherein: described heat conduction bed course 32,33 all can be compressed in stacked direction.Heat conduction bed course 32 and 33 can need not to be electric insulation.
For fixing heat conduction bed course 32,33, the both sides up and down of described metal guide thermosphere 31 are provided with the fit structure of arranging or engaging corresponding heat conduction bed course, this fit structure is the groove 31a that is formed on the both sides up and down of metal guide thermosphere, and heat conduction bed course 32,33 is arranged in corresponding groove.Fit structure also can be for stoping heat conduction bed course along the upper side plane of metal guide thermosphere or other structures of downside plane translation, for example can several restriction protrusion be set at the edge of metal guide thermosphere 31, this restriction protrusion has played the effect that forms the wall of groove 31a in Figure 11.
Described above is the heat-transfer device that the both sides up and down of a metal guide thermosphere arrange respectively a heat conduction bed course.Below with reference to Figure 12-13, other heat-transfer device is described.
As shown in Figures 12-13, heat-transfer device 40 comprises: two metal guide thermospheres 41,42; A heat conduction bed course 43, described heat conduction bed course 43 is arranged between described two metal guide thermospheres 41,42 to form three stacked interposed structures, wherein: described heat conduction bed course 43 has elasticity and can be compressed in stacked direction.
As shown in Figure 13, the side contacting with described heat conduction bed course 43 (for example upside of metal guide thermosphere 42) of at least one metal guide thermosphere 41,42 is provided with the fit structure 42a1 that arranges or engage heat conduction bed course 43, this fit structure is groove, and described heat conduction bed course 43 is arranged in groove.Similarly, fit structure also can be for stoping heat conduction bed course 43 other structures along the upper side plane translation of metal guide thermosphere 42, for example can several restriction protrusion be set at the edge of metal guide thermosphere 43, this restriction protrusion has played the effect that forms the wall of groove 42a in Figure 13.The downside of metal guide thermosphere 41 also can arrange groove with spacing heat conduction bed course 43.
Utilize the heat- transfer device 10,20,30,40 of an embodiment of the utility model, because a heat conduction bed course can be compressed in stacked direction, after heat-transfer device completes assembling, this heat conduction bed course can be in compressive state, this can produce pushing effect to other heat-conducting layers that are in contact with it, thereby reduces the contact heat resistance between heat conduction bed course and other heat-conducting layers and between other heat-conducting layers and external heat transfer parts.And for heat- transfer device 10,20 and 30, in the time that this heat-transfer device is clamped between circuit board and plug casing, the effective heat transfer path between can providing from circuit board to plug casing.
The heat-transfer device of sandwich structure has more than been described.But, according to an embodiment of the present utility model, heat-transfer device also can one the metal guide thermosphere double-decker that adds a heat conduction bed course exist, heat conduction bed course can be arranged on the either side of metal guide thermosphere.Described heat conduction bed course can be compressed in stacked direction.For fixing heat conduction bed course, the upside of described metal guide thermosphere or downside are provided with the fit structure of arranging or engaging corresponding heat conduction bed course, and this fit structure is the groove that is formed on a side of metal guide thermosphere, and heat conduction bed course is arranged in corresponding groove.Fit structure also can be for stoping heat conduction bed course along the upper side plane of metal guide thermosphere or other structures of downside plane translation.
According to an embodiment of the present utility model, the metal derby form that heat-transfer device can also be simple exists.As shown in figure 27, in the time that the metal derby form with simple exists, the upper and lower surface of metal derby still has the boss 41a shown in Figure 12.In the matching relationship of metal derby and optical module, metal derby size is in the vertical direction slightly larger than standard value, makes matching relationship form interference fit, to guarantee metal derby and optical module, optical module and the direct close contact of iron cage.Use this structure lower than the infrastructure cost of three layers.
Describe according to plug of the present utility model below with reference to Figure 14-18.
As shown in Figure 14-16, plug 50 comprises: plug casing 51, and described plug casing 51 limits corresponding to the first direction X of the length direction of plug casing, the second direction Y vertical with first direction X and the third direction Z vertical with described second direction Y with described first direction X;
A circuit board 52, is parallel to the plane layout being limited by first direction and second direction in described plug casing 51, and described circuit board 52 has the first side and the second side (being upside and downside in Figure 14) that are parallel to described plane; And at least one plug heat-transfer device 10, each plug heat-transfer device 10 is arranged between circuit board 52 and a side of the plug casing relative with described circuit board 52 on third direction A, described plug heat-transfer device has: a metal guide thermosphere 11, has the both sides up and down along third direction Z; Two heat conduction bed courses 12,13, be arranged in the both sides up and down of described metal guide thermosphere to be formed on the three-decker being stacked on third direction, wherein: the heat conduction bed course 12 contacting with described plug casing in described heat conduction bed course 12,13 can be compressed on third direction Z, the heat conduction bed course contacting with described circuit board 13 in described heat conduction bed course 12,13 is electric-insulation heat-conduction layer.
