CN203596580U - Bus duct - Google Patents
Bus duct Download PDFInfo
- Publication number
- CN203596580U CN203596580U CN201320813518.8U CN201320813518U CN203596580U CN 203596580 U CN203596580 U CN 203596580U CN 201320813518 U CN201320813518 U CN 201320813518U CN 203596580 U CN203596580 U CN 203596580U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- main board
- bus duct
- silica gel
- described upper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model relates to a bus duct which comprises a housing, conducting bars, insulating strips, silica gel sheets and sealing strips. The housing is composed of an upper main board and a lower main board which are vertically symmetrical, and two guard boards which are horizontally symmetrical. The upper main board and the lower main board are symmetrically connected and form an enclosed space. The conducting bars, the insulating strips and the silica gel sheets are fixedly held in the enclosed space. The insulating sheets are wound on the conducting bars. The silica gel sheets are positioned between the housing and the busbars and the insulating strips. Trenches are arranged at connection places of the upper main board and the lower main board. The sealing strips are received in the trenches. The upper main board and the lower main board are connected together by rivet fasteners. The bus duct has many advantages such as tight clamping, high structural compactness, strong heat radiation performance and high overload capability, has a housing which has a structure having high pressure resistance, and can help to effectively reduce temperature rise.
Description
[technical field]
The utility model relates to a kind of bus duct, and it is applied in the transmission lines such as modern high-rise building and large-scale workshop, belongs to electric power facility technical field.
[background technology]
Concentration bus duct of the prior art comprises shell, generally adopts straight line biside plate or biside plate and a solid shape enclosure space of two cover plates composition, and four faces that form after shell connects have formed integral protection of inner electric conductor.This inside configuration solid shape space and conductor construction compactness is poor, degree of protection is low, poor radiation, temperature rise, overload capacity are poor, easily produce eddy current; The as a whole guard shield of two faces in upper and lower surfaces and left and right, it is low that fastening point less and fastening degree is poor, shell mechanism intensity is withstand voltage, as one side is wherein subject to easily distortion after external force collision, thereby badly influence the damage of inner conductive body etc., easily produce potential safety hazard.
Therefore, for avoiding above-mentioned technical problem, the necessary one that provides has structure improved bus duct, to overcome described defect of the prior art.
[utility model content]
For addressing the above problem, the purpose of this utility model is to provide a kind of and fastens closely, shell mechanism resistance to pressure is strong, compact conformation degree is high, thermal diffusivity is strong, overload capacity is high, effectively reduces the bus duct of temperature rise.
For achieving the above object, the technical scheme that the utility model is taked is: a kind of bus duct, and it comprises shell, busbar, insulating trip, silica gel piece and sealing strip; Wherein, described shell is made up of laterally zygomorphic upper mainboard, lower mainboard and symmetrical two backplates; Described upper mainboard is connected with lower mainboard is symmetrical, and forms an enclosure space; Described busbar, insulating trip, silica gel piece are immobilizated in enclosure space, and described insulating trip is wound on busbar, and described silica gel piece is between shell and busbar, insulating trip; Be provided with groove in described upper mainboard, lower mainboard junction, sealing strip is contained in groove; Described upper mainboard and lower mainboard link together with tightening of rivet part.
Bus duct of the present utility model is further set to: described upper mainboard and the curved structure of lower mainboard, make enclosure space be funnel-form.
Bus duct of the present utility model is further set to: be provided with some buckling partss in described backplate, described buckling parts is held on mainboard, lower mainboard; And form four inner chambers between described upper mainboard, lower mainboard and two of left and right backplate.
Bus duct of the present utility model is further set to: be provided with some fin in described upper mainboard and lower mainboard.
Bus duct of the present utility model is also set to: described upper mainboard, lower mainboard, two backplates are almag material.
Compared with prior art, the utlity model has following beneficial effect:
1. shell mechanism is withstand voltage stronger:
On upper mainboard and lower mainboard, adopt camber design, connect and form funneling enclosure space, finally connect with tightening of rivet again by external pressure, busbar entirety is wrapped in mainboard, and arc mainboard is tightr after contacting with busbar, insulating trip etc. by external pressure, structural strength compression resistance is higher, and have water proof and dust proof design, greatly improve its degree of protection.
2. compact conformation Du Genggao, thermal diffusivity are stronger, overload capacity is higher:
Because mainboard adopts camber design, compact conformation degree is improved greatly, thermal diffusivity is higher, overload capacity is higher, and shell is provided with some fin, can increase structural strength, and make it abut against busbar together can very fast heat be distributed by shell, more effectively reduce temperature rise.
3. fasten tightr, safer:
Because two mainboards have formed to perfect protection such as inner busbars, be designed with again on this basis protection type " U " type backplate, backplate is that 3 same form are fastened on mainboard, fastens point more closely can not come off with mainboard; The inner chamber at four angles of shell that form after fastening, more effectively alleviates damping and damages because of the internal structure that external impact causes, and greatly improves bus security performance.
[accompanying drawing explanation]
Fig. 1 is the sectional drawing of bus duct of the present utility model.
[embodiment]
Refer to shown in Figure of description 1, the utility model is a kind of bus duct, and it is assembled by several parts such as shell, busbar 3, insulating trip 2, silica gel piece 4 and sealing strips 5.Wherein, described shell is made up of laterally zygomorphic upper mainboard 11, lower mainboard 12 and symmetrical two backplates 13.
Described upper mainboard 11 and lower symmetrical connection of mainboard 12, and form an enclosure space 6; Described busbar 3, insulating trip 2, silica gel piece 4 are immobilizated in enclosure space 6.Described upper mainboard 11 and the curved structure of lower mainboard 12, make enclosure space 6 be funnel-form.
Described insulating trip 2 is wound on busbar 3, and described silica gel piece 4 is between shell and busbar 3, insulating trip 2.
Be provided with groove (not label) in described upper mainboard 11, lower mainboard 12 junctions, sealing strip 5 is contained in groove.Described upper mainboard 11 links together with lower mainboard 12 use tightening of rivet parts 15.
Further, be provided with some buckling partss 14 in described backplate 13, described buckling parts 14 is held on mainboard 11, lower mainboard 12; And form four inner chambers 8 between described upper mainboard 11, lower mainboard 12 and two of left and right backplate 13.Be provided with some fin 9 in described upper mainboard 11 and lower mainboard 12.Described upper mainboard 11, lower mainboard 12, two backplates 13 are almag material.
The assembling process of bus duct of the present utility model is as follows: first sealing strip 5 is put on the hook groove of lower mainboard 12, it can not be come off; Then will be wound with the busbar 3 of insulating trip 2 and silica gel piece 4 and put into the enclosure space 6 of lower mainboard 12; Then upper mainboard 11 is buckled on lower mainboard 12; Then connect with tightening of rivet part 15 in the joint portion of upper mainboard 11, lower mainboard 12 by external pressure, last backplate 13 is held in the left and right sides of upper mainboard 11, lower mainboard 12 by external pressure, and forms four inner chambers 8 up and down.
Above embodiment is only the preferred embodiment of this creation, not in order to limit this creation, any modification of making, is equal to replacement, improvement etc., within all should being included in the protection range of this creation within all spirit in this creation and principle.
Claims (5)
1. a bus duct, is characterized in that: comprise shell, busbar, insulating trip, silica gel piece and sealing strip; Wherein, described shell is made up of laterally zygomorphic upper mainboard, lower mainboard and symmetrical two backplates; Described upper mainboard is connected with lower mainboard is symmetrical, and forms an enclosure space; Described busbar, insulating trip, silica gel piece are immobilizated in enclosure space, and described insulating trip is wound on busbar, and described silica gel piece is between shell and busbar, insulating trip; Be provided with groove in described upper mainboard, lower mainboard junction, sealing strip is contained in groove; Described upper mainboard and lower mainboard link together with tightening of rivet part.
2. bus duct as claimed in claim 1, is characterized in that: described upper mainboard and the curved structure of lower mainboard, make enclosure space be funnel-form.
3. bus duct as claimed in claim 1, is characterized in that: be provided with some buckling partss in described backplate, described buckling parts is held on mainboard, lower mainboard; And form four inner chambers between described upper mainboard, lower mainboard and two of left and right backplate.
4. bus duct as claimed in claim 1, is characterized in that: be provided with some fin in described upper mainboard and lower mainboard.
5. bus duct as claimed in claim 1, is characterized in that: described upper mainboard, lower mainboard, two backplates are almag material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320813518.8U CN203596580U (en) | 2013-12-12 | 2013-12-12 | Bus duct |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320813518.8U CN203596580U (en) | 2013-12-12 | 2013-12-12 | Bus duct |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203596580U true CN203596580U (en) | 2014-05-14 |
Family
ID=50677438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320813518.8U Expired - Fee Related CN203596580U (en) | 2013-12-12 | 2013-12-12 | Bus duct |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203596580U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143802A (en) * | 2014-06-30 | 2014-11-12 | 江苏德驰电气有限公司 | Low-voltage bus duct side plate structure |
| CN106159548A (en) * | 2016-08-28 | 2016-11-23 | 威腾电气集团股份有限公司 | A kind of closed heat conduction bus tie |
-
2013
- 2013-12-12 CN CN201320813518.8U patent/CN203596580U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104143802A (en) * | 2014-06-30 | 2014-11-12 | 江苏德驰电气有限公司 | Low-voltage bus duct side plate structure |
| CN106159548A (en) * | 2016-08-28 | 2016-11-23 | 威腾电气集团股份有限公司 | A kind of closed heat conduction bus tie |
| CN106159548B (en) * | 2016-08-28 | 2018-09-18 | 威腾电气集团股份有限公司 | A kind of closed heat conduction bus tie |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140514 Termination date: 20141212 |
|
| EXPY | Termination of patent right or utility model |