CN203574940U - Circuit board of COB LED module - Google Patents
Circuit board of COB LED module Download PDFInfo
- Publication number
- CN203574940U CN203574940U CN201320614772.5U CN201320614772U CN203574940U CN 203574940 U CN203574940 U CN 203574940U CN 201320614772 U CN201320614772 U CN 201320614772U CN 203574940 U CN203574940 U CN 203574940U
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- Prior art keywords
- circuit
- jack
- die bond
- wiring board
- circuit board
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Abstract
The utility model relates to a circuit board of a COB LED module. The circuit board comprises a circuit board and a circuit arranged on the circuit board. The circuit board is provided with chip fixing slots, a first wiring jack, a second wiring jack, and test jacks. Each chip fixing slot is provided with a first pin jack and a second pin jack on the periphery. The circuit comprises a first circuit, a plurality of second circuits, and a third circuit. As each chip fixing slot is provided with the test jacks on the periphery and the circuit arranged on the circuit board comprises the first circuit, the second circuits and the third circuit at the same time, when different test jacks are connected, the corresponding LED chip can be connected for testing, so that various work tests can be done on the single LED chip and the test efficiency is improved.
Description
[technical field]
The utility model relates to LED module, more particularly, relates to the circuit board of a kind of COB (Chip on Board) LED module.
[background technology]
LED, as light source, due to the advantage of himself, is more and more widely used.Wherein COB (Chip on Board, chip on board encapsulation) LED, is exactly the constantly product of progress of its technology.COBLED is exactly chip on board encapsulation, is one of bare chip mounting technology, and semiconductor chip handing-over is mounted on printed substrate, lead-in wire sewing method realization for the electrical connection of chip and pcb board, and cover to guarantee reliability with resin.COB LED is again COB LED source or COB LED is module.This novel COB LED, due to advantages such as it is safe, reliable, efficient, energy-saving and environmental protection, makes its range of application more and more extensive.
The COB LED module that industry adopts conventionally at present, its structure is, at substrate surface, circuit board is set, circuit board comprise be provided with circuit printed panel, be arranged on printed panel bottom surface insulating barrier, be arranged on the ink of printed panel end face, by the pin welding of LED chip on printed panel so that with circuit realize be electrically connected.As shown in Figure 1, in actual product, conventionally can multiple LED chips be set on printed panel, ' for to be set in parallel in two one-sided straight lines of wiring board 10 ', the pin of the LED chip in COB LED module welds together with two straight line circuits respectively circuit 20.When needs carry out brightness or aberration detection, use two straight line circuits on checkout equipment electrical connection circuit board, can detect each LED chip.But when detecting, LED chips all on circuit board all can be luminous, can not to each LED chip, detect separately like this, especially the detection of aberration, if there is a LED chip defective, can only judge that whole COBLED module is defective, it is very inconvenient to detect, and also has influence on rate of finished products.
[utility model content]
The technical problems to be solved in the utility model is, for the circuit board of COB LED module in prior art, exists and detects inconvenient problem, and the circuit board of the COB LED module that the each chip of a kind of correspondence all has a test point is provided.
The utility model solves the technical scheme that its technical problem adopts: the circuit board of constructing a kind of COB LED module, comprise wiring board, circuit is in the circuit board set, described wiring board is provided with multiple for the die bond groove of LED chip is installed, for accessing the first patch jack and second patch jack of power supply, corresponding each die bond groove is provided with at least one test jack for being electrically connected with the second circuit of other die bond grooves, each described die bond groove periphery is provided with the first pin jack and the second pin jack that for LED chip pin, are fixedly connected with, described circuit comprises the first circuit that described the first patch jack is electrically connected with the first pin jack of each described die bond groove, multiple the second circuits that the second corresponding each die bond groove pin jack is electrically connected with corresponding test jack, the tertiary circuit that second circuit is electrically connected with described the second patch jack.
In the circuit board of COB LED module described in the utility model, described die bond groove is linearly distributed on described wiring board.
In the circuit board of COB LED module described in the utility model, the die bond groove correspondence that is positioned at wiring board end is provided with a described test jack, is positioned at the middle die bond groove correspondence of wiring board and is provided with the described test jack of two.
In the circuit board of COB LED module described in the utility model, described tertiary circuit electrical connection is arranged between the second circuit corresponding at the die bond groove of wiring board one end and described the second patch jack.
In the circuit board of COB LED module described in the utility model, described the first patch jack and the second patch jack are separately positioned on the two ends of wiring board.
In the circuit board of COB LED module described in the utility model, described die bond groove is arranged on the front of described wiring board, and described the first circuit, the second circuit and tertiary circuit are arranged on the back side of described wiring board.
In the circuit board of COB LED module described in the utility model, described wiring board two ends are also provided with multiple the 3rd patch jacks, and described circuit also comprises the 4th circuit of the 3rd patch jack at and electrical interconnection plate two ends consistent with the orientation of die bond groove.
The circuit board of implementing COB LED module described in the utility model, has following beneficial effect: by die bond groove in the circuit board, can by fixing LED chip in the circuit board; By the first pin jack and the second pin jack are set in the circuit board, LED chip can be electrically connected on circuit in the circuit board, so that LED chip work; By the first patch jack and the second patch jack are set in the circuit board, thereby power supply can be introduced wiring board from outside, so that driving LED chip operation or LED chip is carried out to various work tests; By test jack being set at each die bond groove periphery, the circuit simultaneously arranging on circuit board comprises the first circuit, the second circuit and tertiary circuit, when connecting different test jack, can access corresponding LED chip, it is tested, thereby realize, single led chip is carried out various work tests, improved detection efficiency.
Below in conjunction with drawings and Examples, the utility model is described in further detail.
[accompanying drawing explanation]
Fig. 1 is the structural representation of the circuit board of COB LED module in prior art;
Fig. 2 a is the Facad structure schematic diagram of the circuit board preferred embodiment of COB LED module described in the utility model;
Fig. 2 b is the structure schematic diagram of the circuit board preferred embodiment of COB LED module described in the utility model.
[embodiment]
In the circuit board of COB LED module described in the utility model, mainly comprise wiring board 10 and be arranged on the circuit 20 on wiring board 10, described wiring board 10 is provided with multiple for the die bond groove 11 of LED chip is installed, for accessing the first patch jack 12a and the second patch jack 12b of power supply, corresponding each die bond groove 11 is provided with at least one test jack 13 for being electrically connected with the second circuit 22 of other die bond grooves 11, each described die bond groove 11 peripheries are provided with the first pin jack 14a and the second pin jack 14b that for LED chip pin, are fixedly connected with, described circuit 20 comprises the first circuit 21 that described the first patch jack 12a is electrically connected with the first pin jack 14a of each described die bond groove, multiple the second circuits 22 that the second corresponding each die bond groove pin jack 14b is electrically connected with described test jack 13, the tertiary circuit 23 that second circuit 22 is electrically connected with described the second patch jack 12b.
As shown in Fig. 2 a, 2b, in the preferred embodiment of the circuit board of COB LED module described in the utility model, comprise wiring board 10 and circuit 20 is in the circuit board set.Wherein wiring board 10 is provided with multiple die bond grooves 11, for fixed L ED chip; Preferably by linearly uniform multiple die bond grooves 11, be arranged on wiring board 10.Each die bond groove 11 correspondences on wiring board are provided with the first pin jack 14a and the second pin jack 14b, for matching with two pins of corresponding LED chip.
In this preferred embodiment, test jack 13 is provided with multiple, wherein has a test jack 13a corresponding with the die bond groove 11a that is positioned at wiring board end, and the die bond groove 11b in the middle of having two test jack 13b and being positioned at wiring board 10 is corresponding; The die bond groove 11a that is positioned at wiring board two ends all has a test jack 13a corresponding with it, and being positioned at wiring board 10 middle each die bond groove 11b all has two test jack 13b corresponding thereto.
No matter be the die bond groove 11a that is positioned at wiring board 10 ends, be still positioned at the middle die bond groove 11b of wiring board 10, the second patch jack 12b of each die bond groove all can be electrically connected with corresponding test jack 13 by each self-corresponding the second circuit 22.Concrete, the second circuit 22 comprises multiple, each the second circuit 22 is all corresponding with a die bond groove 11.For being positioned at two die bond groove 11a of wiring board 10 ends, the second circuit 22a that this die bond groove 11a is corresponding is electrically connected the second pin jack 14b test jack 13a corresponding with this die bond groove corresponding this die bond groove; For the die bond groove 11b in the middle of being positioned at wiring board 10, the second circuit 22b that this die bond groove is corresponding is electrically connected two corresponding with this die bond groove the second corresponding this die bond groove pin jack 14b test jack 13b.
In this preferred embodiment, preferably the first patch jack 12a and the second patch jack 12b are separately positioned on to the two ends of wiring board 10, now the second circuit 22a corresponding with the die bond groove that is positioned at wiring board end and close the second patch jack can be electrically connected with the second patch jack 12b by tertiary circuit 23, to carry out wiring operation.
In the above-described embodiments, die bond groove 11 is arranged on to the front of wiring board 10, and all circuits 20 is arranged on to the back side of wiring board 10, from front, LED chip is fixed on crystal bonding area like this, and carries out overleaf wiring operation, facilitate the enforcement of technique.
In the above-described embodiments, multiple the 3rd patch jack 12c also can be set as required, to conveniently carry out line operation when testing.Preferably multiple the 3rd patch jack 12c are separately positioned on to wiring board 10 two ends, on wiring board 10, arrange consistent with the orientation of multiple die bond grooves 11 the 4th circuit 24, the four circuits 24 of the 3rd patch jack 12c electrical connection at wiring board two ends.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.It should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (7)
1. the circuit board of a COB LED module, comprise wiring board, circuit is in the circuit board set, it is characterized in that, described wiring board is provided with multiple for the die bond groove of LED chip is installed, for accessing the first patch jack and second patch jack of power supply, corresponding each die bond groove is provided with at least one test jack for being electrically connected with the second circuit of other die bond grooves, each described die bond groove periphery is provided with the first pin jack and the second pin jack that for LED chip pin, are fixedly connected with, described circuit comprises the first circuit that described the first patch jack is electrically connected with the first pin jack of each described die bond groove, multiple the second circuits that the second corresponding each die bond groove pin jack is electrically connected with corresponding test jack, the tertiary circuit that second circuit is electrically connected with described the second patch jack.
2. the circuit board of COB LED module according to claim 1, is characterized in that, described die bond groove is linearly distributed on described wiring board.
3. the circuit board of COB LED module according to claim 2, is characterized in that, the die bond groove correspondence that is positioned at wiring board end is provided with a described test jack, and the die bond groove correspondence being positioned in the middle of wiring board is provided with the described test jack of two.
4. the circuit board of COB LED module according to claim 2, is characterized in that, described tertiary circuit electrical connection is arranged between the second circuit corresponding at the die bond groove of wiring board one end and described the second patch jack.
5. the circuit board of COB LED module according to claim 2, is characterized in that, described the first patch jack and the second patch jack are separately positioned on the two ends of wiring board.
6. according to the circuit board of COB LED module described in any one in claim 1 to 5, it is characterized in that, described die bond groove is arranged on the front of described wiring board, and described the first circuit, the second circuit and tertiary circuit are arranged on the back side of described wiring board.
7. according to the circuit board of COB LED module described in any one in claim 1 to 5, it is characterized in that, described wiring board two ends are also provided with multiple the 3rd patch jacks, and described circuit also comprises the 4th circuit of the 3rd patch jack at and electrical interconnection plate two ends consistent with the orientation of die bond groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320614772.5U CN203574940U (en) | 2013-09-30 | 2013-09-30 | Circuit board of COB LED module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320614772.5U CN203574940U (en) | 2013-09-30 | 2013-09-30 | Circuit board of COB LED module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203574940U true CN203574940U (en) | 2014-04-30 |
Family
ID=50542645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320614772.5U Expired - Fee Related CN203574940U (en) | 2013-09-30 | 2013-09-30 | Circuit board of COB LED module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203574940U (en) |
-
2013
- 2013-09-30 CN CN201320614772.5U patent/CN203574940U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140430 Termination date: 20140930 |
|
| EXPY | Termination of patent right or utility model |