In Figure 15-16, in plug 50, comprise the heat-transfer device 10 shown in Fig. 5-6.
The first side of described circuit board 52 is furnished with the chip 53 protruding along third direction, as shown in figure 14; Described at least one plug heat-transfer device is or is included in the heat-transfer device 10 being arranged on third direction Z between the first side of circuit board and a side of the plug casing relative with this first side, the electric-insulation heat-conduction layer that the metal guide thermosphere 11 of described heat-transfer device has a first rectangle opening 11c, described heat-transfer device 10 has a second rectangle opening 13a(simultaneously referring to Fig. 6), described the first rectangle opening 11c and described the second rectangle opening 13a align on third direction; And described chip 53 through the first rectangle opening 11c with the second rectangle opening 13a and with can the contacting by compressed heat conduction bed course 12 of heat-transfer device 10.
The shape of the rectangle opening is here corresponding with the shape of chip.As shown in Figure 16, the size of the first rectangle opening 11c can be slightly larger than chip size, think that chip small-sized stitch around reserves space, the undersized of the second rectangle opening 13a to make electric-insulation heat-conduction layer cover exposed element on stitch around chip and circuit board after assembling, cannot be transmitted on metal guide thermosphere 11 electric current on circuit board in chip size.The upper surface (for example Figure 15) that is placed in the chip of the first rectangle opening 11c expose the first rectangle opening 11c or at least concordant with the first rectangle opening 11c so that with 12 thermo-contacts of heat conduction bed course.
As shown in Figure 14, the both sides along second direction Y of described plug casing 51 inherent described circuit boards have the first fin 54, the both sides along second direction Y of described circuit board 52 have the circuit board notch coordinating with described the first fin 51, and described circuit board notch coordinates with described the first fin.The both sides of the metal guide thermosphere 11 of heat-transfer device 10 have i.e. the first heat-conducting layer notch of location structure 11b(), described the first heat-conducting layer notch coordinates with described the first fin 54.So, can prevent heat-transfer device 10 along first direction X in the interior movement of plug 50.More favourable, described the first fin 54 has the rectangular cross section perpendicular to third direction Z, and described circuit board notch and described heat-conducting layer notch are rectangular notch.
Plug in embodiment of the present utility model can be optical module (transceiver), and chip transfers the light signal of fiber optic conduction to the signal of telecommunication that flows to circuit board.
In the time that heat-transfer device 10 is assemblied in plug 50 as shown in Figure 15 and 16, whole heat-transfer device 10 is in compressive state, this provides compared with submissile power and presses down past metal guide thermosphere 11, the heat conduction bed course 13 of lower floor is contacted tightr with circuit board 52, and the contact heat resistance between metal guide thermosphere 11 and heat conduction bed course 12,13 and between heat conduction bed course 13 and plug body is reduced.In Figure 15, the heat of chip 53 spreads out of plug casing by the heat conduction bed course 12 on upper strata, and the heat that chip 53 is transmitted to circuit board 52 is passed to metal guide thermosphere 11 by the heat conduction bed course 13 of insulation, then passes to plug casing after passing to the heat conduction bed course 12 on upper strata.
As shown in Figure 17-18, plug casing 51 be provided with the side can compressed heat conduction bed course 22 contacting heat-transfer device 20 the second fin 55 extending along second direction Y; The metal guide thermosphere 21 of heat-transfer device 20 is arranging that a described side that can compressed heat conduction bed course 22 has the second heat-conducting layer notch (corresponding to the location structure 21b above mentioning) extending along second direction Y, and described the second heat-conducting layer notch coordinates with described the second fin 55.Favourable, described the second heat-conducting layer notch has the rectangular cross section perpendicular to described second direction Y, and described the second fin 55 has the rectangular cross section perpendicular to described second direction.Like this, by coordinating of the second heat-conducting layer notch and described the second fin 55, can prevent that heat-transfer device 20 from moving along second direction Y.Favourable, heat-transfer device 20 is equal to or slightly less than the corresponding inner chamber of plug casing 51 along the size of second direction along the size of second direction, so, can limit heat-transfer device 20 by plug casing and move along second direction.
In the time that heat-transfer device 20 is assemblied in plug 50 as shown in Figure 18, the heat conduction bed course 23 of insulation is transmitted to metal heat-conducting fast 21 by circuit exposed on covering board 52 to prevent the electric current on circuit board.And whole heat-transfer device 20 is in compressive state, this provides compared with submissile power metal guide thermosphere 21 is up pressed, the heat conduction bed course 23 of the insulation on upper strata is contacted tightr with circuit board 52, and make between metal guide thermosphere 21 and heat conduction bed course 22,23 and heat conduction bed course 22 reduces with the contact heat resistance of plug body.In Figure 18, the heat of circuit board 52 passes to metal guide thermosphere 21 by the heat conduction bed course 23 of insulation, then passes to plug casing after passing to heat conduction bed course 22.
Describe according to the socket of an exemplary embodiment of the present utility model below with reference to Figure 19-21.
Wherein: between described two interlayer housing 62a and 62b, clamping has socket heat-transfer device, described socket heat-transfer device is example heat-transfer device 40 as shown in Figure 12, and two metal guide thermospheres 41,42 of socket heat-transfer device contact with two interlayer housing 62a, 62b respectively.
As shown in Figure 19, on each interlayer housing, be provided with rectangular aperture 63; A side of facing with interlayer housing of each metal guide thermosphere 41,42 of heat-transfer device 40 is provided with boss 41a, a 42a; Described rectangular aperture 63 only allows corresponding boss 41a, 42a2 to protrude into outside the interlayer housing that it is set, as shown in Figure 20.
It is pointed out that heat-transfer device 40 can not have boss, rectangular aperture 63 also can be set on interlayer housing, heat-transfer device 40 can directly be clamped between two interlayer housings and with two interlayer housings and forms effective thermo-contact.
As shown in Figures 12-13, take boss 41a as example, described boss 41a has two side 41a1 that extend parallel to each other perpendicular to second direction and along described first direction X; On second direction Y, distance between two side 41a1 that extend parallel to each other along first direction X of described boss is less than the distance between two sides that extend parallel to each other along first direction X of described metal guide thermosphere 41, in other words, boss 41a is less than the width of metal guide thermosphere 41 along second direction along the width of second direction, favourable, boss 41a is positioned at the centre position of the upside of metal heat-conducting layer 41 in second direction.Two side 41a1 that extend parallel to each other along first direction of described boss 41a respectively with two side engagement that are parallel to first direction of rectangular aperture, as shown in Figure 20.Joint in Figure 20 can prevent that heat-transfer device 40 from moving along second direction.Favourable, the cross section that is parallel to first direction of described boss 41a is isosceles trapezoid cross section, in other words, in Figure 13, the left and right sides of boss 41a is inclined-plane 41a2.
As shown in Figure 19, the both sides place that is parallel to second direction of described rectangular aperture 63 is provided with the block piece 63a extending in the space forming between two interlayer housings, and described block piece 63a stops described metal guide thermosphere (thereby heat-transfer device 40) to move along first direction.
Heat-transfer device 40 is clamped between the interlayer housing 62a and 62b of intermediate interlayer 62, and this prevents that heat-transfer device from moving along third direction.
For the intermediate interlayer that heat-transfer device 40 is housed 62 shown in Figure 20, in the time that the above-below direction of intermediate interlayer 62 has plug 50 to insert, metal guide thermosphere 41 contacts with plug casing respectively with 42, is pushed (as shown in figure 21) toward each other simultaneously, the displacement of metal guide thermosphere 41 and 42 is delivered to heat conduction bed course 43 thus, and heat conduction bed course 43 is compressed.The compressed conductive coefficient that makes heat conduction bed course of heat conduction bed course increases, and heat conductivility is better, and has reduced the contact heat resistance between heat conduction bed course and metal guide thermosphere and between metal guide thermosphere and interlayer housing.The heat of the plug casing of lower floor can be delivered to by heat-transfer device 40 plug casing on upper strata.
Describe according to the socket of another exemplary embodiment of the present utility model below with reference to Figure 22-24.
As shown in Figure 22, each interlayer housing 62a is provided with elasticity boss structure 64, described elasticity boss structure 64 have one be parallel to planar portions 64a that plane that first direction and second direction limit extends and by this planar portions resiliency supported to the elastic joint part 64b on interlayer housing, described planar portions 64a protrudes into outside corresponding interlayer housing; Two heat conduction bed courses 32,33 of heat-transfer device 30 respectively with the planar portions 64a plane contact of two described elasticity boss structures.Favourable, described elasticity boss structure 64 comprises two inclined-plane 64c that are parallel to second direction extension, described two inclined-plane 64c are connected to the both sides that are parallel to described second direction of described planar portions 64a respectively the interlayer housing at place.
For the intermediate interlayer that heat-transfer device 30 is housed 62 shown in Figure 23, in the time that the above-below direction of intermediate interlayer 62 has plug 50 to insert, the planar portions 64a of elasticity boss structure 64 contacts with plug casing respectively, is pushed (as shown in figure 24) toward each other simultaneously, planar portions 64a displacement toward each other due to elastic joint part 64b distortion, heat conduction bed course 32,33 is compressed thus.The compressed conductive coefficient that makes heat conduction bed course of heat conduction bed course 32,33 increases, and heat conductivility is better, and has reduced the contact heat resistance between heat conduction bed course and metal guide thermosphere and between heat conduction bed course and planar portions 64a.The heat of the plug casing of lower floor can be delivered to by heat-transfer device 30 plug casing on upper strata.
According to the utility model, an embodiment also relates to a kind of socket and plug-assembly.As shown in Figure 21,24-26, described assembly comprises: a socket 60, comprise: a Socket casing 61, described Socket casing 61 limits corresponding to the first direction X of the length direction of Socket casing, the second direction Y vertical with first direction and the third direction Z vertical with described second direction with described first direction, and the direction is here corresponding to the direction limiting in plug 50; An and intermediate interlayer 62, described intermediate interlayer 62 is arranged in described Socket casing 61 described Socket casing is divided into two plug spatial accommodations at described third direction Z, described intermediate interlayer comprises two interlayer housing 62a, 62b being spaced apart from each other and being parallel to the plane extension being limited by first direction and second direction, first plug 50, is placed in a plug spatial accommodation; And second plug 50, be placed in another plug spatial accommodation,
Between two interlayer housings of wherein said intermediate interlayer 62, clamping has socket heat-transfer device, and the heat that described socket heat-transfer device produces in the first plug and the second plug (for example, in Figure 21, the 24-26 plug 50 of downside) is delivered to the plug casing of another (plug 50 of for example, upside in Figure 21,24-26) in the first plug and the second plug.
Each in described the first plug and described the second plug can be provided with above-mentioned heat-transfer device 10 and heat-transfer device 20.The intermediate interlayer 62 of described socket can arrange above-mentioned heat-transfer device 40, as shown in figure 25, can on third direction, set up from the plug 50 of lower floor to the heat-transfer path the plug 50 on upper strata, and from the circuit board 52 of plug 50 to the heat-transfer path of plug casing and the heat of chip to the heat-transfer path of the opposite side of plug casing.The intermediate interlayer 62 of described socket can arrange above-mentioned heat-transfer device 30, as shown in figure 26, can on third direction, set up equally from the plug 50 of lower floor to the heat-transfer path the plug 50 on upper strata, and from the circuit board 52 of plug 50 to the heat-transfer path of plug casing and the heat of chip to the heat-transfer path of the opposite side of plug casing.
According to an embodiment of the present utility model, if the limit compression ratio of heat conduction bed course is a%, the decrement that heat conduction bed course need to provide is b, and the scope of the thickness w of described heat conduction bed course is about: b/(a%) <w<b/ (0.8a%).Because the coefficient of conductivity of heat conduction bed course is compared with metal guide thermosphere low (being 5W/mk left and right to the maximum), so in order to reach best heat-transfer effect, select thin as far as possible heat conductive pad, be as the criterion with the limit that decrement can be provided.Heat conduction bed course is compressed and can makes thermal resistance reduce and increase heat-conductive characteristic.For example need to provide the decrement of a mm, and the limit compression ratio of heat conduction bed course is 65%, the thickness of heat conduction bed course can be set to a/ (0.52～0.65) so.
In addition, under certain input power, calorifics emulation of the present utility model has obtained following simulation result:
(1), by heat- transfer device 10 and 20 being placed in to the heat transfer model of existing product, chip temperature rise ratio being used separately in the situation of heat conductive pad (being heat conduction plastic material 4 ') and reduce by 6.4 ℃.
(2), by heat-transfer device 40 being placed in to the heat transfer model of existing product, the temperature difference that makes lower floor's chip and upper strata chip in socket is reduced to 1.5 ℃ from 4.3 ℃, and upper strata chip has been realized the cooling of approximately 0.8 ℃.By heat-transfer device 30 being placed in to the heat transfer model of existing product, the temperature difference that makes lower floor's chip and upper strata chip in socket is reduced to 1.7 ℃ from 4.3 ℃, and the temperature of upper strata chip only improves 0.6 ℃.
(3) by heat- transfer device 10 and 20, heat-transfer device 40 being placed in to the heat transfer model of existing product, the temperature of upper strata chip has reduced by 29.7 ℃, and the temperature of lower floor's chip has reduced by 33.4 ℃, and the temperature difference of upper strata chip and lower floor's chip only has 0.58 ℃; By heat- transfer device 10 and 20, heat-transfer device 30 being placed in to the heat transfer model of existing product, the temperature of upper strata chip has reduced by 29.3 ℃, and the temperature of lower floor's chip has reduced by 32.4 ℃, and the temperature difference of upper strata chip and lower floor's chip is 1.1 ℃.
The utility model has also proposed a kind of socket, comprise: a Socket casing, described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction; An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, in order to hold respectively two plugs, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction, wherein: between described two interlayer housings, be provided with heat-transfer device, described heat-transfer device respectively with two interlayer housing physical contacts, the heat producing when conducting described two plugs work.Optionally, described heat-transfer device is a metal derby.Optionally, described heat-transfer device is the double-deck conductive structure of mentioning in above.
In a word, utilize the technical solution of the utility model, can reduce the temperature of chip, also can be in realization the temperature difference that declines between upper strata chip and lower floor's chip of low socket of the situation of temperature slight modification of layer chip.
Although illustrated and described embodiment of the present utility model, for the ordinary skill in the art, be appreciated that in the situation that not departing from principle of the present utility model and spirit and can change these embodiment.The scope of application of the present utility model is limited by claims and equivalent thereof.Rights protection scope of the present utility model, should as the application claim defined is as the criterion.It should be noted that word " comprises " does not get rid of other element, and word " " is not got rid of multiple.
Claims (38)
1. a heat-transfer device, is characterized in that, described heat-transfer device comprises:
A metal guide thermosphere, has upper and lower both sides;
Two heat conduction bed courses, are arranged in the both sides of described metal guide thermosphere to form three stacked interposed structures,
Wherein:
At least one in described heat conduction bed course has elasticity and can be compressed in stacked direction.
2. heat-transfer device according to claim 1, is characterized in that:
The both sides up and down of described metal guide thermosphere are provided with the fit structure of arranging or engaging corresponding heat conduction bed course.
3. heat-transfer device according to claim 2, is characterized in that:
Described fit structure is the groove that is formed on the both sides up and down of metal guide thermosphere, and heat conduction bed course is arranged in corresponding groove.
4. heat-transfer device according to claim 1, is characterized in that:
Two of described heat conduction bed courses all have elasticity and can be compressed in stacked direction.
5. heat-transfer device according to claim 1, is characterized in that:
The scope of described thickness w that can compressed heat conduction bed course is: b/(a%) <w<b/ (0.8a%), wherein a% be can compressed heat conduction bed course limit compression ratio, b is the described decrement that can compressed heat conduction bed course need to provide.
6. heat-transfer device according to claim 1, is characterized in that:
Described metal guide thermosphere is provided with location structure, and described location structure coordinates with the member that heat-transfer device is arranged on wherein.
7. heat-transfer device according to claim 1, is characterized in that:
One in described heat conduction bed course is electric-insulation heat-conduction layer.
8. a heat-transfer device, is characterized in that, described heat-transfer device comprises:
Two metal guide thermospheres;
A heat conduction bed course, described heat conduction bed course is arranged between described two metal guide thermospheres to form three stacked interposed structures,
Wherein:
Described heat conduction bed course has elasticity and can be compressed in stacked direction.
9. heat-transfer device according to claim 8, is characterized in that:
The side contacting with described heat conduction bed course of at least one metal guide thermosphere is provided with the fit structure of arranging or engaging heat conduction bed course.
10. heat-transfer device according to claim 9, is characterized in that:
Described fit structure is groove, and described heat conduction bed course is arranged in groove.
11. heat-transfer devices according to claim 8, is characterized in that:
The scope of described thickness w that can compressed heat conduction bed course is: b/(a%) <w<b/ (0.8a%), wherein a% be can compressed heat conduction bed course limit compression ratio, b is the described decrement that can compressed heat conduction bed course need to provide.
12. 1 kinds of plugs, is characterized in that, described plug comprises:
Plug casing, described plug casing limits corresponding to the first direction of the length direction of plug casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction;
A circuit board, is parallel to the plane layout being limited by first direction and second direction in described plug casing, and described circuit board has the first side and the second side that are parallel to described plane; And
At least one plug heat-transfer device, each plug heat-transfer device is arranged between circuit board and a side of the plug casing relative with described circuit board on third direction, and described plug heat-transfer device has:
A metal guide thermosphere, has the both sides up and down along third direction;
Two heat conduction bed courses, are arranged in the both sides up and down of described metal guide thermosphere to be formed on the three-decker being stacked on third direction,
Wherein:
The heat conduction bed course contacting with described plug casing in described heat conduction bed course can be compressed on third direction, and the heat conduction bed course contacting with described circuit board in described heat conduction bed course is electric-insulation heat-conduction layer.
13. plugs according to claim 12, is characterized in that:
The first side of described circuit board is furnished with the chip protruding along third direction;
Described at least one plug heat-transfer device is or is included in the first heat-transfer device being arranged on third direction between the first side of circuit board and a side of the plug casing relative with this first side, the metal guide thermosphere of described the first heat-transfer device has first rectangle opening, the electric-insulation heat-conduction layer of described the first heat-transfer device has second rectangle opening, and described the first rectangle opening and described the second rectangle opening align on third direction; And
Described chip through described the first rectangle opening with described the second rectangle opening and with can the contacting by compressed heat conduction bed course of the first heat-transfer device.
14. plugs according to claim 13, is characterized in that:
The both sides along second direction of the inherent described circuit board of described plug casing have the first fin;
The both sides along second direction of described circuit board have the circuit board notch coordinating with described the first fin, and described circuit board notch coordinates with described the first fin;
The both sides along second direction of the metal guide thermosphere of the first heat-transfer device have the first heat-conducting layer notch, and described the first heat-conducting layer notch coordinates with described the first fin.
15. plugs according to claim 14, is characterized in that:
Described the first fin has the rectangular cross section perpendicular to third direction, and described circuit board notch and described heat-conducting layer notch are rectangular notch.
16. plugs according to claim 13, is characterized in that:
The size that the size of the first rectangle opening is slightly larger than chip thinks that chip small-sized stitch around reserves space, the undersized of the second rectangle opening in the size of chip to make electric-insulation heat-conduction layer cover exposed element on stitch around chip and circuit board after assembling.
17. plugs according to claim 12, is characterized in that:
The both sides up and down of the metal guide thermosphere of the first heat-transfer device are provided with the groove of arranging or engaging corresponding heat conduction bed course.
18. plugs according to claim 13, is characterized in that:
Described plug is optical module, and described chip transfers the light signal of fiber optic conduction to the signal of telecommunication that flows to circuit board.
19. plugs according to claim 12, is characterized in that:
The scope of described thickness w that can compressed heat conduction bed course is: b/(a%) <w<b/ (0.8a%), wherein a% be can compressed heat conduction bed course limit compression ratio, b is the described decrement that can compressed heat conduction bed course need to provide.
20. according to the plug described in any one in claim 12-19, it is characterized in that:
Described at least one heat-transfer device is or is included in the second heat-transfer device being arranged on third direction between the second side of described circuit board and a side of the plug casing relative with described the second side.
21. plugs according to claim 20, is characterized in that:
The side can compressed heat conduction bed course contacting of described plug casing and the second heat-transfer device is provided with the second fin extending along second direction;
The metal guide thermosphere of the second heat-transfer device is arranging that a described side that can compressed heat conduction bed course has the second heat-conducting layer notch extending along second direction, and described the second heat-conducting layer notch coordinates with described the second fin.
22. plugs according to claim 21, is characterized in that:
Described the second heat-conducting layer notch has the rectangular cross section perpendicular to described second direction, and described the second fin has the rectangular cross section perpendicular to described second direction.
23. 1 kinds of sockets, comprising:
A Socket casing, described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction;
An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction
It is characterized in that:
Between described two interlayer housings, to have socket heat-transfer device, described socket heat-transfer device be the heat-transfer device described in any one according to Claim 8-11 in clamping, and two metal guide thermospheres of socket heat-transfer device contact with two interlayer housings respectively.
24. sockets according to claim 23, is characterized in that:
On each interlayer housing, be provided with rectangular aperture;
A side of facing with interlayer housing of each metal guide thermosphere of socket heat-transfer device is provided with a boss;
Described rectangular aperture only allows corresponding boss to protrude into arrange outside its interlayer housing.
25. sockets according to claim 24, is characterized in that:
Described boss has two sides that extend parallel to each other perpendicular to second direction and along described first direction;
In second direction, the distance between two sides that extend parallel to each other along first direction of described boss is less than the distance between two sides that extend parallel to each other along first direction of described metal guide thermosphere;
Two sides that extend parallel to each other along first direction of described boss respectively with two side engagement that are parallel to first direction of rectangular aperture.
26. sockets according to claim 25, is characterized in that:
The both sides place that is parallel to second direction of described rectangular aperture is provided with the block piece extending in the space forming between two interlayer housings, and described block piece stops described metal guide thermosphere to move along first direction.
27. sockets according to claim 25, is characterized in that:
The cross section that is parallel to first direction of described boss is isosceles trapezoid cross section.
28. 1 kinds of sockets, comprising:
A Socket casing, described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction;
An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction
It is characterized in that:
Between described two interlayer housings, to have socket heat-transfer device, described socket heat-transfer device be according to the heat-transfer device described in any one in claim 1-5 in clamping, and two heat conduction bed courses of socket heat-transfer device contact with two interlayer housings respectively.
29. sockets according to claim 28, is characterized in that:
Each interlayer housing is provided with elasticity boss structure, described elasticity boss structure have one be parallel to planar portions that plane that first direction and second direction limit extends and by this planar portions resiliency supported to the elastic joint part on interlayer housing, described planar portions protrudes into outside corresponding interlayer housing;
Two heat conduction bed courses of socket heat-transfer device respectively with the planar portions plane contact of two described elasticity boss structures.
30. sockets according to claim 29, is characterized in that:
Described elasticity boss structure comprises two inclined-planes that are parallel to second direction extension, and described two inclined-planes are connected to the both sides that are parallel to described second direction of described planar portions respectively the interlayer housing at place.
31. 1 kinds of heat-transfer devices, comprising:
A metal guide thermosphere;
A heat conduction bed course, is arranged in a side of described metal guide thermosphere, wherein: described heat conduction bed course has elasticity and can be compressed in stacked direction.
32. heat-transfer devices according to claim 31, wherein:
One side of described metal guide thermosphere is provided with the fit structure of arranging or engaging corresponding heat conduction bed course.
33. heat-transfer devices according to claim 32, wherein:
Described fit structure is the groove that is formed on a side of metal guide thermosphere, and described heat conduction bed course is arranged in corresponding groove.
34. heat-transfer devices according to claim 31, wherein:
The scope of described thickness w that can compressed heat conduction bed course is: b/(a%) <w<b/ (0.8a%), wherein a% be can compressed heat conduction bed course limit compression ratio, b is the described decrement that can compressed heat conduction bed course need to provide.
35. 1 kinds of sockets, comprising:
A Socket casing, described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction;
An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, in order to hold respectively two plugs, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction
It is characterized in that:
Between described two interlayer housings, be provided with heat-transfer device, described heat-transfer device respectively with two interlayer housing physical contacts, the heat producing when conducting described two plugs work;
Described heat-transfer device is a kind of heat-transfer device described in any one in claim 31-34.
36. sockets according to claim 35, wherein said heat-transfer device is a metal derby.
37. 1 kinds of sockets and plug-assembly, comprising:
A socket, comprising:
A Socket casing, described Socket casing limits corresponding to the first direction of the length direction of Socket casing, the second direction vertical with first direction and the third direction vertical with described second direction with described first direction; And
An intermediate interlayer, described intermediate interlayer is arranged in described Socket casing described Socket casing is divided into two plug spatial accommodations at described third direction, described intermediate interlayer comprises two interlayer housings that are spaced apart from each other and are parallel to the plane extension being limited by first direction and second direction
First plug, is placed in a described plug spatial accommodation; And
Second plug, is placed in plug spatial accommodation described in another,
It is characterized in that:
Between two interlayer housings of described intermediate interlayer, clamping has socket heat-transfer device, described socket heat-transfer device to can be used for conducting the heat of the first plug and the generation of the second plug;
Described the first plug and described the second plug are according to the plug described in any one in claim 20-22.
38. according to the assembly described in claim 37, it is characterized in that:
Described socket is according to the socket described in any one in claim 23-30,35-36.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320588154.8U CN203617463U (en) | 2013-08-02 | 2013-09-23 | Heat conducting device, plug and socket with the same, and combination thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320472914.9 | 2013-08-02 | ||
| CN201320472914 | 2013-08-02 | ||
| CN201320588154.8U CN203617463U (en) | 2013-08-02 | 2013-09-23 | Heat conducting device, plug and socket with the same, and combination thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203617463U true CN203617463U (en) | 2014-05-28 |
Family
ID=50770087
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320588154.8U Expired - Fee Related CN203617463U (en) | 2013-08-02 | 2013-09-23 | Heat conducting device, plug and socket with the same, and combination thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203617463U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104348005A (en) * | 2013-08-02 | 2015-02-11 | 泰科电子(上海)有限公司 | Heat-conduction devices, plugs with heat-conduction devices, socket and combination |
| CN104582446A (en) * | 2014-12-31 | 2015-04-29 | 广州汉源新材料有限公司 | Heat conducting gasket of composite structure |
| CN107607215A (en) * | 2016-07-11 | 2018-01-19 | 泰科电子(上海)有限公司 | Temperature survey component, temperature measuring equipment and electric appliance component |
| CN108649373A (en) * | 2018-04-07 | 2018-10-12 | 温州意华接插件股份有限公司 | Hot swap type interface connector |
-
2013
- 2013-09-23 CN CN201320588154.8U patent/CN203617463U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104348005A (en) * | 2013-08-02 | 2015-02-11 | 泰科电子(上海)有限公司 | Heat-conduction devices, plugs with heat-conduction devices, socket and combination |
| CN104582446A (en) * | 2014-12-31 | 2015-04-29 | 广州汉源新材料有限公司 | Heat conducting gasket of composite structure |
| CN104582446B (en) * | 2014-12-31 | 2018-01-05 | 广州汉源新材料股份有限公司 | A kind of heat-conducting pad of composite construction |
| CN107607215A (en) * | 2016-07-11 | 2018-01-19 | 泰科电子(上海)有限公司 | Temperature survey component, temperature measuring equipment and electric appliance component |
| CN108649373A (en) * | 2018-04-07 | 2018-10-12 | 温州意华接插件股份有限公司 | Hot swap type interface connector |
| CN108649373B (en) * | 2018-04-07 | 2024-01-26 | 温州意华接插件股份有限公司 | Hot plug type interface connector |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6374455B2 (en) | Connector system with thermal management | |
| US9696506B2 (en) | Connector housing assembly and connector having the same | |
| CN203839574U (en) | Connector, connector assembly and equipment | |
| CN203617463U (en) | Heat conducting device, plug and socket with the same, and combination thereof | |
| CN105474474B (en) | Connector system with hot surface | |
| US10375859B2 (en) | Ganged shielding cage with thermal passages | |
| US9547141B2 (en) | Connector for receiving plug and connector assembly having sandwiched heat conduction | |
| TWI488371B (en) | Power connector | |
| CN204929513U (en) | Hand -held device and use handheld cloud platform of this hand -held device | |
| TW201607160A (en) | Thermally efficient connector system | |
| JPWO2016067659A1 (en) | Heat dissipation structure | |
| CN105988170B (en) | Connector, connector assembly and equipment | |
| CN104470321A (en) | Connector, connector assembly and heat conduction devices for plugs | |
| CN103823280B (en) | Signal transmitting apparatus | |
| US20130020055A1 (en) | Thermal module structure and manufacturing method thereof | |
| CN104010474A (en) | Servo amplifier having cooling structure including heat sink | |
| CN104348005A (en) | Heat-conduction devices, plugs with heat-conduction devices, socket and combination | |
| CN204090411U (en) | Heat pipe assembly structure and mobile phone thereof | |
| KR102545089B1 (en) | Connector | |
| CA2956008C (en) | Modular assembly | |
| CN205985500U (en) | Electric connector structure | |
| CN108232697B (en) | Electrical connector | |
| CN106061180B (en) | Airborne control box | |
| CN204168691U (en) | A kind of high density high speed connector of elasticity self-locking | |
| KR20220008178A (en) | Adapter incorporating heat dissipation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140528 Termination date: 20190923 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |