CN203587623U - Earphone pin welding, injection molding and testing device - Google Patents
Earphone pin welding, injection molding and testing device Download PDFInfo
- Publication number
- CN203587623U CN203587623U CN201320739963.4U CN201320739963U CN203587623U CN 203587623 U CN203587623 U CN 203587623U CN 201320739963 U CN201320739963 U CN 201320739963U CN 203587623 U CN203587623 U CN 203587623U
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- earphone
- contact pin
- pcb board
- golden finger
- welding
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Abstract
The utility model discloses an earphone pin welding, injection molding and testing device, which comprises a PCB (printed circuit board), a welding support, an injection mold and an insulation testing device, wherein one side of the PCB is provided with a golden finger plug, and the other side of the PCB is provided with a plurality of earphone sockets; the welding support is used for welding a earphone line on a welding pad of a welding pin, and the PCB and the welding support are provided with a first positioning device therebetween; the injection mold is used for injecting a protection layer at the position of the welding pad of the earphone pin, the PCB and the injection mold are provided with a second positioning device therebetween, and the earphone pin, the earphone line and the protection layer form an earphone pin assembly together; and the insulation testing device is used for collecting electrical parameters between each of the earphone pin assemblies and an electrode so as to judge the insulating performance, and the insulation testing device is provided with a slot used for plugging the golden finger plug. Adoption of the earphone pin welding, injection molding and testing device greatly improves the production efficiency, reduces the production cost, and greatly improves the product yield at the same time.
Description
Technical field
The utility model relates to a kind of earphone contact pin bonding wire, injection moulding and proving installation.
Background technology
In prior art; getting single earphone contact pin inserts fixedly female seat and carries out contact pin bonding wire; after bonding wire, take out earphone contact pin and insert mould bar pilot hole injection moulding inner protective layer (repeating again same action if any external protection), after injection moulding, extract earphone contact pin component and carry out single Insulation test.
According to single product, repeating plug calculates: the machine transplanting of rice of 2 times+Insulation test of 1 time+interior external protection mould bar plug of wire welding tool plug is pulled out 1 time, and disposable test completes, and single earphone contact pin at least needs to carry out 4 Plug Actions.So not only waste a large amount of activity durations, and properties of product and earphone contact pin overlay coating are caused to certain harmful effect, as bad in electrical property, coating wearing and tearing, contact pin scuffing etc.Simultaneously also with loss and the plant maintenance of Work tool.Waste more human and material resources and financial resources.
Utility model content
Technical problem to be solved in the utility model is: a kind of earphone contact pin bonding wire, injection moulding and proving installation are provided, increase substantially production efficiency, reduce production costs, increase substantially product yield simultaneously.
For solving the problems of the technologies described above, the technical solution of the utility model is: earphone contact pin bonding wire, injection moulding and proving installation, comprising:
Pcb board, a side of described pcb board is provided with golden finger plug, and the opposite side of described pcb board is provided with several earphone sockets, and the electrode on each earphone socket and golden finger monomer on described golden finger plug are corresponding and be electrically connected to by circuit one by one;
For weld the welding support of earphone cord on the pad of earphone contact pin, between described pcb board and described welding support, be provided with the first locating device;
Injection mold for the pad locations injection moulding protective seam at earphone contact pin, is provided with the second locating device between described pcb board and described injection mold, and described earphone contact pin, described earphone cord and described protective seam form earphone contact pin component jointly;
For gathering electrical parameter value between the electrode of each earphone contact pin component to judge the insulated test device of its insulating property, described insulated test device is provided with the slot for golden finger plug described in plug-in mounting.
As a kind of preferred technical scheme, described pcb board is provided with 4 earphone sockets, and each earphone socket is four utmost point earphone sockets, and described golden finger plug is provided with 16 golden finger monomers that are electrically connected to the electrode of described 4 earphone sockets.
As a kind of preferred technical scheme, described the first locating device comprises the pilot hole of being located on described pcb board, and is located at the reference column on described welding support.
As a kind of preferred technical scheme, described injection mold comprises mold and bed die, and described the second locating device comprises the pilot hole of being located on described pcb board, and is located at the reference column on described bed die.
Described injection mold also comprises the mould bar for described earphone cord is positioned of being located between described mold and described bed die.
Adopted after technique scheme, the beneficial effects of the utility model are:
The utility model adopts a side to be provided with the pcb board that golden finger plug opposite side is provided with several earphone sockets, solved traditional handicraft earphone contact pin bonding wire, in injection moulding and test process, need frequently to plug the problem of contact pin, disposable by the earphone socket on a plurality of earphone contact pins insertion pcb boards, not only by earphone socket, realized fixing earphone contact pin, and by the related circuit on earphone socket and pcb board, golden finger monomer conducting on the electrode of earphone contact pin and pcb board golden finger plug, therefore, in contact pin bonding wire craft, pcb board can serve as tooling bracket, in the technique of injection moulding protective seam, pcb board can serve as mould positioning tool, in test process, pcb board can serve as test channel.
Adopt such scheme, each earphone contact pin only need to once plug from start to finish, has avoided because repeating to plug contact pin surface tear, coating wearing and tearing and the Work tool loss that contact pin causes, and product yield improves because plugging the minimizing of number of times.And the utility model arranges a plurality of earphone sockets on a pcb board, can realize many product synchronization jobs, as 4, 8, 16 etc., it is example that the every pcb board of take arranges 4 earphone sockets, once at pcb board, insert after 4 earphone contact pins bonding wire, 4 processed products of every pcb board of take are put into injection mold injection moulding as integral body, external protection, as integral body, will in the slot of the golden finger plug insertion insulated test device of above-mentioned pcb board, test again, such scheme, can effectively save a large amount of the number of working processess that produce because picking and placeing contact pin, and final disposable test completes 4 products, significantly enhance productivity, therefore the utility model can be realized production capacity qualitative leap.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Fig. 1 is structure and the process chart of the utility model embodiment.
Fig. 2 is the figure of configuration of pcb board in the utility model embodiment.
In figure: 1.PCB plate, 11. golden finger plugs, 12. earphone sockets, 13. circuit, 14. pilot holes, 2. earphone contact pin, 3. welding support, the reference column on 31. welding supports, 4. earphone cord, 5. injection mold, 51. bed dies, the reference column on 511. bed dies, 52. mould bars, 6. earphone contact pin component, 7. insulated test device, 71. slots.
Embodiment
As depicted in figs. 1 and 2, a kind of earphone contact pin bonding wire, injection moulding and proving installation.
Earphone contact pin bonding wire, injection moulding and proving installation comprise pcb board 1, welding support 3, injection mold 5 and insulated test device 7.
Concrete, a side of pcb board 1 is provided with golden finger plug 11, and the opposite side of pcb board 1 is provided with several earphone sockets 12, and the electrode on each earphone socket 12 and golden finger monomer on golden finger plug 11 are corresponding and be electrically connected to by circuit 13 one by one.As an example, in the present embodiment, pcb board 1 is provided with four earphone sockets 12, and each earphone socket 12 is four utmost point earphone sockets 12, and golden finger plug 11 is provided with 16 golden finger monomers that are electrically connected to the electrode of four earphone sockets 12.
Welding support 3 is for welding earphone cord 4 on the pad at earphone contact pin 2, between pcb board 1 and welding support 3, be provided with the first locating device, in the present embodiment, the first locating device comprises the pilot hole 14 of being located on pcb board 1, and is located at the reference column 31 on welding support.
Injection mold 5 is for the pad locations injection moulding protective seam at earphone contact pin 2; between pcb board 1 and injection mold 5, be provided with the second locating device; in the present embodiment; injection mold 5 comprise mold, bed die 51 and be located at mold and bed die 51 between the mould bar 52 for earphone cord 4 is positioned; the second locating device comprises the pilot hole 14 of being located on pcb board 1 and is located at the reference column 511 on bed die, and the pilot hole 14 on pcb board 1 is simultaneously for the first locating device and the second locating device.After injection moulding completes, earphone contact pin 2, earphone cord 4 and protective seam form earphone contact pin component 6 jointly.
Insulated test device 7 is for gathering electrical parameter value between the electrode of each earphone contact pin component 6 to judge its insulating property, and insulated test device 7 is provided with the slot 71 for plug-in mounting golden finger plug 11.
The course of work of the present utility model comprises the steps:
(1) by 4 the earphone contact pins 2 of the interior insertion of 4 earphone sockets 12 on pcb board 1.This step, has not only realized fixing to earphone contact pin 2 by earphone socket 12, and by the related circuit 13 on earphone socket 12 and pcb board 1, the golden finger monomer conducting on the electrode of earphone contact pin 2 and pcb board 1 golden finger plug 11.
(2) pcb board 1 is fixed on welding support 3 by the first locating device, concrete, the reference column 31 that the pilot hole on pcb board 1 14 is aimed on welding support 3 is fixing, welds earphone cord 4 on the pad of each earphone contact pin 2, in this step, pcb board 1 serves as tooling bracket and uses.
(3) pcb board 1 put into injection mold 5 and fixed by the second locating device; concrete; the reference column 511 that pilot hole on pcb board 1 14 is aimed on bed die is fixing; then put into 52 pairs of earphone cords of mould bar, 4 location; then the mold that closes again, at the pad locations injection moulding protective seam of each earphone contact pin 2, protective seam has when two-layer twice of injection moulding; finally, make earphone contact pin 2, earphone cord 4 and protective seam jointly form earphone contact pin component 6.
In injection moulding process, pcb board 1 can serve as mould positioning tool, pcb board 1 and four earphone contact pins 2 are done as a whole in turnover eventually, avoided in traditional handicraft frequently picking and placeing the number of working processes waste that contact pin brings and contact pin bad order etc. because of single operation, and save while picking and placeing 3 circulation industrials of contact pin, promote and pick and place 3 times of contact pin operating efficiencies.
(4) the golden finger plug on pcb board 1 11 is inserted to the slot 71 of insulated test device 7, pcb board 1 serves as test channel, and insulated test device 7 gathers electrical parameter value (as magnitude of voltage, resistance value etc.) between the electrode of each earphone contact pin component 6 to judge its insulating property by golden finger plug 11.
After insulated test device 7 is opened, system program is identified testing sequence automatically, respectively or synchronously every product is carried out to Insulation test, and system is according to the test result of every product is presented to display screen place automatically.
Adopt the utility model, each earphone contact pin 2 only need to once plug from start to finish, has avoided because repeating to plug contact pin surface tear, coating wearing and tearing and the Work tool loss that contact pin causes, and product yield improves because plugging the minimizing of number of times.And the utility model arranges a plurality of earphone sockets 12 on a pcb board 1, it is example that the every pcb board 1 of take in the utility model arranges 4 earphone sockets 12, once at pcb board 1, insert after 4 earphone contact pins 2 bonding wire, take every pcb board 1 and 4 processed products puts into injection mold 5 injection moulding protective seams as integral body, as integral body, by insulated test device 7, test again, such scheme, can effectively save a large amount of the number of working processess that produce because picking and placeing contact pin, and final disposable test completes 4 products, significantly enhance productivity, therefore the utility model can be realized production capacity qualitative leap.
Above-described embodiment is only giving an example of the utility model embodiment; protection domain of the present utility model is as the criterion with the content of claim; any equivalent transformation carrying out based on technology enlightenment of the present utility model, also within protection domain of the present utility model.
Claims (5)
1. earphone contact pin bonding wire, injection moulding and proving installation, is characterized in that, comprising:
Pcb board, a side of described pcb board is provided with golden finger plug, and the opposite side of described pcb board is provided with several earphone sockets, and the electrode on each earphone socket and golden finger monomer on described golden finger plug are corresponding and be electrically connected to by circuit one by one;
For weld the welding support of earphone cord on the pad of earphone contact pin, between described pcb board and described welding support, be provided with the first locating device;
Injection mold for the pad locations injection moulding protective seam at earphone contact pin, is provided with the second locating device between described pcb board and described injection mold, and described earphone contact pin, described earphone cord and described protective seam form earphone contact pin component jointly;
For gathering electrical parameter value between the electrode of each earphone contact pin component to judge the insulated test device of its insulating property, described insulated test device is provided with the slot for golden finger plug described in plug-in mounting.
2. earphone contact pin bonding wire as claimed in claim 1, injection moulding and proving installation, it is characterized in that: described pcb board is provided with 4 earphone sockets, and each earphone socket is four utmost point earphone sockets, described golden finger plug is provided with 16 golden finger monomers that are electrically connected to the electrode of described 4 earphone sockets.
3. earphone contact pin bonding wire as claimed in claim 1, injection moulding and proving installation, is characterized in that: described the first locating device comprises the pilot hole of being located on described pcb board, and be located at the reference column on described welding support.
4. earphone contact pin bonding wire as claimed in claim 1, injection moulding and proving installation, it is characterized in that: described injection mold comprises mold and bed die, described the second locating device comprises the pilot hole of being located on described pcb board, and is located at the reference column on described bed die.
5. earphone contact pin bonding wire as claimed in claim 4, injection moulding and proving installation, is characterized in that: described injection mold also comprises the mould bar for described earphone cord is positioned of being located between described mold and described bed die.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739963.4U CN203587623U (en) | 2013-11-20 | 2013-11-20 | Earphone pin welding, injection molding and testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739963.4U CN203587623U (en) | 2013-11-20 | 2013-11-20 | Earphone pin welding, injection molding and testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203587623U true CN203587623U (en) | 2014-05-07 |
Family
ID=50585523
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320739963.4U Withdrawn - After Issue CN203587623U (en) | 2013-11-20 | 2013-11-20 | Earphone pin welding, injection molding and testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203587623U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103675360A (en) * | 2013-11-20 | 2014-03-26 | 歌尔声学股份有限公司 | Earphone inserting pin wire welding, injection molding and testing device and method |
| CN108141658A (en) * | 2015-08-29 | 2018-06-08 | 布拉吉有限公司 | Production line PCB serial programmings and test method and system |
-
2013
- 2013-11-20 CN CN201320739963.4U patent/CN203587623U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103675360A (en) * | 2013-11-20 | 2014-03-26 | 歌尔声学股份有限公司 | Earphone inserting pin wire welding, injection molding and testing device and method |
| CN103675360B (en) * | 2013-11-20 | 2016-06-15 | 歌尔声学股份有限公司 | Earphone contact pin bonding wire, injection moulding and test set and method |
| CN108141658A (en) * | 2015-08-29 | 2018-06-08 | 布拉吉有限公司 | Production line PCB serial programmings and test method and system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140507 Effective date of abandoning: 20160615 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |